CN106028490A - Electromagnetic hot melting apparatus and method for flexible/rigid multilayered printed circuit board - Google Patents
Electromagnetic hot melting apparatus and method for flexible/rigid multilayered printed circuit board Download PDFInfo
- Publication number
- CN106028490A CN106028490A CN201610471061.5A CN201610471061A CN106028490A CN 106028490 A CN106028490 A CN 106028490A CN 201610471061 A CN201610471061 A CN 201610471061A CN 106028490 A CN106028490 A CN 106028490A
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- circuit board
- printed circuit
- multilayer printed
- steel
- hard multilayer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Induction Heating (AREA)
Abstract
The invention discloses an electromagnetic hot melting apparatus and method for a flexible/rigid multilayered printed circuit board. The electromagnetic hot melting apparatus for the flexible/rigid multilayered printed circuit board is used for performing electromagnetic hot melting processing on the flexible/rigid multilayered printed circuit board to enable a copper foil region on the flexible/rigid multilayered printed circuit board to be melted with an insulation layer which is in contact with the copper foil region and is heated by the electromagnetic hot melting process; the electromagnetic hot melting apparatus mainly comprises an electromagnetic generator, a high frequency power supply circuit, a driving circuit, and a main control circuit, wherein the electromagnetic generator is arranged corresponding to the copper foil region; the high frequency power supply circuit is connected with the electromagnetic generator and used for outputting high frequency resonance current to the electromagnetic generator to trigger the copper foil region to generate eddy current; the driving circuit is connected with the high frequency power supply circuit; and the main control circuit is connected with the driving circuit and used for controlling the driving circuit to drive the high frequency power supply circuit to work. Therefore, all the layers can be uniformly and rapidly heated without being limited by the number of layers, so that the binding force between the layers is improved; the quality is ensured; the manufacturing time is shortened; and the efficiency is improved.
Description
Technical field
The application relates to printed circuit board technology field, particularly relates to 9 Cr 2 steel using electromagnetic heating fusing device and the method for a kind of soft/hard multilayer printed circuit board.
Background technology
At present, answering the market demand, the soft or hard printed circuit board number of plies is done higher and higher, so, is heated by electrical bar conduction of heat, makes the insulating barrier between each layer (generally glass fibre) melt because of heating, completes to be fused by the insulating barrier of fusing between each layer.But, due to by electrical bar conduction of heat mode of heating, intermediate layer is bigger with the outer layer temperature difference, the heating-up temperature of internal layer is often low compared with outer layer, insulating barrier melten gel between each layer is widely different, and circuit board internal layer adhesion is bad, and the fusion time is the longest, and the highest situation of the circuit board number of plies is the poorest, quality and efficiency are had a greatly reduced quality.
Summary of the invention
The application is intended to solve one of above-mentioned technical problem the most to a certain extent.
First aspect according to the application, the application provides the 9 Cr 2 steel using electromagnetic heating fusing device of a kind of soft/hard multilayer printed circuit board, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board, Copper Foil region on described soft/hard multilayer printed circuit board is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt, including:
Electromagnetic generator with the corresponding setting in described Copper Foil region；
It is that be connected with described electromagnetic generator, for described electromagnetic generator output high-frequency resonant electric current is produced the high-frequency power supply circuit of current vortex to trigger described Copper Foil region；
The drive circuit being connected with described high-frequency power supply circuit；And,
That be connected with described drive circuit, for controlling the governor circuit that described drive circuit drives described high-frequency power supply circuit to work.
Further, described electromagnetic generator is arranged at the opposite sides in described Copper Foil region.
Further, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes:
The temperature conditioning unit being connected with described governor circuit；And,
Temperature sensor that nearly described Copper Foil region is arranged, that be connected with described temperature conditioning unit.
Further, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes: the mutual inductance circuit of setting corresponding with the output loop of described high-frequency power supply circuit, and described governor circuit includes:
Single-chip microcomputer；And,
It is arranged at the peripheral circuit outside described single-chip microcomputer,
Described single-chip microcomputer has: the driving interface being connected with described drive circuit；The triggering interface being connected with described temperature conditioning unit；And, the transducer signal input interface being connected with described mutual inductance circuit.
Further, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes:
That be connected with described governor circuit, for being controlled the hold-down mechanism driving described electromagnetic generator that described soft/hard multilayer printed circuit board is compressed in described electromagnetism hot melt processing procedure by described governor circuit.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterised in that the frequency range value of described high-frequency resonant electric current: 15000-40000Hz.
According to the second aspect of the application, the application provides the 9 Cr 2 steel using electromagnetic heating melting method of the soft/hard multilayer printed circuit board of a kind of 9 Cr 2 steel using electromagnetic heating fusing device based on above-mentioned soft/hard multilayer printed circuit board, including:
Described governor circuit controls described drive circuit and drives the work of described high-frequency power supply circuit；
Described high-frequency power supply circuit produces current vortex to described electromagnetic generator output high-frequency resonant electric current to trigger described Copper Foil region so that the Copper Foil region on described soft/hard multilayer printed circuit board is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt.
Further, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: when described temperature conditioning unit and described temperature sensor, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described temperature sensor senses obtains the induced signal of the real time temperature for reflecting described Copper Foil region；
Described temperature conditioning unit is converted into the discernible temperature information of described governor circuit to described induced signal；
Described governor circuit controls described drive circuit works according to described temperature information.
Further, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: during mutual inductance circuit, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described governor circuit obtains the high-frequency resonant electric current real-time frequency on the output loop of described high-frequency power supply circuit by described mutual inductance circuit；
Described governor circuit controls described drive circuit works according to described high-frequency resonant electric current real-time frequency.
Further, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: during described hold-down mechanism, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described governor circuit controls described hold-down mechanism and drives described electromagnetic generator to compress described soft/hard multilayer printed circuit board in described electromagnetism hot melt processing procedure.
The application provides the benefit that:
By providing 9 Cr 2 steel using electromagnetic heating fusing device and the method for a kind of soft/hard multilayer printed circuit board, the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board, Copper Foil region on soft/hard multilayer printed circuit board is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt, and 9 Cr 2 steel using electromagnetic heating fusing device specifically includes that and the electromagnetic generator of the corresponding setting in described Copper Foil region；It is that be connected with electromagnetic generator, for described electromagnetic generator output high-frequency resonant electric current is produced the high-frequency power supply circuit of current vortex to trigger described Copper Foil region；The drive circuit being connected with described high-frequency power supply circuit；And, that be connected with described drive circuit, for controlling the governor circuit that described drive circuit drives described high-frequency power supply circuit to work.So, each layer the most uniformly fast heating, breach the number of plies and limit, improve the adhesion between each layer, it is ensured that quality, shorten Production Time, improve efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the 9 Cr 2 steel using electromagnetic heating fusing device of the soft/hard multilayer printed circuit board of the embodiment of the present application one.
Fig. 2 is the structural representation of the 9 Cr 2 steel using electromagnetic heating fusing device of the soft/hard multilayer printed circuit board of the embodiment of the present application two.
Fig. 3 is the structural representation of the 9 Cr 2 steel using electromagnetic heating fusing device of the soft/hard multilayer printed circuit board of the embodiment of the present application three.
Fig. 4 is the another kind of structural representation of the 9 Cr 2 steel using electromagnetic heating fusing device of the soft/hard multilayer printed circuit board of the embodiment of the present application three.
Detailed description of the invention
Embodiments herein is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to be used for explaining the application, and it is not intended that restriction to the application.
In the description of the present application, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, it is for only for ease of description the application and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that restriction to the application.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include one or more this feature.In the description of the present application, " multiple " are meant that two or more, unless otherwise expressly limited specifically.
In this application, unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or be integrally connected；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can include that the first and second features directly contact, it is also possible to include that the first and second features are not directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include that fisrt feature directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " include that fisrt feature immediately below second feature and obliquely downward, or is merely representative of fisrt feature level height less than second feature.
Combine accompanying drawing below by detailed description of the invention the application is described in further detail.
Embodiment one:
As shown in Figure 1, present embodiments provide the 9 Cr 2 steel using electromagnetic heating fusing device of a kind of soft/hard multilayer printed circuit board, the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board 1, Copper Foil region 11 on soft/hard multilayer printed circuit board 1 is fused by insulating barrier 12 that is that contact and that heated by electromagnetism hot melt, including:
The electromagnetic generator 2 of setting corresponding with Copper Foil region 11, is provided with poly-magnetic material in electromagnetic generator 2；
That be connected with electromagnetic generator 2, produce the high-frequency power supply circuit 3 of current vortex to trigger Copper Foil region 11 for electromagnetic generator 2 being exported high-frequency resonant electric current；
The drive circuit 4 being connected with high-frequency power supply circuit 3；And,
That be connected with drive circuit 4, for controlling the governor circuit 5 that drive circuit 4 drives high-frequency power supply circuit 3 to work.
Concrete, in the present embodiment, electromagnetic generator 2 is arranged at the opposite sides in Copper Foil region 11.
The 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes:
That be connected with governor circuit 5, for being controlled the hold-down mechanism driving electromagnetic generator 2 that soft/hard multilayer printed circuit board 1 is compressed in electromagnetism hot melt processing procedure by governor circuit 5.
The frequency range value of high-frequency resonant electric current: 15000-40000Hz, can the numerical value such as value 15000,20000,25000,30000 or 40000Hz.
Accordingly, the application provides the 9 Cr 2 steel using electromagnetic heating melting method of the soft/hard multilayer printed circuit board of a kind of 9 Cr 2 steel using electromagnetic heating fusing device based on above-mentioned soft/hard multilayer printed circuit board, including:
Governor circuit 5 controls drive circuit 4 and drives high-frequency power supply circuit 3 to work；
High-frequency power supply circuit 3 exports high-frequency resonant electric current and produces current vortex to trigger Copper Foil region 11 electromagnetic generator 2 so that the Copper Foil region 11 on soft/hard multilayer printed circuit board 1 is fused by insulating barrier 12 that is that contact and that heated by electromagnetism hot melt.
The 9 Cr 2 steel using electromagnetic heating melting method of soft/hard multilayer printed circuit board also includes:
Governor circuit 5 controls hold-down mechanism and drives electromagnetic generator 2 to compress soft/hard multilayer printed circuit board 1 in electromagnetism hot melt processing procedure.Hold-down mechanism can be cylinder or servomotor etc..
Embodiment two:
The present embodiment essentially consists in the difference of other embodiments:
As in figure 2 it is shown, in the present embodiment, the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes:
The temperature conditioning unit 6 being connected with governor circuit 5；And,
Temperature sensor 7 that nearly Copper Foil region 11 is arranged, that be connected with temperature conditioning unit 6.
So, the 9 Cr 2 steel using electromagnetic heating melting method of soft/hard multilayer printed circuit board also includes:
Temperature sensor 7 sensing obtains the induced signal of the real time temperature for reflecting Copper Foil region 11；
Temperature conditioning unit 6 is converted into the discernible temperature information of governor circuit 5 to induced signal；
Governor circuit 5 controls drive circuit 4 according to temperature information and works.
Embodiment three:
The present embodiment essentially consists in the difference of other embodiments:
As shown in Figure 3-4, in the present embodiment, the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: the mutual inductance circuit 8 of setting corresponding with the output loop of high-frequency power supply circuit 3, and governor circuit 5 includes:
Single-chip microcomputer 51；And,
It is arranged at the peripheral circuit outside single-chip microcomputer 51,
Single-chip microcomputer 51 has: the driving interface being connected with drive circuit 4；The triggering interface being connected with temperature conditioning unit 6；And, the transducer signal input interface being connected with mutual inductance circuit 8.
So, the 9 Cr 2 steel using electromagnetic heating melting method of soft/hard multilayer printed circuit board also includes:
Governor circuit 5 obtains the high-frequency resonant electric current real-time frequency on the output loop of high-frequency power supply circuit 3 by mutual inductance circuit 8；
Governor circuit 5 controls drive circuit 4 according to high-frequency resonant electric current real-time frequency and works.
Implement this high-frequency electromagnetic fusion technique, high-speed microprocessor and high-frequency power supply circuit perfect adaptation, frequency electromagnetic waves can be produced, act on the some position that multilayer circuit board need to fuse, specify that cupric region produces current vortex and uniformly heats the insulating barrier between each layer at every layer circuit board, be allowed to fuse.Each layer the most uniformly fast heating, breaks through the number of plies and limits, improve adhesion, it is ensured that quality, shorten Production Time, improve efficiency.Temperature conditioning unit triggers governor circuit according to the Temperature Feedback of wiring board, governor circuit triggers drive circuit, drive circuit drives high-frequency power supply circuit, produce high frequency electric (electric current of this application general about 25KHz frequency), so electromagnetic generator just produces high frequency magnetic flux, and high frequency magnetic flux multilayer circuit board copper district between bar magnet produces vortex flow heating.During up and down bar magnet by compression multilayer circuit boards such as hold-down mechanism such as cylinders, be finally allowed to mutually fuse with insulating barrier.After temperature reaches design temperature, temperature conditioning unit stops output, and governor circuit stops triggering, and mechanism stops heating.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine this embodiment or example description are contained at least one embodiment or the example of the application.In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment or example.And, the specific features of description, structure, material or feature can combine in any one or more embodiments or example in an appropriate manner.
Above content is to combine the further description that the application is made by specific embodiment, it is impossible to assert the application be embodied as be confined to these explanations.For the application person of an ordinary skill in the technical field, on the premise of conceiving without departing from the application, it is also possible to make some simple deduction or replace.
Claims (10)
1. the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board is for carrying out electromagnetism hot melt process to soft/hard multilayer printed circuit board, Copper Foil region on described soft/hard multilayer printed circuit board is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt, it is characterized in that, including:
Electromagnetic generator with the corresponding setting in described Copper Foil region；
It is that be connected with described electromagnetic generator, for described electromagnetic generator output high-frequency resonant electric current is produced the high-frequency power supply circuit of current vortex to trigger described Copper Foil region；
The drive circuit being connected with described high-frequency power supply circuit；And,
That be connected with described drive circuit, for controlling the governor circuit that described drive circuit drives described high-frequency power supply circuit to work.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterised in that described electromagnetic generator is arranged at the opposite sides in described Copper Foil region.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterised in that the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes:
The temperature conditioning unit being connected with described governor circuit；And,
Temperature sensor that nearly described Copper Foil region is arranged, that be connected with described temperature conditioning unit.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterized in that, the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes: the mutual inductance circuit of setting corresponding with the output loop of described high-frequency power supply circuit, and described governor circuit includes:
Single-chip microcomputer；And,
It is arranged at the peripheral circuit outside described single-chip microcomputer,
Described single-chip microcomputer has: the driving interface being connected with described drive circuit；The triggering interface being connected with described temperature conditioning unit；And, the transducer signal input interface being connected with described mutual inductance circuit.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterised in that the 9 Cr 2 steel using electromagnetic heating fusing device of described soft/hard multilayer printed circuit board also includes:
That be connected with described governor circuit, for being controlled the hold-down mechanism driving described electromagnetic generator that described soft/hard multilayer printed circuit board is compressed in described electromagnetism hot melt processing procedure by described governor circuit.
The 9 Cr 2 steel using electromagnetic heating fusing device of the softest/hard multilayer printed circuit board, it is characterised in that the frequency range value of described high-frequency resonant electric current: 15000-40000Hz.
7. the 9 Cr 2 steel using electromagnetic heating melting method of the soft/hard multilayer printed circuit board of a 9 Cr 2 steel using electromagnetic heating fusing device based on the soft/hard multilayer printed circuit board as according to any one of claim 1-6, it is characterised in that including:
Described governor circuit controls described drive circuit and drives the work of described high-frequency power supply circuit；
Described high-frequency power supply circuit produces current vortex to described electromagnetic generator output high-frequency resonant electric current to trigger described Copper Foil region so that the Copper Foil region on described soft/hard multilayer printed circuit board is fused by insulating barrier that is that contact and that heated by electromagnetism hot melt.
The 9 Cr 2 steel using electromagnetic heating melting method of the softest/hard multilayer printed circuit board, it is characterized in that, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: when described temperature conditioning unit and described temperature sensor, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described temperature sensor senses obtains the induced signal of the real time temperature for reflecting described Copper Foil region；
Described temperature conditioning unit is converted into the discernible temperature information of described governor circuit to described induced signal；
Described governor circuit controls described drive circuit works according to described temperature information.
The 9 Cr 2 steel using electromagnetic heating melting method of the softest/hard multilayer printed circuit board, it is characterized in that, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: during mutual inductance circuit, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described governor circuit obtains the high-frequency resonant electric current real-time frequency on the output loop of described high-frequency power supply circuit by described mutual inductance circuit；
Described governor circuit controls described drive circuit works according to described high-frequency resonant electric current real-time frequency.
The 9 Cr 2 steel using electromagnetic heating melting method of the softest/hard multilayer printed circuit board, it is characterized in that, when the 9 Cr 2 steel using electromagnetic heating fusing device of soft/hard multilayer printed circuit board also includes: during described hold-down mechanism, the 9 Cr 2 steel using electromagnetic heating melting method of described soft/hard multilayer printed circuit board also includes:
Described governor circuit controls described hold-down mechanism and drives described electromagnetic generator to compress described soft/hard multilayer printed circuit board in described electromagnetism hot melt processing procedure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610471061.5A CN106028490A (en) | 2016-06-24 | 2016-06-24 | Electromagnetic hot melting apparatus and method for flexible/rigid multilayered printed circuit board |
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| CN201610471061.5A CN106028490A (en) | 2016-06-24 | 2016-06-24 | Electromagnetic hot melting apparatus and method for flexible/rigid multilayered printed circuit board |
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Cited By (1)
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Application publication date: 20161012 |
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| RJ01 | Rejection of invention patent application after publication |