CN205845925U - Spacing thimble and chuck - Google Patents
Spacing thimble and chuck Download PDFInfo
- Publication number
- CN205845925U CN205845925U CN201620554986.1U CN201620554986U CN205845925U CN 205845925 U CN205845925 U CN 205845925U CN 201620554986 U CN201620554986 U CN 201620554986U CN 205845925 U CN205845925 U CN 205845925U
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- CN
- China
- Prior art keywords
- thimble
- spacing
- chuck
- wafer
- spacing thimble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
This utility model provides a kind of spacing thimble, and described spacing thimble includes: limiting section, the pedestal being arranged on described limiting section and the thimble portion being arranged on described pedestal, and the quantity in described thimble portion is multiple.This utility model also provides on a kind of chuck, and described chuck includes lower substrate, the upper matrix being arranged on described lower substrate and is arranged on the described spacing thimble on described upper matrix.In the spacing thimble that this utility model provides, being multiple designs by thimble portion, multiple thimble portions can clamp wafer respectively, thus decreases the working time in each thimble portion, it is possible to reduce the abrasion of spacing thimble；In addition, when the fracture of one of them thimble portion or other disappearance, replacement effect can be played by other thimble portion, thus prevent the spacing of wafer or solid failure, avoid the problem moved relative to each other between the wafer and chuck occurred after chuck uses a period of time, improve the reliability of semiconductor fabrication process.
Description
Technical field
This utility model relates to field of semiconductor manufacture, particularly to spacing thimble and chuck.
Background technology
In semiconductor fabrication, wafer to stand such as to etch, cleans, polish and material deposition etc. is various surface-treated
Journey, in order to adapt to these processes, it will usually uses rotatable chuck (chuck), supports wafer by described chuck.
The chuck of prior art is typically to utilize Bernoulli Jacob (Bernoulli) principle, thus supports wafer by air cushion
Rather than obtain support from below by directly contact crystal column surface.As it is shown in figure 1, it illustrates a kind of chuck of prior art
10, the upper matrix 11 that described chuck 10 includes lower substrate 12 (lower base body), is arranged on described lower substrate 12
(upper base body) and the spacing thimble 13 (chuck-pin) being arranged on described upper matrix 11, described upper matrix 11
For placing wafer W, described lower substrate 12 is provided with the rotary apparatus for rotating.Described spacing thimble 13 comprise limiting section and
The thimble portion being arranged on described limiting section, eccentric being arranged on described limiting section in described thimble portion.Arrow circular in Fig. 1
Indicate chuck to turn clockwise, when chuck is in running order, the public ring gear in chuck by be arranged at limit
Sawtooth occlusion on the thimble of position, thus drive the thimble portion of spacing thimble to rotate so that the outside of described thimble portion clamping wafer
Edge thus realize the spacing or fixing of wafer, prevent the wafer lateral displacement relative to chuck.
Wafer is referred to as " wafer moves " (" wafer shift ") relative to the rotation of chuck, the most undesirably wafer and
Move relative to each other between chuck, and after chuck uses a period of time, often would tend to occur this less desirable wafer and
Moving relative to each other between chuck.
Utility model content
The purpose of this utility model is to provide a kind of spacing thimble and chuck, to solve to use at chuck in prior art
After a period of time, the problem that move relative to each other less desirable wafer and chuck between often be would tend to occur.
For solving above-mentioned technical problem, the spacing thimble of one that this utility model provides, including: limiting section, it is arranged on institute
Stating the pedestal on limiting section and the thimble portion being arranged on described pedestal, the quantity in described thimble portion is multiple.
Preferably, in described spacing thimble, described thimble portion is shaped as cylinder or Elliptic Cylinder.
Preferably, in described spacing thimble, described pedestal be shaped as cone.
Preferably, in described spacing thimble, described limiting section is provided with the azimuth mark for identifying described thimble portion
Note.
Preferably, in described spacing thimble, the quantity of described thimble is two.
Preferably, in described spacing thimble, described azimuth mark is positioned on the center line in two described thimble portions.
Preferably, in described spacing thimble, described azimuth mark is arranged on described limiting section the one side near pedestal
Or the another side away from pedestal.
Preferably, in described spacing thimble, described pedestal is provided with groove and/or projection.
This utility model also provides for a kind of chuck, and described chuck includes lower substrate, the upper base being arranged on described lower substrate
Body and be arranged on the described spacing thimble on described upper matrix.
Preferably, in described chuck, the quantity of described spacing thimble is multiple.
Preferably, in described chuck, multiple described spacing thimbles are uniformly distributed on matrix on described.
Inventor studies discovery, after chuck uses a period of time, less desirable wafer and chuck often be would tend to occur
Between the reason moved relative to each other be: after a period of operation, often there is mill in various degree in spacing thimble
Damage, the most just have impact on its spacing or fixing wafer, prevent the wafer purpose relative to the lateral displacement of chuck.Therefore, at this
In the spacing thimble that utility model provides, being multiple designs by thimble portion, multiple thimble portions can clamp wafer respectively, from
And decrease the working time in each thimble portion, it is possible to reduce the abrasion of spacing thimble；Additionally, when one of them thimble portion
When fracture or other disappearance, other thimble portion can play replacement effect, thus prevent the spacing of wafer or solid failure,
Avoid after chuck uses a period of time, moving relative to each other less desirable wafer and chuck between often be would tend to occur
Problem, improve the reliability of semiconductor fabrication process.
Accompanying drawing explanation
Fig. 1 is the structural representation of chuck of the prior art；
Fig. 2 is the structural representation of the spacing thimble of this utility model embodiment；
Fig. 3 is the top view of the spacing thimble of this utility model embodiment.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model is described in further detail.According to following explanation and power
Profit claim, advantage of the present utility model and feature will be apparent from.It should be noted that, accompanying drawing all use the form simplified very much and
All use non-ratio accurately, only in order to purpose convenient, aid illustration this utility model embodiment lucidly.
Hereinafter describing is only the description to this utility model preferred embodiment, not to any restriction of the present utility model,
Any change that the those of ordinary skill in this utility model field does according to the disclosure above content, modification, belong to claim
The protection domain of book.
Inventor studies discovery, after chuck uses a period of time, less desirable wafer and chuck often be would tend to occur
Between the reason moved relative to each other be: after a period of operation, often there is mill in various degree in spacing thimble
Damage, the most just have impact on its spacing or fixing wafer, prevent the wafer purpose relative to the lateral displacement of chuck.Therefore, this reality
Being by novel core concept, be set to multiple by the quantity in the thimble portion of spacing thimble, multiple described thimble portions can divide
Do not clamp wafer, thus decrease the working time in each thimble portion, it is possible to reduce the abrasion of spacing thimble；Additionally, work as
When the fracture of one of them thimble portion or other disappearance, other thimble portion can play replacement effect, thus prevent wafer
Spacing or solid failure.
As shown in Figures 2 and 3, in the present embodiment, spacing thimble includes: limiting section 110 is connected with described limiting section
The thimble portion 130 that pedestal 120 is connected with described pedestal 120, the quantity in described thimble portion 130 is multiple.
Preferably, described thimble portion 130 is that cylinder or Elliptic Cylinder, cylinder or Elliptic Cylinder have smooth table
Face, provides preferably contact surface for clamping wafer.Additionally, thimble portion can also be the shape such as triangular prism, quadrangular, other is not advised
Shape then also can play the effect in thimble portion, but use only preferably selection in the present embodiment.In preferred version, described
The quantity in thimble portion is two, both can reach the service life improving spacing thimble, two thimbles simultaneously by two thimble portions
The design in portion makes two thimble portions separately keep a segment distance, can reduce displacement when described thimble portion moves, thus
Quicker and stable clamping wafer, prevents wafer from rocking.
In the present embodiment, described pedestal 120 is a cone, and the design of cone can realize installing easily.Preferably
, described pedestal 120 is additionally provided with some grooves and/or protruding 121, prevents from making by described groove and/or protruding 121
During with, described spacing thimble comes off.
Preferably, described limiting section 110 being additionally provided with azimuth mark 111, described azimuth mark 111 is used for identifying described
The orientation in thimble portion 130, when installing described spacing thimble can the position in conveniently identification thimble portion, this embodiment party
Azimuth mark 111 described in formula uses a triangular marker, and other arbitrary graphic labelling can play mark action, such as arrow
Head, whippletree etc..In preferred version, described azimuth mark 111 is positioned on the center line in said two thimble portion 130, described for installing
Pinpoint effect can be played during spacing thimble.Further, described azimuth mark 111 is arranged on described limiting section 110
One side near described pedestal 120 or the another side away from described pedestal 120, thus realize conveniently recognized purpose further.
This utility model also provides for a kind of chuck, and described chuck includes lower substrate, the upper base being arranged on described lower substrate
Body and be arranged on the described spacing thimble on described upper matrix.Clamped by described spacing thimble and place on described upper matrix
Wafer.Preferably, the quantity of described spacing thimble is multiple, can well be clamped the mesh of wafer by multiple spacing thimbles
, thus prevent wafer relative to rotating against between lateral displacement and wafer and the chuck of chuck.Preferably, described many
Individual spacing thimble is uniformly distributed on matrix on described, reaches most preferably to clamp the effect of wafer by equally distributed spacing thimble
Really.It should be noted that the quantity of spacing thimble is the most, the position-limiting action that spacing thimble rises is the best, but can improve and produce into
The time of spacing thimble is installed in this and increase, and the size that the quantity of spacing thimble also needs to according to wafer size is rationally selected
Select.
Start to introduce the operation principle of chuck below, with continued reference to shown in Fig. 3, in the present embodiment, when chuck starts to turn
Time dynamic, described thimble portion 130 can turn to diplopia position clamping wafer along one of them direction of arrow, thus is limited by several
The thimble portion 130 of position thimble clamps the wafer being placed on matrix；When chuck prepare stop operating need slow down time, described top
Pin portion 130 can turn to another diplopia position clamping wafer along another direction of arrow.
As fully visible, in the spacing thimble that this utility model embodiment provides, it is multiple designs by thimble portion, many
Individual thimble portion can clamp wafer respectively, thus decreases the working time in each thimble portion, it is possible to reduce spacing thimble
Abrasion；Additionally, when the fracture of one of them thimble portion or other disappearance, replacement effect can be played by other thimble portion, from
And prevent the spacing of wafer or solid failure, it is to avoid often would tend to occur less desirable after chuck uses a period of time
The problem moved relative to each other between wafer and chuck, improves the reliability of semiconductor fabrication process.
Above are only preferred embodiment of the present utility model, this utility model is not played any restriction effect.
Any person of ordinary skill in the field, in the range of without departing from the technical solution of the utility model, to this utility model
The technical scheme disclosed and technology contents make the variations such as any type of equivalent or amendment, all belong to without departing from this utility model
The content of technical scheme, within still falling within protection domain of the present utility model.
Claims (11)
1. a spacing thimble, it is characterised in that described spacing thimble includes: limiting section, the base being arranged on described limiting section
Seat and the thimble portion being arranged on described pedestal, the quantity in described thimble portion is multiple.
Spacing thimble the most as claimed in claim 1, it is characterised in that described thimble portion is shaped as cylinder or cylindroid
Body.
Spacing thimble the most as claimed in claim 1, it is characterised in that described pedestal be shaped as cone.
Spacing thimble the most as claimed in claim 1, it is characterised in that be provided with on described limiting section for identifying described thimble
The azimuth mark in portion.
Spacing thimble the most as claimed in claim 4, it is characterised in that the quantity in described thimble portion is two.
Spacing thimble the most as claimed in claim 5, it is characterised in that described azimuth mark is positioned in two described thimble portions
On line.
7. the spacing thimble as according to any one of claim 4～6, it is characterised in that described azimuth mark is arranged at described
One side near pedestal or the another side away from pedestal on limiting section.
8. the spacing thimble as according to any one of claim 1～6, it is characterised in that be provided with on described pedestal groove and/
Or it is protruding.
9. a chuck, it is characterised in that described chuck includes lower substrate, the upper matrix being arranged on described lower substrate and such as
Spacing thimble according to any one of claim 1～8, described spacing thimble is arranged on described upper matrix.
10. chuck as claimed in claim 9, it is characterised in that the quantity of described spacing thimble is multiple.
11. chucks as claimed in claim 10, it is characterised in that multiple described spacing thimbles uniformly divide on matrix on described
Cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620554986.1U CN205845925U (en) | 2016-06-02 | 2016-06-02 | Spacing thimble and chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620554986.1U CN205845925U (en) | 2016-06-02 | 2016-06-02 | Spacing thimble and chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205845925U true CN205845925U (en) | 2016-12-28 |
Family
ID=57623972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620554986.1U Expired - Fee Related CN205845925U (en) | 2016-06-02 | 2016-06-02 | Spacing thimble and chuck |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205845925U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
| CN112185885A (en) * | 2020-12-01 | 2021-01-05 | 西安奕斯伟硅片技术有限公司 | Chuck pin for clamping silicon wafer and device for holding silicon wafer |
-
2016
- 2016-06-02 CN CN201620554986.1U patent/CN205845925U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110034062A (en) * | 2019-04-19 | 2019-07-19 | 德淮半导体有限公司 | Wafer clamping device and chuck |
| CN112185885A (en) * | 2020-12-01 | 2021-01-05 | 西安奕斯伟硅片技术有限公司 | Chuck pin for clamping silicon wafer and device for holding silicon wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161228 Termination date: 20190602 |