CN205826585U - A kind of laminated type gas-sensitive sensor structure - Google Patents

A kind of laminated type gas-sensitive sensor structure Download PDF

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Publication number
CN205826585U
CN205826585U CN201620286102.9U CN201620286102U CN205826585U CN 205826585 U CN205826585 U CN 205826585U CN 201620286102 U CN201620286102 U CN 201620286102U CN 205826585 U CN205826585 U CN 205826585U
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Prior art keywords
substrate
sensor
wire
sensitive
bead
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CN201620286102.9U
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马骏
王毅
肖周
吴建昆
云付珍
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KUNMING GUIYAN JINFENG TECHNOLOGY Co Ltd
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KUNMING GUIYAN JINFENG TECHNOLOGY Co Ltd
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Abstract

The utility model proposes a kind of laminated type gas-sensitive sensor structure, have and use and combine feature flexibly.It uses ceramic substrate as hierarchical element, it is processed porose, middle fixing gas sensor bead, and bead is fixed on the electrode cable of substrate by lead-in wire, then by drawing wire at the extraction electrode on substrate;It is bonded together by binding material between substrate, the Kong Shi UNICOM between substrate.Type and the compound mode of substrate can be changed, it is achieved simple function or the detection of multi-functional air-sensitive according to application requirement.

Description

A kind of laminated type gas-sensitive sensor structure
Technical field
This utility model relates to gas sensor field, mainly proposes a kind of new gas-sensitive sensor structure and system thereof Make method.
Background technology
Gas sensor is the class in numerous sensor, according to the difference of its operation principle, can be divided into burning Thing semiconductor-type, catalytic combustion type, electric chemical formula, optics (as infrared) formula, heat-conducted, high temperature ionized, photoionization etc. are many Type gas sensor, is producing and is playing an important role in life.In sensor production process, conventional manufacture work Skill: ball, chip and semiconductor technology, can select the structure and production matched according to the sensor of different operation principles Technique.
Ball: also referred to as wire wrap technique, makes spiral by heater strip or sensing filament winding, and spiral can take hollow coiling Porcelain tube etc. can also be utilized to do skeleton coiling, and coated carrier and gas sensitive thereon, ultimately form the sensing of spheroidal Device structure.This structure has employed a lot of year the most, is the most still being widely used.
Chip: convenient for large-scale production, it is simple to use silk-screen printing technique, each ingredient of sensor is pressed chip Structure is combined, and partly leads as patent " sheet-type gas sensor CN201575984U " proposes a kind of common metal-oxide Body material chip gas-sensitive sensor structure, measures film respectively by air-sensitive and heating film is coated in the upper and lower surface of substrate, It is drawn out to again on device pedestal be assembled into sensor.Additionally, oxygen sensor in use for car is the most progressively tied to chip from tubular structure Allosteric transformation, patent " manufacture method of a kind of chip oxygen sensor and chip oxygen sensor CN102288664A " elaborates that this type of passes The processing technology of sensor and method.
Semiconductor technology: the sensor bulk made due to traditional ball and chip is relatively big, and semiconductor technology Automaticity is high, and the gas sensor volume of making is little, concordance good, such as infrared type CO2The substantially all employing such as sensor Semiconductor technology produces, and the MEMS (MEMS) occurred the most in semiconductor technology more accelerates sensor field Progress, gas sensor also towards this direction development.
In the most common sensor, metal-oxide semiconductor (MOS) formula, catalytic combustion type mainly use ball and chip to enter Row manufactures and produces.Oxygen sensor in use for car then has tubular type and two kinds of structures of chip.The present invention proposes one and combines ball and sheet The novel gas-sensitive sensor structure of formula sensor advantage, and lamination can be carried out by multi-disc difference gas sensor unit Encapsulation, it is achieved multifunctional gas-sensitive detects, such as the detection function of multiple gases object, gas concentration+temperature etc..
Utility model content
Laminated type gas-sensitive sensor structure of the present utility model be use ceramic substrate as hierarchical element, by a piece of or many Sheet substrate stack is constituted, and it is processed porose, is used for installing sensor sensing bead;Hole between substrate interconnects, middle solid Determining sensor sensing bead, sensitive bead is fixed on the electrode cable of substrate by lead-in wire, then by the extraction electricity on substrate Draw wire at pole, be bonded together by binding material between substrate, type and the group of substrate can be changed according to application requirement Conjunction mode, it is achieved simple function or the detection of multi-functional air-sensitive.
Extraction electrode on described substrate has two, three, four, five or six.
Extraction electrode on the electrode cable of described substrate and substrate uses platinum, gold, palladium, ruthenium or silver paste, or mixing makes With.
It is coated with aluminium oxide or vitreous body inert material on described substrate, and uses as the binding agent between substrate.
Described sensor substrate unit, its stacking number of plies can be one layer and arrive Floor 12.
Accompanying drawing explanation
Fig. 1 laminated type gas-sensitive sensor structure schematic diagram.
Fig. 2 two polar stack formula gas-sensitive sensor structure schematic diagram.
In Fig. 1 and Fig. 2, ceramic material substrate 1, central authorities' processing manhole 2, gas sensor bead 3, conductive electrode draws Line 4, extraction electrode 5, metal lead wire 6.
Detailed description of the invention
Laminated type gas-sensitive sensor structure of the present utility model is as it is shown in figure 1, laminated type gas sensor can be by one layer Or the unit composition of monolithic multilayer structure, each slice structure unit has following structure, and at ceramic material substrate 1, central authorities add Work manhole 2, shape of through holes can be circular or square according to requirements, and gas sensor bead 3 is placed in through hole central authorities, and It is fixed on conductive electrode lead-in wire 4 by the lead-in wire of sensor bead, is provided with extraction electrode 5 in substrate outer, electrode passes through The means such as soldering, electric resistance welding or Laser Welding are connected with metal lead wire 6, and are fixed on external devices pedestal.
According to the number of sensor bead lead-out wire, electrode on substrate and lead-out wire etc. can also change accordingly, as Catalytic sensor can only use two electrode structures.As shown in Figure 2.
By using binding material between above-mentioned chip unit, such as vitreous body or Al2O3Materials etc., bond chip unit Together, its thermal coefficient of expansion matches with substrate, prevents from ftractureing between layers.Binding material is coated with the form of thick film screen printing It is layed onto on substrate, and is sintered at 600~800 DEG C.After sintering, the hole UNICOM from each other in the middle of substrate, ventable, shape Become unified entirety.Each group is drawn out on sensor package casing, ultimately forms operational gas sensitive element device.
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.Should correct understanding It is: the method in embodiment of the present utility model is only used for this utility model being described rather than to limit of the present utility model System.
Embodiment one
Catalytic combustion type sensor, is to utilize imflammable gas flameless combustion to occur on catalyst material, to combustible gas Bulk concentration carries out the class sensor detected, and its structure is formed spherical for wrapping on platinum filament coil with aluminium oxide and binding agent, warp After sintering, outer surface applies the noble metal catalyst such as platinum, palladium, and platinum filament is passed to electric current, make detecting element keep high temperature (300~ 500 DEG C), when there is catalytic reaction, combustion reaction liberated heat makes the temperature of platinum filament coil raise, and the resistance value of coil is upper Rise.Measure the size of platinum wire resistance value change it is known that the concentration of fuel gas.Frequently with Hui Sidun electricity in actual application Bridge measuring circuit measures, and one arm is the detecting element being loaded with catalyst, and another arm is the compensation unit of not supported catalyst Part.
The ceramic substrate of the 10mm × 10mm using thickness to be 1.0mm, heart position processes a diameter of Φ 2mm's wherein Hole, places the catalysis detection sensor bead of a diameter of Φ 0.8mm in hole, and the platinum filament lead-in wire at bead two ends is connected to ceramics and leads On electricity contact conductor, structure is as in figure 2 it is shown, be fixed to platinum filament on extraction electrode use as lead-out wire.In the same way, Put into catalysis in the substrate and compensate bead.Two panels ceramics is bonded together by glass paste, and is fixed to pass by platinum lead-in wire Sensor package header forms sensor.
Embodiment two
The metal-oxide semiconductor (MOS) bead of a diameter of 1.5mm, is mainly made up of SnO2, glass binder etc., and component is not It is the same that it is the most different to the sensitivity of gas with various.It has two groups four lead-in wires, and one of which is heat lead, and other one Group is detecting electrode, is respectively fixed on extraction electrode.Sensing bead is heated to 300~400 DEG C of temperature ranges, when touching During tested gas, its resistance value changes.Bead is fixed on thick 2.0mm, and profile is on the substrate of 8mm × 8mm, structure such as figure Shown in 1.This substrate can be independently operated, after drawing lead-in wire when needing multiple gases synchronous detecting, it is possible to use the gold of different component Belong to oxide semiconductor material bead substrate, use after being processed by lamination together, in this instance, substrate when lamination uses Thickness to thicken more than 2.0mm.

Claims (1)

1. a laminated type gas-sensitive sensor structure, it is characterised in that: employing ceramic substrate is as hierarchical element, by a piece of or many Sheet substrate stack is constituted, and it is processed porose, and the hole between substrate interconnects, middle fixing sensor sensing bead, sensitive little Ball is fixed on the electrode cable of substrate by lead-in wire, then by drawing wire at the extraction electrode on substrate, passes through between substrate Binding material is bonded together,
Extraction electrode on described substrate has two, three, four, five or six, on the electrode cable of substrate and substrate Extraction electrode use platinum, gold, palladium, ruthenium or silver paste,
It is coated with aluminium oxide or vitreous body inert material on described substrate, and uses as the binding agent between substrate,
Described employing ceramic substrate is as hierarchical element, and its hierarchical element stacking number of plies can be one layer and arrive Floor 12.
CN201620286102.9U 2016-04-08 2016-04-08 A kind of laminated type gas-sensitive sensor structure Active CN205826585U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620286102.9U CN205826585U (en) 2016-04-08 2016-04-08 A kind of laminated type gas-sensitive sensor structure

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703189A (en) * 2017-10-14 2018-02-16 郑州炜盛电子科技有限公司 The ceramic package of MEMS gas sensors and module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703189A (en) * 2017-10-14 2018-02-16 郑州炜盛电子科技有限公司 The ceramic package of MEMS gas sensors and module

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