CN205826585U - A kind of laminated type gas-sensitive sensor structure - Google Patents
A kind of laminated type gas-sensitive sensor structure Download PDFInfo
- Publication number
- CN205826585U CN205826585U CN201620286102.9U CN201620286102U CN205826585U CN 205826585 U CN205826585 U CN 205826585U CN 201620286102 U CN201620286102 U CN 201620286102U CN 205826585 U CN205826585 U CN 205826585U
- Authority
- CN
- China
- Prior art keywords
- substrate
- sensor
- wire
- sensitive
- bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model proposes a kind of laminated type gas-sensitive sensor structure, have and use and combine feature flexibly.It uses ceramic substrate as hierarchical element, it is processed porose, middle fixing gas sensor bead, and bead is fixed on the electrode cable of substrate by lead-in wire, then by drawing wire at the extraction electrode on substrate;It is bonded together by binding material between substrate, the Kong Shi UNICOM between substrate.Type and the compound mode of substrate can be changed, it is achieved simple function or the detection of multi-functional air-sensitive according to application requirement.
Description
Technical field
This utility model relates to gas sensor field, mainly proposes a kind of new gas-sensitive sensor structure and system thereof
Make method.
Background technology
Gas sensor is the class in numerous sensor, according to the difference of its operation principle, can be divided into burning
Thing semiconductor-type, catalytic combustion type, electric chemical formula, optics (as infrared) formula, heat-conducted, high temperature ionized, photoionization etc. are many
Type gas sensor, is producing and is playing an important role in life.In sensor production process, conventional manufacture work
Skill: ball, chip and semiconductor technology, can select the structure and production matched according to the sensor of different operation principles
Technique.
Ball: also referred to as wire wrap technique, makes spiral by heater strip or sensing filament winding, and spiral can take hollow coiling
Porcelain tube etc. can also be utilized to do skeleton coiling, and coated carrier and gas sensitive thereon, ultimately form the sensing of spheroidal
Device structure.This structure has employed a lot of year the most, is the most still being widely used.
Chip: convenient for large-scale production, it is simple to use silk-screen printing technique, each ingredient of sensor is pressed chip
Structure is combined, and partly leads as patent " sheet-type gas sensor CN201575984U " proposes a kind of common metal-oxide
Body material chip gas-sensitive sensor structure, measures film respectively by air-sensitive and heating film is coated in the upper and lower surface of substrate,
It is drawn out to again on device pedestal be assembled into sensor.Additionally, oxygen sensor in use for car is the most progressively tied to chip from tubular structure
Allosteric transformation, patent " manufacture method of a kind of chip oxygen sensor and chip oxygen sensor CN102288664A " elaborates that this type of passes
The processing technology of sensor and method.
Semiconductor technology: the sensor bulk made due to traditional ball and chip is relatively big, and semiconductor technology
Automaticity is high, and the gas sensor volume of making is little, concordance good, such as infrared type CO2The substantially all employing such as sensor
Semiconductor technology produces, and the MEMS (MEMS) occurred the most in semiconductor technology more accelerates sensor field
Progress, gas sensor also towards this direction development.
In the most common sensor, metal-oxide semiconductor (MOS) formula, catalytic combustion type mainly use ball and chip to enter
Row manufactures and produces.Oxygen sensor in use for car then has tubular type and two kinds of structures of chip.The present invention proposes one and combines ball and sheet
The novel gas-sensitive sensor structure of formula sensor advantage, and lamination can be carried out by multi-disc difference gas sensor unit
Encapsulation, it is achieved multifunctional gas-sensitive detects, such as the detection function of multiple gases object, gas concentration+temperature etc..
Utility model content
Laminated type gas-sensitive sensor structure of the present utility model be use ceramic substrate as hierarchical element, by a piece of or many
Sheet substrate stack is constituted, and it is processed porose, is used for installing sensor sensing bead;Hole between substrate interconnects, middle solid
Determining sensor sensing bead, sensitive bead is fixed on the electrode cable of substrate by lead-in wire, then by the extraction electricity on substrate
Draw wire at pole, be bonded together by binding material between substrate, type and the group of substrate can be changed according to application requirement
Conjunction mode, it is achieved simple function or the detection of multi-functional air-sensitive.
Extraction electrode on described substrate has two, three, four, five or six.
Extraction electrode on the electrode cable of described substrate and substrate uses platinum, gold, palladium, ruthenium or silver paste, or mixing makes
With.
It is coated with aluminium oxide or vitreous body inert material on described substrate, and uses as the binding agent between substrate.
Described sensor substrate unit, its stacking number of plies can be one layer and arrive Floor 12.
Accompanying drawing explanation
Fig. 1 laminated type gas-sensitive sensor structure schematic diagram.
Fig. 2 two polar stack formula gas-sensitive sensor structure schematic diagram.
In Fig. 1 and Fig. 2, ceramic material substrate 1, central authorities' processing manhole 2, gas sensor bead 3, conductive electrode draws
Line 4, extraction electrode 5, metal lead wire 6.
Detailed description of the invention
Laminated type gas-sensitive sensor structure of the present utility model is as it is shown in figure 1, laminated type gas sensor can be by one layer
Or the unit composition of monolithic multilayer structure, each slice structure unit has following structure, and at ceramic material substrate 1, central authorities add
Work manhole 2, shape of through holes can be circular or square according to requirements, and gas sensor bead 3 is placed in through hole central authorities, and
It is fixed on conductive electrode lead-in wire 4 by the lead-in wire of sensor bead, is provided with extraction electrode 5 in substrate outer, electrode passes through
The means such as soldering, electric resistance welding or Laser Welding are connected with metal lead wire 6, and are fixed on external devices pedestal.
According to the number of sensor bead lead-out wire, electrode on substrate and lead-out wire etc. can also change accordingly, as
Catalytic sensor can only use two electrode structures.As shown in Figure 2.
By using binding material between above-mentioned chip unit, such as vitreous body or Al2O3Materials etc., bond chip unit
Together, its thermal coefficient of expansion matches with substrate, prevents from ftractureing between layers.Binding material is coated with the form of thick film screen printing
It is layed onto on substrate, and is sintered at 600~800 DEG C.After sintering, the hole UNICOM from each other in the middle of substrate, ventable, shape
Become unified entirety.Each group is drawn out on sensor package casing, ultimately forms operational gas sensitive element device.
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.Should correct understanding
It is: the method in embodiment of the present utility model is only used for this utility model being described rather than to limit of the present utility model
System.
Embodiment one
Catalytic combustion type sensor, is to utilize imflammable gas flameless combustion to occur on catalyst material, to combustible gas
Bulk concentration carries out the class sensor detected, and its structure is formed spherical for wrapping on platinum filament coil with aluminium oxide and binding agent, warp
After sintering, outer surface applies the noble metal catalyst such as platinum, palladium, and platinum filament is passed to electric current, make detecting element keep high temperature (300~
500 DEG C), when there is catalytic reaction, combustion reaction liberated heat makes the temperature of platinum filament coil raise, and the resistance value of coil is upper
Rise.Measure the size of platinum wire resistance value change it is known that the concentration of fuel gas.Frequently with Hui Sidun electricity in actual application
Bridge measuring circuit measures, and one arm is the detecting element being loaded with catalyst, and another arm is the compensation unit of not supported catalyst
Part.
The ceramic substrate of the 10mm × 10mm using thickness to be 1.0mm, heart position processes a diameter of Φ 2mm's wherein
Hole, places the catalysis detection sensor bead of a diameter of Φ 0.8mm in hole, and the platinum filament lead-in wire at bead two ends is connected to ceramics and leads
On electricity contact conductor, structure is as in figure 2 it is shown, be fixed to platinum filament on extraction electrode use as lead-out wire.In the same way,
Put into catalysis in the substrate and compensate bead.Two panels ceramics is bonded together by glass paste, and is fixed to pass by platinum lead-in wire
Sensor package header forms sensor.
Embodiment two
The metal-oxide semiconductor (MOS) bead of a diameter of 1.5mm, is mainly made up of SnO2, glass binder etc., and component is not
It is the same that it is the most different to the sensitivity of gas with various.It has two groups four lead-in wires, and one of which is heat lead, and other one
Group is detecting electrode, is respectively fixed on extraction electrode.Sensing bead is heated to 300~400 DEG C of temperature ranges, when touching
During tested gas, its resistance value changes.Bead is fixed on thick 2.0mm, and profile is on the substrate of 8mm × 8mm, structure such as figure
Shown in 1.This substrate can be independently operated, after drawing lead-in wire when needing multiple gases synchronous detecting, it is possible to use the gold of different component
Belong to oxide semiconductor material bead substrate, use after being processed by lamination together, in this instance, substrate when lamination uses
Thickness to thicken more than 2.0mm.
Claims (1)
1. a laminated type gas-sensitive sensor structure, it is characterised in that: employing ceramic substrate is as hierarchical element, by a piece of or many
Sheet substrate stack is constituted, and it is processed porose, and the hole between substrate interconnects, middle fixing sensor sensing bead, sensitive little
Ball is fixed on the electrode cable of substrate by lead-in wire, then by drawing wire at the extraction electrode on substrate, passes through between substrate
Binding material is bonded together,
Extraction electrode on described substrate has two, three, four, five or six, on the electrode cable of substrate and substrate
Extraction electrode use platinum, gold, palladium, ruthenium or silver paste,
It is coated with aluminium oxide or vitreous body inert material on described substrate, and uses as the binding agent between substrate,
Described employing ceramic substrate is as hierarchical element, and its hierarchical element stacking number of plies can be one layer and arrive Floor 12.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620286102.9U CN205826585U (en) | 2016-04-08 | 2016-04-08 | A kind of laminated type gas-sensitive sensor structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620286102.9U CN205826585U (en) | 2016-04-08 | 2016-04-08 | A kind of laminated type gas-sensitive sensor structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205826585U true CN205826585U (en) | 2016-12-21 |
Family
ID=58148267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620286102.9U Active CN205826585U (en) | 2016-04-08 | 2016-04-08 | A kind of laminated type gas-sensitive sensor structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205826585U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107703189A (en) * | 2017-10-14 | 2018-02-16 | 郑州炜盛电子科技有限公司 | The ceramic package of MEMS gas sensors and module |
-
2016
- 2016-04-08 CN CN201620286102.9U patent/CN205826585U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107703189A (en) * | 2017-10-14 | 2018-02-16 | 郑州炜盛电子科技有限公司 | The ceramic package of MEMS gas sensors and module |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5313908B2 (en) | Hydrogen sensitive composite material, hydrogen gas sensor, and sensor for detecting hydrogen and other gases with improved reference resistance | |
US9494548B2 (en) | Gas sensor | |
JP2022530944A (en) | Heat ray type gas sensor chip, sensor and manufacturing method of sensor | |
EP3081930A1 (en) | Gas detection device and method thereof | |
CN205720077U (en) | Semiconductor gas sensor and encapsulating structure thereof | |
CN205826585U (en) | A kind of laminated type gas-sensitive sensor structure | |
CN105758899B (en) | A kind of laminated type gas-sensitive sensor structure and its manufacturing method | |
JP2020034348A (en) | Particulate matter detection sensor element | |
JP4376093B2 (en) | Thin film gas sensor | |
CN104931559B (en) | A kind of Oxynitride sensor chip and preparation method thereof | |
JP2007017217A (en) | Thin film gas sensor | |
JP4084593B2 (en) | Oxygen sensor element | |
JP2020165896A (en) | Mems-type semiconductor gas sensing element | |
JP5212286B2 (en) | Thin film gas sensor and method of manufacturing thin film gas sensor | |
JP6679787B1 (en) | MEMS type semiconductor gas detector | |
JP3814549B2 (en) | Oxygen sensor element | |
JP5115247B2 (en) | Gas sensor element | |
CN110865100A (en) | Sheet-type structure integrated catalytic combustion type combustible gas sensor and preparation method thereof | |
WO2020203100A1 (en) | Mems-type semiconductor gas detection element | |
CN104597087A (en) | Manufacturing method of gas sensor chip | |
JP2020034349A (en) | Particulate matter detection sensor element | |
JP7421442B2 (en) | MEMS type semiconductor gas detection element | |
JP7421441B2 (en) | MEMS type semiconductor gas detection element | |
CN206164873U (en) | Embedded heater of nitric oxide sensor label | |
JP6805852B2 (en) | Gas sensor element and manufacturing method of gas sensor element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |