CN205818202U - Silicon ingot truncated system - Google Patents
Silicon ingot truncated system Download PDFInfo
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- CN205818202U CN205818202U CN201620485193.9U CN201620485193U CN205818202U CN 205818202 U CN205818202 U CN 205818202U CN 201620485193 U CN201620485193 U CN 201620485193U CN 205818202 U CN205818202 U CN 205818202U
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- silicon ingot
- truncated system
- intercept unit
- ingot
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Abstract
This utility model provides a kind of silicon ingot truncated system, and this silicon ingot truncated system includes: silicon ingot intercept unit, for silicon ingot is blocked operation to form silicon cube；And silicon ingot storage equipment, it is positioned at the front end of described silicon ingot intercept unit, for storing silicon ingot and the described silicon ingot stored being delivered to described silicon ingot intercept unit.Compared to prior art, this utility model bag silicon ingot truncated system, can be stored in unified for silicon ingot to be blocked in silicon ingot storage equipment well, when blocking, the silicon ingot of storage is then delivered to from silicon ingot storage equipment silicon ingot intercept unit carry out blocking operation to form silicon cube, it is simple to the storage of silicon ingot and conveying and block efficiency and be substantially improved.
Description
Technical field
This utility model relates to work pieces process technical field, particularly relates to silicon ingot truncated system.
Background technology
Line cutting technology is the most more advanced evolution process technology, and its principle is by high-speed motion
Workpiece to be processed (such as: silicon ingot, sapphire or other quasiconductor hard brittle materials) is rubbed by diamond wire, the side's of cutting out ingot, from
And reach to cut purpose.In the cutting process to workpiece, the diamond wire guiding by guide roller, main line roller forms one
Gauze, and workpiece to be processed realizes the feeding of workpiece by the rise and fall of workbench, under the effect of compression pump, is assemblied in and sets
Cooling water is sprayed to the cutting position of diamond wire and workpiece by standby upper cooling water automatic spraying device, diamond wire move back and forth
Produce cutting, so that the hard brittle materials such as quasiconductor are cut into polylith the most simultaneously.Line cutting technology and traditional knife saw sheet, emery wheel
Sheet and inner circle cutting are compared has efficiency height, production capacity height, precision advantages of higher.
But, current silicon ingot intercept unit yet suffers from deficiency, and the most current linear cutting equipment once can only be to one
Individual thing to be cut cuts, and can only repeatedly perform repeatedly to process multiple workpiece, and efficiency is the lowest.It addition, required section
The quantity of disconnected workpiece to be processed is many, and the storage of workpiece to be processed and carrying are a great problems, has that efficiency is low, potential safety hazard is big
Etc. problem.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide silicon ingot truncated system, is used for
Solve in prior art that silicon ingot blocks inefficiency, the storage of silicon ingot to be processed and handling efficiency is low and potential safety hazard is big etc. asks
Topic.
For achieving the above object and other purposes, this utility model provides a kind of silicon ingot truncated system on the one hand, including:
For silicon ingot being blocked operation to form the silicon ingot intercept unit of silicon cube；For storing silicon ingot the described silicon that will store
Ingot is delivered to the silicon ingot storage equipment of described silicon ingot intercept unit, and described silicon ingot storage equipment is positioned at described silicon ingot intercept unit
Front end.
This utility model silicon ingot truncated system, including silicon ingot intercept unit and silicon ingot storage equipment, can cut waiting well
Disconnected silicon ingot is unified to be stored in silicon ingot storage equipment, when blocking, is then delivered to by the silicon ingot of storage from silicon ingot storage equipment
Silicon ingot intercept unit carries out blocking operation to form silicon cube, it is simple to the storage of silicon ingot and conveying and block efficiency and be substantially improved.
Alternatively, described silicon ingot intercept unit includes: block support；Silicon ingot load carrier, be located at described in block on support；
Described silicon ingot load carrier includes the first station platform and the second station platform of transposition, described first station platform and institute
State the multiple load plates being equipped with on the second station platform for carrying described silicon ingot；Wire cutting mechanism, be located at described in block support
On, including the line cutter unit for cutting described silicon ingot.
Alternatively, described load plate is provided with turns mechanism, described load plate under the described driving turning mechanism in horizontal plane
Rotate 180 ° so that the position end to end of polysilicon to be cut is exchanged.
Alternatively, described silicon ingot storage equipment includes: material seat；Material bracing frame, is located on described material seat；For carrying week
Turn the silicon ingot turnover carrier of described silicon ingot, be located on described material bracing frame.
Alternatively, described silicon ingot turnover carrying machine includes: drive mechanism, is located at bottom described material bracing frame；At least one week
Rotation mechanism, is located at least one sidepiece of described material bracing frame；Send part for carrying and having enough to meet the need multiple the holding of described silicon ingot, be located at institute
State on epicyclical mechanism and have enough to meet the need motion with described epicyclical mechanism.
Alternatively, described drive mechanism includes: drive motor；Drive sprocket, is linked in described driving motor；Drive chain
Bar, is configured on described drive sprocket.
Alternatively, described epicyclical mechanism includes: a pair week rotary chain wheel, is respectively arranged on sidepiece upper and lower of described material bracing frame
Two ends；At least one week rotary chain wheel in the pair of all rotary chain wheels is linked in described drive mechanism；Turnover chain, is configured at institute
State on a pair week rotary chain wheel.
Alternatively, described in hold and send part to include: connecting portion, be fixedly connected on described epicyclical mechanism；Hold that to send portion, axle to be connected to described
Connecting portion；The described portion of sending of holding has the plummer for carrying described silicon ingot.
Alternatively, described silicon ingot truncated system also includes: for being transferred to from described silicon ingot storage equipment by described silicon ingot
First work piece transfer apparatus of described silicon ingot intercept unit, be located at described silicon ingot storage equipment and described silicon ingot intercept unit it
Between.
Accompanying drawing explanation
Fig. 1 is this utility model silicon ingot truncated system structural representation in one embodiment.
Fig. 2 is the structural representation of silicon ingot storage equipment in this utility model silicon ingot truncated system.
Fig. 3 be in this utility model silicon ingot truncated system silicon ingot intercept unit and the first work piece transfer apparatus at the first visual angle
Under structural representation.
Fig. 4 be in this utility model silicon ingot truncated system silicon ingot intercept unit and the first work piece transfer apparatus at the second visual angle
Under structural representation.
Fig. 5 is to block cleaning equipment and the structural representation of second workpiece transfer equipment in this utility model silicon ingot truncated system
Figure.
Fig. 6 is the enlarged diagram of circled in Fig. 5.
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model being described below, those skilled in the art can be by this
Content disclosed by description understands other advantages of the present utility model and effect easily.
Refer to Fig. 1 to Fig. 5.It should be clear that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to
Coordinate the content disclosed in description, understand for those skilled in the art and read, being not limited to this utility model
Enforceable qualifications, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment, under not affecting effect that this utility model can be generated by and the purpose that can reach, all should still fall new in this practicality
In the range of technology contents disclosed in type obtains and can contain.Meanwhile, in this specification cited as " on ", D score, " left ",
The term of " right ", " middle " and " one " etc., is merely convenient to understanding of narration, and it is enforceable to be not used to limit this utility model
Scope, being altered or modified of its relativeness, changing under technology contents without essence, enforceable when being also considered as this utility model
Category.
Referring to Fig. 1, this utility model silicon ingot truncated system includes: silicon ingot storage equipment 1 and silicon ingot intercept unit 2.
Silicon ingot storage equipment 1, for storing silicon ingot 40 and the silicon ingot 40 of storage being delivered to silicon ingot intercept unit 2.Please continue
Continuous refering to Fig. 2, for the structural representation of silicon ingot storage equipment 1 in this utility model silicon ingot truncated system.In conjunction with Fig. 1 and Fig. 2, silicon
Ingot storage equipment 1 farther includes: material seat 11；Material bracing frame 13；Silicon ingot turnover carrier 15.
Material seat 11, is respectively provided with as the main element of silicon ingot storage equipment 1, material bracing frame 13 and silicon ingot turnover carrier 15
On material seat 11.In the present embodiment, material seat 11 is preferably a disc structure (such as cast iron disk or steel disc), described circle
Dish uses the metal material that quality is bigger so that the overall center of gravity of silicon ingot storage equipment 1 is sunk, and improves silicon ingot storage equipment 1
Stable degree.
Material bracing frame 13, is located on material seat 11.In the present embodiment, material bracing frame 13 is preferably a flat column support body.
Silicon ingot turnover carrier 15, is located on material bracing frame 13, is used for carrying and have enough to meet the need silicon ingot 40.
Specifically, silicon ingot turnover carrier 15 includes: drive mechanism；At least one epicyclical mechanism 14；Hold and send part 16.
Drive mechanism, is located at the bottom of material bracing frame 13.In the present embodiment, described drive mechanism includes: drive motor
121, it is located at the bottom of material bracing frame 13；Drive sprocket 123, is linked in driving motor 121；Drive chain 125, be configured at driving
On sprocket wheel 123.
At least one epicyclical mechanism 14, is located at least one sidepiece of material bracing frame 13.In the present embodiment, epicyclical mechanism 14 is
A pair, it is respectively arranged on two as the flat column support body expecting bracing frame 13 and is mounted opposite on cylinder.Each epicyclical mechanism 14
All include: a pair week rotary chain wheel 141, be respectively arranged on the two ends up and down of the sidepiece (that is, install cylinder) of material bracing frame 13, a pair week
At least one week rotary chain wheel 141 in rotary chain wheel 141 is linked in the driving chain 125 in described drive mechanism；Turnover chain
143, circle is located on a pair week rotary chain wheel 141.
Hold and send part 16, be located on epicyclical mechanism 14 and have enough to meet the need motion with epicyclical mechanism 14, being used for carrying and having enough to meet the need silicon ingot
40.Specifically, hold and send part 16 to include: connecting portion 161 and hold and send portion 163.Connecting portion 161, is fixedly connected on epicyclical mechanism 14,
In the present embodiment, connecting portion 161 is a column connector, is attached to epicyclical mechanism 14 by additional locking elements (such as fixed screw)
In turnover chain 143 on.Holding and send portion 163, axle is connected to connecting portion 161 and (is built-in with as the column connector of connecting portion 161 and turns
Axle), hold the plummer sending portion 163 to have for carrying silicon ingot 40, in the present embodiment, holding and sending preferably cross section, portion 163 is ㄩ type
Open box-like structure, and the plummer bottom described open box-like structure may further be hollow out design, be not only convenient for silicon ingot
The access of 40, it is possible to save material and the overall deadweight sending portion 163 is held in reduction.
Silicon ingot intercept unit 2, for blocking operation to form silicon cube to silicon ingot 40.Specifically, such as Fig. 3 and Fig. 4
Shown in, silicon ingot intercept unit 2 includes: block support；Silicon ingot load carrier；Wire cutting mechanism.
Silicon ingot load carrier, be located at described in block on support.Described silicon ingot load carrier is rotated by a rotating mechanism
It is provided with the first station platform and the second station platform, the first station platform and the second station platform in vertical plane along same
Circumference carries out rotating and being positioned at and is equipped with on the two ends of the same diameter of described circumference, the first station platform and the second station platform
For carrying multiple load plates of silicon ingot 40 to be cut.In the present embodiment, described rotating mechanism includes: two pedestals, sets respectively
In the two ends blocking support；Two rotating shafts, are articulated on two pedestals respectively；Two are in transmission connection plate, are fixedly arranged on two rotating shafts respectively
On, rotating shaft is connected to be in transmission connection the center of plate, and the two ends of the first station platform are respectively and fixedly connected with in two plates that are in transmission connection
The first end, the two ends of the second station platform are respectively and fixedly connected with the second end in two plates that are in transmission connection.The plate that is in transmission connection is straight plate
Structure, therefore, in actual applications, the axis of rotation of described rotating mechanism, the strip that is in transmission connection moves the first station platform and
Two station platforms also rotate 180 °, it is possible to complete the exchange of the position of the first station platform and the second station platform, it is achieved right
Silicon ingot 40 to be cut on the silicon ingot 40 to be cut being positioned on the first station platform and the second station platform is handed over
Effect for cutting.
Frame, is arranged at and blocks support and be close in silicon ingot load carrier.
The line being located in frame and being liftably located at by an elevating mechanism top of described device for transporting objects is cut
Cutting mill structure, wire cutting mechanism includes the multiple line cutter units for cutting silicon ingot 40 to be cut.Especially, at the present embodiment
In: the quantity of the line cutter unit in wire cutting mechanism is consistent with the quantity of load plate, and, line cutter unit is positioned at the top of load plate
And the position of the head of correspondence silicon ingot 40.For making line cutter unit the silicon ingot 40 on load plate can also be carried out back-end crop process, carry
Being additionally provided with on dish and turn mechanism, load plate can be horizontal rotation in surface 180 ° under the described driving turning mechanism so that load plate
On silicon ingot 40 to be cut position end to end exchange.
In actual applications, turn mechanism described in include rotary shaft, the support support plate bottom load plate, be located at rotary shaft
And bearing assembly between support plate and for a support plate is carried out spacing banking stop.In actual applications, rotary shaft rotation
Turn and drive a support plate to rotate, a support plate drive load plate horizontal rotation in surface 180 ° so that the silicon ingot to be cut on load plate
The position end to end of 40 is exchanged, and can carry out spacing to a support plate by stirring banking stop again so that a support plate cannot be rotated further by.
Line cutter unit includes being in transmission connection in the cutting roll stand of elevating mechanism and is symmetricly set in bottom cutting roll stand
Two cutting rollers, be provided with line of cut between two cutting rollers.Specifically, cutting roll stand includes being in transmission connection in elevating mechanism
Horizontal frame and be symmetricly set in two vertical frameworks bottom horizontal frame, two cutting rollers are respectively arranged on two vertical frames
On frame.It is highly preferred that two vertical frameworks are respectively arranged on the two bottom sides of horizontal frame, so, two vertical frameworks and level
Framework is spliced to form undercut font cutting roll stand.
Further, the opposite sides in frame is respectively equipped with slide bar, the multiple line cutter units in wire cutting mechanism it
Between be connected with each other by a connecting rod, connecting rod is provided with slide block, slide block offers and is slidedly arranged on the chute of slide bar for slide block.Rise
Descending mechanism can drive slide block to move up and down on slide bar, and then makes connecting rod drive multiple line cutter units together to do lifting fortune
Dynamic, to complete the cutting work to silicon ingot 40 to be cut on load plate.
Preferably, on load plate, corresponding silicon ingot 40 to be cut both sides end to end offer determine corresponding with line of cut respectively
Position groove, locating slot has the width of certain degree of depth and notch and is greater than the line footpath of line of cut, and so, line of cut is cutting completely
Fall can falling in locating slot afterwards end to end of silicon ingot 40, while realizing silicon ingot 40 cut-out end to end, protection cutting can be played
The effect of line, it is to avoid line of cut produces friction with load plate and damages.
Further, each load plate carries 1～3 silicon ingot 40 to be cut (as it can be seen, hold on shown load plate
It is loaded with 2 silicon ingots 40), load plate is provided with the detent mechanism for fixing silicon ingot 40 to be cut, and described detent mechanism includes solid
Be located at the support bar on load plate 30, level connection joint is in the fixing bar of support bar and is fixed in fixing bar and is positioned to be cut
Briquetting above silicon ingot 40, the bottom of briquetting is resisted against the top of silicon ingot 40 to be cut.Described detent mechanism can be to be cut
The silicon ingot 40 cut positions, it is ensured that during cutting, the position of silicon ingot 40 to be cut will not be moved, it is ensured that cuts
The precision cut.
Silicon ingot intercept unit in this utility model silicon ingot truncated system, is excising end to end to silicon ingot 40 to be cut
Time: synchronize to decline multiple line cutter units by elevating mechanism, will be located on the first station platform below line cutter unit
The head excision of silicon ingot 40 to be cut；Multiple line cutter units are resetted；Utilize described rotating mechanism to rotate the first station to put down
Platform and the second station platform, swap the position of the first station platform and the second station platform, turn described in utilization meanwhile
Load plate on first station platform and silicon ingot 40 to be cut thereon are rotated 180 ° by mechanism so that on the first station platform
Silicon ingot 40 position end to end to be cut is exchanged；Synchronize to decline multiple line cutter units, by the second station platform by elevating mechanism
On silicon ingot 40 to be cut head excision, by multiple line cutter units reset；The first station is rotated by a rotating mechanism
Platform and the second station platform, swap the position of the second station platform and the first station platform, meanwhile, utilizes described tune
Load plate on second station platform and silicon ingot 40 to be cut thereon are rotated 180 ° by rotation mechanism so that on the second station platform
Silicon ingot 40 position end to end to be cut exchange；Utilize elevating mechanism to synchronize to decline multiple line cutter units, the first station is put down
Multiple line cutter units are resetted by the afterbody excision of the silicon ingot 40 to be cut on platform；Described rotating mechanism is utilized to rotate first
Station platform and the second station platform, swap the position of the first station platform and the second station platform, unload the first work
Complete the silicon ingot 40 that cuts of head and the tail on bit platform and more renew batch of polysilicon to be cut；Elevating mechanism is utilized to synchronize to decline
Multiple line cutter units, excise the afterbody of the polysilicon to be cut on the second station platform, and multiple line cutter units are multiple
Position；Utilize described rotating mechanism to rotate the first station platform and the second station platform, the second station platform and the first station are put down
The position of platform swaps, and unloads the silicon ingot 40 completing to cut from beginning to end on the second station platform and more renews batch of to be cut
Polysilicon.
Need to remark additionally: above-mentioned described silicon ingot intercept unit is only a preferred embodiment, but not as
Limit, this utility model silicon ingot intercept unit still can make other variations.Such as: in another embodiment, the line in wire cutting mechanism
The quantity of cutter unit is consistent with the quantity of load plate, and, line cutter unit is positioned at top and the afterbody of corresponding silicon ingot 40 of load plate
Position.For making line cutter unit the silicon ingot 40 on load plate can also be carried out back-end crop process, load plate is additionally provided with and turns mechanism,
Load plate can be horizontal rotation in surface 180 ° under the described driving turning mechanism so that the silicon ingot 40 to be cut on load plate
Position is exchanged end to end.As can be seen here, in this another embodiment, in the application of cutting on line unit cutting polysilicon, it is first to cut
Cut the afterbody of the silicon ingot 40 upper to be cut of load plate, then cut the head of silicon ingot 40 to be cut.And in another embodiment, line cuts
The quantity of the line cutter unit in mechanism is the twice of the quantity of load plate, i.e. for each load plate, is all configured with two lines and cuts
Cutting unit, two line cutter units are positioned at the top of load plate and the position of the head of the most corresponding silicon ingot 40 and the position of afterbody.
So, in this another embodiment, in the application of cutting on line unit cutting polysilicon, it is only necessary to perform to decline the cutting of multiple lines single
One-stop operation that is first and that cut can complete the head to silicon ingot 40 and afterbody excises simultaneously, it will be apparent that promote cutting efficiency
Effect.
This utility model silicon ingot truncated system separately includes the first work piece transfer apparatus, for being set from silicon ingot storing by silicon ingot 40
Standby 1 is transferred to silicon ingot intercept unit 2.In conjunction with Fig. 3 and Fig. 4, described first work piece transfer apparatus includes: feeding device fills with putting material
Put.
Described feeding device farther includes: arm for taking material 61, is located on silicon ingot intercept unit 2；It is located at arm for taking material 61 freely
The grippers 63 of end；Drive the hoisting mechanism 65 that arm for taking material 61 promotes；And drive arm for taking material 61 along silicon ingot intercept unit 2
The conveying mechanism 67 of length direction traveling (left and right directions).In the present embodiment: the end of grippers 63 has vac sorb chamber,
(such as, the vac sorb chamber in mechanical gripper is just cut one of them of silicon ingot 40 is perpendicular to adsorb silicon ingot to be transferred 40 accordingly
Face also adsorbs silicon ingot 40 and shifts in the way of the straight placement of silicon ingot).Conveying mechanism 67 is for rail structure and is accompanied with row
Enter tooth bar and drive cylinder (or driving motor).
Described material device of putting farther includes: puts material arm 62, is located on silicon ingot intercept unit 2；It is located at and puts material arm 62 freely
The grippers 64 of end；The material arm 62 first direction along silicon ingot intercept unit 2 length direction traveling (left and right directions) is put in driving
Conveyer 66；And drive the second direction putting material arm 62 along silicon ingot intercept unit 2 depth width traveling (front and back)
Conveyer 68.In the present embodiment: the end of grippers 64 has vac sorb chamber, adsorbs silicon ingot to be transferred accordingly
(such as, the vac sorb chamber in mechanical gripper is just to one of them vertical tangent plane of silicon ingot 40 and adsorb silicon ingot 40 and put down with silicon ingot
The straight mode placed shifts).First direction conveyer 66 is for rail structure and is accompanied with traveling tooth bar and drives cylinder
(or drive motor), second direction conveyer 68 includes free gear and the driving that stationary rack engages with described tooth bar
Driving motor that described free gear is advanced on described stationary rack or second direction conveyer 68 include fixed gear,
The movable rack that engages in described fixed gear and drive described fixed gear to be rotated such that movable rack is the most described solid
The driving motor that fixed gear is advanced.
Referring to Fig. 5 and Fig. 6, this utility model silicon ingot truncated system also includes: block cleaning equipment 3 and second workpiece turns
Moving device 7.
Second workpiece transfer equipment 7 is located at silicon ingot intercept unit 2 and blocks between cleaning equipment 3, for by silicon cube 50
It is transferred to block cleaning equipment 3 from silicon ingot intercept unit 2.Specifically,
Second workpiece transfer equipment 7 includes: telescopic arm 71, is movably arranged at by telescoping mechanism 72 and blocks on cleaning equipment 3；
Feeding platform 73, is movably arranged at telescopic arm 71 by elevating mechanism 74；Feeding flip piece, turns over including switching mechanism and described in being located at
Grippers 75 on rotation mechanism.In the present embodiment: telescoping mechanism 72 is for rail structure and is accompanied with traveling tooth bar and drives gas
Cylinder (or driving motor).Elevating mechanism 74 is for rail structure and is accompanied with traveling tooth bar and drives cylinder (or driving motor).Institute
State feeding flip piece to farther include: fixed support 761, be fixed at feeding platform 73；Movable telescopic arm 763, connects including axle
Cylinder arm and the expansion link being movably arranged at described cylinder arm in fixed support 761；Grippers 75, axle is connected to movable telescopic arm
The expansion link of 763.In the present embodiment, grippers 75 is fixture.Utilize described feeding flip piece, in principle can be by silicon cube 50
Carry out overturning and (such as silicon cube 50 is placed upset for vertically placing or by silicon cube 50 by vertically placing upset being by straight
Straight placement).So, utilize second workpiece transfer equipment 7, silicon cube 50 can be turned from silicon ingot intercept unit 2 (straight placement)
Move to block cleaning equipment 3 (vertically placing).
Block cleaning equipment, be adjacent to silicon ingot intercept unit 2, for the silicon cube 50 of silicon ingot intercept unit 2 output is entered
Row washing and cleaning operation.Specifically, block cleaning equipment 3 to include: equipment bin 31；The first transmitting device being located on equipment bin 31
32, the transmission path of the first transmitting device 32 is provided with the first cleaning device 33 and the first water trap 34；It is located at equipment material
The second transmitting device 35 on frame, is provided with the second cleaning device 36 and second on the transmission path of described second transmitting device 35
Water trap 37.In the present embodiment: the first transmitting device 32 is transmission belt structure, first device 33 is cleaned corresponding to the first biography
The leading portion of defeated device 32, including spray equipment, described spray equipment has multiple spray head, and each spray head circumference is located at spray district
Territory.First water trap 34, corresponding to the back segment of the first transmitting device 32, (is located at equipment bin 31 including blowing device and is positioned at
On the first transmitting device 32 above the silicon cube 50 of transmission).Second cleans device 36 corresponding to the second transmitting device 35
Leading portion, including flusher, described flusher has two the vertical spraying pack units being arranged oppositely and (if desired, is also provided with
Top spray part), vertical spraying pack unit is uniformly laid with multiple sparge pipe, each sparge pipe shares water-supply-pipe.Second anhydrates dress
Put 37 back segments corresponding to the second transmitting device 35, (be located at equipment bin 31 including blowing device and be located at the second transmission dress
Put the side of the silicon cube 50 of transmission on 35).
It is described in detail below for this utility model silicon ingot truncated system operating process in actual applications.
First, silicon ingot 40 to be blocked is transferred to silicon ingot storage equipment 1；
By the first work piece transfer apparatus, silicon ingot 40 is transferred to silicon ingot intercept unit 2 from silicon ingot storage equipment 1.
By silicon ingot intercept unit 2, silicon ingot 40 is blocked operation to form silicon cube 50.
It is transferred to block cleaning equipment 3 from silicon ingot intercept unit 2 by silicon cube 50 by second workpiece transfer equipment.
It is carried out operation by blocking the silicon cube 50 that silicon ingot intercept unit 2 exports by cleaning equipment 3.
This utility model silicon ingot truncated system, has gathered multiple implement, blocks set including silicon ingot storage equipment, silicon ingot
Standby and block cleaning equipment, on the one hand, silicon ingot to be blocked to be stored in silicon ingot storage equipment, when need to block, then from silicon ingot
The silicon ingot of storage is delivered to silicon ingot intercept unit by storage equipment carry out blocking operation to form silicon cube, it is simple to the storage of silicon ingot
Deposit and carry and block efficiency and be substantially improved, on the other hand, blocking after operation completes, can follow-up can be by blocking cleaning
Equipment 3 is carried out operation to the silicon cube after blocking.
It addition, this utility model silicon ingot truncated system, silicon ingot is set by available first work piece transfer apparatus from silicon ingot storing
For being transferred to silicon ingot intercept unit and utilizing second workpiece transfer equipment to be transferred to block clearly from silicon ingot intercept unit by silicon cube
Wash equipment, automatization can realize multiple procedures that silicon ingot blocks, save labour turnover and improve production efficiency.
This utility model effectively overcomes various shortcoming of the prior art and has high industrial utilization.
Above-described embodiment only illustrative principle of the present utility model and effect thereof are new not for limiting this practicality
Type.Above-described embodiment all can be carried out by any person skilled in the art under spirit and the scope of the present utility model
Modify or change.Therefore, art has usually intellectual such as without departing from the essence disclosed in this utility model
All equivalences completed under god and technological thought are modified or change, and must be contained by claim of the present utility model.
Claims (9)
1. a silicon ingot truncated system, it is characterised in that including:
For silicon ingot being blocked operation to form the silicon ingot intercept unit of silicon cube；And
For storing silicon ingot and the described silicon ingot stored being delivered to the silicon ingot storage equipment of described silicon ingot intercept unit, described silicon
Ingot storage equipment is positioned at the front end of described silicon ingot intercept unit.
Silicon ingot truncated system the most according to claim 1, it is characterised in that described silicon ingot intercept unit includes:
Block support；
Silicon ingot load carrier, be located at described in block on support；Described silicon ingot load carrier includes that the first station of transposition is put down
It is equipped with for carrying described silicon ingot on platform and the second station platform, described first station platform and described second station platform
Multiple load plates；And
Wire cutting mechanism, be located at described in block on support, including the line cutter unit for cutting described silicon ingot.
Silicon ingot truncated system the most according to claim 2, it is characterised in that described load plate is provided with turns mechanism, described load
Dish under the described driving turning mechanism horizontal rotation in surface 180 ° so that the position end to end of polysilicon to be cut is exchanged.
Silicon ingot truncated system the most according to claim 1, it is characterised in that described silicon ingot storage equipment includes:
Material seat；
Material bracing frame, is located on described material seat；And
For carrying and have enough to meet the need the silicon ingot turnover carrier of described silicon ingot, it is located on described material bracing frame.
Silicon ingot truncated system the most according to claim 4, it is characterised in that described silicon ingot turnover carrying machine includes:
Drive mechanism, is located at bottom described material bracing frame；
At least one epicyclical mechanism, is located at least one sidepiece of described material bracing frame；And
Send part for carrying and having enough to meet the need multiple the holding of described silicon ingot, be located on described epicyclical mechanism and all with described epicyclical mechanism
Transhipment is dynamic.
Silicon ingot truncated system the most according to claim 5, it is characterised in that described drive mechanism includes:
Drive motor；
Drive sprocket, is linked in described driving motor；And
Drive chain, be configured on described drive sprocket.
Silicon ingot truncated system the most according to claim 5, it is characterised in that described epicyclical mechanism includes:
A pair week rotary chain wheel, is respectively arranged on the two ends up and down of the sidepiece of described material bracing frame；In the pair of all rotary chain wheels extremely
Few all rotary chain wheel is linked in described drive mechanism；And
Turnover chain, is configured on the pair of all rotary chain wheels.
Silicon ingot truncated system the most according to claim 5, it is characterised in that described in hold and send part to include:
Connecting portion, is fixedly connected on described epicyclical mechanism；And
Hold and send portion, axle to be connected to described connecting portion；The described portion of sending of holding has the plummer for carrying described silicon ingot.
Silicon ingot truncated system the most according to claim 1, it is characterised in that also include: be used for described silicon ingot from described
Silicon ingot storage equipment is transferred to the first work piece transfer apparatus of described silicon ingot intercept unit, is located at described silicon ingot storage equipment and institute
State between silicon ingot intercept unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620485193.9U CN205818202U (en) | 2016-05-24 | 2016-05-24 | Silicon ingot truncated system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620485193.9U CN205818202U (en) | 2016-05-24 | 2016-05-24 | Silicon ingot truncated system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205818202U true CN205818202U (en) | 2016-12-21 |
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ID=57559153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620485193.9U Active CN205818202U (en) | 2016-05-24 | 2016-05-24 | Silicon ingot truncated system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105818286A (en) * | 2016-05-24 | 2016-08-03 | 上海日进机床有限公司 | Silicon ingot truncation system and silicon ingot truncation method |
| CN106827273A (en) * | 2017-04-01 | 2017-06-13 | 上海日进机床有限公司 | Linear cutting equipment and wire cutting method |
| CN106827274A (en) * | 2017-04-01 | 2017-06-13 | 上海日进机床有限公司 | Silicon rod intercept unit and silicon rod method for cutting |
| CN106956373A (en) * | 2017-03-31 | 2017-07-18 | 上海日进机床有限公司 | Double-deck linear cutting equipment and double-deck wire cutting method |
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2016
- 2016-05-24 CN CN201620485193.9U patent/CN205818202U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105818286A (en) * | 2016-05-24 | 2016-08-03 | 上海日进机床有限公司 | Silicon ingot truncation system and silicon ingot truncation method |
| CN105818286B (en) * | 2016-05-24 | 2018-09-14 | 浙江集英精密机器有限公司 | Silicon ingot truncated system and silicon ingot method for cutting |
| CN106956373A (en) * | 2017-03-31 | 2017-07-18 | 上海日进机床有限公司 | Double-deck linear cutting equipment and double-deck wire cutting method |
| CN106827273A (en) * | 2017-04-01 | 2017-06-13 | 上海日进机床有限公司 | Linear cutting equipment and wire cutting method |
| CN106827274A (en) * | 2017-04-01 | 2017-06-13 | 上海日进机床有限公司 | Silicon rod intercept unit and silicon rod method for cutting |
| CN106827273B (en) * | 2017-04-01 | 2019-04-02 | 天通日进精密技术有限公司 | Linear cutting equipment and wire cutting method |
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Effective date of registration: 20180806 Address after: 314400 6 Building 128, Shuang Lian Road, Haining Economic Development Zone, Zhejiang Patentee after: Zhejiang Ji Ying Precision Machinery Co., Ltd. Address before: 314400 4 buildings in No. 17, Shi Dai Road, Haining Economic Development Zone, Haining, Jiaxing, Zhejiang Patentee before: Haining Dijin science and Technology Co., Ltd. |