CN205789938U - A kind of device for radiator for semiconductor assembling - Google Patents
A kind of device for radiator for semiconductor assembling Download PDFInfo
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- CN205789938U CN205789938U CN201620645724.6U CN201620645724U CN205789938U CN 205789938 U CN205789938 U CN 205789938U CN 201620645724 U CN201620645724 U CN 201620645724U CN 205789938 U CN205789938 U CN 205789938U
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Abstract
This utility model relates to a kind of device for radiator for semiconductor assembling, this device includes spring, described spring includes left part (1), left folding turn of bilge (5), pars intermedia (3), right folding turn of bilge (6), right part (2) and position limiting structure (4), and described left part (1), left folding turn of bilge (5), pars intermedia (3), right folding turn of bilge (6) and right part (2) are sequentially connected with.This utility model not only has good firm performance, and has easy to use and that versatility is good advantage.
Description
Technical field
This utility model relates to radiator for semiconductor field, especially relates to a kind of dress for radiator for semiconductor assembling
Put.
Background technology
Along with electron trade is fast-developing, the caloric value of thermal source, heat generation density are more and more higher, between radiator and thermal source
Assembling must assure that reliably " hot interracial contact ", ensures that thermal dissipating path is smooth and easy.Deformed spring passes through simple bending technique, dress
Producing reliable grip power after joining, manufacturing process is simple, cost is reasonable.But, deformed spring machining shape precision, dimensional accuracy ratio
It is much lower, also than the SMT equipment at Fine Boring PCB of mechanical hand (robot) that radiator squeezes type precision, metal plate punching precision
Precision is much lower, and in order to ensure PCB Fine Boring qualification rate, deformed spring should directly assemble and be fixed on inside radiator, letter
Change and reduce dimension chain.
The following is assembling mode several frequently seen in prior art:
United States Patent (USP) US4509839 proposes right angle setting two class assembling scheme: spring bending is from crowded type radiator top
Portion, through leg hole down, it is fixing that fore-and-aft direction clamps thermal source assembling, and the two ends of spring exceed bottom radiator, directly weld
Fix to PCB(short transverse), target is fixed in the assembling of degree of freedom=0 meeting spring；But spring material hardness ratio thermal source
Leg is much higher, and pruning spring after PCB welding needs special processes, plant equipment, such as cut smooth, causes client to become
Ben Taigao；If both ends of the spring is not as leg, simply inserts and squeeze the leg hole of type radiator down, then spring is easily in shake
Come off after dynamic, impact inefficacy (degree of freedom=1)；And squeeze the leg hole dimension precision comparison height of type radiator, easily do with spring
Relate to and cause assembling difficulty.Or: after spring bending, short transverse is stuck in the U-lag that punch forming radiator is symmetrical, to
In stamping forming symmetrical multiple little ear, simultaneously fore-and-aft direction clamp semiconductor fab fix (degree of freedom of spring=
0)；But, because the aluminium that heat dissipation characteristics is good, ductility is the best, the thickness of aluminium sheet little (usual aluminium sheet minimum up to
0.5 millimeter), after load time length, the easy creep aging of little ear of fixing spring lost efficacy.
U.S. Patent application US2011/0013374A1 proposes two class assembling schemes: be horizontally mounted, and wears after spring bending
Crossing and squeeze type radiator top, through leg hole down, fore-and-aft direction is clamped semiconductor fab and is fixed, and the two ends of spring exceed heat radiation
Bottom device, then horizontal positioned is welded direct to PCB, and target is fixed in the assembling of degree of freedom=0 meeting spring；But spring material
Hardness is big, dimensional uniformity is relatively low for material, after client's pre-assembled thermal source to heat radiator assembly, needs shaping sizing guarantee chi
Very little concordance, facilitates automatic welding PCB technology reliable in quality, consistent.And squeeze the leg hole dimension ratio of precision of type radiator
Higher, easily cause assemble difficulty with spring interference.Another selects: right angle setting, after spring bending, short transverse is by card
At top, punch forming radiator bottom surface bayonet socket (short transverse, left and right directions fix spring), fore-and-aft direction clamping semiconductor is solid
Fixed (degree of freedom=0 of spring)；But spring two tail end is required to be welded to PCB, it is to avoid spring resilience inside gets loose.Because bullet
Spring material hardness big (could produce the pressure needed), prunes after welding and needs special processes, plant equipment, such as laser to cut
Cut, cause client cost the biggest.Both the above assembling scheme (be horizontally mounted, right angle setting), it is desirable to spring must be as welding
Foot is fixed to PCB, and dimension chain is complicated, it is desirable to the spring accuracy of manufacture is the highest, packed and transported does not allow any slight deformation, visitor
Family is necessary for undertaking high cost.
Summary of the invention
The purpose of this utility model is the deficiency overcoming above-mentioned prior art to exist, it is provided that a kind of for semiconductor heat-dissipating
The device of device assembling, this device can not only simplify and optimized dimensions chain, has good versatility, enables to partly lead simultaneously
Body radiator assembles more firm, reliable and convenience.
In order to realize foregoing invention purpose, the technical scheme that this utility model provides is as follows:
A kind of device for radiator for semiconductor assembling, this device includes that spring, described spring include left part, left folding
Turn of bilge, pars intermedia, right folding turn of bilge, right part and position limiting structure, described left part, left folding turn of bilge, pars intermedia, right folding turn of bilge and the right side
End is sequentially connected with.
A kind of in the device of radiator for semiconductor assembling at this utility model, the structure of described pars intermedia includes level
Shape structure, convex structure and v-shaped structure.
A kind of in the device of radiator for semiconductor assembling at this utility model, the left folding turn of bilge of described spring and right folding
Turn of bilge is R shape structure, plane residing for described left folding turn of bilge and right folding turn of bilge all with pars intermedia residing for plane perpendicular, a described left side
Bending part includes that leading portion, epimere and back segment, described leading portion, epimere and back segment are sequentially connected with, described right folding turn of bilge include front portion, on
Portion and rear portion, described front portion, top and rear portion are sequentially connected with, at described left folding turn of bilge with pars intermedia junction, pars intermedia with right
Bending part junction is equipped with position limiting structure.
A kind of in the device of radiator for semiconductor assembling at this utility model, this radiator for semiconductor includes radiating fin
Sheet and heat-radiator plate, described heat-radiator plate includes front bottom surface and rear bottom surface, and the molding mode of this radiator for semiconductor is for being squeezed into
Type, bottom surface is provided with several radiating fins in the rear, is provided with several transection slots and at least between described radiating fin
Two U-lags, left part and the right part of described spring all bend inwards；When confined state, one of them plate face of thermal source
Contacting with front bottom surface, another plate face on the other side contacts with pars intermedia, and described front portion and leading portion are positioned at front bottom surface
Front side, in described rear portion lays respectively at two U-lags of rear bottom surface with back segment and contact with rear bottom surface, described left part and right-hand member
Portion is fastened in two transection slots respectively, and described position limiting structure lays respectively at the left and right sides of thermal source.
A kind of in the device of radiator for semiconductor assembling at this utility model, this radiator for semiconductor includes radiating fin
Sheet and heat-radiator plate, described heat-radiator plate includes front bottom surface and rear bottom surface, and the molding mode of this radiator for semiconductor is panel beating punching
Molded, several radiating fins it are equipped with at two ends, described front bottom surface, bottom surface is provided with at least two punching press limit in the rear
Position, described punching press is spacing to be included through hole, grid hole and crosses bridge opening；When confined state, one of them plate face of thermal source and the front end
Face contacts, and another plate face on the other side contacts with pars intermedia, and described front portion and leading portion are positioned at the front side of front bottom surface, institute
Stating rear portion and back segment contacts with rear bottom surface respectively, it is spacing interior that described left part and right part are fastened on two punching presses respectively, institute
State position limiting structure and lay respectively at the left and right sides of thermal source.
This utility model a kind of for radiator for semiconductor assembling device in, the global shape of described spring is M shape,
It is equipped with position limiting structure, described left part with left folding turn of bilge junction, right part with right folding turn of bilge junction in described left part
All bend inwards with right part.
A kind of in the device of radiator for semiconductor assembling at this utility model, this radiator for semiconductor includes radiating fin
Sheet and heat-radiator plate, described heat-radiator plate includes front bottom surface and rear bottom surface, and the molding mode of this radiator for semiconductor is for being squeezed into
Type, bottom surface is provided with several radiating fins in the rear, is provided with several transection slots and at least between described radiating fin
Two U-lags, described left part and right part all inwardly lateral buckling；When confined state, one of them plate face of thermal source is with front
Bottom surface contacts, and another plate face on the other side contacts with pars intermedia, and described position limiting structure lays respectively at a left side for radiator
Right both sides, described left part and right part are fastened in transection slot respectively.
A kind of in the device of radiator for semiconductor assembling at this utility model, this radiator for semiconductor includes radiating fin
Sheet and heat-radiator plate, described heat-radiator plate includes front bottom surface and rear bottom surface, and the molding mode of this radiator for semiconductor is panel beating punching
Molded, several radiating fins it are equipped with at two ends, described front bottom surface, bottom surface is provided with at least two punching press limit in the rear
Position, described punching press is spacing to be included through hole, grid hole and crosses bridge opening, described left part and right part all inwardly lateral buckling；In assembling
During state, one of them plate face of thermal source contacts with front bottom surface, and another plate face on the other side contacts with pars intermedia, institute
State position limiting structure be fastened on respectively two punching presses spacing in, described left part and Jun Yuhou bottom surface, right part contact.
This utility model a kind of for radiator for semiconductor assembling device in, described spring is plastics spring, its become
Type mode includes molded and 3D printing shaping.
A kind of in the device of radiator for semiconductor assembling at this utility model, the main material of described spring is elastic gold
Belonging to, elastic metallic is coated with plastic protective layer, and its molding mode is punch forming.
According to technique scheme, have the advantage that compared to prior art this utility model
One, this utility model assembling device is by unique Design of Mechanical Structure, optimizes and devises spring end fastening knot
Structure, spring is affixed directly to inside radiator, it is not necessary to be welded to PCB, simplifies dimension chain, can be achieved with the degree of freedom of spring=
0, it is effective against vibrations and impact, spring end is provided with clearance structure simultaneously, facilitates client to dismantle, adjusts and do over again.
Two, spring of the present utility model is assembled to the aluminium punching press radiator that panel beating thickness is little, material hardness is little, and spring
Force is in the plane that radiator is relatively large, and this assembling structure has the advantage that elasticity stable, aging resistance and creep resistant are good, it is ensured that
The load life of radiator for semiconductor.
Three, avoid through crowded type leg hole when spring of the present utility model assembling, so the spring accuracy of manufacture requires phase
To low, meet identical function, assembling fixing on the premise of, the low cost that client undertakes.
Four, this utility model has the good suitability, it is possible to be widely applied to all types of products of electron trade.
Accompanying drawing explanation
Fig. 1 is the structural representation of spring in embodiment one of the present utility model.
Fig. 2 is the structural representation of spring in embodiment four of the present utility model and embodiment five.
Fig. 3 is the structural representation of radiator in embodiment one of the present utility model and embodiment four.
Fig. 4 is the structural representation of radiator in embodiment two of the present utility model.
Fig. 5 is the structural representation of thermal source.
Fig. 6 is the front three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment one.
Fig. 7 is the reverse side three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment one.
Fig. 8 is the structural representation of spring in this utility model embodiment two.
Fig. 9 is the front three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment two.
Figure 10 is the reverse side three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment two.
Figure 11 is the structural representation of spring in this utility model embodiment three.
Figure 12 is the structural representation of radiator in this utility model embodiment three.
Figure 13 is the front three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment three.
Figure 14 is the reverse side three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment three.
Figure 15 is the front three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment four.
Figure 16 is the reverse side three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment four.
Figure 17 is the structural representation of the radiator of this utility model embodiment five.
Figure 18 is the front three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment five.
Figure 19 is the reverse side three dimensional structure schematic diagram of the radiator assembling completion status of this utility model embodiment five.
Detailed description of the invention
We combine accompanying drawing and specific embodiment is assembled for radiator for semiconductor this utility model is a kind of below
Device further elaborated, in the hope of being more fully apparent from understand its structure composition and working method, but can not be with
This limits the protection domain of this utility model patent.
Embodiment one
As shown in Fig. 1, Fig. 3, Fig. 5, Fig. 6 and Fig. 7, a kind of device for radiator for semiconductor assembling, this device includes
Spring, described spring includes left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6, right part 2 and position limiting structure 4, described
Left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6 and right part 2 are sequentially connected with.
The left folding turn of bilge 5 of described spring and right folding turn of bilge 6 are R shape structure, described left folding turn of bilge 5 and right folding turn of bilge 6 institute
Place's plane all with pars intermedia 3 residing for plane perpendicular, described left folding turn of bilge 5 includes leading portion 51, epimere 52 and back segment 53, described before
Section 51, epimere 52 and back segment 53 are sequentially connected with, and described right folding turn of bilge 6 includes front portion 61, top 62 and rear portion 63, described front portion
61, top 62 and rear portion 63 are sequentially connected with, at described left folding turn of bilge 5 with pars intermedia 3 junction, pars intermedia 3 with right folding turn of bilge 6 even
The place of connecing is equipped with position limiting structure 4, and left part 1 and the right part 2 of described spring all bend inwards.
This radiator for semiconductor includes that radiating fin 7 and heat-radiator plate, described heat-radiator plate include front bottom surface 8 and rear bottom surface
9, the molding mode of this radiator for semiconductor is extruded, and bottom surface 9 is provided with several radiating fins 7 in the rear, in institute
State and between radiating fin 7, be provided with several transection slots 10 and at least two U-lag.
When confined state, one of them plate face of thermal source 14 contacts with front bottom surface 8, another plate face on the other side
Contacting with pars intermedia 3, described pars intermedia 3 is horizontal structure, and the shape of pars intermedia 3 can also is that arc-shaped or V-arrangement, described before
Portion 61 and leading portion 51 are positioned at the front side of front bottom surface 8, and described rear portion 63 and back segment 53 lay respectively in two U-lags of rear bottom surface 9
And contact with rear bottom surface 9, described left part 1 and right part 2 are fastened in two transection slots 10 respectively, described position limiting structure 4 points
It is not positioned at the left and right sides of thermal source 14.
The operation of installing and using and dismantle during radiator assembles of this embodiment includes step used below:
The first step, pushes down on spring from radiator upper end so that the front portion 61 of spring is positioned on front side of radiator, spring
Rear portion 63 is positioned at two U-lags of radiator, avoids the position, welding foot hole 12 of radiator simultaneously, until the top 62 of spring
It is close to radiator upper end with epimere 52, left part 1 and the right part 2 of spring are fastened in two transection slots 10 respectively；
Second step, uses hook type tool to be mentioned forward in front portion 61 and leading portion 51, then thermal source 14 is placed on spring and dissipates
Between hot device, and thermal source 14 one side is fitted with radiator, another side contacts with spring pars intermedia 3；
3rd step, adjusts the position of thermal source 14 so that thermal source 14 is between the position limiting structure 4 of spring so that thermal source 14
Can not move left and right；
4th step, dismounting: left part 1 and the right part 2 of spring are removed, before mentioning spring in transection slot 10 simultaneously
Portion 61, moves up spring entirety, until departing from radiator.
Embodiment two
As shown in Fig. 4, Fig. 5, Fig. 8, Fig. 9 and Figure 10, a kind of device for radiator for semiconductor assembling, this device includes
Spring, described spring includes left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6, right part 2 and position limiting structure 4, described
Left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6 and right part 2 are sequentially connected with.
The left folding turn of bilge 5 of described spring and right folding turn of bilge 6 are R shape structure, described left folding turn of bilge 5 and right folding turn of bilge 6 institute
Place's plane all with pars intermedia 3 residing for plane perpendicular, described left folding turn of bilge 5 includes leading portion 51, epimere 52 and back segment 53, described before
Section 51, epimere 52 and back segment 53 are sequentially connected with, and described right folding turn of bilge 6 includes front portion 61, top 62 and rear portion 63, described front portion
61, top 62 and rear portion 63 are sequentially connected with, at described left folding turn of bilge 5 with pars intermedia 3 junction, pars intermedia 3 with right folding turn of bilge 6 even
The place of connecing is equipped with position limiting structure 4, and left part 1 and the right part 2 of described spring the most outwards bend.
This radiator for semiconductor includes that radiating fin 7 and heat-radiator plate, described heat-radiator plate include front bottom surface 8 and rear bottom surface
9, the molding mode of this radiator for semiconductor is metal plate punching molding, is equipped with several radiating fins at two ends, described front bottom surface 8
Sheet 7, bottom surface 9 is provided with two grid holes and two mistake bridge openings in the rear.
When confined state, one of them plate face of thermal source 14 contacts with front bottom surface 8, another plate face on the other side
Contacting with pars intermedia 3, described pars intermedia 3 is horizontal structure, and the shape of pars intermedia 3 can also is that arc-shaped or V-arrangement, described before
Portion 61 and leading portion 51 are positioned at the front side of front bottom surface 8, and described rear portion 63 and back segment 53 contact with rear bottom surface 9 respectively, described mistake
Bridge opening lays respectively at back segment 53 and the inner side at rear portion 63, and described left part 1 and right part 2 are fastened in two grid holes respectively,
Described position limiting structure 4 lays respectively at the left and right sides of thermal source 14.
The operation of installing and using and dismantle during radiator assembles of this embodiment includes step used below:
The first step, pushes down on spring from radiator upper end so that before the front portion 61 of spring and leading portion 51 are positioned at radiator
Side, the rear portion 63 of spring and back segment 53 lay respectively at two outsides crossing bridge opening, until the top 62 of spring and epimere 52 are close to
Radiator upper end, is fastened in two grid holes respectively by left part 1 and the right part 2 of spring；
Second step, uses hook type tool to be mentioned forward front portion 61, is then placed between spring and radiator by thermal source 14,
And thermal source 14 one side is fitted with radiator, another side contacts with spring pars intermedia 3；
3rd step, adjusts the position of thermal source 14 so that thermal source 14 is between the position limiting structure 4 of spring so that thermal source 14
Can not move left and right；
4th step, dismounting: left part 1 and the right part 2 of spring are removed in grid hole, mentions the front portion of spring simultaneously
61, spring entirety is moved up, until departing from radiator.
Embodiment three
As shown in Figure 11, Fig. 5, Figure 12, Figure 13 and Figure 14, a kind of device for radiator for semiconductor assembling, this device
Including spring, described spring includes left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6, right part 2 and position limiting structure 4,
Described left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6 and right part 2 are sequentially connected with.
The left folding turn of bilge 5 of described spring and right folding turn of bilge 6 are R shape structure, described left folding turn of bilge 5 and right folding turn of bilge 6 institute
Place's plane all with pars intermedia 3 residing for plane perpendicular, described left folding turn of bilge 5 includes leading portion 51, epimere 52 and back segment 53, described before
Section 51, epimere 52 and back segment 53 are sequentially connected with, and described right folding turn of bilge 6 includes front portion 61, top 62 and rear portion 63, described front portion
61, top 62 and rear portion 63 are sequentially connected with, at described left folding turn of bilge 5 with pars intermedia 3 junction, pars intermedia 3 with right folding turn of bilge 6 even
The place of connecing is equipped with position limiting structure 4, the equal forward fold in left part 1 and right part 2 of described spring.
This radiator for semiconductor includes that radiating fin 7 and heat-radiator plate, described heat-radiator plate include front bottom surface 8 and rear bottom surface
9, the molding mode of this radiator for semiconductor is metal plate punching molding, is equipped with several radiating fins at two ends, described front bottom surface 8
Sheet 7, is provided with two through holes on heat-radiator plate.
When confined state, one of them plate face of thermal source 14 contacts with front bottom surface 8, another plate face on the other side
Contacting with pars intermedia 3, described pars intermedia 3 is horizontal structure, and the shape of pars intermedia 3 can also is that arc-shaped or V-arrangement, described before
Portion 61 and leading portion 51 are positioned at the front side of front bottom surface 8, and described rear portion 63 and back segment 53 contact with rear bottom surface 9 respectively, described left end
Portion 1 and right part 2 are fastened in two through holes respectively, and described position limiting structure 4 lays respectively at the left and right sides of thermal source 14.
The operation of installing and using and dismantle during radiator assembles of this embodiment includes step used below:
The first step, pushes down on spring from radiator upper end so that before the front portion 61 of spring and leading portion 51 are positioned at radiator
Side, the rear portion 63 of spring and back segment 53 are positioned at the rear side of radiator, until the top 62 of spring and epimere 52 are close on radiator
End, is fastened in two through holes respectively by left part 1 and the right part 2 of spring；
Second step, uses hook type tool to be mentioned forward front portion 61, is then placed between spring and radiator by thermal source 14,
And thermal source 14 one side is fitted with radiator, another side contacts with spring pars intermedia 3；
3rd step, adjusts the position of thermal source 14 so that thermal source 14 is between the position limiting structure 4 of spring so that thermal source 14
Can not move left and right；
4th step, dismounting: left part 1 and right part 2 hook type tool of spring are removed in through hole, mentions bullet simultaneously
The front portion 61 of spring, moves up spring entirety, until departing from radiator.
Embodiment four
As shown in Fig. 2, Fig. 3, Fig. 5, Figure 15 and Figure 16, a kind of device for radiator for semiconductor assembling, this device bag
Including spring, described spring includes left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6, right part 2 and position limiting structure 4, institute
State left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6 and right part 2 to be sequentially connected with.
The global shape of described spring is M shape, in described left part 1 and left folding turn of bilge 5 junction, right part 2 and right folding
Turn of bilge 6 junction is equipped with position limiting structure 4, and described left part 1 and right part 2 all bend inwards.
This radiator for semiconductor includes that radiating fin 7 and heat-radiator plate, described heat-radiator plate include front bottom surface 8 and rear bottom surface
9, the molding mode of this radiator for semiconductor is extruded, and bottom surface 9 is provided with several radiating fins 7 in the rear, in institute
State and between radiating fin 7, be provided with several transection slots 10 and at least two U-lag.
When confined state, one of them plate face of thermal source 14 contacts with front bottom surface 8, another plate face on the other side
Contacting with pars intermedia 3, described pars intermedia 3 is horizontal structure, and the shape of pars intermedia 3 can also is that arc-shaped or V-arrangement, described limit
Bit architecture 4 is positioned at the both sides of radiator, and described left part 1 and right part 2 are fastened in the transection slot 10 of rear bottom surface 9 respectively.
The operation of installing and using and dismantle during radiator assembles of this embodiment includes step used below:
The first step, is stuck in the left part 1 of spring in transection slot 10 and the U-type groove of radiator；
Second step, puts well thermal source 14 in position to be assembled, and spring pars intermedia 3 is close to thermal source 14, the spacing knot of spring
Structure 4 lays respectively at the both sides of radiator；
3rd step, is stuck in the right part 2 of spring in the transection slot 10 of radiator opposite side；
4th step, dismounting: removed in the transection slot 10 of radiator in left part 1 and the right part 2 of spring, spring departs from
Radiator.
Embodiment five
As shown in Fig. 2, Fig. 5, Figure 17, Figure 18 and Figure 19, a kind of device for radiator for semiconductor assembling, this device bag
Including spring, described spring includes left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6, right part 2 and position limiting structure 4, institute
State left part 1, left folding turn of bilge 5, pars intermedia 3, right folding turn of bilge 6 and right part 2 to be sequentially connected with.
The global shape of described spring is M shape, in described left part 1 and left folding turn of bilge 5 junction, right part 2 and right folding
Turn of bilge 6 junction is equipped with position limiting structure 4, and described left part 1 and right part 2 all bend inwards.
This radiator for semiconductor includes that radiating fin 7 and heat-radiator plate, described heat-radiator plate include front bottom surface 8 and rear bottom surface
9, the molding mode of this radiator for semiconductor is metal plate punching molding, is equipped with several radiating fins at two ends, described front bottom surface 8
Sheet 7, is provided with two on the rear bottom surface 9 of described radiator and crosses bridge opening, and described bridge opening of crossing is strip.
When confined state, one of them plate face of thermal source 14 contacts with front bottom surface 8, another plate face on the other side
Contacting with pars intermedia 3, described pars intermedia 3 is horizontal structure, and the shape of pars intermedia 3 can also is that arc-shaped or V-arrangement, described
Position limiting structure 4 is positioned at the both sides of thermal source 14, and described left part 1 and right part 2 are fastened on two respectively and cross in bridge opening.
The operation of installing and using and dismantle during radiator assembles of this embodiment includes step used below:
The first step, is stuck in the left part 1 of radiator in a mistake bridge opening of radiator；
Second step, puts well thermal source 14 in position to be assembled, and spring pars intermedia 3 is close to thermal source 14, the spacing knot of spring
Structure 4 lays respectively at the both sides of radiator；
3rd step, is fastened on another one by the right part of spring and crosses in bridge opening；
4th step, dismounting: by the left part 1 of spring and right part 2 from radiator cross bridge opening in remove, spring departs from and dissipates
Hot device.
In five above-mentioned embodiments, the material of described spring can be plastics, and its molding mode includes molded
Or 3D printing shaping；The main material of described spring can also is that elastic metallic, is coated with plastic protective layer at elastic metallic, its
Molding mode includes punch forming.
Certainly, a kind of device for radiator for semiconductor assembling of this utility model is except telling about in above-described embodiment
Type and mode beyond, also include other similar structure building forms and fixing connected mode.Sum it up, this practicality is new
Type also includes other conversion that will be apparent to those skilled in the art in and replacement.
Claims (10)
1. the device for radiator for semiconductor assembling, it is characterised in that this device includes that spring, described spring include a left side
End (1), left folding turn of bilge (5), pars intermedia (3), right folding turn of bilge (6), right part (2) and position limiting structure (4), described left part
(1), left folding turn of bilge (5), pars intermedia (3), right folding turn of bilge (6) and right part (2) are sequentially connected with.
A kind of device for radiator for semiconductor assembling the most according to claim 1, it is characterised in that described pars intermedia
(3) structure includes horizontal structure, convex structure and v-shaped structure.
A kind of device for radiator for semiconductor assembling the most according to claim 1 and 2, it is characterised in that described bullet
The left folding turn of bilge (5) of spring and right folding turn of bilge (6) are R shape structure, plane residing for described left folding turn of bilge (5) and right folding turn of bilge (6)
All with pars intermedia (3) residing for plane perpendicular, described left folding turn of bilge (5) includes leading portion (51), epimere (52) and back segment (53), institute
State leading portion (51), epimere (52) and back segment (53) to be sequentially connected with, described right folding turn of bilge (6) include front portion (61), top (62) and
Rear portion (63), described front portion (61), top (62) and rear portion (63) are sequentially connected with, at described left folding turn of bilge (5) and pars intermedia (3)
Junction, pars intermedia (3) are equipped with position limiting structure (4) with right folding turn of bilge (6) junction.
A kind of device for radiator for semiconductor assembling the most according to claim 3, it is characterised in that this quasiconductor dissipates
Hot device includes radiating fin (7) and heat-radiator plate, and described heat-radiator plate includes front bottom surface (8) and rear bottom surface (9), and this quasiconductor dissipates
The molding mode of hot device is extruded, and bottom surface (9) are provided with several radiating fins (7) in the rear, at described radiating fin
Being provided with several transection slots (10) and at least two U-lag between sheet (7), the left part (1) of described spring and right part (2) are equal
Bend inwards；When confined state, one of them plate face of thermal source (14) contacts with front bottom surface (8), on the other side another
Individual plate face contacts with pars intermedia (3), and described front portion (61) and leading portion (51) are positioned at the front side of front bottom surface (8), described rear portion
(63) lay respectively at two U-lags of rear bottom surface (9) with back segment (53) in and contact with rear bottom surface (9), described left part (1) and
Right part (2) is fastened in two transection slots (10) respectively, and described position limiting structure (4) lays respectively at the left and right two of thermal source (14)
Side.
A kind of device for radiator for semiconductor assembling the most according to claim 3, it is characterised in that this quasiconductor dissipates
Hot device includes radiating fin (7) and heat-radiator plate, and described heat-radiator plate includes front bottom surface (8) and rear bottom surface (9), and this quasiconductor dissipates
The molding mode of hot device is metal plate punching molding, is equipped with several radiating fins (7), in institute at described front bottom surface (8) two ends
Stating rear bottom surface (9) and be provided with at least two punching press spacing (13), described punching press spacing (13) includes through hole, grid hole and gap bridge
Hole；When confined state, one of them plate face of thermal source (14) contacts with front bottom surface (8), another plate face on the other side
Contacting with pars intermedia (3), described front portion (61) and leading portion (51) are positioned at the front side of front bottom surface (8), described rear portion (63) and after
Section (53) contacts with rear bottom surface (9) respectively, and it is spacing that described left part (1) and right part (2) is fastened on two punching presses respectively
(13), in, described position limiting structure (4) lays respectively at the left and right sides of thermal source (14).
A kind of device for radiator for semiconductor assembling the most according to claim 1 and 2, it is characterised in that described bullet
The global shape of spring is M shape, in described left part (1) with left folding turn of bilge (5) junction, right part (2) with right folding turn of bilge (6) even
The place of connecing is equipped with position limiting structure (4), and described left part (1) and right part (2) all bends inwards.
A kind of device for radiator for semiconductor assembling the most according to claim 6, it is characterised in that this quasiconductor dissipates
Hot device includes radiating fin (7) and heat-radiator plate, and described heat-radiator plate includes front bottom surface (8) and rear bottom surface (9), and this quasiconductor dissipates
The molding mode of hot device is extruded, and bottom surface (9) are provided with several radiating fins (7) in the rear, at described radiating fin
Being provided with several transection slots (10) and at least two U-lag between sheet (7), described left part (1) and right part (2) is all to inner side
Bending；When confined state, one of them plate face of thermal source (14) contacts with front bottom surface (8), another plate on the other side
Face contacts with pars intermedia (3), and described position limiting structure (4) lays respectively at the left and right sides of radiator, described left part (1) and the right side
End (2) is fastened in transection slot (10) respectively.
A kind of device for radiator for semiconductor assembling the most according to claim 6, it is characterised in that this quasiconductor dissipates
Hot device includes radiating fin (7) and heat-radiator plate, and described heat-radiator plate includes front bottom surface (8) and rear bottom surface (9), and this quasiconductor dissipates
The molding mode of hot device is metal plate punching molding, is equipped with several radiating fins (7), in institute at described front bottom surface (8) two ends
Stating rear bottom surface (9) and be provided with at least two punching press spacing (13), described punching press spacing (13) includes through hole, grid hole and gap bridge
Hole, described left part (1) and right part (2) all inwardly lateral buckling；When confined state, one of them plate face of thermal source (14) with
Front bottom surface (8) contacts, and another plate face on the other side contacts with pars intermedia (3), and described position limiting structure (4) blocks respectively and sets
In two punching presses spacing (13), described left part (1) and right part (2) all contacts with rear bottom surface (9).
A kind of device for radiator for semiconductor assembling the most according to claim 1 and 2, it is characterised in that described bullet
Spring is plastics spring, and its molding mode includes molded and 3D printing shaping.
A kind of device for radiator for semiconductor assembling the most according to claim 1 and 2, it is characterised in that described bullet
The main material of spring is elastic metallic, and elastic metallic is coated with plastic protective layer, and its molding mode is punch forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620645724.6U CN205789938U (en) | 2016-06-27 | 2016-06-27 | A kind of device for radiator for semiconductor assembling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620645724.6U CN205789938U (en) | 2016-06-27 | 2016-06-27 | A kind of device for radiator for semiconductor assembling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205789938U true CN205789938U (en) | 2016-12-07 |
Family
ID=58131096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620645724.6U Active CN205789938U (en) | 2016-06-27 | 2016-06-27 | A kind of device for radiator for semiconductor assembling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205789938U (en) |
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2016
- 2016-06-27 CN CN201620645724.6U patent/CN205789938U/en active Active
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Address after: No. 1199 Xinfei Road, Songjiang District, Shanghai, 20161 Patentee after: AAVID THERMALLOY LLC Patentee after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: No. 1199 Xinfei Road, Songjiang District, Shanghai, 20161 Patentee before: AAVID THERMALLOY LLC Patentee before: Aavid Shenzen Thermal Energy System Co.,Ltd. |
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Address after: No. 1199 Xinfei Road, Songjiang District, Shanghai, 20161 Patentee after: Baode (Shanghai) Technology Co.,Ltd. Patentee after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: No. 1199 Xinfei Road, Songjiang District, Shanghai, 20161 Patentee before: AAVID THERMALLOY LLC Patentee before: Baode South China (Shenzhen) thermal energy system Co.,Ltd. |
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