CN205766620U - A kind of hot press heat-conducting buffer pressure pad - Google Patents
A kind of hot press heat-conducting buffer pressure pad Download PDFInfo
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- CN205766620U CN205766620U CN201620717789.7U CN201620717789U CN205766620U CN 205766620 U CN205766620 U CN 205766620U CN 201620717789 U CN201620717789 U CN 201620717789U CN 205766620 U CN205766620 U CN 205766620U
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- heat
- conducting
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- buffer pressure
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Abstract
This utility model belongs to heat-conducting buffer pad technical field, particularly relates to a kind of wood industry dalle process equipment that is used in and runs the hot press heat-conducting buffer pressure pad in producing.Its technical scheme is made up of heat-conducting mechanism and the silica gel piece being affixed on its both sides；Described heat-conducting mechanism by overall metal heat-conducting substrate and be respectively arranged at some heat absorbing units of its arranged on both sides, heat releasing unit is constituted.The heat-conducting plate constituting this heat-conducting buffer pressure pad is overall structure, there is no cross point, during equipment high-voltage operation, not only do not have heat-conducting plate mutual extrusion fracture phenomenon there is the feature of length in service life, the most also because of its flatness height make it have heat conduction homogeneous temperature, heat transfer is fast, the temperature difference is little and the feature of good heat conduction effect.
Description
Technical field
This utility model belongs to thermal conductance buffering spacer technical field, particularly relate to a kind of flat-bed press equipment, purposes in
Wood industry dalle, electronics, fabrication pressing facing overlay film process equipment run the hot press heat-conducting buffer pressure pad in producing.
Background technology
Reinforced composite floorboard, wood mould pressing floor, multi-layer solid wood floor, bamboo flooring, furniture wood is included at timber wood-based plate
Door, particieboard, building template and thick china etc. overlay finish coat during, in order to prevent plate surface hot-spot or local
Supercool and affect wood-based plate surface quality, between heating platen and steel plate, it is provided with one layer of liner, i.e. heat-conducting buffer pressure pad, this is led
Hot buffer pressure pad plays a part compensator or trimmer pressure and conduction of heat, can make up template (steel plate) when pressurized and differ with hot plate pressurized
The pressure that cause and sheet metal thickness tolerance are caused is uneven, temperature is irregular and affects the phenomenon of wood-based plate surface quality.Therefore at wood
Material artificial board decorative must use heat-conducting buffer pressure pad during overlaying.By retrieval:
The heat-conducting buffer pressure pad of British patent WO9613376 (applicant: Marathon company) be in the world today at first
The product entered.Its structure is: the radial direction yarn of pressure pad is multiply brass wire, and weft yams is silicone rubber parcel annealing copper wire, footpath
It is woven into net by the oblique string of herringbone to yarn and weft yams；The defect of this kind of product existence is: radially have with broadwise junction
Cross point is pressurized maximum position, when equipment work runs to maximum pressure, is easily generated and radially extrudes mutually with broadwise, use
Period causes the many places copper wire that fractures to be scattered, impact buffering resilience, uses certain time limit gel coated line to cause and comes off, reduces buffering
Resilience, another radially copper cash thermal conductive contact point area is the least, and heat conduction amount is low, and when pressurized, deflection is very big, loses resilience effect,
Thus reduce service life.Based on these problems:
Chinese Patent Application No. is 981024541.3, the utility application of Publication No. CN1240165A is the most public
Open a kind of keyboard type heat-conducting buffer pressure pad.Constitute the structure of this heat-conducting buffer pressure pad by the gold radially and after broadwise use roll bending
Belong to paper tinsel, be woven into the wire netting of certain specification by the weaving method of wire screen and silicone rubber is injected composition between metal forming.
Although the heat-conducting buffer pressure pad of this structure has (1), radial direction is that face contacts with the point of intersection of broadwise, and rubber connects with metal forming
Tactile stress is less, and rubber deformation amount changes according to pressure size, is not likely to produce permanent deformation；(2), rubber is in radial direction and broadwise
Between metal forming, difficult drop-off；(3), radially and broadwise metal forming is heat carrier, heat transfer temperature is fast, the temperature difference is little, homogeneous temperature
High with thermal conductivity；(4), only have rubber to be compressed when using, play elastic reaction, the advantages such as resilience scope is wide.But due to this heat conduction
The heat-conducting plate of buffer pressure pad structure is the braiding structure radially constituted with broadwise metal forming, therefore there is problems in that one, structure
The metal forming that the radial direction of one-tenth heat-conducting plate and broadwise weave there will be loosening of braiding again after the extruding being repeated continuously, and makes
Integral structure loose, affects its service life；Its two, owing to the metal forming of braiding superposition does not has elasticity, therefore overall
The elastic performance of heat-conducting buffer pressure pad is poor, the heat-conducting effect that impact is overall；Its three, due to metal forming through, broadwise elasticity
Be difficult to consistent, during braiding its entirety flatness it is difficult to ensure that, thus affect buffering heat-conducting effect.
Utility model content
The purpose of this utility model is just to provide a kind of overall heat transfer, good and length in service life the hot press of elastic effect is led
Hot buffer pressure pad.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of hot press heat-conducting buffer pressure pad, its structure is made up of heat-conducting mechanism and the silica gel piece being affixed on its both sides；It is special
Levy and be: described heat-conducting mechanism is by overall metal heat-conducting substrate and the some heat absorption lists being respectively arranged at its arranged on both sides
Unit, heat releasing unit are constituted.
In the structure constituting above-mentioned a kind of hot press heat-conducting buffer pressure pad,
Described heat absorbing units and heat releasing unit are that corresponding spread configuration is in the bar of described metal heat-conducting substrate both sides
Convex curved of shape, the both sides that this strip is convex curved are that the silicone rubber being arranged at described metal heat-conducting substrate two sides is through high temperature sulfur
Change the silica gel piece connecting hole forming integrative-structure；The top that described strip is convex curved is exposed to the outside of described silica gel piece and forms suction
Heat or heat releasing unit sheet；
Constitute the convex song of strip protruding from described metal heat-conducting substrate both sides of described heat absorbing units and heat releasing unit
Shape face is that equal in width interval is arranged；
Described heat absorbing units and heat releasing unit are that the top being correspondingly arranged in described metal heat-conducting substrate both sides is
The hollow convex bucket of arc is constituted, and the arc top of this hollow convex bucket is exposed to the outside of described silica gel piece and forms neither endothermic nor exothermic unit
Sheet；
Constitute the hollow convex bucket protruding from described metal heat-conducting substrate both sides of described heat absorbing units and heat releasing unit
Arrange for equal in width interval；
The barrel of described hollow convex bucket is provided with the silicone rubber of described metal heat-conducting substrate two sides through high temperature
Sulfuration forms the silica gel piece connecting hole of integrative-structure；
Described silica gel piece connecting hole is arranged on the metal heat-conducting substrate between described hollow convex bucket.
Hot press heat-conducting buffer pressure pad provided by the utility model compared with the existing technology, has the advantage that
One, is overall structure owing to constituting the heat-conducting plate of this hot press heat-conducting buffer pressure pad, does not has cross point, this buffering
Pressure pad, does not only have heat-conducting plate mutual extrusion fracture phenomenon during equipment high-voltage operation and has length in service life
Feature, the most also because of its flatness height make it have heat conduction homogeneous temperature, heat transfer is fast, the temperature difference is little and the feature of good heat conduction effect；
Its two, be through the hollow convex bucket that curved of excess convexity or top are arc owing to constituting the heat-conducting unit of this heat-conducting plate, this curved
Or arc top has good elasticity, simultaneously smooth with the both side surface that sulfuration is structure as a whole flexible silicon film, the most convex
Curved or the combination elastic with silica gel piece both of hollow convex bucket that top is arc, substantially increase this hot press heat conduction and delay
The buffering effect of punching press pad；Its three, due to constitute high temperature resistant resilience silastic material by between heat-conducting plate joint gap with silicon
Rubber forms integrative-structure so that heat-conducting plate and silica gel difficult drop-off, substantially prolongs its service life.
Accompanying drawing explanation
The structural representation of the hot press heat-conducting buffer pressure pad that Fig. 1 provides for this utility model；
Fig. 2 is the structural representation of the second metal heat-conducting substrate of hot press heat-conducting buffer pressure pad.
Detailed description of the invention
Below in conjunction with the accompanying drawings a kind of structure to hot press heat-conducting buffer pressure pad provided by the utility model is done into one
The detailed description of step.
As it is shown in figure 1, be the structural representation of a kind of hot press heat-conducting buffer pressure pad provided by the utility model.I.e. should
The structure of heat-conducting buffer pressure pad is made up of heat-conducting mechanism 1 and the silica gel piece 21,22 being affixed on its upper and lower both sides；The most above-mentioned heat conduction
Mechanism is arranged on some heat absorbing units 13 of side by overall metal heat-conducting substrate 11 and is arranged at the heat release on the downside of it
Unit 12 is constituted；The most above-mentioned heat absorbing units 13 and heat releasing unit 12 are that to be correspondingly arranged in the strip of metal heat-conducting substrate both sides convex
Curved, the both sides that this strip is convex curved are that the silicone rubber 21,22 being arranged at described metal heat-conducting substrate two sides is through high temperature
Sulfuration forms the silica gel piece connecting hole 14 of integrative-structure；The top dew that above-mentioned strip is convex curved is in the outside of silica gel piece and is formed
Neither endothermic nor exothermic dice 16.
In the structure constituting above-mentioned hot press heat-conducting buffer pressure pad,
Constitute convex curved of the strip protruding from metal heat-conducting substrate both sides of above-mentioned heat absorbing units and heat releasing unit
12,13 arrange for equal in width D interval, the area equation of area with room focus unit to ensure heat absorbing units；
Constitute above-mentioned heat absorbing units and the structure of heat releasing unit, it is also possible to be being correspondingly arranged in as shown in Figure 2
The hollow convex bucket 17 that top 16 is arc of metal heat-conducting substrate 11 both sides is constituted, and the arc top of this hollow convex bucket is exposed to silica gel
The outside of sheet forms neither endothermic nor exothermic dice；Equally in order to ensure area and heat releasing unit area equation, the structure of heat absorbing units
Becoming the hollow convex bucket protruding from metal heat-conducting substrate both sides of above-mentioned heat absorbing units and heat releasing unit is that equal in width is spaced and sets
Put；
So that be affixed on the silicone rubber of metal heat-conducting substrate two sides through high temperature vulcanized formation firmly one knot
Structure, is provided with silica gel piece connecting hole 18 on the barrel of hollow convex bucket；Certainly this connecting hole can also be arranged between hollow convex bucket
Metal heat-conducting substrate on.
No matter constitute heat absorbing units and the heat releasing unit of the metal heat-conducting substrate both sides of above-mentioned hot press heat-conducting buffer pressure pad
It is convex curved structure or hollow convex barrel shape structure, all can be completed by Sheet Metal Forming Technology；And this Sheet Metal Forming Technology can be protected
Demonstrate,prove the accuracy of its shape, advantageously allow the flatness of two sides of hot press heat-conducting buffer pressure pad formed, to ensure it
Heat conduction temperature uniform, heat transfer is fast, the temperature difference is little and the performance of good heat conduction effect, and owing to constituting above-mentioned heat absorbing units and heat release
The top of unit is arc shape so that the heat-conducting buffer pressure pad of composition have convex curved or hollow convex bucket that top is arc with
Two kinds of elastic combinations of silica gel piece, substantially increase the buffering effect of this hot press heat-conducting buffer pressure pad.
Hot press heat-conducting buffer pressure pad provided by the utility model, is applicable not only to wood industry dalle pressing facing and covers
Film is processed, and the pressing facing overlay film process equipment that relates to being applied equally to the different technologies such as electronics, fabrication field runs
Hot press heat-conducting buffer pressure pad in production.
Claims (7)
1. a hot press heat-conducting buffer pressure pad, its structure is made up of heat-conducting mechanism and the silica gel piece being affixed on its both sides；Its feature
It is: described heat-conducting mechanism is by overall metal heat-conducting substrate and the some heat absorption lists being respectively arranged at its arranged on both sides
Unit, heat releasing unit are constituted.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: described heat absorbing units and putting
Hot cell is corresponding convex curved of the spread configuration strip in described metal heat-conducting substrate both sides, the both sides that this strip is convex curved
For being arranged at the silicone rubber silica gel piece connecting hole through high temperature vulcanized formation integrative-structure of described metal heat-conducting substrate two sides；Institute
The top stating convex curved of strip is exposed to the outside formation neither endothermic nor exothermic dice of described silica gel piece.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: constitute described heat absorbing units and
Convex curved of the strip protruding from described metal heat-conducting substrate both sides of heat releasing unit is arranged for equal in width interval.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: described heat absorbing units and putting
Hot cell is that the hollow convex bucket that top is arc being correspondingly arranged in described metal heat-conducting substrate both sides is constituted, this hollow convex bucket
Arc top is exposed to the outside of described silica gel piece and forms neither endothermic nor exothermic dice.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 4, it is characterised in that: constitute described heat absorbing units and
The hollow convex bucket protruding from described metal heat-conducting substrate both sides of heat releasing unit is that equal in width interval is arranged.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 4, it is characterised in that: at the cylinder of described hollow convex bucket
The silicone rubber silica gel piece connecting hole through high temperature vulcanized formation integrative-structure of described metal heat-conducting substrate two sides it is provided with on wall.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 6, it is characterised in that: described silica gel piece connecting hole
It is arranged on the metal heat-conducting substrate between described hollow convex bucket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620717789.7U CN205766620U (en) | 2016-07-09 | 2016-07-09 | A kind of hot press heat-conducting buffer pressure pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620717789.7U CN205766620U (en) | 2016-07-09 | 2016-07-09 | A kind of hot press heat-conducting buffer pressure pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205766620U true CN205766620U (en) | 2016-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620717789.7U Active CN205766620U (en) | 2016-07-09 | 2016-07-09 | A kind of hot press heat-conducting buffer pressure pad |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965623A (en) * | 2016-07-09 | 2016-09-28 | 衡水华科橡塑有限公司 | Heat conducting cushioning pressure pad of hot press |
-
2016
- 2016-07-09 CN CN201620717789.7U patent/CN205766620U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105965623A (en) * | 2016-07-09 | 2016-09-28 | 衡水华科橡塑有限公司 | Heat conducting cushioning pressure pad of hot press |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |