CN202878829U - High-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate - Google Patents
High-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate Download PDFInfo
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- CN202878829U CN202878829U CN 201220496207 CN201220496207U CN202878829U CN 202878829 U CN202878829 U CN 202878829U CN 201220496207 CN201220496207 CN 201220496207 CN 201220496207 U CN201220496207 U CN 201220496207U CN 202878829 U CN202878829 U CN 202878829U
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Abstract
The utility model discloses a high-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate which comprises glass fabrics, glass felts and a composite copper foil, wherein epoxy-resin-glass-fabric-based bonding sheets are selected as the glass fabrics, epoxy resin glass fiber felt bonding sheets are selected as the glass felts, the epoxy-resin-glass-fabric-based bonding sheets and the epoxy resin glass fiber felt bonding sheets are formed by overlapping and curing low-bromine modified epoxy resin and bromine-free modified epoxy resin and then pressing, two to six layers of glass fabrics can be set according to different use occasions, the layer number of the glass felts corresponds to that of the glass fabrics, the layer number can be set to be one to five, and the two outermost layers of the glass fabrics are overlapped with the composite foil and then pressed. According to the high-CTI CEM-3 copper-clad plate, through selecting the low-bromine modified epoxy resin and the bromine-free modified epoxy resin as curing gents, the content of bromine element in a base material is reduced, and the CTI value of the plate is increased; and the CEM-3 copper-clad plate has better heat performance.
Description
(1) technical field
The utility model relates to the processing technique field of copper-clad plate, is specifically related to a kind of CEM-3 copper-clad plate with high CTI value.
(2) background technology
CEM-3 (Composite Epoxy Material Grade-3) is a kind of compound copper-clad plate, take epoxy resin glass fiber fabric base bonding sheet (glass-fiber-fabric) as fabric, epoxy resin fiberglass felt bonding sheet (glass felt) is as core material, single or double covers the Copper Foil after heat and presses and form.Fundamental characteristics and the FR-4 of CEM-3 are suitable, can punching processing (FR-4 need hole), cost was lower than FR-4 when CEM-3 made PCB, when opening material, sheet edge is smooth, does not have burr, surface smoothness is better than FR-4, processing technology is identical with FR-4, and the CTI value is generally 175V, can not be applicable to wet environment.Along with the changes in demand of client, must develop a kind of CEM-3 copper-clad plate applicable to (for example large zone of washing machine or mountain area appropriateness) under the wet environment in recent years, namely it must have higher CTI value.
(3) utility model content
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of CEM-3 copper-clad plate with high CTI value that combines with epoxy resin glass fiber fabric base bonding sheet and epoxy resin fiberglass felt bonding sheet is provided.
The purpose of this utility model is achieved in that the CEM-3 copper-clad plate of a kind of high CTI, formed by glass-fiber-fabric, glass felt and composite copper foil, described glass-fiber-fabric is selected epoxy resin glass fiber fabric base bonding sheet, glass felt is selected epoxy resin fiberglass felt bonding sheet, and the two is by hanging down bromine, forming without suppressing after the superimposed curing of the modified epoxy of bromine; Described glass-fiber-fabric also can arrange according to the difference of use occasion two to six layers, and the number of plies of described glass felt is corresponding with the number of plies of glass-fiber-fabric, and the number of plies can be set to one to five layer, two layers of again and compacting superimposed with composite copper foil of glass-fiber-fabric outermost.
The CEM-3 copper-clad plate of a kind of high CTI described in the utility model, by select low bromine, without the modified epoxy of bromine as curing agent, reduced the content of bromo element in the base material, improved the CTI value of sending out sheet material, simultaneously so that CEM-3 sheet material still has preferably hot property.
(4) description of drawings
Fig. 1 is structural representation of the present utility model
(5) specific embodiment
Below in conjunction with specific embodiment the utility model is specifically addressed.
As shown in Figure 1, the purpose of this utility model that the utility model relates to is achieved in that the CEM-3 copper-clad plate of a kind of high CTI, formed by glass-fiber-fabric 1, glass felt 2 and composite copper foil 3, described glass-fiber-fabric 1 is selected epoxy resin glass fiber fabric base bonding sheet, glass felt 2 is selected epoxy resin fiberglass felt bonding sheet, and glass-fiber-fabric 1 and glass felt 2 are by hanging down bromine, forming without suppressing after the superimposed curing of the modified epoxy of bromine; Glass-fiber-fabric 1 also can arrange according to the difference of use occasion two to six layers, and the number of plies of glass felt 2 is corresponding with the number of plies of glass-fiber-fabric 1, and the number of plies can be set to one to five layer, and two layers of the outermost of glass-fiber-fabric 1 are superimposed with composite copper foil 3 and suppress again.
Claims (2)
1. the CEM-3 copper-clad plate of a high CTI, mainly comprise glass-fiber-fabric, glass felt and composite copper foil, it is characterized in that: described glass-fiber-fabric is selected epoxy resin glass fiber fabric base bonding sheet, glass felt is selected epoxy resin fiberglass felt bonding sheet, and the two is by hanging down bromine, forming without suppressing after the superimposed curing of the modified epoxy of bromine; Two layers of again and compacting superimposed with composite copper foil of described glass-fiber-fabric outermost.
2. the CEM-3 copper-clad plate of a kind of high CTI according to claim 1, it is characterized in that: described glass-fiber-fabric also can arrange according to the difference of use occasion two to six layers, the number of plies of described glass felt is corresponding with the number of plies of glass-fiber-fabric, and the number of plies can be set to one to five layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220496207 CN202878829U (en) | 2012-09-21 | 2012-09-21 | High-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220496207 CN202878829U (en) | 2012-09-21 | 2012-09-21 | High-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202878829U true CN202878829U (en) | 2013-04-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220496207 Expired - Fee Related CN202878829U (en) | 2012-09-21 | 2012-09-21 | High-CTI (Comparative Tracking Index) CEM-3 (Composite Epoxy Material Grade-3) copper-clad plate |
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| CN (1) | CN202878829U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103413639A (en) * | 2013-05-31 | 2013-11-27 | 镇江天信电器有限公司 | Novel epoxy plate |
| CN104210181A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED lamps, and making method thereof |
| CN105172262A (en) * | 2015-07-24 | 2015-12-23 | 山东金宝电子股份有限公司 | Preparation method for composite group CEM-3 copper-clad laminate (CCL) with high comparative tracking index (CTI) and high thermal conductivity |
| CN107771418A (en) * | 2016-08-29 | 2018-03-09 | 上海国纪电子材料有限公司 | A kind of copper-clad plates of high-toughness halogen-free CEM 3 |
| CN107778772A (en) * | 2016-08-29 | 2018-03-09 | 上海国纪电子材料有限公司 | A kind of preparation method of the copper-clad plates of high-toughness halogen-free CEM 3 |
| CN110154486A (en) * | 2019-06-10 | 2019-08-23 | 铜陵华科电子材料有限公司 | The copper-clad plate of high proof tracking |
| CN110561857A (en) * | 2019-08-21 | 2019-12-13 | 瑞声科技（南京）有限公司 | Copper-clad laminate, printed wiring board, and method for manufacturing printed wiring board |
-
2012
- 2012-09-21 CN CN 201220496207 patent/CN202878829U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103413639A (en) * | 2013-05-31 | 2013-11-27 | 镇江天信电器有限公司 | Novel epoxy plate |
| CN104210181A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED lamps, and making method thereof |
| CN104210181B (en) * | 2014-08-14 | 2016-09-07 | 金安国纪科技股份有限公司 | LED highly heat-conductive copper-clad plate and preparation method thereof |
| CN105172262A (en) * | 2015-07-24 | 2015-12-23 | 山东金宝电子股份有限公司 | Preparation method for composite group CEM-3 copper-clad laminate (CCL) with high comparative tracking index (CTI) and high thermal conductivity |
| CN105172262B (en) * | 2015-07-24 | 2017-06-16 | 山东金宝电子股份有限公司 | A kind of CTI high, the preparation method of the copper-clad plates of high heat conduction composite base CEM 3 |
| CN107771418A (en) * | 2016-08-29 | 2018-03-09 | 上海国纪电子材料有限公司 | A kind of copper-clad plates of high-toughness halogen-free CEM 3 |
| CN107778772A (en) * | 2016-08-29 | 2018-03-09 | 上海国纪电子材料有限公司 | A kind of preparation method of the copper-clad plates of high-toughness halogen-free CEM 3 |
| CN107778772B (en) * | 2016-08-29 | 2021-06-25 | 上海国纪电子材料有限公司 | Preparation method of high-toughness halogen-free CEM-3 copper-clad plate |
| CN107771418B (en) * | 2016-08-29 | 2021-12-17 | 上海国纪电子材料有限公司 | High-toughness halogen-free CEM-3 copper-clad plate |
| CN110154486A (en) * | 2019-06-10 | 2019-08-23 | 铜陵华科电子材料有限公司 | The copper-clad plate of high proof tracking |
| CN110561857A (en) * | 2019-08-21 | 2019-12-13 | 瑞声科技（南京）有限公司 | Copper-clad laminate, printed wiring board, and method for manufacturing printed wiring board |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20150921 |
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| EXPY | Termination of patent right or utility model |