CN105965623A - Heat conducting cushioning pressure pad of hot press - Google Patents
Heat conducting cushioning pressure pad of hot press Download PDFInfo
- Publication number
- CN105965623A CN105965623A CN201610535714.1A CN201610535714A CN105965623A CN 105965623 A CN105965623 A CN 105965623A CN 201610535714 A CN201610535714 A CN 201610535714A CN 105965623 A CN105965623 A CN 105965623A
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- CN
- China
- Prior art keywords
- heat
- heat conducting
- conducting
- pressure pad
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/08—Manufacture of shaped articles; Presses specially designed therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M1/00—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching
- B27M1/02—Working of wood not provided for in subclasses B27B - B27L, e.g. by stretching by compressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
Abstract
The invention belongs to the technical field of heat conducting cushioning gaskets, and particularly relates to a heat conducting cushioning pressure pad of a hot press, which is used during the operation and production process of wood decorative sheet processing devices. The technical scheme adopted by the invention is that the heat conducting cushioning pressure pad comprises a heat conducting mechanism and silicon sheets stuck to two sides of the heat conducting mechanism. The heat conducting mechanism comprises a whole metal heat conducting substrate, a plurality of heat absorbing units and a plurality of heat releasing units. The heat absorbing units and the heat releasing units are separately arranged on two sides of the whole metal heat conducting substrate. The heat conducting plates of the heat conducting cushioning pressure pad adopt whole structures, no cross points exist on the heat conducting plates, the phenomenon that heat conducting plates are broken due to mutual extrusion is avoided during the high-pressure operation period of the device, and the heat conducting cushioning pressure pad has the characteristics that the service life is long, and since the flatness is high, the heat conducting temperature is uniform, the heat transfer speed is high, the temperature difference is small, and the heat conducting effect is good.
Description
Technical field
The invention belongs to thermal conductance buffering spacer technical field, particularly relate to a kind of flat-bed press equipment, purposes in wood industry
Dalle, electronics, fabrication pressing facing overlay film process equipment run the hot press heat-conducting buffer pressure pad in producing.
Background technology
Reinforced composite floorboard, wood mould pressing floor, multi-layer solid wood floor, bamboo flooring, furniture timber, plane is included at timber wood-based plate
Card, building template and thick china etc. overlay finish coat during, in order to prevent plate surface hot-spot or local overcooling
And affect wood-based plate surface quality, and between heating platen and steel plate, it being provided with one layer of liner, i.e. heat-conducting buffer pressure pad, this heat conduction is delayed
Punching press paves the effect of compensator or trimmer pressure and conduction of heat, can make up when pressurized template (steel plate) and hot plate pressurized inconsistent and
The pressure that sheet metal thickness tolerance is caused is uneven, temperature is irregular and affects the phenomenon of wood-based plate surface quality.Therefore timber people
Make during plate facing overlays and must use heat-conducting buffer pressure pad.By retrieval:
The heat-conducting buffer pressure pad of British patent WO9613376 (applicant: Marathon company) is state-of-the-art in the world today
Product.Its structure is: the radial direction yarn of pressure pad is multiply brass wire, and weft yams is silicone rubber parcel annealing copper wire, radially yarn
Line and weft yams are woven into net by the oblique string of herringbone；The defect of this kind of product existence is: radially has with broadwise junction and intersects
Point is pressurized maximum position, when equipment work runs to maximum pressure, is easily generated and radially extrudes mutually with broadwise, during use
The many places copper wire that fractures is caused to be scattered, impact buffering resilience, use certain time limit gel coated line to cause and come off, reduce buffering resilience
Property, another radially copper cash thermal conductive contact point area is the least, and heat conduction amount is low, and when pressurized, deflection is very big, loses resilience effect, thus
Reduce service life.Based on these problems:
Chinese Patent Application No. is 981024541.3, the application for a patent for invention of Publication No. CN1240165A then discloses one
Keyboard type heat-conducting buffer pressure pad.Constitute the structure of this heat-conducting buffer pressure pad by radially and broadwise use roll bending after metal forming, press
The weaving method of wire screen is woven into the wire netting of certain specification and silicone rubber injects composition between metal forming.This structure
Although heat-conducting buffer pressure pad has (1), radial direction is that face contacts with the point of intersection of broadwise, and rubber is with metal forming contact stress relatively
Little, rubber deformation amount changes according to pressure size, is not likely to produce permanent deformation；(2), rubber radially and broadwise metal forming it
Between, difficult drop-off；(3), radially and broadwise metal forming is heat carrier, heat transfer temperature is fast, the temperature difference is little, homogeneous temperature and thermal conductivity
High；(4), only have rubber to be compressed when using, play elastic reaction, the advantages such as resilience scope is wide.But due to this heat-conducting buffer pressure pad
The heat-conducting plate of structure is the braiding structure radially constituted with broadwise metal forming, therefore there is problems in that one, constitutes heat-conducting plate
The metal forming that weaves of radial direction and broadwise after the extruding being repeated continuously, there will be loosening of braiding again, and cause overall knot
Structure loose, affects its service life；Its two, owing to the metal forming of braiding superposition does not has elasticity, therefore overall heat-conducting buffer
The elastic performance of pressure pad is poor, the heat-conducting effect that impact is overall；Its three, be difficult to unanimously due to metal forming through, broadwise elasticity,
During braiding its entirety flatness it is difficult to ensure that, thus affect buffering heat-conducting effect.
Summary of the invention
It is an object of the invention to provide a kind of overall heat transfer, good and length in service life the hot press heat conduction of elastic effect is delayed
Punching press pad.
To achieve these goals, the technical solution used in the present invention is:
A kind of hot press heat-conducting buffer pressure pad, its structure is made up of heat-conducting mechanism and the silica gel piece being affixed on its both sides；Its feature exists
Some heat absorbing units of by overall metal heat-conducting substrate and being respectively arranged at its arranged on both sides in: described heat-conducting mechanism,
Heat releasing unit is constituted.
In the structure constituting above-mentioned a kind of hot press heat-conducting buffer pressure pad,
Described heat absorbing units and heat releasing unit are that the corresponding spread configuration strip in described metal heat-conducting substrate both sides is convex
Curved, the both sides that this bar shaped is convex curved are that the silicone rubber being arranged at described metal heat-conducting substrate two sides is through high temperature vulcanized shape
Into a single integrated structure silica gel piece connecting hole；The top that described strip is convex curved be exposed to described silica gel piece outside formed heat absorption or
Heat releasing unit sheet；
Constitute convex curved of the strip protruding from described metal heat-conducting substrate both sides of described heat absorbing units and heat releasing unit
Arrange for equal in width interval；
Described heat absorbing units and heat releasing unit are that to be correspondingly arranged in the top of described metal heat-conducting substrate both sides be arc
Hollow convex bucket constitute, the arc top of this hollow convex bucket be exposed to described silica gel piece outside formed neither endothermic nor exothermic dice；
The hollow convex bucket protruding from described metal heat-conducting substrate both sides constituting described heat absorbing units and heat releasing unit is
Width interval is arranged；
The barrel of described hollow convex bucket is provided with the silicone rubber of described metal heat-conducting substrate two sides through high temperature vulcanized
Form the silica gel piece connecting hole of integrative-structure；
Described silica gel piece connecting hole is arranged on the metal heat-conducting substrate between described hollow convex bucket.
Hot press heat-conducting buffer pressure pad provided by the present invention compared with the existing technology, has the advantage that
One, is overall structure owing to constituting the heat-conducting plate of this hot press heat-conducting buffer pressure pad, does not has cross point, this buffering pressure
Pad, does not only have heat-conducting plate mutual extrusion fracture phenomenon during equipment high-voltage operation and has the spy of length in service life
Point, the most also because of its flatness height make it have heat conduction homogeneous temperature, heat transfer is fast, the temperature difference is little and the feature of good heat conduction effect；Its
Two, be through the hollow convex bucket that curved of excess convexity or top are arc owing to constituting the heat-conducting unit of this heat-conducting plate, this curved or
Arc top has good elasticity, simultaneously smooth with the both side surface that sulfuration is structure as a whole flexible silicon film, the most convex song
Shape face or top are hollow convex bucket and the combination of silica gel piece both elasticity of arc, substantially increase this hot press heat-conducting buffer
The buffering effect of pressure pad；Its three, due to constitute high temperature resistant resilience silastic material by between heat-conducting plate joint gap with silicon rubber
Glue forms integrative-structure so that heat-conducting plate and silica gel difficult drop-off, substantially prolongs its service life.
Accompanying drawing explanation
The structural representation of the hot press heat-conducting buffer pressure pad that Fig. 1 provides for the present invention；
Fig. 2 is the structural representation of the second metal heat-conducting substrate of hot press heat-conducting buffer pressure pad.
Detailed description of the invention
Below in conjunction with the accompanying drawings a kind of structure to hot press heat-conducting buffer pressure pad provided by the present invention is done further
Describe in detail.
As it is shown in figure 1, be the structural representation of a kind of hot press heat-conducting buffer pressure pad provided by the present invention.This heat conduction i.e.
The structure of buffer pressure pad is made up of heat-conducting mechanism 1 and the silica gel piece 21,22 being affixed on its upper and lower both sides；The most above-mentioned heat-conducting mechanism
It is arranged on some heat absorbing units 13 of side by overall metal heat-conducting substrate 11 and is arranged at the heat releasing unit on the downside of it
12 are constituted；The most above-mentioned heat absorbing units 13 and heat releasing unit 12 are that to be correspondingly arranged in the strip of metal heat-conducting substrate both sides convex curved
Face, the both sides that this bar shaped is convex curved are that the silicone rubber 21,22 being arranged at described metal heat-conducting substrate two sides is through high temperature vulcanized
Form the silica gel piece connecting hole 14 of integrative-structure；The top dew that above-mentioned strip is convex curved is in the outside of silica gel piece and forms heat absorption
Or heat releasing unit sheet 16.
In the structure constituting above-mentioned hot press heat-conducting buffer pressure pad,
Constitute the convex curved face 12,13 of the strip protruding from metal heat-conducting substrate both sides of above-mentioned heat absorbing units and heat releasing unit
Arrange for equal in width D interval, the area equation of area with room focus unit to ensure heat absorbing units；
Constitute above-mentioned heat absorbing units and the structure of heat releasing unit, it is also possible to be as shown in Figure 2 be correspondingly arranged in metal
The hollow convex bucket 17 that top 16 is arc of heat-conducting substrate 11 both sides is constituted, and the arc top of this hollow convex bucket is exposed to silica gel piece
Outside forms neither endothermic nor exothermic dice；Equally in order to ensure area and the heat releasing unit area equation of heat absorbing units, in composition
The hollow convex bucket protruding from metal heat-conducting substrate both sides stating heat absorbing units and heat releasing unit is that equal in width is spaced setting；
So that be affixed on the silicone rubber of metal heat-conducting substrate two sides through the firm integrative-structure of high temperature vulcanized formation,
It is provided with silica gel piece connecting hole 18 on the barrel of hollow convex bucket；Certainly this connecting hole can also be arranged at the metal between hollow convex bucket
On heat-conducting substrate.
No matter constitute heat absorbing units and the heat releasing unit of the metal heat-conducting substrate both sides of above-mentioned hot press heat-conducting buffer pressure pad
It is convex curved structure or hollow convex barrel shape structure, all can be completed by Sheet Metal Forming Technology；And this Sheet Metal Forming Technology can be protected
Demonstrate,prove the accuracy of its shape, advantageously allow the flatness of two sides of hot press heat-conducting buffer pressure pad formed, to ensure it
Heat conduction temperature uniform, heat transfer is fast, the temperature difference is little and the performance of good heat conduction effect, and owing to constituting above-mentioned heat absorbing units and heat release
The top of unit is arc shape so that the heat-conducting buffer pressure pad of composition have convex curved or hollow convex bucket that top is arc with
Two kinds of elastic combinations of silica gel piece, substantially increase the buffering effect of this hot press heat-conducting buffer pressure pad.
Hot press heat-conducting buffer pressure pad provided by the present invention, is applicable not only to wood industry dalle pressing facing overlay film and adds
Work, and the pressing facing overlay film process equipment that relates to being applied equally to the different technologies such as electronics, fabrication field runs and produces
In hot press heat-conducting buffer pressure pad.
Claims (7)
1. a hot press heat-conducting buffer pressure pad, its structure is made up of heat-conducting mechanism and the silica gel piece being affixed on its both sides；Its feature
It is: described heat-conducting mechanism is by overall metal heat-conducting substrate and the some heat absorption lists being respectively arranged at its arranged on both sides
Unit, heat releasing unit are constituted.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: described heat absorbing units and putting
Hot cell is corresponding convex curved of the spread configuration strip in described metal heat-conducting substrate both sides, the both sides that this bar shaped is convex curved
For being arranged at the silicone rubber silica gel piece connecting hole through high temperature vulcanized formation integrative-structure of described metal heat-conducting substrate two sides；Institute
The top stating convex curved of strip is exposed to the outside formation neither endothermic nor exothermic dice of described silica gel piece.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: constitute described heat absorbing units and
Convex curved of the strip protruding from described metal heat-conducting substrate both sides of heat releasing unit is arranged for equal in width interval.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 1, it is characterised in that: described heat absorbing units and putting
Hot cell is that the hollow convex bucket that top is arc being correspondingly arranged in described metal heat-conducting substrate both sides is constituted, this hollow convex bucket
Arc top is exposed to the outside of described silica gel piece and forms neither endothermic nor exothermic dice.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 4, it is characterised in that: constitute described heat absorbing units and
The hollow convex bucket protruding from described metal heat-conducting substrate both sides of heat releasing unit is that equal in width interval is arranged.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 4, it is characterised in that: at the cylinder of described hollow convex bucket
The silicone rubber silica gel piece connecting hole through high temperature vulcanized formation integrative-structure of described metal heat-conducting substrate two sides it is provided with on wall.
A kind of hot press heat-conducting buffer pressure pad the most according to claim 6, it is characterised in that: described silica gel piece connecting hole
It is arranged on the metal heat-conducting substrate between described hollow convex bucket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610535714.1A CN105965623A (en) | 2016-07-09 | 2016-07-09 | Heat conducting cushioning pressure pad of hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610535714.1A CN105965623A (en) | 2016-07-09 | 2016-07-09 | Heat conducting cushioning pressure pad of hot press |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105965623A true CN105965623A (en) | 2016-09-28 |
Family
ID=56951390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610535714.1A Pending CN105965623A (en) | 2016-07-09 | 2016-07-09 | Heat conducting cushioning pressure pad of hot press |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105965623A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235965A (en) * | 2019-07-15 | 2021-01-15 | 卓英社有限公司 | Heat-conducting elastic protection component for Harper |
| CN113439022A (en) * | 2019-02-20 | 2021-09-24 | 胡克莱茵有限责任公司 | Pressure pad for use in a hydraulic single-layer or multi-layer hot press, and pressure pad press plate unit and press plate heating plate unit |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2239340A1 (en) * | 1973-07-31 | 1975-02-28 | Becker & Van Huellen | Press for wood-based materials - with integral lower support of glass fibre for wet or dry pressing |
| CN1240165A (en) * | 1998-06-22 | 2000-01-05 | 刘东升 | Keyboard type heat-conducting buffer pressure pad |
| EP1040909A1 (en) * | 1999-03-03 | 2000-10-04 | Thomas Josef Heimbach Gesellschaft mit beschränkter Haftung & Co. | Press pad |
| US20030059576A1 (en) * | 2001-09-27 | 2003-03-27 | Walter Halterbeck | Pressing cushion |
| US20050200062A1 (en) * | 2004-03-12 | 2005-09-15 | Dow Global Technologies, Inc. | Impact absorption structure |
| CN101413560A (en) * | 2008-11-24 | 2009-04-22 | 哈尔滨工业大学 | Array type metal cup-shaped thin wall structure energy absorber |
| CN203863778U (en) * | 2014-03-31 | 2014-10-08 | 江苏东佳木业有限公司 | Hot-press board crash pad structure of hot press |
| CN205766620U (en) * | 2016-07-09 | 2016-12-07 | 衡水华科橡塑有限公司 | A kind of hot press heat-conducting buffer pressure pad |
-
2016
- 2016-07-09 CN CN201610535714.1A patent/CN105965623A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2239340A1 (en) * | 1973-07-31 | 1975-02-28 | Becker & Van Huellen | Press for wood-based materials - with integral lower support of glass fibre for wet or dry pressing |
| CN1240165A (en) * | 1998-06-22 | 2000-01-05 | 刘东升 | Keyboard type heat-conducting buffer pressure pad |
| EP1040909A1 (en) * | 1999-03-03 | 2000-10-04 | Thomas Josef Heimbach Gesellschaft mit beschränkter Haftung & Co. | Press pad |
| US20030059576A1 (en) * | 2001-09-27 | 2003-03-27 | Walter Halterbeck | Pressing cushion |
| US20050200062A1 (en) * | 2004-03-12 | 2005-09-15 | Dow Global Technologies, Inc. | Impact absorption structure |
| CN101413560A (en) * | 2008-11-24 | 2009-04-22 | 哈尔滨工业大学 | Array type metal cup-shaped thin wall structure energy absorber |
| CN203863778U (en) * | 2014-03-31 | 2014-10-08 | 江苏东佳木业有限公司 | Hot-press board crash pad structure of hot press |
| CN205766620U (en) * | 2016-07-09 | 2016-12-07 | 衡水华科橡塑有限公司 | A kind of hot press heat-conducting buffer pressure pad |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113439022A (en) * | 2019-02-20 | 2021-09-24 | 胡克莱茵有限责任公司 | Pressure pad for use in a hydraulic single-layer or multi-layer hot press, and pressure pad press plate unit and press plate heating plate unit |
| CN113439022B (en) * | 2019-02-20 | 2023-11-07 | 胡克莱茵有限责任公司 | Press pad, press pad platen unit or press pad heating plate unit |
| CN112235965A (en) * | 2019-07-15 | 2021-01-15 | 卓英社有限公司 | Heat-conducting elastic protection component for Harper |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160928 |