CN1240165A - Keyboard type heat-conducting buffer pressure pad - Google Patents
Keyboard type heat-conducting buffer pressure pad Download PDFInfo
- Publication number
- CN1240165A CN1240165A CN98102451A CN98102451A CN1240165A CN 1240165 A CN1240165 A CN 1240165A CN 98102451 A CN98102451 A CN 98102451A CN 98102451 A CN98102451 A CN 98102451A CN 1240165 A CN1240165 A CN 1240165A
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- CN
- China
- Prior art keywords
- metal forming
- pressure pad
- buffer pressure
- broadwise
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/061—Cushion plates
Abstract
The present invention relates to a buffer pressure pad for artificial board press. In particular, it is a keyboard-type heat-conducting buffer pressure pad. Said invented buffer pressure pad is characterized by that it is formed from longitudinal and transverse metal foil strips and rubber. The bent longitudinal metal foil strips and transverse metal foil strips are woven into the metal net according to the keyboard-type structure, and the rubber is injected between the metal foil strips. Said invented heat-conducting buffer pressure pad can be worked for a long period at 230 deg.C, its heat-conductivity is high under the pressure of 20-30 kg/sq.cm, after the pressure is removed it can be restored into natural state, its elasticity is good, raw material source is extensive, cost is low and production process is simple.
Description
The present invention relates to the buffer pressure pad that timber wood-based plate press uses, specifically be meant a kind of keyboard type heat-conducting buffer pressure pad, it is applicable to melamine impregnated paper facing low pressure short period press.Its Heat Conduction Material is metal forming (metal forming that brass or thermal conductivity are high), and elastomeric material is resistant to elevated temperatures silicon rubber, and this heat-conducting buffer pressure pad can long-term work when 230 ℃ of environment temperatures.Apply 20-30kg/cm
2Pressure under the thermal conductivity height, recover nature after the pressure relief, good springiness, material source is extensive, low price, manufacturing technique is simple, import substitutes are saved foreign exchange.
Overlay in the process at timber wood-based plate melamine impregnated paper facing, influence the wood-based plate surface quality in order to prevent plate surface hot-spot or local overcooling, between heating platen and steel plate, be provided with one deck liner, it is heat-conducting buffer pressure pad, this heat-conducting buffer pressure pad plays compensator or trimmer pressure and heat conducting effect, can remedy backing plate (steel plate) and reach the irregular phenomenon that influences the wood-based plate surface quality of pressure inequality, temperature that is caused owing to the sheet metal thickness tolerance with the heating platen loose contact when pressurized.Therefore overlay in the process at timber wood-based plate melamine impregnated paper facing and must use heat-conducting buffer pressure pad.
2. by the state of the art as seen, (applicant: heat-conducting buffer pressure pad Marathon company) is a state-of-the-art product in the world today as BP WO 9613376.Its structure is: the radially yarn of pressure pad is the multiply brass wire, and weft yams is a silicon rubber parcel annealing copper wire, and radially yarn and weft yams are made into net partially by the oblique string of herringbone; The defective that this kind product exists is: (1), warp-wise and the intersection point place of weft yams contact, and rubber and wire compact stress are bigger, make rubber and Metal Yarns easily produce permanent deformation, reduction elasticity.(2), weft yams silica gel is exposed at the surface, use certain hour after, silicon rubber contact with pressing plate and backing plate circulation, causes silicon rubber to come off, reduction elasticity, thereby minimizing service life.(3), have only radially yarn heat conduction, heat-conducting area is little, thermal conductivity is low, is about 16 ℃ according to test heating platen temperature and the backing plate temperature difference.(4), its heat-conducting buffer pressure pad surface is countless points, stress is bigger when contacting with heating platen and steel plate, makes the contact point place easily produce plastic deformation, the time has been grown yarn and has easily fractureed from this point.(5), when pressurized the distortion of rubber and wire bigger, wire easily produces dead folding, produces permanent deformation forfeiture resilience, thereby reduces service life.(6), need foreign exchange when buying, and every (about 4 square metres) 1.2 ten thousand RMB of present price that cost an arm and a leg, Lead Time is long.
Based on the problems referred to above, the inventor develops product of the present invention through long-term concentrating on studies.Main purpose of the present invention is to provide a kind of good quality, and the suitable keyboard type heat-conducting buffer pressure pad of price, the remarkable result that expectation can reach with the characteristics on its structure and the material composition thereof.
Keyboard type heat-conducting buffer pressure pad provided by the present invention is applicable to timber wood-based plate melamine impregnated paper facing low pressure short period press.Through pressure pad on probation and that the excellent dried Britain of its combination property of test Marathon company produces.
The objective of the invention is that the following technical scheme of nationality realizes:
Keyboard type heat-conducting buffer pressure pad, it is characterized in that: comprise that warp-wise and broadwise metal forming and silicon rubber (or fluorubber) forms, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with silicon rubber or fluorubber between metal forming.
Described metal forming can be the high metal formings of thermal conductivity factor such as brass, aluminium, steel, bronze.
Described radially metal forming and broadwise metal forming can be two or more metal sheet band or metallic plates.
In the keyboard type heat-conducting buffer pressure pad provided by the present invention, designed braided structure radially uses the metal forming roll after curved with broadwise, is woven into the wire netting of certain specification by the braid method of metal gauze, and silicon rubber injects between the metal forming.
Characteristics of the present invention are embodied in: (1), be that face contacts radially with the intersection point place of broadwise, rubber and metal forming compact stress are less, and the rubber deformation amount changes according to the pressure size, and its scope is difficult for producing permanent deformation between 30-60%.(2), rubber is radially and between the broadwise metal forming, difficult drop-off.(3), radially be heat carrier, heat transfer temperature is fast, has a narrow range of temperature, and temperature is even, the thermal conductivity height with the broadwise metal forming.(4), when using, only rubber to be compressed, play elastic reaction, the resilience scope is wide, is 50-85%; Indeformable or deflection is minimum because of metal forming, so long service life.(5), the raw material wide material sources, low price, manufacturing technique is simple.(6), save foreign exchange.
Below in conjunction with drawings and Examples the present invention is described in detail.
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a stereogram of the present invention;
Fig. 3 is preceding schematic diagram for the present invention presses;
Fig. 4 presses the back schematic diagram for the present invention.
As shown in Figure 1, keyboard type heat-conducting buffer pressure pad is made up of warp-wise metal forming 1 and broadwise metal forming 2 and rubber 3, Wherein employed metal forming can be the high metals of thermal conductivity such as brass, aluminium. Wherein radially metal forming 1 and broadwise metal Paper tinsel 2 is that 6-30mm, thickness are the metal sheet band of 0.1-0.5mm for width, through being rolled into stereochemical structure shown in Figure 2. The roll extrusion embayment radially or the single face recess of broadwise metal sheet band inject rubber 3 (degree of depth of metal forming groove and silicon rubber 3 Thickness determine according to Mechanics Calculation and test), then by radially, broadwise is woven into plain weave one on the other, Its structure all is every a grid warp-wise and broadwise metal on the gauze pad warp-wise of weaving into and the weft direction as shown in Figure 1 Be injected with rubber between the strip.
The present invention is cut into the breadth that adapts with it according to the size of platen book size, put into pressing plate and backing plate it Between, can reach the purpose of heat-conducting buffer.
Fig. 3, Fig. 4 pressurize respectively front and press after fundamental diagram. As shown in Figure 3, before pressurization silicon rubber 3 will through, Latitude two holds tightly to metal tape, and heat radially transmits broadwise by platen and passes to backing plate again. After Figure 4 shows that pressurization The state of cushion pad, rubber 3 is compressed after the pressurization, and warp-wise, broadwise metal tape are as direct heat carrier, and heat is by pressing Plate transmits warp-wise (broadwise) metal tape, is delivered to backing plate again, and this moment, thermal conductivity factor was the highest.
Below in conjunction with embodiment the present invention is described in detail.
Use width as 6mm, thickness as 0.1mm brass as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the former silicon rubber of 2mm between metal forming.
Concrete technical indicator after the test is: pressure 28Kg/cm
2, 135 ℃ of platen temperatures, 124 ℃ of backing plate temperature, 11 time of temperature difference 1min, pressure pad decrement 0.6-1.2mm.
Use width as 10mm, thickness as 0.15mm brass and aluminium as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the 2mm fluorubber between metal forming.
Concrete technical indicator after the test is: pressure 28Kg/cm
2, 134 ℃ of platen temperatures, 124 ℃ of backing plate temperature, the temperature difference 10, time 1min, pressure pad decrement 0.6-1.2mm.
Embodiment 3
Use width as 13mm, thickness as 0.2mm brass and aluminium and bronze as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the former silicon rubber of 2mm between metal forming.
Concrete technical indicator after the test is: pressure 25Kg/cm
2, 132 ℃ of platen temperatures, 125 ℃ of backing plate temperature, the temperature difference 7, time 1min, pressure pad decrement 0.6-1.2mm.
Embodiment 4
Use width as 18mm, thickness as 0.3mm brass as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the 1mm fluorubber between metal forming.
Concrete technical indicator after the test is: pressure 25Kg/cm
2, 134 ℃ of platen temperatures, 125 ℃ of backing plate temperature, the temperature difference 9, time 1min, pressure pad decrement 0.4-0.5mm.
Embodiment 5
Use width as 24mm, thickness as 0.4mm brass as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the former silicon rubber of 1mm between metal forming.
Concrete technical indicator after the test is: pressure 22Kg/cm
2, 133 ℃ of platen temperatures, 126 ℃ of backing plate temperature, the temperature difference 7, time 1min, pressure pad decrement 0.3-0.4mm.
Embodiment 6
Use width as 30mm, thickness as 0.5mm brass as radially with the metal forming of broadwise, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, are injected with the former silicon rubber of 1mm between metal forming.
Concrete technical indicator after the test is: pressure 22Kg/cm
2, 132 ℃ of platen temperatures, 125 ℃ of backing plate temperature, the temperature difference 7, time 1min, pressure pad decrement 0.4-0.5mm.
As seen from the above-described embodiment, heat insulation about 15 ℃ of Britain's heat-conducting buffer pad, and of the present invention heat insulation be about 10 ℃.
Claims (3)
1, keyboard type heat-conducting buffer pressure pad, it is characterized in that: comprise that warp-wise and broadwise metal forming and rubber forms, wherein radially metal forming of Ya Waning and broadwise metal forming button tray type structure are woven into wire netting, and the rubber that injects between metal forming is silicon rubber or fluorubber.
2, the described keyboard type heat-conducting buffer pressure pad of claim 1 is characterized in that: described metal forming can be brass, aluminium, steel or the high metal forming of bronze thermal conductivity factor.
3, the described keyboard type heat-conducting buffer pressure pad of claim 1 is characterized in that: described radially metal forming and broadwise metal forming can be two or more metal sheet band or metallic plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98102451A CN1240165A (en) | 1998-06-22 | 1998-06-22 | Keyboard type heat-conducting buffer pressure pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98102451A CN1240165A (en) | 1998-06-22 | 1998-06-22 | Keyboard type heat-conducting buffer pressure pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1240165A true CN1240165A (en) | 2000-01-05 |
Family
ID=5217353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98102451A Pending CN1240165A (en) | 1998-06-22 | 1998-06-22 | Keyboard type heat-conducting buffer pressure pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1240165A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1105009C (en) * | 1999-03-03 | 2003-04-09 | 托马斯约瑟夫亨巴赫有限公司 | Press pad |
| CN100439089C (en) * | 2001-09-27 | 2008-12-03 | 托马斯约瑟夫亨巴赫有限公司 | Pressure pad |
| CN105965623A (en) * | 2016-07-09 | 2016-09-28 | 衡水华科橡塑有限公司 | Heat conducting cushioning pressure pad of hot press |
-
1998
- 1998-06-22 CN CN98102451A patent/CN1240165A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1105009C (en) * | 1999-03-03 | 2003-04-09 | 托马斯约瑟夫亨巴赫有限公司 | Press pad |
| CN100439089C (en) * | 2001-09-27 | 2008-12-03 | 托马斯约瑟夫亨巴赫有限公司 | Pressure pad |
| CN105965623A (en) * | 2016-07-09 | 2016-09-28 | 衡水华科橡塑有限公司 | Heat conducting cushioning pressure pad of hot press |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |