CN205723617U - A kind of Novel LED light - Google Patents
A kind of Novel LED light Download PDFInfo
- Publication number
- CN205723617U CN205723617U CN201620680118.8U CN201620680118U CN205723617U CN 205723617 U CN205723617 U CN 205723617U CN 201620680118 U CN201620680118 U CN 201620680118U CN 205723617 U CN205723617 U CN 205723617U
- Authority
- CN
- China
- Prior art keywords
- pin support
- chip
- groove
- encapsulation
- glass lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of Novel LED light, including installing plate, left pin support, right pin support, chip, metal wire, encapsulation overcoat, groove, glass lens, fixed plate and electrode column, left pin support and right pin support it is provided with on described installing plate, described right pin support one end is provided with chip, chip is connected with left pin support one end metal wire, installing plate upper end is provided with encapsulation overcoat, metal wire, chip, right pin support one end and left pin support one end are positioned at encapsulation overcoat, are provided with glass lens in encapsulating the groove of outer set upper side；This utility model, by being provided with glass lens in the groove at encapsulation overcoat top, can be effectively improved the wearability of LED；Encapsulation overcoat on LED is epoxy or organosilicon material, can effectively prevent electrical short or electrostatic from scurrying into chip and cause chip to puncture failure phenomenon；This utility model simple in construction, easy to manufacture, quality is good, can be widely popularized and apply.
Description
[technical field]
This utility model relates to the technical field of the technical field of LED, particularly Novel LED light.
[background technology]
LED light source various packaging technologies since coming out emerge in an endless stream, but are only mainly plug-in unit for encapsulation in appearance
Formula and surface-mount type (SMD).The most common plug-in type has overall epoxy encapsulation or mould top formula silica gel packaging, metal
Shell adds glass (or quartz) lens packages, and glass shell adds overall epoxy encapsulation.Owing to epoxy resin TG point is low, hardness
The most wear-resisting, during so using in the environment of the contact friction of long-term external force, surface is easy to obscure, thus causes product light
Learn degradation and can not normally use, for solving epoxy resin TG point the most wear-resisting low problem, occur in that the most again metal
Shell is plus the encapsulating products of glass (or quartz) lens, although solve wear-resisting problem, but due to the conductive characteristic of metal
Cause being easy to occur electrical short or electrostatic to scurry into chip and cause chip to puncture inefficacy during processing or use,
Additionally the cost of metal shell is the highest, and the processing of product entirety needs man-made assembly completely, causes the product using this packing forms
The concordance of quality is the highest and holds at high price, for solving the fraud that metal shell adds the encapsulation of glass (or quartz) lens
End, is proposed the most again a kind of glass shell and adds the product of overall epoxy encapsulation (outside the product of epoxy encapsulation
A glass shell in surface cover), owing to the encapsulation of LED is by epoxy encapsulation, so having stopped Metal Packaging to be susceptible to electricity
Property short circuit or the problem that lost efficacy of electrostatic breakdown, additionally product peripheral is by glass shell parcel, so wearability is also
Arrived solution, this kind encapsulation glass shell by processing conditions limited can not automated production, each shell be both needed to by burn
Making artificial cutting processing molding again after binding, speed is very slow, and concordance is very poor, simultaneously because the characteristic of Glass breadks easily needs to protect
Hold bigger production size and certain wall thickness just can complete processing, so using the product size of this kind of packing forms all to compare
Bigger than normal, and product design can not carry out the design of more complexity as required, the semi-finished product additionally, due to epoxy resin are to be enclosed within
In glass shell, both build-up tolerances cause the most much can not normally assembling, and produce yield and can not always
It is improved, between these problems, is applied the most on a large scale to this packing forms.
[utility model content]
The purpose of this utility model solves the problems of the prior art exactly, proposes a kind of Novel LED light, it is possible to make wear-resisting
Property good, do not occur electrical short or electrostatic to scurry into the phenomenons such as chip, manufacture easy to assembly, production efficiency is high, good product quality.
For achieving the above object, the utility model proposes a kind of Novel LED light, including installing plate, left pin support, the right side
Pin support, chip, metal wire, encapsulation overcoat, groove, glass lens, fixed plate and electrode column, described installing plate is provided with
Left pin support and right pin support, described right pin support one end is provided with chip, and chip is connected with left pin support one end
Metal wire, installing plate upper end is had to be provided with encapsulation overcoat, metal wire, chip, right pin support one end and left pin support one end
It is positioned at encapsulation overcoat, in encapsulating the groove of outer set upper side, is provided with glass lens.
As preferably, described fixed plate is provided with chip and electrode column, passes through metal wire between described chip and electrode column
Being connected, be provided with glass lens in the groove of fixed plate upper end, outside described chip, fixed plate and electrode column, bag is provided with encapsulation
Overcoat, encapsulation overcoat is outside equipped with installing plate.
As preferably, described groove is bondd by binding agent with glass lens；Described encapsulation overcoat is epoxy or organosilicon
Material；Described metal wire is the one in gold thread, alloy wire or aluminum steel；Mix in described glass lens and be provided with filter.
As preferably, described groove is cylindrical, semicircle, triangular prism shaped and cuboid, the glass corresponding with groove
Glass lens are cylindrical, spherical, triangular prism shaped and cuboid.
The beneficial effects of the utility model: this utility model is by saturating by being provided with glass in the groove at encapsulation overcoat top
Mirror, can be effectively improved the wearability of LED；Mutually bondd by binding agent between groove and glass lens, easy to assembly, with
Time product quality be guaranteed；Encapsulation overcoat on LED is epoxy or organosilicon material, can effectively prevent electrical short or
Person's electrostatic is scurried into chip and is caused chip to puncture failure phenomenon；This utility model simple in construction, easy to manufacture, quality is good, Ke Yijin
Row is widely popularized and applies.
Feature of the present utility model and advantage will combine accompanying drawing by embodiment and be described in detail.
[accompanying drawing explanation]
Fig. 1 is the three-dimensional structure diagram of a kind of embodiment of a kind of Novel LED light of this utility model；
Fig. 2 is the front view of a kind of embodiment of a kind of Novel LED light of this utility model；
Fig. 3 is the side view of a kind of embodiment of a kind of Novel LED light of this utility model；
Fig. 4 is the three-dimensional structure diagram of the another kind of embodiment of a kind of Novel LED light of this utility model；
Fig. 5 is the front view of the another kind of embodiment of a kind of Novel LED light of this utility model；
Fig. 6 is the side view of the another kind of embodiment of a kind of Novel LED light of this utility model.
In figure: the left pin support of 1-installing plate, 2-, the right pin support of 3-, 4-chip, 5-metal wire, 6-encapsulate overcoat, 7-
Groove, 8-glass lens, 9-fixed plate, 10-electrode column.
[detailed description of the invention]
Refering to Fig. 1-Fig. 6, this utility model one Novel LED light, prop up including installing plate 1, left pin support 2, right pin
Frame 3, chip 4, metal wire 5, encapsulation overcoat 6, groove 7, glass lens 8, fixed plate 9 and electrode column 10, described installing plate 1 sets
Being equipped with left pin support 2 and right pin support 3, described right pin support 3 one end is provided with chip 4, chip 4 and left pin support
2 one end connect have metal wire 5, installing plate 1 upper end be provided with encapsulation overcoat 6, metal wire 5, chip 4, right pin support 3 one end and
Left pin support 2 one end is positioned at encapsulation overcoat 6, is provided with glass lens 8 in the groove 7 of encapsulation overcoat 6 upper end；Described fixed plate
9 are provided with chip 4 and electrode column 10, are connected by metal wire 5 between described chip 4 and electrode column 10, fixed plate 9 upper end
Being provided with glass lens 8 in groove 7, outside described chip 4, fixed plate 9 and electrode column 10, bag is provided with encapsulation overcoat 6, outside encapsulation
Set 6 is outside equipped with installing plate 1；Described groove 7 is bondd by binding agent with glass lens 8；Described encapsulation overcoat 6 for epoxy or has
Machine silicon materials；Described metal wire 5 is the one in gold thread, alloy wire or aluminum steel；Mix in described glass lens 8 and be provided with optical filtering material
Material；Described groove 7 is cylindrical, semicircle, triangular prism shaped and cuboid, and the glass lens 8 corresponding with groove 7 is cylinder
Shape, spherical, triangular prism shaped and cuboid.
Utility model works process:
This utility model one Novel LED light in the course of the work, by chip 4 by metal wire 5 and left pin support 2 and
Right pin support 3 is electrically connected with, and product top is made the semi-finished product with fluted 7, then by glass with encapsulation overcoat 6
Lens 8 are bonded to finished product in being placed into groove 7, can carry out installing and using.
This utility model, by being provided with glass lens 8 in the groove 7 at encapsulation overcoat 6 top, can be effectively improved LED
The wearability of lamp；Mutually being bondd by binding agent between groove 7 and glass lens 8, easy to assembly, the quality of product obtains simultaneously
Ensure；Encapsulation overcoat 6 on LED is epoxy or organosilicon material, can effectively prevent electrical short or electrostatic from scurrying into chip 4
Chip 4 is caused to puncture failure phenomenon；This utility model simple in construction, easy to manufacture, quality is good, can carry out being widely popularized and answering
With.
Above-described embodiment is to explanation of the present utility model, is not to restriction of the present utility model, any new to this practicality
Scheme after type simple transformation belongs to protection domain of the present utility model.
Claims (4)
1. a Novel LED light, it is characterised in that: include installing plate (1), left pin support (2), right pin support (3), chip
(4), metal wire (5), encapsulation overcoat (6), groove (7), glass lens (8), fixed plate (9) and electrode column (10), described installation
Being provided with left pin support (2) and right pin support (3) on plate (1), described right pin support (3) one end is provided with chip (4),
Chip (4) is connected with left pin support (2) one end metal wire (5), and installing plate (1) upper end is provided with encapsulation overcoat (6), metal
Line (5), chip (4), right pin support (3) one end and left pin support (2) one end are positioned at encapsulation overcoat (6), encapsulation overcoat (6)
It is provided with glass lens (8) in the groove (7) of upper end.
2. Novel LED light as claimed in claim 1 a kind of, it is characterised in that: described fixed plate (9) be provided with chip (4) and
Electrode column (10), is connected by metal wire (5) between described chip (4) and electrode column (10), the groove of fixed plate (9) upper end
(7) being provided with glass lens (8) in, described chip (4), fixed plate (9) and electrode column (10) outside bag are provided with encapsulation overcoat
(6), encapsulation overcoat (6) is outside equipped with installing plate (1).
3. a kind of Novel LED light as claimed in claim 1, it is characterised in that: described groove (7) passes through with glass lens (8)
Binding agent bonds；Described encapsulation overcoat (6) is epoxy or organosilicon material；Described metal wire (5) is gold thread, alloy wire or aluminum steel
In one；Mix in described glass lens (8) and be provided with filter.
4. Novel LED light as claimed in claim 1 a kind of, it is characterised in that: described groove (7) be cylindrical, semicircle, three
Prismatic and cuboid, the glass lens (8) corresponding with groove (7) is cylindrical, spherical, triangular prism shaped and cuboid
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620680118.8U CN205723617U (en) | 2016-06-27 | 2016-06-27 | A kind of Novel LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620680118.8U CN205723617U (en) | 2016-06-27 | 2016-06-27 | A kind of Novel LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723617U true CN205723617U (en) | 2016-11-23 |
Family
ID=57327037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620680118.8U Expired - Fee Related CN205723617U (en) | 2016-06-27 | 2016-06-27 | A kind of Novel LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723617U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531856A (en) * | 2016-12-20 | 2017-03-22 | 苏州金科电子有限公司 | Diode package structure used on anti-counterfeiting cash counter for bank and fabrication method of diode package structure |
| CN113410373A (en) * | 2021-06-02 | 2021-09-17 | 麦科勒（滁州）新材料科技有限公司 | Light-gathering type ultraviolet LED lamp bead |
-
2016
- 2016-06-27 CN CN201620680118.8U patent/CN205723617U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106531856A (en) * | 2016-12-20 | 2017-03-22 | 苏州金科电子有限公司 | Diode package structure used on anti-counterfeiting cash counter for bank and fabrication method of diode package structure |
| CN113410373A (en) * | 2021-06-02 | 2021-09-17 | 麦科勒（滁州）新材料科技有限公司 | Light-gathering type ultraviolet LED lamp bead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20170627 |