CN205648330U - CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction - Google Patents
CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction Download PDFInfo
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- CN205648330U CN205648330U CN201620507586.5U CN201620507586U CN205648330U CN 205648330 U CN205648330 U CN 205648330U CN 201620507586 U CN201620507586 U CN 201620507586U CN 205648330 U CN205648330 U CN 205648330U
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- cpci
- board
- circuit board
- integrated circuit
- hot pipe
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Abstract
The utility model relates to a CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction, simple structure, and be convenient for install the dismantlement, shortened product production cycle, reduced the maintenance cost, hot conduction efficiency is high. It is including the integrated circuit board cooling box who is used for connecting fixed CPCI integrated circuit board, be provided with flat heat pipe with the embedding of welded mode on integrated circuit board cooling box's the cooling surface, the one end of flat heat pipe extends to the center of cooling surface, and the other end sets up along integrated circuit board cooling box's fixed expose edge surfaces parallel and level, after the fixed CPCI of formation of CPCI integrated circuit board and integrated circuit board cooling box reinforced integrated circuit board and insertion machine case, flat heat pipe contacted with quick -witted case guide slot. Utilize the direct guide slot contact with slot -in type machine case as the contact surface of flat heat pipe, the heat transfer carrier of flat heat pipe between as CPCI integrated circuit board and quick -witted tank wall, with the heat from integrated circuit board center part fast transferring to slot -in type quick -witted case lateral wall to form a high -efficient heat conduction route, improvement plug -in CPCI that can be very big reinforces integrated circuit board heat transmission efficiency.
Description
Technical field
This utility model is directed to use with CPCI and reinforces the thermal design field of the electronic equipments such as board, is specially
A kind of CPCI based on hot pipe conducting reinforces board radiator structure.
Background technology
CPCI reinforces board and has obtained applying widely, for its heat radiation in industry and business
Technology also has a variety of, it is common practice to lead at CPCI securing plate card backside installing small aerogenerator
Dynamic formula dispels the heat.Although this radiating mode can meet major part radiating requirements, but at the cabinet of closed
In, the heat loss through convection produced due to blower fan is simply carried out at enclosure interior, has with extraneous heat exchange
Limit, therefore radiating effect is not ideal.Further, since blower fan falls within a simple small-sized system
System, the reliability of himself is the most crucial for whole machinery equipment.Particularly shake in high-magnitude
In the middle of the adverse circumstances such as dynamic, impact, it is particularly evident that this point shows.
Utility model content
For problems of the prior art, this utility model provides a kind of based on hot pipe conducting
CPCI reinforces board radiator structure, simple in construction, and is easily installed dismounting, shortens production week
Phase, decreasing maintenance cost, heat conduction efficiency is high.
This utility model is to be achieved through the following technical solutions:
A kind of CPCI based on hot pipe conducting reinforces board radiator structure, including fixing for connecting
The board heat dissipation box of CPCI board；Embed in a welding manner on the radiating surface of board heat dissipation box and be provided with
Flat hot pipe；One end of flat hot pipe extends to the center of radiating surface, and the other end is consolidated along board heat dissipation box
Deckle edge flush is arranged；The fixing CPCI that formed of CPCI board and board heat dissipation box reinforce board and
After inserting cabinet, flat hot pipe contacts with cabinet guide groove.
Preferably, the built-in edge at the board heat dissipation box radiating surface back side is fixedly installed wedge lock mechanism,
CPCI is reinforced in the guide-track groove that board constrains in cabinet by wedge lock mechanism for producing coupling mechanism force；
CPCI reinforces board and inserts after cabinet, wedge lock mechanism and flat hot pipe respectively with cabinet guide groove two
Face contacts.
Preferably, the L-shaped setting of flat hot pipe.
Preferably, wedge lock mechanism is fixed with board heat dissipation box by screw.
Preferably, the radiating surface of board heat dissipation box is provided with the preformed groove coordinated with flat hot pipe.
Preferably, board heat dissipation box reinforces board plug peace using flat hot pipe surface as whole CPCI
The datum level of dress.
Compared with prior art, this utility model has a following useful technique effect:
This utility model is that one CPCI ruggedized construction, heat pipe, retaining mechanism combined is novel to be added
Gu CPCI board structure.Flat hot pipe is embedded, with flat hot pipe surface at the edge of board radiating box
As installing contact surface, flat hot pipe is utilized directly to contact with the guide groove of insertion slot type cabinet as contact surface,
Flat hot pipe is as the heat transfer carrier between CPCI board and cabinet wall, by heat from board centre
Quickly it is delivered to insertion slot type case side wall, thus forms an efficient heat conduction path, it is possible to greatly
Improve plug-in CPCI and reinforce board heat transfer efficiency.This structure can inherently solve plug-in
Reinforce a difficult problem for high-power board heat radiation difficulty.Owing to the reliability of heat pipe itself is the highest, and without dimension
Repair, its global reliability can't be affected for whole machine system.This is simple and practical, can
With in multiple occasion flexible Application, it is simple to installing/dismounting, shorten life cycle of the product greatly, and
Technology is the most controlled, can produce in enormous quantities, forms standardization, the product of seriation.
Further, this utility model installs wedge lock mechanism at the reverse side of board datum clamp face,
After CPCI board inserts cabinet, wedge contacts with cabinet guide groove with flat hot pipe simultaneously, improves biography
Lead efficiency.
Accompanying drawing explanation
Fig. 1 is the exploded perspective view of radiator structure described in this utility model example.
Fig. 2 is the overall structure schematic diagram of radiator structure described in this utility model example.
Fig. 3 is radiator structure described in this utility model example and CPCI board assembly relation schematic diagram.
Fig. 4 is that radiator structure described in this utility model example assembles schematic diagram with CPCI board.
Fig. 5 is the specifically used schematic diagram of radiator structure described in this utility model example.
In figure, 1 is flat hot pipe, and 2 is board heat dissipation box, 3 wedge lock mechanisms, and 4 is screw, 5
For CPCI board, 6 is cabinet.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described in further detail, described in be to this utility model
Explanation rather than restriction.
The one that CPCI ruggedized construction, heat pipe, retaining mechanism are combined by this utility model is novel
CPCI board ruggedized construction, this structure can inherently solve plug-in high-power board heat radiation difficulty
A difficult problem.
Comprise as it is shown in figure 1, this utility model CPCI based on hot pipe conducting reinforces board radiator structure
Flat hot pipe 1, board heat dissipation box 2, wedge lock mechanism 3 and screw 4.
As in figure 2 it is shown, flat hot pipe 1 is embedded in the edge of board heat dissipation box 2 in a welding manner, with
Flat hot pipe 1 surface is as face on the basis of whole board plug datum clamp face, i.e. radiating surface.Board dissipates
Hot box 2 datum level edge is provided with preformed groove for installing flat hot pipe 1.Board heat dissipation box 2 datum level
Reverse side wedge lock mechanism 3 is installed, wedge lock mechanism 3 and board heat dissipation box 2 use screw 4 even
Connect.As shown in Figure 3 and Figure 4, CPCI board 5 fixed constraint the most in some way dispels the heat at board
Form CPCI on box 2 and reinforce board.As it is shown in figure 5, after CPCI reinforces board insertion cabinet, wedge shape
Retaining mechanism 3 contacts with cabinet guide groove two sides respectively with flat hot pipe 1, and wedge lock mechanism 3 produces lock
CPCI is reinforced in the guide-track groove that board constrains in cabinet 6 by clamp force.Flat hot pipe 1 is as CACP plate
Heat transfer carrier between card 5 and cabinet wall, it is possible to improve plug-in CPCI greatly and reinforce board heat
Efficiency of transmission.And wedge lock mechanism 3 contacts with cabinet guide groove with flat hot pipe 1 simultaneously, increase heat
Conduction surface, improves conduction efficiency.This reinforcing board radiator structure, can produce in enormous quantities, is formed
Standardization, the product of seriation.
Claims (6)
1. a CPCI based on hot pipe conducting reinforces board radiator structure, it is characterised in that include using
In the board heat dissipation box (2) connecting fixing CPCI board (5)；The radiating surface of board heat dissipation box (2)
On in a welding manner embed be provided with flat hot pipe (1)；One end of flat hot pipe (1) extends to dissipate
The center of hot side, the other end is arranged along the built-in edge flush of board heat dissipation box (2)；CPCI plate
After card (5) and the fixing CPCI that formed of board heat dissipation box (2) reinforce board and insert cabinet, flat heat
Pipe (1) contacts with cabinet guide groove.
A kind of CPCI based on hot pipe conducting the most according to claim 1 reinforces board heat radiation knot
Structure, it is characterised in that the built-in edge at board heat dissipation box (2) the radiating surface back side is fixedly installed wedge shape
Retaining mechanism (3), wedge lock mechanism (3) is used for producing coupling mechanism force and CPCI reinforces board constraint
In the guide-track groove of cabinet (6)；After CPCI reinforces board and inserts cabinet, wedge lock mechanism
(3) contact with cabinet guide groove two sides respectively with flat hot pipe (1).
A kind of CPCI based on hot pipe conducting the most according to claim 1 reinforces board heat radiation knot
Structure, it is characterised in that flat hot pipe (1) L-shaped setting.
A kind of CPCI based on hot pipe conducting the most according to claim 1 reinforces board heat radiation knot
Structure, it is characterised in that wedge lock mechanism (3) is solid with board heat dissipation box (2) by screw (4)
Fixed.
A kind of CPCI based on hot pipe conducting the most according to claim 1 reinforces board heat radiation knot
Structure, it is characterised in that be provided with on the radiating surface of board heat dissipation box (2) and coordinate with flat hot pipe (1)
Preformed groove.
A kind of CPCI based on hot pipe conducting the most according to claim 1 reinforces board heat radiation knot
Structure, it is characterised in that using flat hot pipe (1) surface as whole CPCI on board heat dissipation box (2)
Reinforce the datum level that board plug is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620507586.5U CN205648330U (en) | 2016-05-30 | 2016-05-30 | CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620507586.5U CN205648330U (en) | 2016-05-30 | 2016-05-30 | CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205648330U true CN205648330U (en) | 2016-10-12 |
Family
ID=57050798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620507586.5U Active CN205648330U (en) | 2016-05-30 | 2016-05-30 | CPCI reinforces integrated circuit board heat radiation structure based on heat pipe conduction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205648330U (en) |
-
2016
- 2016-05-30 CN CN201620507586.5U patent/CN205648330U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |