A kind of chip type wide-area automobile oxygen sensor chip structure
Technical field
This utility model relates to automotive oxygen sensor, particularly relates to a kind of chip territory automotive oxygen sensor
Chip structure.
Background technology
Lean combustion engine has efficiency of combustion high, improves the advantages such as discharge, meets that people are energy-conservation to be subtracted
The requirement of row, but its air-fuel ratio is more than 18 (chemically correct fuel is 14.7).Traditional chip oxygen sensing
Device can only detect the situation of oxygen concentration in air-fuel ratio tail gas near chemically correct fuel, it is impossible to dilute
The tail gas of thin combustion engine effectively detects, and wide area automotive oxygen sensor can measure λ accurately
Value (0.65≤λ≤∞).Tail gas enters diffuser casing, zirconium oxide reference cell perception tail gas by diffusion aperture
In oxygen concentration after produce voltage (Us).According to the difference of oxygen concentration in tail gas, the dense of fuel-rich mixes
Close gas by generation higher than reference voltage (UsRef), sensor controller will produce the pump of a positive direction
Electric current (Ip), this Ip carries out chemolysis reaction in oxygen pumps into diffuser casing, produces in the offgas
Water and carbon monoxide and some oxides, be attached to the surface of pump oxygen unit.Will be too much in chemical reaction
Hydrocarbon decompose, thus reduce the concentration of waste gas, make oxygen concentration in diffuser casing change,
Making Us become 0.45V, now in tail gas, oxygen concentration reaches poised state simultaneously.On the contrary, oxygen-enriched dilute
Generation is less than Us by gaseous mixtureRef, sensor controller will produce a reciprocal Ip, and this Ip is by oxygen
Air pump goes out diffuser casing.Ip now reflects the oxygen concentration of tail gas, and Ip is converted into by sensor controller
Output voltage (Uout), just may be used with size by the polarity (direction of current flow) changing pump electric current
To reach to balance the tail gas oxygen content in diffuser casing.The Ip how this to be changed goes to control electromotor
Electronic control unit ECU to the adjustment of fuel injector injection time it is critical that, in controlling loop
Having one piece of digital signal processor (DSP) circuit, this circuit has two tunnel outputs, and a road is by change
Ip signal is by amplifying the linear voltage of digital-to-analogue conversion, and this voltage, from 0V~5V consecutive variations, goes control
The air-fuel ratio of Engine ECU processed adjusts.Another road output pulse width modulated signal removes controlling filed effect switch
The conducting of transistor (COM) and deadline, provide electric current to heater, add heated oxygen sensor.
Broad domain oxygen sensor oxygen pump is based on carrying current principle:
The core component of territory type oxygen sensor is its sensitive chip, it by add thermode, oxygen pump external electrode,
Oxygen inner pump electrode and reference electrode composition, generally by five layers of compact zirconia of multilayer printed circuit
(ZrO2) substrate is formed by stacking, the manufacture method of this chip is: make oxygen by casting arrangement
Change zirconio sheet;Substrate is carried out punching of cutting into slices;The substrate cut is carried out multi-layer silk screen printing, makes
Each functional layer;Five layers of substrate overlapping being cut, be finally sintered, glazing etc. processes again.
Application No.: the patent of invention of 201010238039.9 discloses one " chip wide domain standard signal
Output oxygen sensor used in vehicle ", the oxygen pump base layer of this sensor and reactive matrix layer are stabilized with yttrium oxide
Zirconium oxide substrate;Multi-layer ceramics gas exchange layer and upper and lower heated substrate layer be by aluminium oxide+magnesium oxide+
The most compounded substrate of Barium monoxide, each layer laminate afterwards by first printing electrode and with
Sintering processing is integrally forming.In this patent, the shortcoming of sensor construction is the substrate of the top adding thermode
Being formed by two pieces, in lamination process, the stress adding thermode is uneven,
Resistance wire can be caused to deform, heating process increases thermal stress, causes adding thermode and blow, thus
Affect sensor life-time;Reference channel air chamber is bigger, forms a big cavity in the sensor,
The intensity in working sensor region can be reduced, make sensor failure.
Wide area oxygen sensing described in the patent of Application No. 201120115065.2 and 201310029118.2
In device structure, all it is above opening on substrate layer for importing tested atmosphere to the aperture of diffusion barrier layer
Aperture, owing to aperture is the least, upper and lower para-position is extremely difficult, makes yield rate the highest.
Summary of the invention
The purpose of this utility model is for the deficiency of above-mentioned chip broad domain oxygen sensor structure design, to core
Chip architecture is improved, it is provided that a kind of chip territory automotive oxygen sensor chip structure, has more
Simple version, it is not necessary to form minimum gas port by punching, it is to avoid para-position difficulty is blocked up
Plug aperture causes chip yield low;The air guide channel flexible structure formed on substrate, Fabrication parameter can
Control.
A kind of chip type wide-area automobile oxygen sensor chip structure, is laminated the most successively by five layers of substrate
Form;5 layers of substrate are respectively the first base layer, the second base layer, the 3rd base layer, the 4th matrix
Layer and the 5th base layer, the oxygen pump external electrode formed on the first base layer and the guarantor of oxygen pump external electrode
Sheath;At the reference electrode that is formed below of the 3rd base layer, and it is formed at the 3rd base layer and the 4th
Reference channel is formed between base layer;On the 5th base layer, formed through insulating barrier covering
Add thermode, the connection pin below conductive hole to the 5th base layer;It is characterized in that:
One base layer is formed below oxygen inner pump electrode and internal cavity and diffusion barrier layer, and air guide channel connects tested
Atmosphere and diffusion barrier layer.
Described air guide channel opening is located at oxygen sensor chip head front end, and tested tail gas is from head front end
Enter.
Described air guide channel opening is located at the oxygen sensor chip both sides near head, and tested tail gas is from head two
Side enters.
In former chip type wide-area automobile oxygen sensor chip structure: before the diffusion barrier layer of oxygen inner pump electrode
It is the aperture obtained in the first base layer upper punch cutting for importing the diffusion aperture of tested atmosphere, and this reality
With novel formed respectively at the die-cut aperture processed of former chip type wide-area automobile oxygen sensor chip structure inducing QI lead to
Road and diffusion layer.Its advantage is that structure simplifies, and makes and production process simplifies, and yield rate is higher.No
Need to form minimum gas port by punching, it is to avoid para-position difficulty blocking aperture causes chip finished product
Rate is low;The air guide channel flexible structure formed on substrate, Fabrication parameter is controlled.
Accompanying drawing explanation
Fig. 1 is a kind of cross-sectional view along its length of the present utility model.
Fig. 2 is the schematic top plan view of a kind of air guide channel form in Fig. 1.
Fig. 3 is the schematic top plan view of another kind of air guide channel form in Fig. 1.
Detailed description of the invention
The utility model will be further described with detailed description of the invention below in conjunction with the accompanying drawings, and part is right
The restriction of its protection domain.
Embodiment 1
Structure of the present utility model is as it is shown in figure 1, be overrided to form the most successively by five layers of substrate, 5
Layer substrate is respectively first base layer the 1, second base layer the 2, the 3rd base layer the 3, the 4th base layer 4
With the 5th base layer 5;The oxygen pump external electrode 15 formed on the first base layer 1 and oxygen pump external electrode
Protective layer 16;Oxygen inner pump electrode 14 and internal cavity 13 and diffusion are formed below at the first base layer 1
Barrier layer 12, air guide channel 11 connects tested atmosphere and diffusion barrier layer 12;At the 3rd base layer 3
Reference electrode 10 is formed below, and be formed at shape between the 3rd base layer 3 and the 4th base layer 4
Become reference channel 9;On the 5th base layer 5, formed and add thermode 8 through what insulating barrier covered,
Connection pin 7 below conductive hole 6 to the 5th base layer 5;The Diffusion Barrier of oxygen inner pump electrode
The diffusion aperture that layer 12 is previously used for importing tested atmosphere does not obtains in the first base layer 1 upper punch cutting
Aperture, and on this interior electrode 14, form air guide channel 11 and diffusion barrier layer 12 respectively, such as Fig. 2
Shown in, the concrete structure of air guide channel 11 be opening in head front end, tested tail gas enters from head front end
Enter.
Embodiment 2
A kind of chip type wide-area automobile oxygen sensor chip structure.In addition to following situation, remaining is with embodiment 1:
The concrete structure of air guide channel 11 as shown in Figure 3 be opening at chip near the both sides of head,
Tested tail gas enters from head both sides.
This detailed description of the invention compared with prior art has a following good effect:
In this detailed description of the invention, a kind of chip type wide-area automobile oxygen sensor chip structure makes chip wide domain vapour
The manufacturing process of car oxygen sensor chip is simple.The pump electricity of chip type wide-area automobile oxygen sensor chip at present
Pond part is as air guide channel by the first base layer 1 top aperture, owing to aperture is the least, causes making
The upper and lower para-position during overlapping of die-cut good substrate is extremely difficult.And this detailed description of the invention only needs
Second base layer 2 to form air guide channel, the problem that there is not upper and lower para-position, to make manufacturing process
Obtain great simplification.
Two, this detailed description of the invention makes the yield rate of chip type wide-area automobile oxygen sensor chip be greatly improved,
Reduce production cost.Relative to existing Oxynitride sensor chip structure, this detailed description of the invention
The mode using side to form gas passage instead of top aperture as gas passage, makes chip folded
Stress during conjunction is more uniformly distributed, and reduces the stress adding thermode, decreases the deformation of resistance wire
With thermal stress in sintering process, improve the probability of electrode conduction in product, and extend
The service life of resistance wire.