CN205629602U - Tin head is spread in dimorphism chamber - Google Patents

Tin head is spread in dimorphism chamber Download PDF

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Publication number
CN205629602U
CN205629602U CN201620437894.5U CN201620437894U CN205629602U CN 205629602 U CN205629602 U CN 205629602U CN 201620437894 U CN201620437894 U CN 201620437894U CN 205629602 U CN205629602 U CN 205629602U
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China
Prior art keywords
tin
step body
stannum
head
type
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Active
Application number
CN201620437894.5U
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Chinese (zh)
Inventor
关美英
吴涛
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SHENZHEN PENGCHENGXIANG INDUSTRIAL Co Ltd
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SHENZHEN PENGCHENGXIANG INDUSTRIAL Co Ltd
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Priority to CN201620437894.5U priority Critical patent/CN205629602U/en
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Abstract

The utility model relates to a tin head is spread in dimorphism chamber, including the first step body, the second step body. Because of being provided with hemispherical recess main part on the second step body, be provided with two symmetric design's buckle groove between this hemispherical recess main part and the second step body, be provided with two die cavities on the lower face portion that should first step personally experiences sth. Part of the body, be provided with the X type in every die cavity and melt the tin guide way, melt the tin guiding gutter in this X type and be provided with the exhaust ditch around. During soldering tin, utilize hemispherical recess embedding ball -type tool, rotatory 90 degrees, can realize the nimble working face of swinging, can guarantee to melt tin is flowed to four sides by fine guide, recycle the exhaust ditch with the inside air of the die cavity external world that in time discharges, it influences the electrically conductive ability of chip to have avoided fashioned tin layer to have the bubble, reach when avoiding the monotype chamber to spread the tin head and carry two independent chips on the dish and paste the frame, solder paste under two molten conditions is because receive the chip extrusion or the frame rocks and the tin head is spread in dimorphism chamber of company of production silk phenomenon emergence.

Description

Dimorphism chamber paving stannum head
[technical field]
This utility model relates to a kind of dimorphism chamber in terms of paster technique paving stannum head.
[background technology]
Described chip paster technique refers to paste on the load plate of framework by chip scolding tin material, and in this technical process, described scolding tin material not only acts as electric action, but also plays the effect of fixed chip.Existing traditional scolding tin material technique of paving is: by melted scolding tin gob to framework load plate, uses the paving stannum head with the single die cavity of certain depth to subdue, and is spread out by melted scolding tin material and is formed at consistent square of die cavity and has certain thickness scolding tin body.The most again chip is kept flat and be placed on scolding tin body upper surface.Pave in scolding tin material technical process at this, in most cases, a framework load plate pastes a chips.In order to ensure that scolding tin material needs to be heated to 380 degree to 420 degree at molten condition, then described framework load plate.In the process, owing to needing to paste the chip that two spacing are about 0.5 millimeter to 1 millimeter on the existing load plate occurred on some product.Owing to clearance distance is the least, and framework is easily rocking during by work, and the scolding tin material making to be arranged at the molten condition above framework load plate can be unstable and flow, between two some scolding tin will because of flowing the company's of generation silk.
[utility model content]
In view of this, technical problem to be solved in the utility model is to provide one when can avoid pasting two independent chips on a framework load plate simultaneously, the dimorphism chamber paving stannum head that between two solder(ing) pastes of molten condition, the company's of generation silk phenomenon occurs.
Above-mentioned technical problem is solved for this, technical scheme in this utility model is used a kind of dimorphism chamber paving stannum head, it includes the first step body being placed on work surface, it is arranged at the second step body above first step body, it is characterized in that: be provided with on described second step body and can be provided with the buckle slot for two symmetric designs of swing work surface flexibly between this hemisphere main body and second step body with the hemisphere main body of flexible rotating 90 degree.
Limiting further according to technical characteristics, described hemisphere body interior is provided with the hemispherical groove for embedding ball-type tool.
Limit further according to technical characteristics, two die cavities with the degree of depth arranged side by side it are provided with on work surface under described first step body, it is provided with for ensureing that the solder(ing) paste guiding molten condition melts stannum gathering sill to the X-type that surrounding is uniformly paved with in the middle of each die cavity, melts stannum gathering sill four sides at this X-type and be provided with for ensureing the aerofluxus ditch that air is normally discharged.
Advantageous Effects of the present utility model: because being provided with hemisphere main body on described second step body, the buckle slot of two symmetric designs it is provided with between this hemisphere main body and second step body, two die cavities it are provided with on work surface under this first step body, it is provided with X-type in the middle of each die cavity and melts stannum gathering sill, this X-type solder guiding gutter four sides is provided with aerofluxus ditch.During scolding tin, the hemispherical groove utilizing described hemisphere body interior embeds ball-type tool, 90-degree rotation, can realize swinging work surface flexibly, can ensure that molten stannum is well guided to flow to four limits, air within die cavity is discharged the external world by recycling aerofluxus ditch in time, there is aeration chip conductive ability in the tin layers avoiding molding, therefore, when reaching to avoid single-cavity paving stannum head to paste two independent chips on framework load plate, the solder(ing) paste under two molten conditions is because being rocked by chip extruding or framework and dimorphism chamber that company of generation silk phenomenon occurs spreads stannum head.
Below in conjunction with the accompanying drawings and embodiment, the technical solution of the utility model is described in further detail.
[accompanying drawing explanation]
Fig. 1 is the axonometric chart of dimorphism chamber paving stannum head in this utility model;
Fig. 2 is the front schematic view of dimorphism chamber paving stannum head in this utility model;
Fig. 3 be the total A-A of Fig. 2 to schematic cross-section;
Fig. 4 be in Fig. 3 A to close-up schematic view;
Fig. 5 is the side schematic view of dimorphism chamber paving stannum head in this utility model;
Fig. 6 is the schematic diagram overlooking direction of dimorphism chamber paving stannum head in this utility model.
[detailed description of the invention]
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer, clear, below in conjunction with drawings and Examples, this utility model is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain this utility model, is not used to limit this utility model.
Refer to shown in Fig. 1 to Fig. 6, below in conjunction with embodiment, a kind of dimorphism chamber paving stannum head is described, it first step body 1 including being placed in work surface, it is arranged at first step body 1 second step body 2 above, it is arranged at the hemisphere main body 3 on second step body 2 top, is arranged on buckle slot 4 between hemisphere main body 3 and second step body 2.
It is provided with on described second step body 2 and can be provided with the buckle slot 4 for two symmetric designs of swing work surface flexibly between this hemisphere main body 3 and second step body 2 with the hemisphere main body 3 of flexible rotating 90 degree.Described hemisphere main body 3 is internally provided with the hemispherical groove 5 for embedding ball-type tool.Two die cavities 6 with certain depth arranged side by side it are provided with on 1 time work surface of described first step body, when each die cavity 6 middle is provided with for ensureing to spread stannum, the solder(ing) paste of molten condition melts stannum gathering sill to the X-type that surrounding is uniformly paved with, and is provided with for ensureing the aerofluxus ditch that air is normally discharged in this X-type solder guiding gutter surrounding.
The installation position of described solder(ing) paste is a hemispherical groove 5, to be used for embedding ball-type tool, 90-degree rotation.The buckle slot 4 that two be designed with are symmetrical is blocked, to ensure that dimorphism chamber paving stannum head normally fixedly mounts, it is possible to swing work surface flexibly in the position of second step body 2.Described solder(ing) paste is by the spacing height of reality ensureing restriction equipment identification work surface of the second step body 2 of design certain altitude.Second step body 2 is transitioned into design work face.It is two degree of depth arranged side by side die cavities 6 at 10um to 40um in design work face.Two die cavities 6 devise X-type respectively and melt stannum gathering sill in middle part, this X-type melts stannum gathering sill and ensures that dimorphism paving is clapped stannum head and pressed when paving under the solder(ing) paste to molten condition, ensureing that solder(ing) paste melts the direction of stannum gathering sill according to X-type, extruding until being uniformly paved with whole die cavity to surrounding.Melt the aerofluxus ditch devising a width between stannum gathering sill and work surface step at 150um at X-type, ensure that air can normally be discharged when pressure down is paved, it is to avoid cause tin layers to there is aeration chip conductive ability.
In sum, because being provided with hemisphere main body 3 on described second step body 2, the buckle slot 4 of two symmetric designs it is provided with between this hemisphere main body 3 and second step body 2, it is provided with two die cavities 6 on 1 time work surface of this first step body, it is provided with X-type in the middle of each die cavity 6 and melts stannum gathering sill, melt stannum gathering sill surrounding at this X-type and be provided with aerofluxus ditch.During scolding tin, the hemispherical groove 5 utilizing described hemisphere body interior embeds ball-type tool, 90-degree rotation, can realize swinging work surface flexibly, can increase clearance distance between two chips, the air within die cavity 6 is discharged the external world by recycling aerofluxus ditch in time, it is to avoid the tin layers of molding exists aeration chip conductive ability, thus avoiding when pasting two chips on a load plate, between the tin layers under two chips, the phenomenon of the company's of generation silk occurs.Therefore, when reaching to avoid two independent chips on framework load plate to paste, the dimorphism chamber paving stannum head that between two connected solder(ing) pastes of molten condition, the company's of generation silk phenomenon occurs.
Illustrate preferred embodiment of the present utility model above by reference to accompanying drawing, not thereby limit to interest field of the present utility model.Those skilled in the art, all should be within interest field of the present utility model without departing from any amendment, equivalent and the improvement made in scope and spirit of the present utility model.

Claims (3)

1. a dimorphism chamber paving stannum head, it includes the first step body being placed on work surface, is arranged at First Second step body above the body of rank, it is characterised in that: it is provided with and can revolve flexibly on described second step body The hemisphere main body turning 90 degrees, is provided with for swinging work flexibly between this hemisphere main body and second step body The buckle slot of two symmetric designs in face.
2. dimorphism chamber as claimed in claim 1 paving stannum head, it is characterised in that: described hemisphere body interior sets It is equipped with the hemispherical groove for embedding ball-type tool.
3. dimorphism chamber as claimed in claim 1 paving stannum head, it is characterised in that: work under described first step body Make on face, to be provided with two die cavities with the degree of depth arranged side by side, be provided with in the middle of each die cavity for ensureing guiding The solder(ing) paste of molten condition melts stannum gathering sill to the X-type that surrounding is uniformly paved with, and melts stannum gathering sill four at this X-type Face is provided with for ensureing the aerofluxus ditch that air is normally discharged.
CN201620437894.5U 2016-05-12 2016-05-12 Tin head is spread in dimorphism chamber Active CN205629602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620437894.5U CN205629602U (en) 2016-05-12 2016-05-12 Tin head is spread in dimorphism chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620437894.5U CN205629602U (en) 2016-05-12 2016-05-12 Tin head is spread in dimorphism chamber

Publications (1)

Publication Number Publication Date
CN205629602U true CN205629602U (en) 2016-10-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110394523A (en) * 2019-07-19 2019-11-01 王育安 A kind of flexible printed board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110394523A (en) * 2019-07-19 2019-11-01 王育安 A kind of flexible printed board
CN110394523B (en) * 2019-07-19 2021-10-15 朱笑笑 Flexible printed substrate

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