CN205609491U - Wafer box - Google Patents

Abstract

The utility model provides a wafer box, including a box body, in the bottom in the box body outside has inside sunken being used for of box body earlier on and forms the recess that bears the plummer of wafer to still including set up in the buffer layer of the bottom in the box body outside. The utility model provides an among the wafer box, because the outside of its bottom is provided with a buffer layer, but buffer layer cushioning effect in the effort of box body bottom, external force was received to the plummer of avoiding bearing the wafer touching and extrusion to can not receive the damage by the interior wafer of effectual protection wafer box.

Description

Wafer cassette

Technical field

The present invention relates to technical field of manufacturing semiconductors, particularly to a kind of wafer cassette.

Background technology

In field of semiconductor manufacture, owing to wafer is frangible and the microgranule in environment need to be avoided to pollute, therefore In the preservation and transportation of wafer, generally wafer need to be positioned in wafer cassette.

As depicted in figs. 1 and 2, bottom outside the box body of traditional wafer cassette has one and caves inward Groove 11a, this groove 11a form the plummer 11 for carrying wafer, and wafer 20 is positioned over plummer On 11, wherein fit with described plummer 11 in a surface of wafer 20.As can be seen here, on using When stating wafer cassette storing wafer 20, owing to the described direct plummer 11 with wafer cassette of wafer 20 is fitted, Therefore touched when the bottom of wafer cassette, when especially extruding, easily caused the wafer 20 in wafer cassette There is fragmentation.Particularly when the wafer using this wafer cassette to deposit and transport thinner thickness, its fragmentation Probability is higher.

For reducing the probability of wafer generation fragmentation, current way is the bottom avoiding personnel to touch wafer cassette, Further, when packing this wafer cassette, the upper-lower position in the wafer cassette being placed with wafer respectively increases One empty wafer cassette, to prevent from touching or be expressed to be placed with the wafer of wafer because of any extraneous factor Box, especially needs to guarantee or extruding the most touched with the plummer of wafer laminating, thus ensures the complete of wafer Whole.But, a wafer cassette carrying wafer needs corresponding upper and lower two empty wafer cassette, relatively costly, And increase the difficulty of packaging.

Summary of the invention

The purpose of this utility model is to provide a kind of wafer cassette that can preferably protect wafer, existing to solve The problem that wafer in some wafer cassette easily occurs fragmentation.

For solving above-mentioned technical problem, this utility model provides a kind of wafer cassette, including a box body, in institute Stating the bottom outside box body and have a groove to tray interior depression, described groove is formed and is used for carrying crystalline substance The plummer of circle, and also include the cushion being arranged at the bottom outside described box body.

Optionally, in described wafer cassette, described cushion is positioned at described groove.

Optionally, in described wafer cassette, there are one between described cushion and the bottom of groove and delay Rush region.

Optionally, in described wafer cassette, the thickness of described cushion is less than the height of described groove.

Optionally, in described wafer cassette, described cushion fills up described groove, and described cushion The elastic modelling quantity of material less than 8Mpa.Further, the material of described cushion is rubber.

Optionally, in described wafer cassette, described cushion generally circular in shape.

Optionally, in described wafer cassette, described cushion covers whole grooved area and described box Subregion bottom body.

Optionally, in described wafer cassette, described cushion generally circular in shape or square.

Optionally, in described wafer cassette, described cushion is network structure.

Optionally, in described wafer cassette, described cushion is gridiron.

Compared with prior art, in the wafer cassette that this utility model provides, the bottom outside its box body sets It is equipped with a cushion, when the bottom of wafer cassette is touched by external force or is extruded, described cushion available buffer Act on the active force bottom box body, it is to avoid extruded by external force for carrying the plummer of wafer, from And the wafer in box body can be effectively protected.Further, when the wafer cassette in this utility model is packed Time, it is not necessary to the upper-lower position in this wafer cassette respectively increases an empty wafer cassette, with escapable cost, keeps away Exempt to cause the wasting of resources.

Accompanying drawing explanation

Fig. 1 is the upward view of a kind of wafer cassette of the prior art；

Fig. 2 is the schematic diagram using the wafer cassette shown in Fig. 1 to place wafer；

Fig. 3 is the structural representation of a kind of wafer；

Fig. 4 is the structural representation of another kind of wafer；

Fig. 5 is the upward view bottom the box body of the wafer cassette of this utility model embodiment one；

Fig. 6 is the sectional view of the box body of the wafer cassette shown in Fig. 5；

Fig. 7 is the upward view bottom the box body of the wafer cassette that this utility model implements two；

Fig. 8 is the upward view bottom the box body of the wafer cassette that this utility model implements three.

Detailed description of the invention

As stated in the Background Art, when wafer is deposited in wafer, described wafer and the carrying of box wafer cassette Platform is fitted, and therefore when plummer is touched or extrudes, easily causes the wafer depositing in wafer cassette There is the risk of fragmentation.Especially, for the wafer of thinner thickness, the probability of its fragmentation is higher.

Fig. 3 is the structural representation of a kind of wafer, and the structure of current most of wafers is as it is shown on figure 3, be Required figure is formed, so after a surface of wafer 20A carries out thin film deposition, photoetching and etching And be not patterned technique on the silicon substrate 21A on another surface of wafer 20A, and described silicon The thickness of substrate 21A is usuallyExtremelyFig. 4 is the structural representation of another kind of wafer, as Shown in Fig. 4, described wafer 20B is the wafer of particular process sequence, such as MEMS wafer, at described wafer There is on one surface of 20B the figure formed through patterning process, and the silicon substrate of described wafer 20B 21B is engraved structure, and the thickness of the silicon substrate of the wafer of the thickness compared with normal flow process of described silicon substrate 21B Degree is thin, and the thickness of the silicon substrate 21B of the most described wafer 20B is

Visible, when using existing wafer cassette to deposit the most above-described MEMS wafer, due to it Thinner thickness, especially, the silicon substrate of described wafer is engraved structure, is therefore subject to when the bottom of wafer cassette During to touching or extruding, easily cause the wafer generation fragmentation in wafer cassette.

To this end, the purpose of this utility model is to provide a kind of wafer cassette that can preferably protect wafer, bag Including lid and box body, the bottom outside described box body has a groove caved inward, described groove type Becoming the plummer for carrying wafer, wherein the bottom outside described box body is additionally provided with a cushion, Described cushion available buffer acts on the active force bottom box body, it is to avoid be subject to for carrying the plummer of wafer Extruding to external force, it is to avoid extruded by external force for carrying the plummer of wafer, thus can be effective Wafer in protecting box body.Further, when the wafer cassette in this utility model is packed, it is not necessary in The upper-lower position of this wafer cassette respectively increases an empty wafer cassette, with escapable cost, it is to avoid cause resource Waste.

Below in conjunction with accompanying drawing and several specific embodiment, the wafer cassette to the utility model proposes is made the most in detail Describe in detail bright.According to following explanation and claims, advantage of the present utility model and feature will be apparent from. It should be noted that, accompanying drawing all uses the form simplified very much and all uses non-ratio accurately, only in order to side Just the purpose of the embodiment of the present invention, is aided in illustrating lucidly.

Embodiment one

Fig. 5 is the upward view bottom the box body of the wafer cassette of this utility model embodiment one, and Fig. 6 is Fig. 5 Sectional view bottom the box body of shown wafer cassette, wherein, Fig. 5 is to watch from the bottom up of wafer cassette Time box body schematic diagram.As shown in Figures 5 and 6, wafer cassette includes a box body 10, in described box body 10 The bottom in outside has a groove caved inward, and described groove forms the plummer 11 for carrying wafer, Wherein the bottom outside described box body is additionally provided with a cushion 12, is used for carrying crystalline substance in described wafer cassette The plummer 11 of circle is fitted with wafer 20, and described cushion 12 is positioned at the bottom outside box body.

In the wafer cassette that this utility model provides, the bottom outside box body is provided with a cushion 12, when When the bottom of wafer cassette is touched by applied external force or extrudes, then act on the active force bottom box body i.e. Putting on described cushion 12, described cushion 12 available buffer acts on the active force bottom box body, Avoid being extruded by external force for the plummer 11 carrying wafer, thus can be effectively protected in box body Wafer.Secondly as the bottom of wafer cassette of the present utility model has a cushion 12, can prevent any Extraneous factor touching or be expressed to on the plummer 11 of wafer laminating, and then when in this utility model When wafer cassette is packed, it is not necessary to the upper-lower position in this wafer cassette respectively increases an empty wafer cassette, with Escapable cost, it is to avoid cause the wasting of resources.

With continued reference to shown in Fig. 5 and Fig. 6, described cushion 12 is positioned at and forms the recessed of described plummer 11 In groove.Preferably, described cushion 12 defines a buffer area 121 with described plummer 11.Due to A buffer area 121 is there is, therefore when there being external force to touch between described cushion 12 and described plummer 11 Or when extruding described cushion 12, can avoid because the extruding of external force makes described cushion 12 deform upon Cushion 12 is made to touch on described plummer 11, and then extruding plummer 11.

Further, described groove is circular groove, thus described cushion 12 is generally circular in shape.Institute State the thickness height less than described groove of cushion 12, and, the bottom surface of described cushion 12 and institute The bottom stating box body 10 flushes.

Preferably, described cushion 12 is breathable non-tight structure.When described wafer cassette is positioned at high pressure Or in lower pressure environment, when using unsealed cushion, buffer area and external environment can be avoided to there is gas Pressure reduction, thus the pressure produced due to draught head can be prevented, and then it is described that this pressure can be avoided to act on On plummer 11, plummer 11 is caused extruding.Wherein, described cushion 12 can be arbitrary band Having the non-tight structure of hole, such as, described cushion 12 is network structure, or, described cushion 12 can also be a plurality of cross one another gridiron of crossbeam etc..Wherein, the material of described cushion 12 Can be consistent with the material of described wafer cassette, certainly, the material of described cushion 12 can also be with wafer cassette Material different, such as, described cushion 12 can use rubber.

Further, described wafer cassette also includes a lid (not shown), and described lid can be covered on On described box body 10, to constitute the space of storage wafer.

Embodiment two

Fig. 7 is the upward view bottom the box body of the wafer cassette that this utility model implements two, as it is shown in fig. 7, Wafer cassette in the present embodiment is with the difference of embodiment one, and described cushion 12 not only covers whole recessed Groove region, also covers the subregion bottom box body 10.Owing to cushion 12 is not located in groove Portion, the area of the buffer area 121 between described cushion 12 and described plummer 11 is relatively big, thus Have in bigger cushion space, i.e. the present embodiment for acting on the active force on described cushion 12 Wafer cassette, in the case of bearing bigger active force, is still avoided that described plummer is squeezed, more preferably Protection wafer cassette in wafer.

In the present embodiment, the shape of described cushion 12 can be circular, it is also possible to is square etc., as long as Cover described groove.

Embodiment three

Fig. 8 is the upward view bottom the box body of the wafer cassette that this utility model implements three, as shown in Figure 8, Wafer cassette in the present embodiment is with the difference of embodiment one, and described cushion 12 fills up described groove, And the elastic modelling quantity of the material of described cushion 12 is less than 8Mpa, such as, the material of described cushion 12 Matter is rubber (elastic modelling quantity of usual rubber is about 7.84Mpa).On the one hand, described cushion 12 can be every From described plummer 11, it is to avoid plummer contacts with the external environment condition of box body；On the other hand, due to described Cushion 12 has bigger elasticity, the most described cushion 12 can mitigation on cushion 12 External force.

In the present embodiment, described cushion 12 and the form fit of groove, the thickness of described cushion 12 Equal to the height of described groove, the bottom surface of described cushion 12 flushes with the bottom of described box body 10.

In sum, the wafer cassette that this utility model provides can be used for depositing all types of wafer, especially , can be used for the wafer of the thinner thickness of silicon substrate.Such as MEMS wafer, due to the thickness of its silicon substrate Relatively thin and be engraved structure, therefore when plummer is by a small active force, the most easily cause wafer There is the phenomenon of fragmentation, when the wafer cassette using this utility model to provide deposits MEMS wafer, due to Bottom outside its box body is provided with a cushion, described cushion can effectively cushioning effect at the bottom of box body The active force in portion, thus can avoid the plummer carrying wafer by the touching of external force or extruding, to guarantee Wafer in wafer cassette is injury-free.

In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment stresses Being the difference with other embodiments, between each embodiment, identical similar portion sees mutually.

Foregoing description is only the description to this utility model preferred embodiment, not to this utility model scope Any restriction, any change that the those of ordinary skill in this utility model field does according to the disclosure above content More, modify, belong to the protection domain of claims.

Claims (10)

1. a wafer cassette, including a box body, the bottom outside described box body has one in box body The groove of portion's depression, described groove forms the plummer for carrying wafer, it is characterised in that: also wrap Include the cushion being arranged at the bottom outside described box body.

2. wafer cassette as claimed in claim 1, it is characterised in that: described cushion is positioned at described recessed In groove.

3. wafer cassette as claimed in claim 2, it is characterised in that: described cushion and the end of groove A buffer area is there are between portion.

4. wafer cassette as claimed in claim 2, it is characterised in that: the thickness of described cushion is less than The height of described groove.

5. wafer cassette as claimed in claim 2, it is characterised in that: described cushion fills up described recessed Groove, and the material of described cushion is rubber.

6. wafer cassette as claimed in claim 2, it is characterised in that: being shaped as of described cushion is round Shape.

7. wafer cassette as claimed in claim 1, it is characterised in that: described cushion covers whole recessed Subregion bottom groove region and described box body.

8. wafer cassette as claimed in claim 7, it is characterised in that: being shaped as of described cushion is round Shape or square.

9. wafer cassette as claimed in claim 1, it is characterised in that: described cushion is network structure.

10. wafer cassette as claimed in claim 1, it is characterised in that: described cushion is grid-like Structure.