WO2019019728A1

WO2019019728A1 - Mask

Info

Publication number: WO2019019728A1
Application number: PCT/CN2018/084521
Authority: WO
Inventors: 安乐平; 李高敏; 郝力强; 刘宏俊
Original assignee: 昆山维信诺科技有限公司
Priority date: 2017-07-28
Filing date: 2018-04-25
Publication date: 2019-01-31
Also published as: TWM564826U; CN207009484U

Abstract

A mask for preparing an OLED device on a substrate. The substrate is provided with a device region and an electrode lead region disposed on at least one side of the device region. The device region is used to form the OLED device. The electrode lead region is used to form an electrode lead layer electrically connected to an electrode of the OLED device. The mask is provided with a first opening and a second opening in a thickness direction thereof, and the first opening and the second opening communicate with each other. The first opening corresponds to the device region. The second opening is larger than the first opening and cooperates with the first opening to form a stepped surface. The stepped surface is capable of covering the electrode lead region. The depth of the second opening is greater than the thickness of the electrode lead layer. The mask provided by the present invention does not cause contact damage to an electrode lead layer, and greatly improves OLED yield.

Description

Mask

Technical field

The present invention relates to the field of semiconductors, and more particularly to a mask used in the preparation of semiconductor devices.

Background technique

Referring to FIG. 1 , in the prior art, in preparing an OLED, an anode layer 122 (eg, an ITO pattern layer) and an anode lead layer 124 electrically connected to the anode layer are generally prepared on the substrate 110, and then an insulating layer 126 is prepared and isolated. Each of the film layers such as the pillars 128 and the organic material layer (not shown). When the organic material layer is prepared on the anode layer 122, the anode lead layer 124 needs to be shielded using a mask 210, and the mask 210 may be in direct contact with the anode lead layer 124, resulting in the anode lead. The layer 124 is easily scratched, causing a undesirable phenomenon in the OLED.

Summary of the invention

Based on this, it is necessary to provide a mask that does not scratch the OLED electrode lead layer.

In order to achieve the above object, the present invention provides a mask for preparing an OLED device on a substrate, the substrate being provided with a device region and an electrode lead region disposed on at least one side of the device region, the device a region for forming the OLED device, the electrode lead region for forming an electrode lead layer electrically connected to an electrode of the OLED device, the mask plate being provided with a first opening and a first opening communicating with each other along a thickness direction thereof a second opening, the first opening corresponding to the device region, the second opening has an area larger than the first opening and covering the first opening, and the second opening is formed to cooperate with the first opening a step surface capable of covering the electrode lead region, the second opening having a depth greater than a thickness of the electrode lead layer.

In one of the embodiments, the depth of the first opening is equal to or less than one-half of the thickness of the mask.

In one of the embodiments, the shape of the stepped surface is the same as the shape of the electrode lead region.

In one of the embodiments, the stepped surface has the same size as the electrode lead region.

In one embodiment, the opposite sides of the device region are respectively provided with the electrode lead regions, and the second openings and the first openings respectively form the step faces on the opposite sides.

In one embodiment, a plurality of the device regions are disposed on the substrate, and at least one side of each of the device regions is provided with the electrode lead region, and the mask plate is provided with a plurality of mutual The first opening and the second opening are connected.

In one of the embodiments, the stepped surface is for forming a receiving cavity for receiving the electrode lead layer with the substrate.

In one embodiment, the mask is provided with one side of the second opening for contacting the substrate.

In one of the embodiments, a deposition material is deposited in the device region through the first opening.

According to the present invention, when the mask plate is in contact with the substrate by the second opening and the step surface, the stepped surface cooperates with the substrate to form a receiving cavity for accommodating the electrode lead layer. . When depositing an organic material layer on the device region, the electrode lead layer is housed in the receiving cavity, and a mask plate above the receiving cavity provides shielding for the electrode lead layer to prevent deposition of organic material on the An electrode lead layer, and since the depth of the second opening is greater than a thickness of the electrode lead layer, a gap exists between the stepped surface and the electrode lead layer, so that the electrode lead layer is not The mask is bruised.

DRAWINGS

1 is a schematic structural view of a conventional mask for the preparation of an OLED device on a substrate;

2 is a schematic structural view of a mask plate for preparing an OLED device on a substrate according to an embodiment of the present invention;

3 is a schematic structural view of a mask according to another embodiment of the present invention;

Figure 4 is a partial enlarged view of A in Figure 3.

Detailed ways

In order to make the objects, the technical solutions and the advantages of the present invention more comprehensible, the present invention will be further described in detail by the accompanying drawings. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to FIG. 2, the present invention provides a mask 220 for use in the fabrication of an OLED device on a substrate 110. The substrate 110 is provided with a device region 112 and an electrode lead region 114 disposed on at least one side of the device region 112. The device region 112 is used to form the OLED device, and the electrode lead region 114 is used to form an electrode lead layer 124 that is electrically connected to electrodes of the OLED device.

The mask plate 220 is provided with a first opening 222 and a second opening 224 that communicate with each other along the thickness direction thereof. The first opening 222 corresponds to the device region 112. The second opening 224 has an area larger than the first opening 222 and covers the first opening 222. The second opening 222 and the first opening 224 can cooperate to form a stepped surface 223 . The stepped surface 223 can cover the electrode lead region 114. The depth of the second opening 224 is greater than the thickness of the electrode lead layer 124.

The present invention can provide the second opening 224 and the stepped surface 223, so that the stepped surface 223 can be made when the masking plate 220 is in contact with the substrate 110 through a surface on which the second opening 224 is disposed. The substrate 110 cooperates to form a receiving cavity for accommodating the electrode lead layer 124. When an organic material layer is deposited on the device region 112, the electrode lead layer 124 is housed in the receiving cavity, and a mask plate above the receiving cavity provides shielding for the electrode lead layer 124 to prevent deposition of organic materials. On the electrode lead layer 124, and because the depth of the second opening 224 is greater than the thickness of the electrode lead layer 124, there is a gap between the step surface 223 and the electrode lead layer 124, thereby The electrode lead layer 124 is not scratched by the mask 220. The organic material layer may be deposited in the device region 112 through the first opening 222.

Preferably, the depth of the second opening 224 is equal to or less than 1/2 of the thickness of the mask 220. At this time, it is ensured that the organic material layer does not pass through when depositing the organic material layer. A gap between the stepped surface 223 and the electrode lead layer 124 is deposited on the electrode lead layer 124, and it is ensured that the mask 220 has a sufficient thickness at the stepped surface 223 (for example, equal to The depth of the first opening 222 is not affected by the deformation of the mask 220 during use to damage the electrode lead layer 124.

The shape of the stepped surface 223 may match the shape of the electrode lead region 124 to cover the electrode lead region 124. The stepped surface 223 may have the same size as the electrode lead region 124 such that the stepped surface 223 can cover both the electrode lead region 124 and the second opening 224 region as small as possible. It is ensured that the mask 220 is not easily deformed.

In one embodiment, the opposite sides of the device region 112 are respectively provided with electrode lead regions 114, and the second openings 224 and the first openings 222 respectively form the step faces 223 on opposite sides of the device region 112. Two of the step faces 223 correspond to the two electrode lead regions 114, respectively, for protecting the two electrode lead regions 114.

Referring to FIG. 3 and FIG. 4, in one embodiment, a plurality of device regions are disposed on the substrate, and at least one side of each device region is provided with an electrode lead region. The mask 220 may be provided with a plurality of first openings 222 and second openings 224 that communicate with each other along its thickness direction. At this time, the organic material layer can be simultaneously deposited on a plurality of device regions, thereby greatly improving the preparation efficiency of the OLED device.

In one embodiment, the mask is provided with one side of the second opening for contacting the substrate, and a deposition material is deposited in the device region through the first opening.

It can be understood that the mask 220 is not only suitable for the preparation of the organic material layer, but also for the preparation of other film layers which are only disposed in the device region 112 and are not disposed in the electrode lead region 114.

The mask provided by the invention can avoid the bruising of other pattern layers already provided on the substrate when preparing the film layer of the OLED device, thereby greatly improving the yield of the OLED device.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

A mask for preparing an OLED device on a substrate, the substrate being provided with a device region and an electrode lead region disposed on at least one side of the device region, wherein the device region is used to form the OLED device, The electrode lead region is for forming an electrode lead layer electrically connected to an electrode of the OLED device, characterized in that

The mask plate is provided with a first opening and a second opening communicating with each other along a thickness direction thereof, the first opening corresponding to the device region, and the second opening has an area larger than the first opening and covering The first opening, the second opening cooperates with the first opening to form a stepped surface, the stepped surface can cover the electrode lead region, and the second opening has a depth greater than a thickness of the electrode lead layer.
The mask according to claim 1, wherein the depth of the first opening is equal to or less than one-half of the thickness of the mask.
The mask according to claim 1, wherein the shape of the stepped surface is the same as the shape of the electrode lead region.
The mask according to claim 3, wherein the stepped surface has the same size as the electrode lead region.
The mask according to claim 1, wherein the opposite sides of the device region are respectively provided with the electrode lead regions, and the second openings and the first openings are on opposite sides The step faces are formed separately.
The mask according to claim 1, wherein a plurality of the device regions are disposed on the substrate, and at least one side of each of the device regions is provided with the electrode lead region, the mask The film plate is provided with a plurality of the first openings and the second openings that communicate with each other.
The mask according to claim 1, wherein the stepped surface is for forming a receiving cavity for accommodating the electrode lead layer with the substrate.
The mask according to claim 1, wherein the mask is provided with one side of the second opening for contacting the substrate.