CN205601319U - A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology - Google Patents

A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology Download PDF

Info

Publication number
CN205601319U
CN205601319U CN201620396331.6U CN201620396331U CN205601319U CN 205601319 U CN205601319 U CN 205601319U CN 201620396331 U CN201620396331 U CN 201620396331U CN 205601319 U CN205601319 U CN 205601319U
Authority
CN
China
Prior art keywords
circuit board
utility
composite membrane
flexible circuit
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201620396331.6U
Other languages
Chinese (zh)
Inventor
钟洪添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou City Best Film Industry Co Ltd
Original Assignee
Huizhou City Best Film Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou City Best Film Industry Co Ltd filed Critical Huizhou City Best Film Industry Co Ltd
Priority to CN201620396331.6U priority Critical patent/CN205601319U/en
Application granted granted Critical
Publication of CN205601319U publication Critical patent/CN205601319U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The utility model provides a complex film that is used for flexible circuit board to press reinforcement and covers membrane technology, the complex film has three layer construction, and the bottom is the substrate, and adhesive layer is glued for ya keli in the substrate top, and yakeli glues the adhesive layer top and is extinction PET membrane. The utility model discloses a PET film combines high temperature resistant inferior gram force to glue the integrated configuration of glue, can reach effect high temperature resistant, no cull simultaneously, and it has the advantage that does not contain quick -witted element silicon, can not pollute the flexible circuit board in press and fit process, the utility model provides a complex film, even coating, high temperature resistant, 180 DEG C of 30min do not have unusually.

Description

A kind of for flexible circuit board compression moulding reinforcement and the composite membrane of coverlay technique
Technical field
This utility model belongs to microelectronic element production field, is specifically related to a kind of for flexible electrical The film of road plate process for pressing.
Background technology
Flexible PCB is called for short soft board (also known as FPC), makes with the insulating substrate of flexibility Printed circuit board (PCB), has the advantage that many rigid printed circuit boards do not possess, and it can be the most curved Bent, wind, fold, thus be substantially reduced the volume of electronic product, be suitable for electronic product to height The needs that density, miniaturization, highly reliable direction are developed.
PET film surface to just one layer of acrylic glue of topcoating cloth, can obtain tool by coating process Sticking protecting film, PET glue coating is used for packaging industry, can be effectively protected product Surface, but due to its non-refractory characteristic, have cull, it is rarely used in flexible PCB and produced Process for pressing in journey.
Utility model content
For solving the deficiency that prior art exists, the purpose of this utility model be propose a kind of for Flexible circuit board compression moulding reinforcement and the composite membrane of coverlay technique.
For realizing this utility model purpose technical scheme it is:
A kind of for flexible circuit board compression moulding reinforcement and the composite membrane of coverlay technique, described composite membrane Having three-decker, the bottom is base material, and base material is arranged above acrylic glue bond layer, Ya Ke Power glue bond layer is arranged above delustring polyethylene terephthalate film.
Further, described base material is the film of transparent polyethylene terephthalate material, base material Thickness be 50~60 μm.
Wherein, the thickness of described acrylic glue bond layer is 10~15 μm.
Wherein, the thickness of described polyethylene terephthalate film is 30~40 μm.
The preparation process of this composite membrane can be: first by after deployed for acrylic glue glue, will In PET film, machine makes face tight smooth through tension system, then crosses coating head scraper and is coated with Cloth, drying, going up machine through tension system again, mould release membrance cooled, compound, rolling are shaped to Composite membrane.
The beneficial effects of the utility model are:
This utility model uses PET film to combine the combinative structure of high temperature resistant acrylic glue glue, Can reach high temperature resistant and without cull effect, it has the advantage without organic element silicon simultaneously, Flexible PCB will not be polluted in bonding processes.
The composite membrane that the utility model proposes, coating uniform, high temperature resistant (180 DEG C of * 30min) Without exception, elementary analysis does not contains element silicon.
Accompanying drawing explanation
Fig. 1 is the structure chart of this utility model embodiment 1 composite membrane.
Fig. 2 is the process chart of composite membrane.
In figure, 1 is base material, and 2 is acrylic glue bond layer, and 3 is the poly-terephthaldehyde of delustring Acid glycol ester film.
Detailed description of the invention
Following example are used for illustrating the present invention, but are not limited to the scope of the present invention.
In description of the present utility model, it should be noted that term " " center ", " ", " horizontal stroke To ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", Orientation or the position relationship of the instruction such as " end " " interior ", " outward " are based on orientation shown in the drawings Or position relationship, it is for only for ease of description this utility model and simplifies description rather than instruction Or the hint device of indication or element must have specific orientation, with specific azimuth configuration and Operation, therefore it is not intended that to restriction of the present utility model.
Embodiment 1:
See Fig. 1.It is a kind of for flexible circuit board compression moulding reinforcement and the composite membrane of coverlay technique, Described composite membrane has three-decker, and the bottom is base material 1, and it is gluing that base material is arranged above acrylic Connecing oxidant layer 2, acrylic glue bond layer is arranged above delustring polyethylene terephthalate film 3.
Wherein base material 1 is the film of transparent polyethylene terephthalate material, and the thickness of base material is 55μm.The thickness of acrylic glue bond layer is 12 μm.Delustring polyethylene terephthalate The thickness of ester film 3 (PET film) is 36 μm.During use, flexible PCB is placed on multiple Close on film, flexible PCB is placed composite membrane again, puts into and high-temperature laminating machine carries out pressing work Sequence.
Preparation process such as Fig. 2.After acrylic glue glue is deployed, by machine warp in PET film Overtension system makes face tight smooth, then crosses coating head scraper for coating, drying, tension force system Unite, cool down, compound PET film, rolling are shaped to PET composite membrane.Acrylic glue glue is adjusted Timing, the ratio of its glue and organic solvent is 1;0.9, add catalyst cured dose and stir Mix 30min.Measure acrylic glue glue layer thickness during scraper for coating, control that acrylic is gluing connects The thickness of oxidant layer is in the range of requiring.
The PET composite membrane obtained, coating uniform, high temperature resistant, at 180 DEG C, keep 30min (180 DEG C of * 30min) is without exception, and elementary analysis does not contains organic element silicon, two in composite membrane Silicon oxide exists makes properties of product more stable, but will not shift.
Above embodiment is only to be described preferred implementation of the present utility model, and Non-scope of the present utility model is defined, before without departing from this utility model design spirit Put, the various modification that technical scheme is made by this area ordinary skill technical staff And improvement, all should fall in the protection domain that claims of the present utility model determine.

Claims (4)

1. for flexible circuit board compression moulding reinforcement and a composite membrane for coverlay technique, its feature Being, described composite membrane has three-decker, and the bottom is base material, and base material is arranged above acrylic Glue bond layer, acrylic glue bond layer is arranged above delustring polyethylene terephthalate Film.
Composite membrane the most according to claim 1, it is characterised in that described base material is The film of bright polyethylene terephthalate material, the thickness of base material is 50~60 μm.
Composite membrane the most according to claim 1, it is characterised in that described acrylic glue The thickness of bond layer is 10~15 μm.
4. according to the arbitrary described composite membrane of claims 1 to 3, it is characterised in that described poly- The thickness of ethylene glycol terephthalate film is 30~40 μm.
CN201620396331.6U 2016-05-04 2016-05-04 A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology Expired - Fee Related CN205601319U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620396331.6U CN205601319U (en) 2016-05-04 2016-05-04 A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620396331.6U CN205601319U (en) 2016-05-04 2016-05-04 A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology

Publications (1)

Publication Number Publication Date
CN205601319U true CN205601319U (en) 2016-09-28

Family

ID=56968394

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620396331.6U Expired - Fee Related CN205601319U (en) 2016-05-04 2016-05-04 A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology

Country Status (1)

Country Link
CN (1) CN205601319U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107415346A (en) * 2017-04-27 2017-12-01 张家港康得新光电材料有限公司 A kind of composite membrane
CN109831870A (en) * 2019-03-11 2019-05-31 河南博美通电子科技有限公司 A kind of flexible circuit board PET film structure and preparation process

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107415346A (en) * 2017-04-27 2017-12-01 张家港康得新光电材料有限公司 A kind of composite membrane
CN109831870A (en) * 2019-03-11 2019-05-31 河南博美通电子科技有限公司 A kind of flexible circuit board PET film structure and preparation process
CN109831870B (en) * 2019-03-11 2021-04-20 河南博美通电子科技有限公司 PET film structure for flexible circuit board and preparation process

Similar Documents

Publication Publication Date Title
CN104853896B (en) The main body manufactured by in-mold process and the method for manufacturing the main body
CN102559121A (en) Ultraviolet (UV)/moisture dual-cured laminated adhesive and preparation method thereof
CN205970253U (en) A compound hinder gluey from type membrane for flexible circuit board pressfitting technology
CN205601319U (en) A complex film that is used for flexible circuit board to press reinforcement and covers membrane technology
CN205736325U (en) Film opened by a kind of polyimides for flexible PCB pressing technique
CN103834320A (en) Re-peel-off type special double-faced adhesive sheet for fixing flexible printed circuit board
CN109836885A (en) Liquid photosensitive ink, PCB and preparation method of PCB inner layer plate
CN101605432B (en) Automatic wet process lamination method of rigid printed circuit boards
CN205961580U (en) A compound glued membrane component that hinders for production of printed circuit board
CN207166846U (en) The soft or hard combination pcb board of the high yield of high reliability
CN204031568U (en) Flexible printed circuit board
CN205601306U (en) A compound polyester film for flexible circuit board pressfitting technology
CN212115384U (en) Protective film for curved mobile phone
CN202764317U (en) Colored protective film and cover film, composite film and stiffening plate with colored protective film
CN206475518U (en) Interior rupture pressure disc for many curved surface touch-control display modules
CN205071442U (en) A attach aluminium FPC substrate and circuit board for LED illumination
TW201826891A (en) Coverlay film
CN207014926U (en) A kind of polyimide laminates stiffening plate
CN205603515U (en) Use commentaries on classics pad pasting of polydiethylene terephthalate as substrate
CN104717829B (en) High density bubble-free golden finger pressing structure plate and its processing method
CN204721704U (en) Circuit board
CN205522781U (en) Insulating material layer structure of lazy flow copper -clad plate
CN206616182U (en) A kind of red U.S. adhesive tape of high temperature
CN101437358A (en) Protection film for printed circuit board and procedure for processing circuit board using the protection film
CN203104949U (en) Double-sided PCB (Printed Circuit Board)

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160928

Termination date: 20180504