CN205584643U - HDI high density build -up circuit board drying device - Google Patents
HDI high density build -up circuit board drying device Download PDFInfo
- Publication number
- CN205584643U CN205584643U CN201620142537.6U CN201620142537U CN205584643U CN 205584643 U CN205584643 U CN 205584643U CN 201620142537 U CN201620142537 U CN 201620142537U CN 205584643 U CN205584643 U CN 205584643U
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- Prior art keywords
- warm table
- frame
- hdi
- bellows
- circuit board
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Abstract
The utility model discloses a HDI high density build -up circuit board drying device, including frame and warm table, the warm table is connected to the frame, the warm table has bellows, be equipped with the power in the frame, the warm table top is equipped with U type overhead guard, be equipped with the support on the warm table, be equipped with the rotor on the support, the motor is connected to the rotor, be fixed with the telescopic link on the rotor, be fixed with the spring clamp on the telescopic link, bellows are gone to the bottom and are equipped with the pulley, be equipped with the slide rail in the frame, the bellows both sides are equipped with the magnetic ring, be connected with electromagnetic relay in the frame, electromagnetic relay is connected with single chip microcomputer system and links to each other, adopts bellows to remove rotation type heating method for heating effect to the HDI board is showing, and can not cause the injury to the HDI board.
Description
Technical field
This utility model relates to electronic manufacturing equipment field, is specifically related to a kind of HDI high-density lamination electricity
Sheet drying path device.
Background technology
Along with the products such as smart mobile phone, panel computer and Wearable device are to miniaturization, multifunction
Direction is developed, and high density interconnected printed circuit board technology constantly promotes, and HDI conductor width, spacing are micro-
The diameter of porose disc and hole centre distance, and the thickness of conductor layer and insulating barrier is all in constantly decline, makes
The number of plies of HDI in the case of HDI size, weight and volume do not increase, must be promoted, accommodate more
Components and parts, HDI plate can become in manufacturing process tide, affect the performance of HDI plate, in industry commonly use
It is uneven all to there is heating in HDI heater, causes HDI plate some places excessively to be dried and excessive
Heating, traditional drying unit does not solve the gas emission problem dried.
Utility model content
For problem above, this utility model provides a kind of HDI high-density lamination circuit board and dries dress
Put, use bellows to move, rotary heating means so that be notable to the heats of HDI plate, and
Will not damage HDI plate, U-shaped overhead guard set on warm table can solve to be produced in drying course
The emission problem of raw gas, can effectively solve the problem in background technology.
To achieve these goals, the technical solution adopted in the utility model is as follows: a kind of HDI is highly dense
Degree laminated circuit board drying unit, including frame and warm table, described frame connects warm table, described in add
Being fixed with bellows under thermal station, described frame is provided with power supply, and described frame is provided with motor, described in add
Thermal station is arranged over U-shaped overhead guard, and described U-shaped overhead guard is provided with air outlet, and described warm table is provided with
Support, described support is provided with rotor, and described rotor connects motor, and described rotor is fixed with expansion link,
Being fixed with alligator clamp on described expansion link, described alligator clamp two ends are provided with baffle plate, and described bellows are gone to the bottom and set
Having pulley, described frame to be provided with slide rail, described bellows both sides are provided with magnet ring, and described frame connects
Having electromagnetic relay, described electromagnetic relay connects has Single Chip Microcomputer (SCM) system to be connected.
As a kind of optimal technical scheme of the present utility model, described support is provided with oscillating bearing.
As a kind of optimal technical scheme of the present utility model, described baffle plate is provided with spongy layer, described
Spongy layer thickness is 2-3mm.
As a kind of optimal technical scheme of the present utility model, described warm table is provided with infrared measurement of temperature dress
Put.
The beneficial effects of the utility model:
This utility model uses bellows to move, rotary heating means so that the heats to HDI plate
Significantly, and HDI plate will not be damaged, use monolithic to control electricity irritation point device switching frequency, make
Bellows move back and forth and are in controllable state, the heating to HDI plate is more efficient, set on warm table
Overhead guard can solve the emission problem of produced gas in drying course.
Accompanying drawing explanation
Fig. 1 is this utility model overall structure schematic diagram.
Figure is numbered: 1-frame, 2-warm table, 3-bellows, 4-motor, 5-U type overhead guard, 6-
Air outlet, 7-support, 8-rotor, 9-expansion link, 10-alligator clamp, 11-baffle plate, 12-pulley, 13-
Slide rail, 14-magnet ring, 15-electromagnetic relay, 16-Single Chip Microcomputer (SCM) system, 17-power supply, 18-oscillating bearing,
19-spongy layer, 20-infrared temperature measurement apparatus.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with
Drawings and Examples, are further elaborated to this utility model.Should be appreciated that this place is retouched
The specific embodiment stated, only in order to explain this utility model, is not used to limit this utility model.
Embodiment:
As it is shown in figure 1, a kind of HDI high-density lamination circuit board drying unit, including frame 1 with add
Thermal station 2, described frame 1 connects warm table 2, and described warm table 2 has bellows 3, described frame
1 is provided with power supply 17, and described frame 1 is provided with motor 4, and described warm table 2 is arranged over U-shaped top
Cover 5, described U-shaped overhead guard is provided with air outlet 6, and described warm table 2 is provided with support 7, described
Frame 7 is provided with rotor 8, and described rotor 8 connects motor 4, and described rotor 8 is fixed with expansion link 9,
Being fixed with alligator clamp 10 on described expansion link 9, described alligator clamp 10 two ends are provided with baffle plate 11, described
Bellows 3 are gone to the bottom and are provided with pulley 12, and described frame 1 is provided with slide rail 13, and described bellows 3 both sides are provided with
Magnet ring 14, described frame 1 connects and has electromagnetic relay 15, and described electromagnetic relay 15 connects to be had
Single Chip Microcomputer (SCM) system 16 is connected；Rotor 8 is used to rotate, and pulley 12 side of movement on slide rail 13
Formula toasts HDI, serves controllable comprehensive without dead angle heating so that the heating to HDI plate reaches
To just, will not damage because of excessively drying but HDI.
On above-described embodiment preferably, described support 7 is provided with oscillating bearing 18 so that the side of rotor
To can be easily dimmable, the Omnidirectional heating of beneficially HDI plate.
On above-described embodiment preferably, described baffle plate 11 is provided with spongy layer 19, described spongy layer 19
Thickness is 2-3mm, and arranging of spongy layer 19 can play the effect protecting HDI plate, prevents HDI plate
Crush.
On above-described embodiment preferably, described warm table is provided with infrared temperature measurement apparatus 20, prevents temperature
Too high two groups of HDI plates cause damage.
Based on above-mentioned, this utility model uses rotor to rotate, and pulley movement on slide rail
Mode toasts HDI, serves controllable comprehensive without dead angle heating so that the heating to HDI plate
Reach just, will not be because of excessively drying but HDI damage, the drying of beneficially HDI plate.
The foregoing is only preferred embodiment of the present utility model, not new in order to limit this practicality
Type, all any amendment, equivalent and improvement made within spirit of the present utility model and principle
Deng, within should be included in protection domain of the present utility model.
Claims (4)
1. a HDI high-density lamination circuit board drying unit, including frame (1) and warm table (2),
Described frame (1) connects warm table (2), and described warm table (2) has bellows (3), described
Frame (1) is provided with power supply (17), it is characterised in that described frame (1) is provided with motor (4),
Described warm table (2) is arranged over U-shaped overhead guard (5), and described U-shaped overhead guard is provided with air outlet (6),
Described warm table (2) is provided with support (7), and described support (7) is provided with rotor (8), described
Rotor (8) connects motor (4), and described rotor (8) is fixed with expansion link (9), described flexible
Being fixed with alligator clamp (10) on bar (9), described alligator clamp (10) two ends are provided with baffle plate (11), institute
Stating bellows (3) to go to the bottom and be provided with pulley (12), described frame (1) is provided with slide rail (13), described
Bellows (3) both sides are provided with magnet ring (14), and the upper connection of described frame (1) has electromagnetic relay (15),
Described electromagnetic relay (15) connects has Single Chip Microcomputer (SCM) system (16) to be connected.
A kind of HDI high-density lamination circuit board drying unit the most according to claim 1, it is special
Levy and be: described support (7) is provided with oscillating bearing (18).
A kind of HDI high-density lamination circuit board drying unit the most according to claim 1, it is special
Levying and be: described baffle plate (11) is provided with spongy layer (19), described spongy layer (19) thickness is 2-3mm.
A kind of HDI high-density lamination circuit board drying unit the most according to claim 1, it is special
Levy and be: described warm table is provided with infrared temperature measurement apparatus (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620142537.6U CN205584643U (en) | 2016-02-25 | 2016-02-25 | HDI high density build -up circuit board drying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620142537.6U CN205584643U (en) | 2016-02-25 | 2016-02-25 | HDI high density build -up circuit board drying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205584643U true CN205584643U (en) | 2016-09-14 |
Family
ID=56870708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620142537.6U Active CN205584643U (en) | 2016-02-25 | 2016-02-25 | HDI high density build -up circuit board drying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205584643U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234668A (en) * | 2017-08-09 | 2017-10-10 | 福建利德宝电子有限公司 | A kind of PCB automatic press system and methods for being applied to have baking demand |
| CN110856352A (en) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
-
2016
- 2016-02-25 CN CN201620142537.6U patent/CN205584643U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107234668A (en) * | 2017-08-09 | 2017-10-10 | 福建利德宝电子有限公司 | A kind of PCB automatic press system and methods for being applied to have baking demand |
| CN110856352A (en) * | 2019-11-23 | 2020-02-28 | 湖南东神自动化设备有限公司 | Circuit board preheating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |