CN205576304U - Micropore coppering device of HDI (High density interconnect) circuit board - Google Patents
Micropore coppering device of HDI (High density interconnect) circuit board Download PDFInfo
- Publication number
- CN205576304U CN205576304U CN201620211945.2U CN201620211945U CN205576304U CN 205576304 U CN205576304 U CN 205576304U CN 201620211945 U CN201620211945 U CN 201620211945U CN 205576304 U CN205576304 U CN 205576304U
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- China
- Prior art keywords
- groove
- micropore
- copper plating
- hdi
- bath
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
Abstract
The utility model relates to a HDI circuit board field of making, concretely relates to micropore coppering device of HDI (High density interconnect) circuit board. Micropore coppering device of HDI (High density interconnect) circuit board, including the manipulator, the manipulator is installed on the workstation pillar, still including whole hole groove, lose groove, preimpregnation groove, activated bath, copper facing groove and washing tank a little, whole hole groove, loses groove, preimpregnation groove, activated bath, copper facing groove and washing tank a little and is circular around arranging around the workstation pillar, and two arbitrary cell bodies can be strideed across to the manipulator, setting up the water pipe in the washing tank, spraying deionized water in the water pipe, the activated bath setting is in 60 DEG C preserve heat tank. Around all setting up the workstation pillar with the required process step of copper facing, holding cable fetch way board in hand through machinery and carrying out the processing of each process, prevent splash spill in the cleaning process, the washing tank sets up to the enclosed construction, and the easy oxidation of activate fluid is so set up in the water bath keeps warm. Can the copper -plated work efficiency of effectual improvement micropore through this utility model to can improve copper -plated quality.
Description
Technical field
This utility model relates to HDI wiring board and manufactures field, is specifically related to the micropore copper plating device of a kind of HDI wiring board.
Background technology
Along with developing rapidly of electronic technology, electronic product gradually tends to miniaturization, lighting, highly integrated, the encapsulation of semiconductor device also tends to many pins fine-pitch, and this such as requires that the HDI wiring board carrying semiconductor device accordingly also wants miniaturization lightweight and densification.Can HDI substrate densification depend on micropore and the circuit that interlayer connects, and depending on combining the performance of electronic product, therefore micro-aperture technique becomes one of key technology of HDI industry.Micropore includes the through hole on printed substrate, buried via hole and blind hole etc..Traditional rectilinear direct current electrode position is to install hanger track, making sheet angle of inclination link plate and mjector in copper plating groove additional, and to improve copper facing effect, but this device still cannot meet the micropore copper facing prescription of HDI (interconnecting between high-density layer) wiring board.
Utility model content
Problem to be solved in the utility model is to overcome the deficiencies in the prior art, it is provided that the micropore copper plating device of a kind of HDI wiring board, and this device can promote the copper-plated quality of wiring board micropore and efficiency.
For solving the problems referred to above, the technical solution adopted in the utility model is: the micropore copper plating device of HDI wiring board, including mechanical hand, described mechanical hand is arranged on workbench pillar, also include whole hole slot, microetch groove, pre-immersion trough, activated bath, copper plating groove and rinse bath, described whole hole slot, microetch groove, pre-immersion trough, activated bath, copper plating groove and rinse bath are rounded around being arranged in workbench column circumference, and described mechanical hand can cross over any two cell body；Arranging water pipe in described rinse bath, injection deionized water in water pipe, described activated bath is arranged in the heat preservation tank of 60 DEG C.
Preferably, described rinse bath is for sealing structure.
Preferably, in described microetch groove, filling has the micro-corrosion liquid of copper ion.
Preferably, dilute acidic solution is filled in described pre-immersion trough.
Preferably, activating solution is filled in described activated bath.
Preferably, glyoxalic acid chemical bronze plating liquid is filled in described copper plating groove.
The beneficial effects of the utility model are: the process needed for copper facing all arranges workbench pillar surrounding, take wiring board by gripper of manipulator and carry out the process of each operation, through whole hole, microetch, presoak, activate after, wiring board all can be placed in rinse bath cleaning by mechanical hand, for preventing spray in cleaning process from spilling, therefore rinse bath is set to enclosed construction, the activating solution in activated bath easily aoxidizes, so should be arranged in water bath heat preservation.Can effectively improve the copper-plated work efficiency of micropore by this utility model, and copper-plated quality can be improved.
Figure of description
Fig. 1 is the structural representation of this utility model.
Wherein reference is as follows:
1, mechanical hand；2, workbench pillar；3, whole hole slot；4, microetch groove；5, pre-immersion trough；6, activated bath；7, copper plating groove；8, rinse bath；9, heat preservation tank.
Detailed description of the invention
Below in conjunction with Fig. 1, this utility model is described further:
The micropore copper plating device of HDI wiring board, including mechanical hand 1, described mechanical hand 1 is arranged on workbench pillar 2, also include whole hole slot 3, microetch groove 4, pre-immersion trough 5, activated bath 6, copper plating groove 7 and rinse bath 8, described whole hole slot 3, microetch groove 4, pre-immersion trough 5, activated bath 6, copper plating groove 7 and rinse bath 8 are rounded around being arranged in around workbench pillar 2, and described mechanical hand 1 can cross over any two cell body；Arranging water pipe in described rinse bath 8, injection deionized water in water pipe, described activated bath 6 is arranged in the heat preservation tank 9 of 60 DEG C.
Alkaline degreaser and regulator is added in whole hole slot 3, described rinse bath 8, for sealing structure, is filled the micro-corrosion liquid with copper ion, is filled dilute acidic solution in described pre-immersion trough 5 in described microetch groove 4, fill activating solution in described activated bath 6, in described copper plating groove 7, fill glyoxalic acid chemical bronze plating liquid.
The beneficial effects of the utility model are: the process needed for copper facing all arranges workbench pillar 2 surrounding, capture wiring board by mechanical hand 1 and carry out the process of each operation, through whole hole, microetch, presoak, activate after, wiring board all can be placed in rinse bath 8 cleaning by mechanical hand 1, for preventing spray in cleaning process from spilling, therefore rinse bath 8 is set to enclosed construction, the activating solution in activated bath 6 easily aoxidizes, so should be arranged in water bath heat preservation.Can effectively improve the copper-plated work efficiency of micropore by this utility model, and copper-plated quality can be improved.
The above, be only preferred embodiment of the present utility model, is not the restriction that this utility model is made other form.Any those skilled in the art are changed possibly also with the technology contents of the disclosure above or are modified as the Equivalent embodiments of equivalent variations.But every without departing from technical solutions of the utility model content, any simple modification, equivalent variations and remodeling above example made according to structure of the present utility model and operation principle, still fall within the protection domain of technical solutions of the utility model.
Claims (6)
- The micropore copper plating device of 1.HDI wiring board, including mechanical hand, described mechanical hand is arranged on workbench pillar, it is characterized in that: also include whole hole slot, microetch groove, pre-immersion trough, activated bath, copper plating groove and rinse bath, described whole hole slot, microetch groove, pre-immersion trough, activated bath, copper plating groove and rinse bath are rounded around being arranged in workbench column circumference, and described mechanical hand can cross over any two cell body；Arranging water pipe in described rinse bath, injection deionized water in water pipe, described activated bath is arranged in the heat preservation tank of 60 DEG C.
- The micropore copper plating device of HDI wiring board the most according to claim 1, it is characterised in that: described rinse bath is for sealing structure.
- The micropore copper plating device of HDI wiring board the most according to claim 1, it is characterised in that: fill the micro-corrosion liquid with copper ion in described microetch groove.
- The micropore copper plating device of HDI wiring board the most according to claim 1, it is characterised in that: fill dilute acidic solution in described pre-immersion trough.
- The micropore copper plating device of HDI wiring board the most according to claim 1, it is characterised in that: fill activating solution in described activated bath.
- The micropore copper plating device of HDI wiring board the most according to claim 1, it is characterised in that: fill glyoxalic acid chemical bronze plating liquid in described copper plating groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620211945.2U CN205576304U (en) | 2016-03-21 | 2016-03-21 | Micropore coppering device of HDI (High density interconnect) circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620211945.2U CN205576304U (en) | 2016-03-21 | 2016-03-21 | Micropore coppering device of HDI (High density interconnect) circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205576304U true CN205576304U (en) | 2016-09-14 |
Family
ID=56869489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620211945.2U Expired - Fee Related CN205576304U (en) | 2016-03-21 | 2016-03-21 | Micropore coppering device of HDI (High density interconnect) circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205576304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
-
2016
- 2016-03-21 CN CN201620211945.2U patent/CN205576304U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113179593A (en) * | 2021-03-26 | 2021-07-27 | 赣州金顺科技有限公司 | Pre-impregnated supporting bridge frame for circuit board copper deposition and pickling and implementation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170411 Address after: 341600 Jiangxi Province, Ganzhou city Xinfeng County Industrial Park Green Avenue Patentee after: XINFENG XUNJIEXING CIRCUIT TECHNOLOGY CO.,LTD. Address before: 330031 Jiangxi province Nanchang Honggutan former Lake Avenue No. 999 No. 179 unit area incense Ting Room 302 Patentee before: NANCHANG JINXUAN TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |