CN205546203U - Electron device's electron device with lead bonding - Google Patents
Electron device's electron device with lead bonding Download PDFInfo
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- CN205546203U CN205546203U CN201520771694.9U CN201520771694U CN205546203U CN 205546203 U CN205546203 U CN 205546203U CN 201520771694 U CN201520771694 U CN 201520771694U CN 205546203 U CN205546203 U CN 205546203U
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Abstract
The utility model relates to an electron device's electron device with lead bonding (100, 200). Electron device (100, 200) include: device carrier (190), the device carrier is including at least partial elastic electric insulation layer structure (110), device chamber (130) on surface parts (120) of electric insulation layer structure (110), electron device (150) are located at least in part in device chamber (130), and lead bonding (140), joint pin connection electron device (150) and conductive welding disk (160), the conductive welding disk is arranged on another layer structure of device carrier (190), rather than on electron device (150). The utility model provides a reliable electron device to mechanical stress modified stability has.
Description
Technical field
This utility model relates to a kind of electronic installation.
Background technology
Component carrier and electronic device that is mounted thereto and/or that be embedded are widely used in electronic product.Included the rigid-flexible component carrier of rigid element and flexible portion by employing, rigid device carrier and the advantage of flexible device carrier can be combined.The quantity of the miniaturization day by day and ever-increasing product function and increase that are mounted in the electronic device in component carrier (such as printed circuit board (PCB)) causes the electronic installation of more dense encapsulation, wherein must connect the electric contact of increasing number.Lead-in wire engages and is typically considered the cost-effective of electric contact for connecting electronic installation and interconnection technique flexibly, but it is also sensitive for mechanical stress.
US 201,0/0 025 087 A1 discloses a kind of flex-rigid circuit board including rigid substrates and flexible base board.Described rigid substrates has the recess being formed on the surface of rigid substrates and being suitable to accommodate electronic device.Figure 18 A in the document shows that the electronic device 500 in recess 300, electronic device lead-in wire are bonded to be positioned at the connection terminal 180 of the recess 300 of patch panel.
US 7 489 839 B2 discloses a kind of printed circuit board (PCB), and it includes the first plate member, the second plate member and the compliant-plate member being arranged between the first plate member and the second plate member.Compliant-plate member includes electricity wiring layer and fiber waveguide.Treat to be disposed in by the photo-electric conversion element of the signal of waveguide in the groove of the first plate member and the second plate member for conversion.Conversion element can be engaged by lead-in wire or arrange in contact with the form of flip-chip.
Utility model content
The purpose of this utility model is to provide a kind of reliable electronic installation having the stability that mechanical stress is improved.
To achieve these goals, it is provided that a kind of according to electronic installation defined below.
According to an exemplary embodiment of the present utility model, it is provided that a kind of electronic installation, wherein said electronic installation includes: component carrier, including the most elastic electric insulation layer structure；And device cavity, it is positioned in the surface portion of described electric insulation layer structure.Described electronic installation also includes that electronic device and lead-in wire engage (wire bond), described electronic device is at least partially situated in described device cavity, described lead-in wire engages and connects described electronic device and conductive welding disk, described conductive welding disk is arranged on another Rotating fields of described component carrier, rather than on electronic device, be disposed particularly in outside described device cavity.
According to another exemplary embodiment, provide a kind of for manufacturing electronic installation, the method especially manufacturing electronic installation according to embodiment of the present utility model, the method comprise the steps that and form the most elastic electric insulation layer structure, and in the surface portion of described electric insulation layer structure, form device cavity.Described method also includes: be at least partially disposed at by electronic device in described device cavity, and lead-in wire engages described electronic device and conductive welding disk, described conductive welding disk is arranged on another Rotating fields of described component carrier, rather than on described electronic device, be disposed particularly in outside described device cavity.
According to an exemplary embodiment, described lead-in wire engages and connects described electronic device and the described conductive welding disk being arranged in outside described device cavity.
In the context of this application, term " component carrier " particularly can represent any supporting construction, and it can accommodate one or more electronic device thereon and/or wherein, is used for providing both mechanical support and electrical connection.
Particularly, at least partly elastic electric insulation layer structure can be layer or layer stack is folded, and it includes elastic part/layer and rigid element/layer.Such as, the electric insulation layer structure of described at least part of elasticity can include being attached to rigid layer or being disposed at least one flexible core between two rigid layers.Described flexible core and described rigid layer can include a layer of identical or different material or multiple layer.
Therefore, according to an exemplary embodiment, the electric insulation layer structure of described at least part of elasticity includes at least one flexible core structure, and described surface portion is disposed in described flexible core structure.
According to another exemplary embodiment, described surface portion includes being formed as at least one rigid layer than flexible core structure more rigidity.
According to another exemplary embodiment, the electric insulation layer structure of described at least part of elasticity includes being formed the rigid layer structure than flexible core structure more rigidity, and wherein said flexible core structure is clipped between described rigid layer structure and described surface portion.
The surface portion of described electric insulation layer structure can include at least one rigid layer, and it is the layer of FR4 or prepreg.Particularly, surface portion can be the layered product of two rigid layers, and one of them layer is prepreg, and another layer is FR4 layer, and described FR4 layer is attached on described prepreg.
Device cavity in the surface portion of the most elastic electric insulation layer structure can be the recess at least one rigid layer of the surface portion of the most elastic electric insulation layer structure.Particularly, device cavity can be at prepreg and the recess being attached in the FR4 layer of prepreg.In other words, described prepreg and FR4 layer can be patterned such that described device cavity is formed in prepreg and the FR4 layer of surface portion.
Conductive welding disk outside device cavity can be formed by electroless nickel gold plate (ENIG); and therefore can be made up of the nickel coating of the thin layer being coated with leaching gold (immersion gold), the thin layer protection nickel coating of described leaching gold is from oxidation.Alternatively, conductive welding disk can include copper, aluminum or any other conductive material or is made up of it.
In the context of this application, " surface portion " of Rotating fields described in term can represent the region (i.e. Rotating fields) of the most elastic electric insulation layer structure, it limits the most elastic core structure of electric insulation layer structure and the border between the environment of electronic installation or the proximity structure (such as, another electronic installation) of electronic installation.
Described electronic installation is based on such design, i.e., by described conductive welding disk is arranged on another Rotating fields of described component carrier, rather than on described electronic device (be especially arranged in compared with the Rotating fields being provided with electronic device on it on vertical Rotating fields raised), especially by arranging electronic device in device cavity and by the conductive welding disk being bonded to be disposed in outside device cavity by electronic device lead-in wire, it is provided that have the electronic installation of the mechanical stability of the size of reduction.It is very advantageous that the electronic device with high vertical (i.e. along the direction of its stack layer structure) size can be sunk to have bonded connections to another layer in chamber and by one or more lead-in wires.Owing to signal path can be kept the shortest, the most such structure is mechanically firm and electric reliable.
The advantage being at least partially disposed in device cavity by electronic device can provide the electronic installation of the height with reduction, sees in terms of i.e. having the extension reduced on the z direction of the surface plane being perpendicular to Rotating fields.It addition, by accommodating electronic device at intracavity, the mechanical force applied on the electronic device can be protected the electronics from.
Engaging electronic device and the conductive welding disk being positioned at outside described device cavity by lead-in wire, the size of device cavity can keep the least.The size in chamber might be chosen such that the size size corresponding to electronic device in described chamber.In other words, the size of device cavity might be chosen such that between electronic device and the sidewall of device cavity very close to each other or almost without gap.This can be particularly advantageous, because by the size in chamber is kept the least, and the risk reduction of the pollutant of residual in described device cavity.It is very important for avoiding pollution in the manufacture process of electronic installation, because pollutant in an electronic (as dust, predetermined substance or solder residue thing) can result in impaired electrical connection or layering.Disposed outside conductive welding disk at device cavity allows the joint electronic device that reliably goes between, and the size in described chamber and the risk of pollutant that therefore remains are reduced.In addition, depend on different manufacturing process, retainer member chamber is the least can cause the less gas being closed such as air in device cavity, and thus cause the small amount of air humidity being closed, it can cause the corrosion of electronic installation, can also cause the corrosion of electronic installation when even producing under conditions of high degree of controlled.Therefore; lead-in wire engages described electronic device can cause the electronic installation with longer operating life time with the conductive welding disk of layout outside device cavity, this is because it is better protected against mechanical stress and is not susceptible to pollute and pollute the fault or corrosion caused simultaneously.
Hereinafter, by the further exemplary embodiment of explanation electronic installation.
In one embodiment, described electronic installation also includes the tectum structure being arranged in surface portion, in tectum structure, wherein form lead-in wire engagement cavity, making described lead-in wire engagement cavity around device cavity, and wherein said lead-in wire engages connection of electronic devices and the conductive welding disk being positioned at described lead-in wire engagement cavity.Therefore, surface portion is sandwiched between core structure and the tectum structure of such as electric insulation layer structure.Described lead-in wire engagement cavity can form the passage by tectum structure or through hole so that can enter lead-in wire engagement cavity from the environment around described tectum structure.But, lead-in wire engagement cavity can also form a class and accommodate the blind hole of lead-in wire engagement cavity.
According to another embodiment, the method manufacturing electronic installation also includes: forms the tectum structure being arranged in surface portion, and forms lead-in wire engagement cavity in tectum structure so that described lead-in wire engagement cavity covering device chamber.Described method also includes that lead-in wire engages electronic device and the conductive welding disk in lead-in wire engagement cavity.
Especially, tectum structure can be the cover layer directly contacted with described surface portion.Lead-in wire engagement cavity can be formed on the just position above device cavity of cover layer so that described lead-in wire engagement cavity forms receiving chamber together with device cavity, and it accommodates electronic device and lead-in wire engages.
Engage can provide the advantage that at the receiving intracavity described electronic device of receiving and described lead-in wire, i.e. both electronic device and lead-in wire joint are protected from mechanical stress, and the height of electronic installation is further reduced.The height (in a z-direction) of device cavity can be substantially identical with the height of electronic device.Therefore, in lead-in wire engagement cavity, arrange conductive welding disk allow to arrange the conductive welding disk connection terminal as electronic device in substantially the same height level (i.e. position on the z direction of surface plane being perpendicular to Rotating fields).Therefore, connect described electronic device and the connection merely having to provide in the horizontal direction on (the most in an x or y direction, be both perpendicular to z direction) is provided with the lead-in wire of conductive welding disk, therefore can be designed shorter.
In one embodiment, lead-in wire engagement cavity has the chamber size of the size more than device cavity.
Especially, lead-in wire engagement cavity has a cross section in the surface plane (set by X-direction and Y-direction and limit, wherein z direction is the normal of surface plane) of surface portion or diameter, described cross section or diameter are more than cross section or the diameter of device cavity.Especially, the engagement cavity that goes between at least both sides of device cavity in the surface plane limited by x direction and y direction extends beyond the edge of device cavity.The size of lead-in wire engagement cavity can also be selected so that the engagement cavity that goes between on three or more sides of device cavity extends beyond the edge of device cavity, and particularly each side in x-y plane extends upwardly beyond device cavity.
With extend beyond the size at least one edge of device cavity come regulation lead-in wire engagement cavity size can provide an advantage in that conductive welding disk can be fixed on the marginal portion of surface portion, described marginal portion surround device cavity.Therefore, conductive welding disk can be disposed on height level's substantially the same height level (seeing in a z-direction) of the connection terminal (this connection terminal can be on the upper surface of electronic device) with electronic device.As explained above, this allows shorter bonding wire.Advantageously, lead-in wire engagement cavity can extend upwardly beyond device cavity all sides of x-y surface plane.This allows to be bonded to be disposed on multiple conductive welding disks of the different directions of electronic device by electronic device lead-in wire.Meanwhile, the joint that goes between mechanical stress sensitivity is well protected against the pressure in a z-direction caused by tectum structure.
In one embodiment, electronic installation also includes the cap (cap) covering described lead-in wire engagement cavity.
Especially, lead-in wire engagement cavity can be at least partially filled with cap material.Cap material can be electrically insulating material.Such as, cap material can be polymer, in it is filled into lead-in wire engagement cavity in liquid form and the most such as by ultraviolet (UV) light and/or visible-light curing.Alternatively, cap material can be resin, the most curable resin.
Fill described lead-in wire joint with cap material can provide the advantage that, i.e. cap material embedding supporting wire engages, and therefore protection lead-in wire engages from the pressure applied on the electronic device further.Additionally, described cap material can cover conductive welding disk, and therefore protect conductive welding disk from corrosion.Embedding bonding wire further increases the signal integrity of electronic installation.
In one embodiment, the material of cap has the stiffness characteristics identical with tectum structure.
Especially, the material of cap material and tectum structure can be resin and/or polyurethane.The hot strength of cap material and/or tectum structure can be between 4MPa to 10MPa in the range of, particularly between 6MPa to 8MPa in the range of.The stretch modulus of cap material and/or tectum structure can be between 1GPa to 5GPa in the range of, particularly between 2GPa to 4GPa in the range of.
Had the material of the cap of the mechanical performance essentially identical with the mechanical performance of tectum structure by selection, the stability of electronic installation can be modified further and can avoid undesirable layering of cap layers and tectum structure.
In one embodiment, the material of cap has the thermal coefficient of expansion identical with tectum structure.
Especially, the thermal coefficient of expansion (CTE) of cap material is essentially identical with the CTE of tectum structure.Such as, the CTE of cap material and/or tectum structure can be between 15ppm/K to 100ppm/K in the range of.
Had calotte material and the material of tectum structure of essentially identical CTE by selection, described electronic installation is more tolerant to the change of temperature, and does not has the layering of calotte material and tectum structure.
In one embodiment, electronic installation also includes the adhesion promotion structure being fixed in device cavity by electronic device.
Particularly, adhesion promotion structure can be bonding film or sheet material or can apply the curable adhesive to device cavity in liquid form.Have turned out the electronic installation causing high reliability in electronic device being fixed on device cavity by binding agent.Adhesion promotion structure can include heat conduction particle, to improve the heat radiation from electronic device to environment.If can be it is further favourable that adhesion promotion structure be disposed in device cavity so that it is from least three collateral support electronic device.Can also arrange that adhesion promotion structure makes it from five sides to support electronic device.By being arranged electrical connection by lead-in wire joint, wherein bonding wire is connected to the upper surface of described electronic device, and the whole downside of electronic device can be covered by described adhesion promotion structure.This allows the stable mechanical connection of electronic device and electric insulation layer structure, and allows electrically connecting reliably of device and the conductive welding disk being arranged in outside device cavity simultaneously.
In other words, by adhesion promotion structure, electronic device to be embedded can be glued at the correct position of the desired locations in component carrier, so that it is guaranteed that the latter's is properly positioned.Optionally, the glue applied can be conduction, for the device embedded by glue electric coupling and environment simultaneously, or can be electric insulation to embed electronic device, and not have undesirable current path.
In one embodiment, conductive welding disk is the conductive structure of outermost (seeing the most in a z-direction) of electronic installation.
In traditional electronic installation, it is challenging by the outmost conductive layer that electronic device lead-in wire is bonded to component carrier, this is because the bonding wire of sensitivity is disposed in the proximity of electronic installation, and the pressure being therefore particularly exposed to be applied on the surface of electronic installation.By arranging the device cavity accommodating described electronic device and by the conductive welding disk that electronic device lead-in wire is bonded to be arranged in outside device cavity is arranged electronic installation, wherein, outmost conductive structure can be bonded to electronic device by reliably lead-in wire, and does not damage the risk of the bonding wire of sensitivity.It is bonded to outmost conductive layer additionally, electronic installation of the present utility model is capable of going between and does not increase the total height of electronic installation.
In one embodiment, described electronic installation also includes the screen layer covering described electronic device.
Particularly, screen layer is the outermost layer (seeing the most in a z-direction) of electronic installation.In other words, screen layer defines the boundary region between electronic installation and the environment of electronic installation.Screen layer can be arranged on the cap of described electronic installation.
Arranging shielding layer can provide an advantage in that the described electronic installation of protection is from less desirable electromagnetic effect.Screen layer can also reduce radio wave and the coupling of electrostatic wave in electronic installation.
According to another exemplary embodiment, electronic device is nude film (bare crystalline sheet), the most unencapsulated semiconductor chip.In such embodiments, electronic installation can keep the least because nude film can be encapsulated in component carrier, and without around it molding compounds (or the like), be such as made up of plastics or resin.Therefore, described electronic device structure provide not only effective electromagnetic shielding, but also provides in the compact encapsulation technology of component carrier inner structure.
According to another exemplary embodiment, the electric insulation layer structure of component carrier and particular at least partial elastic includes the stacking of at least one electric insulation layer structure and at least one conductive coating structure or is made up of described stacking.
In one embodiment, component carrier includes the stacking of at least one electric insulation layer structure and at least one conductive coating structure or is made up of described stacking.Such as, component carrier can be the one or more electric insulation layer structures and the layered product of one or more conductive coating structure being previously mentioned, especially by applying what mechanical pressure was formed, and the layered product supported if needed by heat energy.The stacking being previously mentioned can provide the component carrier of plate shape, and the component carrier of described plate shape can provide big for other electronic device and installs surface and remain unusual thin compact.Term " Rotating fields " particularly can represent pantostrat, the layer of patterning or the multiple discrete island (island) in common plane.
According to another exemplary embodiment, at least one electric insulation layer structure described includes by resin, especially bismaleimide-triazine resin, cyanate, glass, particularly glass fibre, prepreg material, polyimides, liquid crystal polymer, laminated film based on epoxy (epoxy-based Build-Up Film), FR4 material, at least one in pottery, and the group of metal-oxide composition.Although prepreg or FR4 are typically preferably but it also may use other materials.
According to another exemplary embodiment, at least one conductive coating structure includes at least one in the group being made up of copper, aluminum and nickel.Although copper is typically preferably, but other materials is also possible.
According to another exemplary embodiment, component carrier is shaped as plate.
In one embodiment, component carrier is shaped as plate.This contributes to the compact design of electronic installation, and wherein said component carrier still provides the big substrate for mounted thereon electronic device.Additionally, the nude film especially as the preferred embodiment of the electronic device for embedding can be embedded in thin plate such as printed circuit board (PCB) easily due to its little thickness.
According to another exemplary embodiment, component carrier is configured to one in the group being made up of printed circuit board (PCB) and substrate.
Use PCB can provide an advantage in that by the surface portion of conventional PCB respectively as component carrier and the most elastic electric insulation layer structure, such as the outermost layer at PCB or two outermost layers at PCB are formed device cavity and can inexpensively and simply manufacture stable and reliable electronic installation.Then, in electronic device being arranged in device cavity and the conductive welding disk that is bonded to outside device cavity of going between.It is, therefore, possible to provide have undersized stable electronic installation.
In other words, term " printed circuit board (PCB) " (PCB) particularly can be with the component carrier of display plate shape, it by being laminated multiple conductive coating structures and multiple electric insulation layer structures, such as, is formed by applying pressure (if desired with the supply of heat energy).As the preferred material for PCB technology, conductive coating structure is made of copper, and electric insulation layer structure can include resin and/or glass fibre, so-called prepreg or FR4 material.Various conductive coating structures can be in desired mode by following and be connected to each other: forms the through hole of across-layer laminate, such as by laser drill or machine drilling, and fill them with conductive material (particularly copper), thus form the via connected as through hole.Except one or more electronic devices being embedded in the printed circuit boards, printed circuit board (PCB) is generally further configured to for accommodating one or more electronic device on one or two apparent surface of plate shape printed circuit board (PCB).They can be connected to corresponding first type surface by welding.
Term " substrate " particularly can represent the little component carrier with the size essentially identical with electronic device mounted thereto.
According to another exemplary embodiment, electronic device selects free active electronic device, passive electronic, electronic chip, storage device, wave filter, integrated circuit, signal processor, power management devices, optic electric interface element, electric pressure converter, encryption element, emitter and/or receptor, electromechanical transducer, sensor, actuator, MEMS, microprocessor, capacitor, resistor, inductance, battery, switch, camera, antenna and the group of logic chip composition.Such as, magnetics is used as electronic device.Such magnetics can be permanent magnetic elements (such as ferromagnetic component, anti-ferromagnetism element or ferrimagnetism element, such as FERRITE CORE), or can be paramagnetic elements.
But, other electronic devices, particularly produce and launch electromagnetic radiation and/or those electronic devices for the electromagnetic radiation sensitivity from environmental dissemination to electronic device can be embedded in an electronic.
According to another exemplary embodiment, component carrier is lamination (layered product) type component carrier.
In one embodiment, what conductive welding disk was disposed in component carrier keeps flat on Rotating fields (lying layer structure), described in keep flat Rotating fields higher than component carrier above be disposed with other of electronic device lower keep flat Rotating fields.Such as, figure 1 illustrates such embodiment.In such embodiments, the vertical height of bonding wire can keep less.
In one embodiment, what conductive welding disk was disposed in component carrier keeps flat on Rotating fields, described in keep flat Rotating fields and be disposed with less than component carrier above that other of electronic device are higher keeps flat Rotating fields.Such as, figure 3 illustrates such embodiment.In such an embodiment, the whole height of electronic installation can keep less, this is because extending vertically of bonding wire can keep less.
By the example of the embodiment being described below, the aspect of above-mentioned restriction of the present utility model and other aspects are apparent from, and these examples with reference to embodiment are explained.
Example below in reference to embodiment is more fully described this utility model, but this utility model is not limited to this.
Accompanying drawing explanation
Fig. 1 shows the sectional view of the electronic installation according to exemplary embodiment of the present utility model.
Fig. 2 shows the sectional view of the electronic installation according to another exemplary embodiment of the present utility model.
Fig. 3 shows the sectional view of the electronic installation according to further example embodiment of the present utility model.
Detailed description of the invention
Diagram in accompanying drawing is schematic.In different drawings, similar or identical element is provided with identical reference.
Fig. 1 shows the sectional view of the electronic installation according to exemplary embodiment of the present utility model.Electronic installation 100 includes component carrier 190, and this component carrier includes the most elastic electric insulation layer structure 110, and it includes the flexible core structure 125 being disposed between rigid surface part 120 and other rigid element 121.Each rigid element 120,121 includes FR4 layer 122 (or any other electrically insulating material) and prepreg 123.Device cavity 130 is formed in the surface portion 120 of at least partly flexible electric insulation layer structure 110.Electronic device 150 is accommodated in device cavity 130.
In an illustrated embodiment, optional adhesion promotion structure 170, such as bonding sheet, electronic device 150 is fixed in device cavity.Alternatively, it is also possible to omit bonding sheet and by welding or other modes, electronic device be fixed in device cavity 130.Such as, in electronic device 150 being fixed on device cavity 130 by solder projection or similar structures, permission sends the signal of telecommunication by solder projection.Lead-in wire engages the connection of 140 offers and conductive welding disk 160, and described conductive welding disk is arranged in outside device cavity, is particularly fixed on the outer surface 120 of electric insulation layer structure 110.As obtained from Fig. 1, lead-in wire engages and 140 is connected with conductive welding disk 160 by electronic device 150, described conductive welding disk be arranged in component carrier 190 compared with electronic device 150 on the most higher Rotating fields.As can be seen, the space requirement of the device cavity 130 of Fig. 1 is substantially lower than the space requirement of the traditional recess 300 in the traditional wiring plate in the accompanying drawing of prior art literature US 2010/0025087 A1.The size in chamber is kept the less stability that can improve electronic installation 100 entirety, and helps avoid the pollution in chamber.
Embodiment according to Fig. 1, what conductive welding disk 160 was disposed in component carrier 190 keeps flat on Rotating fields (lying layer structure), described in keep flat Rotating fields higher than component carrier 190 above be disposed with other of electronic device 150 lower keep flat Rotating fields.Therefore, the base portion of electronic device 150 is disposed in below conductive welding disk 160.The whole height of this holding electronic installation 100 is less.
Fig. 2 shows the sectional view of the electronic installation according to another exemplary embodiment of the present utility model.Electronic installation 200 also includes the tectum structure 210 being arranged in the surface portion 120 of the most elastic electric insulation layer structure 110.Tectum structure 210 provides lead-in wire engagement cavity 220.
In an illustrated embodiment, lead-in wire engagement cavity 220 forms receiving chamber together with device cavity 130, is used for accommodating described electronic device 150, lead-in wire joint 140 and conductive welding disk 160.Particularly, in the surface plane limited by X-direction and Y-direction at least two side of device cavity 130, lead-in wire engagement cavity 220 extends beyond the edge of device cavity 130.Surface portion 120 includes the interior marginal portion around device cavity 130 of engagement cavity 220 that goes between.Conductive welding disk 160 is disposed in lead-in wire engagement cavity 220, and on the surface of the marginal portion being disposed in surface portion 120.
Additionally, described lead-in wire engagement cavity 220 is filled with cap material 230, it extends beyond tectum structure 210 in a z-direction.Cap material 230 can embed lead-in wire joint 140, thus improves reliability and the mechanical stability of electronic installation 200.It addition, be disposed in cap 230 for shielding the screen layer 240 of electromagnetic effect.Lead-in wire engages 140 electrical connection electronic devices 150 and the conductive welding disk 160 being disposed in lead-in wire engagement cavity 220.
Further, according to Fig. 2, lead-in wire engages 140 connection of electronic devices 150 and conductive welding disks 160, and conductive welding disk is disposed on the Rotating fields that the ratio electronic device 150 of component carrier 190 is the highest.
Fig. 3 shows the sectional view of the electronic installation 100 according to another exemplary property embodiment of the present utility model.
According to the embodiment of Fig. 3, what conductive welding disk 160 was arranged in component carrier 190 keeps flat on Rotating fields, described in keep flat that other of the low component carrier 190 being disposed with electronic device 150 thereon of Rotating fields are higher keeps flat Rotating fields.Therefore, the base portion of electronic device 150 is arranged on above conductive welding disk 160.This allows compact structure.
It should be noted that, term " includes " being not excluded for other elements or step, and " one " or " a kind of " are not precluded from multiple.Furthermore, it is possible to combination combines the element that different embodiment describes.Should also be noted that the reference marker in claim is not necessarily to be construed as limiting the scope of claim.Embodiment of the present utility model is not limited to shown in figure and preferred embodiment described above.On the contrary, even if in the case of the embodiment of fundamental difference, it is also possible for using shown scheme and the multiple modification according to principle of the present utility model.
Reference
100 electronic installations
110 the most elastic electric insulation layer structures
120 surface portion
121 rigid layer structures
122 FR4 layers
123 prepreg
125 flexible core structures
130 device cavities
140 lead-in wires engage
150 electronic devices
160 conductive welding disks
170 adhesion promotion structures
180 connect terminal
190 component carrier
200 electronic installations
210 tectum structures
220 lead-in wire engagement cavities
230 caps
240 screen layers.
Claims (28)
1. an electronic installation (100,200), it is characterised in that described electronic installation (100,200) including:
Component carrier (190), including the most elastic electric insulation layer structure (110)；
Device cavity (130), is positioned in the surface portion (120) of described electric insulation layer structure (110)；
Electronic device (150), is at least partially situated in described device cavity (130)；
Lead-in wire engages (140), connect described electronic device (150) and conductive welding disk (160), described conductive welding disk is disposed on another Rotating fields of described component carrier (190) rather than on described electronic device (150).
Electronic installation the most according to claim 1 (100,200), it is characterized in that, described lead-in wire engages (140) and connects described electronic device (150) and the described conductive welding disk (160) being arranged in described device cavity (130) outward.
Electronic installation the most according to claim 1 (100,200), it is characterised in that also include tectum structure (210), described tectum structure is disposed in described surface portion (120)；Wherein, in lead-in wire engagement cavity (220) is formed at described tectum structure (210) so that described lead-in wire engagement cavity (220) is around described device cavity (130)；And wherein, described lead-in wire joint (140) connects described electronic device (150) and the described conductive welding disk (160) being positioned at described lead-in wire engagement cavity (220).
Electronic installation the most according to claim 3 (100,200), it is characterised in that described lead-in wire engagement cavity (220) has the chamber size of the size more than described device cavity (130).
Electronic installation the most according to claim 3 (200), it is characterised in that also include the cap (230) covering described lead-in wire engagement cavity (220).
Electronic installation the most according to claim 5 (200), it is characterised in that the material of described cap (230) has the stiffness characteristics identical with described tectum structure (210).
7. according to the electronic installation (200) according to any one of claim 5 to 6, it is characterised in that the material of described cap (230) has the thermal coefficient of expansion identical with described tectum structure (210).
Electronic installation the most according to any one of claim 1 to 6 (100,200), it is characterized in that, also include the adhesion promotion structure (170) being fixed in described device cavity (130) by described electronic device (150).
Electronic installation the most according to any one of claim 1 to 6 (100,200), it is characterised in that described conductive welding disk (160) is the outmost conductive structure of described electronic installation (100,200).
Electronic installation the most according to any one of claim 1 to 6 (200), it is characterised in that also include the screen layer (240) covering described electronic device (150).
11. electronic installations according to any one of claim 1 to 6 (100,200), it is characterized in that, the electric insulation layer structure (110) of described at least part of elasticity includes at least one flexible core structure (125), and described surface portion (120) is disposed in described flexible core structure.
12. electronic installations according to claim 11 (100,200), it is characterised in that described surface portion (120) includes being formed as at least one rigid layer than described flexible core structure (125) more rigidity.
13. electronic installations according to claim 11 (100,200), it is characterized in that, the electric insulation layer structure (110) of described at least part of elasticity includes being formed as the rigid layer structure (121) than described flexible core structure (125) more rigidity, and described flexible core structure (125) is sandwiched between described rigid layer structure (121) and described surface portion (120).
14. electronic installations according to any one of claim 1 to 6 (100,200), it is characterised in that described electronic device (150) is nude film.
15. electronic installations according to any one of claim 1 to 6 (100,200), it is characterized in that, described component carrier (190) includes the stacking of at least one electric insulation layer structure and at least one conductive coating structure or is made up of described stacking.
16. electronic installations according to claim 15 (100,200), it is characterized in that, at least one electric insulation layer structure described is resin, cyanate, glass, prepreg material, polyimides, liquid crystal polymer, laminated film based on epoxy, FR4 material, pottery, and the one in metal-oxide.
17. electronic installations according to claim 15 (100,200), it is characterised in that at least one conductive coating structure described is the one in copper, aluminum and nickel.
18. electronic installations according to any one of claim 1 to 6 (100,200), it is characterised in that described component carrier (190) is shaped as plate.
19. electronic installations according to any one of claim 1 to 6 (100,200), it is characterised in that described component carrier (190) is configured to the one in the group being made up of printed circuit board (PCB) and substrate.
20. electronic installations (100 according to any one of claim 1 to 6, 200), it is characterized in that, described electronic device (150) selects free active electronic device, passive electronic, electronic chip, storage device, wave filter, integrated circuit, signal processor, power management devices, optic electric interface element, electric pressure converter, encryption element, emitter and/or receptor, electromechanical transducer, sensor, actuator, MEMS, microprocessor, capacitor, resistor, inductance, battery, switch, camera, antenna, magnetics, and the group of logic chip composition.
21. electronic installations according to any one of claim 1 to 6 (100,200), it is characterised in that described component carrier (190) is lamination-type component carrier.
22. electronic installations according to any one of claim 1 to 6 (100,200), it is characterized in that, what described conductive welding disk (160) was disposed in described component carrier (190) keeps flat on Rotating fields, described in keep flat Rotating fields higher than described component carrier (190) above be disposed with other of described electronic device (150) lower keep flat Rotating fields.
23. electronic installations according to any one of claim 1 to 6 (100,200), it is characterized in that, what described conductive welding disk (160) was disposed in described component carrier (190) keeps flat on Rotating fields, described in keep flat Rotating fields and be disposed with less than described component carrier (190) above that other of described electronic device (150) are higher keeps flat Rotating fields.
24. electronic installations according to claim 2 (100,200), it is characterised in that also include tectum structure (210), described tectum structure is disposed in described surface portion (120)；Wherein, in lead-in wire engagement cavity (220) is formed at described tectum structure (210) so that described lead-in wire engagement cavity (220) is around described device cavity (130)；And wherein, described lead-in wire joint (140) connects described electronic device (150) and the described conductive welding disk (160) being positioned at described lead-in wire engagement cavity (220).
25. electronic installations according to claim 4 (200), it is characterised in that also include the cap (230) covering described lead-in wire engagement cavity (220).
26. electronic installations according to any one of claim 1 to 6 (100,200), it is characterised in that described electronic device (150) is unencapsulated semiconductor chip.
27. electronic installations according to any one of claim 1 to 6 (100,200), it is characterized in that, the electric insulation layer structure (110) of described at least part of elasticity includes the stacking of at least one electric insulation layer structure and at least one conductive coating structure or is made up of described stacking.
28. electronic installations according to claim 16 (100,200), it is characterised in that described resin is bismaleimide-triazine resin, and described glass is glass fibre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771694.9U CN205546203U (en) | 2015-09-30 | 2015-09-30 | Electron device's electron device with lead bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520771694.9U CN205546203U (en) | 2015-09-30 | 2015-09-30 | Electron device's electron device with lead bonding |
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| Publication Number | Publication Date |
|---|---|
| CN205546203U true CN205546203U (en) | 2016-08-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520771694.9U Active CN205546203U (en) | 2015-09-30 | 2015-09-30 | Electron device's electron device with lead bonding |
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| Country | Link |
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| CN (1) | CN205546203U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167331A (en) * | 2018-02-16 | 2019-08-23 | 丰田自动车株式会社 | Engagement device and joint method |
| WO2021203726A1 (en) * | 2020-04-10 | 2021-10-14 | 青岛歌尔智能传感器有限公司 | Sensor and manufacturing method therefor, and electronic device |
-
2015
- 2015-09-30 CN CN201520771694.9U patent/CN205546203U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167331A (en) * | 2018-02-16 | 2019-08-23 | 丰田自动车株式会社 | Engagement device and joint method |
| CN110167331B (en) * | 2018-02-16 | 2020-12-18 | 丰田自动车株式会社 | Bonding apparatus and bonding method |
| WO2021203726A1 (en) * | 2020-04-10 | 2021-10-14 | 青岛歌尔智能传感器有限公司 | Sensor and manufacturing method therefor, and electronic device |
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