CN205542770U - 多发光点的led灯珠 - Google Patents

多发光点的led灯珠 Download PDF

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Publication number
CN205542770U
CN205542770U CN201521012263.0U CN201521012263U CN205542770U CN 205542770 U CN205542770 U CN 205542770U CN 201521012263 U CN201521012263 U CN 201521012263U CN 205542770 U CN205542770 U CN 205542770U
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Prior art keywords
luminous
led lamp
pin
lamp bead
interface
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CN201521012263.0U
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梁发权
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Nanning Hongcai Lighting Technology Co ltd
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Dongguan Chencai Lighting Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

本实用新型公开了一种多发光点的LED灯珠，包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。本实用新型结构简单，设计合理，利用LED发光体本身的单向导电发光性，通过多个发光点间的正向并联和反向并联，实现基于控制电流方向进而实现控制发光体工作状态的多发光点的LED灯珠。

Description

多发光点的LED灯珠
技术领域
本实用新型涉及一种LED灯珠，具体的说是一种在同一封装体内具备多个发光点的LED灯珠。
背景技术
现有的LED灯珠，在其内一般仅有一个发光点，功能有限，仅能实现明暗两个状态的变化，同时，单一LED灯珠的发光亮度及射光角度有限，功能单一，LED灯珠不具备有发光颜色可调节的功能，这就使得，如需要高度的且可变多色的LED照明工具时，不能仅仅使用单一LED灯珠，需要使用多种不同颜色的LED灯珠进行配合。
实用新型内容
本实用新型的目的在于克服现在单发光点式LED灯珠，提供一种具备有多个发光点的LED灯珠。
为实现上述目的，本实用新型所采用的技术方案是：一种多发光点的LED灯珠，包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。
作为一种优选，发光体均包括LED发光芯片。
作为一种备选，发光体为贴片式发光二级管。
作为一种优选，一发光体正极接口与相邻光体的正极接口相连后接正极引脚，发光体负极接口与相邻发光体的负极接口接负极引脚。
作为一种备选，一发光体负极接口与相邻发光体的正极接口相连后接正极引脚，发光体正极接口与相邻发光体的负极接口接负极引脚。
作为一种优选，封装树脂为无色透明树脂。
作为一种备选，封装树脂为单色。
作为一种备选，封装树脂为多层的多色结构。
本实用新型结构简单，设计合理，利用LED发光体本身的单向导电发光性，通过多个发光点间的正向并联和反向并联，实现基于控制电流方向进而实现控制发光体工作状态的多发光点的LED灯珠。
附图说明
图1是实施例1的结构示意图。
图2是实施例2的结构示意图。
图中各标号分别是：
（1）发光体
（2）发光体
（3）发光体
（4）发光体
（5）封装树脂
（6）封装树脂
（7）正极引脚
（8）正极引脚
（9）负极引脚
（10）负极引脚。
具体实施方式
为方便对本实用新型作进一步的理解，现结合附图举出实施例，对本实用新型作进一的说明。
实施例1：
如图1所示，本实用新型包括两发光体1、2、封装树脂5，至少两个发体1、2并联后被一封装树脂5包覆并与插入封装树脂5内的正极引脚7、负极引脚9相连; 发光体1、2为LED发光芯片; 一发光体1正极接口与相邻光体2的正极接口相连后接正极引脚7，发光体1负极接口与相邻发光体2的负极接口接负极引脚9; 封装树脂5为无色透明树脂。
实施例2：
如图2所示，本实用新型包括两发光体3、4、封装树脂6，至少两个发体3、4并联后被一封装树脂6包覆并与插入封装树脂6内的正极引脚8、负极引脚10相连; 发光体3、4为贴片式发光二极管；一发光体4负极接口与相邻发光体3的正极接口相连后接正极引脚8，发光体4正极接口与相邻发光体3的负极接口接负极引脚10；封装树脂6为两层的两色结构
以上所述,仅是本实用新型的较佳实施而已,并非对本实用新型作任何形式上的限制,任何熟悉本专业的技术人员都可能利用上述技术内容加以变更或修饰为等同变化的等效实施例,在此，凡未脱离本实用新型的技术方案内容,就依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本实用新型技术方案的范围内。

Claims (6)

1.一种多发光点的LED灯珠，其特征在于：包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。
2.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体均包括LED发光芯片。
3.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体为贴片式发光二级管。
4.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体正极接口与相邻光体的正极接口相连后接正极引脚，发光体负极接口与相邻发光体的负极接口接负极引脚。
5.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体负极接口与相邻发光体的正极接口相连后接正极引脚，发光体正极接口与相邻发光体的负极接口接负极引脚。
6.如权利要求1中所述的多发光点的LED灯珠，其特征在于：封装树脂为树脂，或为无数或为单色或为多层的多色结构。
CN201521012263.0U 2015-12-09 2015-12-09 多发光点的led灯珠 Active CN205542770U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105428345A (zh) * 2015-12-09 2016-03-23 东莞市晨彩照明科技有限公司 多发光点的led灯珠

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105428345A (zh) * 2015-12-09 2016-03-23 东莞市晨彩照明科技有限公司 多发光点的led灯珠

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TR01 Transfer of patent right

Effective date of registration: 20190415

Address after: 530000 No. 9 Gaoke Road, Nanning High-tech Zone, Nanning, Guangxi Zhuang Autonomous Region

Patentee after: NANNING HONGCAI LIGHTING TECHNOLOGY Co.,Ltd.

Address before: 523000 Yongsheng Industrial Zone, Dongshan Village, Qishi Town, Dongguan City, Guangdong Province

Patentee before: DONGGUAN CHENCAI ILLUMINATING TECHNOLOGY Co.,Ltd.

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Denomination of utility model: LED lamp bead with multiple luminous points

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