CN105428345A - 多发光点的led灯珠 - Google Patents

多发光点的led灯珠 Download PDF

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Publication number
CN105428345A
CN105428345A CN201510899222.6A CN201510899222A CN105428345A CN 105428345 A CN105428345 A CN 105428345A CN 201510899222 A CN201510899222 A CN 201510899222A CN 105428345 A CN105428345 A CN 105428345A
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China
Prior art keywords
led lamp
lamp bead
negative pole
luminous
interface
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Pending
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CN201510899222.6A
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English (en)
Inventor
梁发权
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Dongguan Chencai Lighting Technology Co Ltd
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Dongguan Chencai Lighting Technology Co Ltd
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Priority to CN201510899222.6A priority Critical patent/CN105428345A/zh
Priority to GB1522387.8A priority patent/GB2545279A/en
Priority to US14/975,233 priority patent/US9958142B2/en
Publication of CN105428345A publication Critical patent/CN105428345A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17—Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

本发明公开了一种多发光点的LED灯珠，包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。本发明结构简单，设计合理，利用LED发光体本身的单向导电发光性，通过多个发光点间的正向并联和反向并联，实现基于控制电流方向进而实现控制发光体工作状态的多发光点的LED灯珠。

Description

多发光点的LED灯珠
技术领域
本发明涉及一种LED灯珠，具体的说是一种在同一封装体内具备多个发光点的LED灯珠。
背景技术
现有的LED灯珠，在其内一般仅有一个发光点，功能有限，仅能实现明暗两个状态的变化，同时，单一LED灯珠的发光亮度及射光角度有限，功能单一，LED灯珠不具备有发光颜色可调节的功能，这就使得，如需要高度的且可变多色的LED照明工具时，不能仅仅使用单一LED灯珠，需要使用多种不同颜色的LED灯珠进行配合。
发明内容
本发明的目的在于克服现在单发光点式LED灯珠，提供一种具备有多个发光点的LED灯珠。
为实现上述目的，本发明所采用的技术方案是：一种多发光点的LED灯珠，包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。
作为一种优选，发光体均包括LED发光芯片。
作为一种备选，发光体为贴片式发光二级管。
作为一种优选，一发光体正极接口与相邻光体的正极接口相连后接正极引脚，发光体负极接口与相邻发光体的负极接口接负极引脚。
作为一种备选，一发光体负极接口与相邻发光体的正极接口相连后接正极引脚，发光体正极接口与相邻发光体的负极接口接负极引脚。
作为一种优选，封装树脂为无色透明树脂。
作为一种备选，封装树脂为单色。
作为一种备选，封装树脂为多层的多色结构。
本发明结构简单，设计合理，利用LED发光体本身的单向导电发光性，通过多个发光点间的正向并联和反向并联，实现基于控制电流方向进而实现控制发光体工作状态的多发光点的LED灯珠。
附图说明
图1是实施例1的结构示意图。
图2是实施例2的结构示意图。
图中各标号分别是：
（1）发光体
（2）发光体
（3）发光体
（4）发光体
（5）封装树脂
（6）封装树脂
（7）正极引脚
（8）正极引脚
（9）负极引脚
（10）负极引脚。
具体实施方式
为方便对本发明作进一步的理解，现结合附图举出实施例，对本发明作进一的说明。
实施例1：
如图1所示，本发明包括两发光体1、2、封装树脂5，至少两个发体1、2并联后被一封装树脂5包覆并与插入封装树脂5内的正极引脚7、负极引脚9相连;发光体1、2为LED发光芯片;一发光体1正极接口与相邻光体2的正极接口相连后接正极引脚7，发光体1负极接口与相邻发光体2的负极接口接负极引脚9;封装树脂5为无色透明树脂。
实施例2：
如图2所示，本发明包括两发光体3、4、封装树脂6，至少两个发体3、4并联后被一封装树脂6包覆并与插入封装树脂6内的正极引脚8、负极引脚10相连;发光体3、4为贴片式发光二极管；一发光体4负极接口与相邻发光体3的正极接口相连后接正极引脚8，发光体4正极接口与相邻发光体3的负极接口接负极引脚10；封装树脂6为两层的两色结构
以上所述,仅是本发明的较佳实施而已,并非对本发明作任何形式上的限制,任何熟悉本专业的技术人员都可能利用上述技术内容加以变更或修饰为等同变化的等效实施例,在此，凡未脱离本发明的技术方案内容,就依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (6)

1.一种多发光点的LED灯珠，其特征在于：包括若干发光体、封装树脂，至少两个发体并联后被一封装树脂包覆并与插入封装树脂内的正极引脚、负极引脚相连。
2.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体均包括LED发光芯片。
3.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体为贴片式发光二级管。
4.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体正极接口与相邻光体的正极接口相连后接正极引脚，发光体负极接口与相邻发光体的负极接口接负极引脚。
5.如权利要求1中所述的多发光点的LED灯珠，其特征在于：发光体负极接口与相邻发光体的正极接口相连后接正极引脚，发光体正极接口与相邻发光体的负极接口接负极引脚。
6.如权利要求1中所述的多发光点的LED灯珠，其特征在于：封装树脂为树脂，或为无数或为单色或为多层的多色结构。
CN201510899222.6A 2015-12-09 2015-12-09 多发光点的led灯珠 Pending CN105428345A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201510899222.6A CN105428345A (zh) 2015-12-09 2015-12-09 多发光点的led灯珠
GB1522387.8A GB2545279A (en) 2015-12-09 2015-12-18 LED Lamp beads with multiple light-emitting points
US14/975,233 US9958142B2 (en) 2015-12-09 2015-12-18 LED lamp beads with multiple light-emitting points

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CN201510899222.6A CN105428345A (zh) 2015-12-09 2015-12-09 多发光点的led灯珠

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GB2545279A (en) * 2015-12-09 2017-06-14 Dongguan Chen Cai Illuminating Tech Co Ltd LED Lamp beads with multiple light-emitting points

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CN107788951A (zh) * 2017-11-23 2018-03-13 加动健康科技（芜湖）有限公司 用于健康检测的光谱发射装置
CN219263990U (zh) * 2022-09-26 2023-06-27 江西奥赛光电有限公司 Led灯珠和led灯组

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GB2545279A (en) * 2015-12-09 2017-06-14 Dongguan Chen Cai Illuminating Tech Co Ltd LED Lamp beads with multiple light-emitting points

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US9958142B2 (en) 2018-05-01
GB2545279A (en) 2017-06-14
US20170167698A1 (en) 2017-06-15
GB201522387D0 (en) 2016-02-03

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Application publication date: 20160323

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