CN205540790U - Fingerprint module for electronic product - Google Patents
Fingerprint module for electronic product Download PDFInfo
- Publication number
- CN205540790U CN205540790U CN201620115401.6U CN201620115401U CN205540790U CN 205540790 U CN205540790 U CN 205540790U CN 201620115401 U CN201620115401 U CN 201620115401U CN 205540790 U CN205540790 U CN 205540790U
- Authority
- CN
- China
- Prior art keywords
- circuit substrate
- fingerprint
- silicone gasket
- fingerprint module
- sealer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses a fingerprint module for electronic product, its characterized in that: including surface protective layer, fingerprint chip, base ring, circuit substrate and silicone gasket, surface protective layer is located directly over the fingerprint chip, surface protective layer and fingerprint chip install in the through -hole of base ring, the silicone gasket is located the circuit substrate below, and the inside area territory and the circuit substrate of this silicone gasket pass through the bonding of glue layer to be connected, and a FPC soft arranging wire is connected to the bottom of circuit substrate. The utility model discloses two liang of sealed laminatings between cell -phone casing, silica gel pad and base plate and the base ring, with cell -phone inside and outside isolated, can be effectively waterproof dustproof, also make key pressing hand feeling better.
Description
Technical field
This utility model relates to a kind of handset touch panel, belongs to technical field of semiconductor encapsulation.
Background technology
Fingerprint recognition is widely used to the electronic product industries such as mobile phone/notebook computer at present; mostly fingerprint module is in FPC soft arranging wire mode; it is connected with cell phone mainboard by adapter; in traditional design: FPC outlet is from module side outlet; mostly module is with handset shell to coordinate with hole shaft clearance fit system; with reference to Fig. 1, module is by 1. top layer protection；2. fingerprint chip；3. basic ring；4. this four part of substrate+FPC composition；Top layer protection covers at fingerprint chip surface, and fingerprint chip is connected with substrate by conductive material, and basic ring is connected with substrate by glue, gluing, sealing.Whole module is connected with cell phone mainboard in adapter mode by side FPC soft arranging wire, and module coordinates with hole shaft clearance fit system with handset shell, there is fit clearance at cooperation.Because there is fit clearance between existing module and handset shell, the thing such as steam/grieshoch can enter interior of mobile phone by this gap, cause mobile phone not the most reliable waterproof & dust-proof effect.
Summary of the invention
This utility model purpose is to provide a kind of use for electronic products fingerprint module, this use for electronic products its handset shell of fingerprint module, seals laminating between silicagel pad and substrate and basic ring two-by-two, by interior of mobile phone and external environment, and can effective water proof and dust proof.
For reaching above-mentioned purpose; the technical solution adopted in the utility model is: a kind of use for electronic products fingerprint module; it is characterized in that: include sealer, fingerprint chip, basic ring, circuit substrate and silicone gasket; described sealer is positioned at directly over fingerprint chip, and described sealer and fingerprint chip are installed in the through hole of basic ring；
Described silicone gasket is positioned at below circuit substrate, and the inside region of this silicone gasket is connected by glue layer bonding with circuit substrate, and a FPC soft arranging wire is connected to the bottom of described circuit substrate.
In technique scheme, further improved plan is as follows:
1. in such scheme, described shape of through holes is circular, square, oval or track type, it is not limited to above-mentioned shape, it is also possible to for other centrosymmetry or symmetrical figure.
2., in such scheme, described sealer is generally circular in shape, square, oval or track type, it is not limited to above-mentioned shape, it is also possible to for other centrosymmetry or symmetrical figure.
3., in such scheme, described sealer material is sapphire, glass, pottery, plastics, solidified glue or ink.
4., in such scheme, described first glue layer, the second glue layer are solid-state glue-line, layers of two-sided or liquid glue-line.
Owing to technique scheme is used, this utility model compared with prior art has following advantages and an effect:
1. this utility model use for electronic products fingerprint module, which overcome existing scheme laminating and can there is micro gap, water proof and dust proof effect defect cannot be ensured, FPC outlet position is moved to bottom by this patent case, laminating is sealed two-by-two between handset shell, silicagel pad and substrate and basic ring, by interior of mobile phone and external environment, can effective water proof and dust proof.
2. this utility model use for electronic products fingerprint module, it is for the module of integrated mechanical key function, and when module pressing, whole circle silicagel pad can play cushioning effect, makes handfeel of keys more preferably；Secondly, need not be specifically designed structure or tool when mobile phones design and assembling and carry out fingerprint module assembling fixing or pre-fixing, rely on the laminating of module silicagel pad own can realize assembling location or pre-fix function.
Accompanying drawing explanation
Accompanying drawing 1 is existing use for electronic products fingerprint modular structure schematic diagram；
Accompanying drawing 2 is this utility model use for electronic products fingerprint modular structure schematic diagram.
In the figures above: 1, sealer；2, fingerprint chip；4, circuit substrate；5, basic ring；51, through hole；6, silicone gasket；8, glue layer；9, FPC soft arranging wire.
Detailed description of the invention
Below in conjunction with embodiment, this utility model is further described:
Embodiment 1: a kind of use for electronic products fingerprint module; including sealer 1, fingerprint chip 2, basic ring 5, circuit substrate 4 and silicone gasket 6; described sealer 1 is positioned at directly over fingerprint chip 2, and described sealer 1 and fingerprint chip 2 are installed in the through hole 51 of basic ring 5；
Described silicone gasket 6 is positioned at below circuit substrate 4, and the inside region of this silicone gasket 6 is connected by glue layer 8 bonding with circuit substrate 4, and a FPC soft arranging wire 9 is connected to the bottom of described circuit substrate 4.
Above-mentioned through hole 51 is generally circular in shape, and above-mentioned sealer 1 is generally circular in shape.
Above-mentioned sealer 1 material is glass.
Above-mentioned first glue layer the 7, second glue layer 8 is solid-state glue-line.
Embodiment 2: a kind of use for electronic products fingerprint module; including sealer 1, fingerprint chip 2, basic ring 5, circuit substrate 4 and silicone gasket 6; described sealer 1 is positioned at directly over fingerprint chip 2, and described sealer 1 and fingerprint chip 2 are installed in the through hole 51 of basic ring 5；
Described silicone gasket 6 is positioned at below circuit substrate 4, and the inside region of this silicone gasket 6 is connected by glue layer 8 bonding with circuit substrate 4, and a FPC soft arranging wire 9 is connected to the bottom of described circuit substrate 4.
Above-mentioned through hole 51 is shaped as track type, and above-mentioned sealer 1 is shaped as track type.
Above-mentioned sealer 1 material is sapphire.
Above-mentioned first glue layer the 7, second glue layer 8 is liquid glue-line.
FPC soft arranging wire 9 is from circuit substrate 4 cabling in the raised floor; sealer 1 covers on fingerprint chip 2 surface; fingerprint chip 2 is connected with circuit substrate 4 by conductive material; basic ring 5 is connected with circuit substrate 4 by glue; gluing, sealing, silicone gasket is fitted with base plate seals by glue (solid-state glue/double faced adhesive tape/liquid glue etc.).When module assembles with handset shell, module main body and handset shell matched in clearance, edge one encloses silicone gasket and uses glue (solid-state glue/double faced adhesive tape/liquid glue etc.) to seal laminating with handset shell.
When using above-mentioned use for electronic products fingerprint module, which overcome existing scheme laminating and can there is micro gap, water proof and dust proof effect defect cannot be ensured, FPC outlet position is moved to bottom by this patent case, laminating is sealed two-by-two between handset shell, silicagel pad and substrate and basic ring, by interior of mobile phone and external environment, can effective water proof and dust proof；Secondly, it is for the module of integrated mechanical key function, and when module pressing, whole circle silicagel pad can play cushioning effect, makes handfeel of keys more preferably；Again, need not be specifically designed structure or tool when mobile phones design and assembling and carry out fingerprint module assembling fixing or pre-fixing, rely on the laminating of module silicagel pad own can realize assembling location or pre-fix function.
Above-described embodiment only for technology of the present utility model design and feature are described, its object is to allow person skilled in the art will appreciate that content of the present utility model and to implement according to this, can not limit protection domain of the present utility model with this.All equivalence changes made according to this utility model spirit or modification, all should contain within protection domain of the present utility model.
Claims (5)
1. a use for electronic products fingerprint module; it is characterized in that: include sealer (1), fingerprint chip (2), basic ring (5), circuit substrate (4) and silicone gasket (6); described sealer (1) is positioned at directly over fingerprint chip (2), and described sealer (1) and fingerprint chip (2) are installed in the through hole (51) of basic ring (5)；
Described silicone gasket (6) is positioned at circuit substrate (4) lower section, and the inside region of this silicone gasket (6) is connected by glue layer (8) bonding with circuit substrate (4), and a FPC soft arranging wire (9) is connected to the bottom of described circuit substrate (4).
Use for electronic products fingerprint module the most according to claim 1, it is characterised in that: described through hole (51) is generally circular in shape, square, oval or track type.
Use for electronic products fingerprint module the most according to claim 1, it is characterised in that: described sealer (1) is generally circular in shape, square, oval or track type.
Use for electronic products fingerprint module the most according to claim 1, it is characterised in that: described sealer (1) material is sapphire, glass, pottery, plastics, solidified glue or ink.
Use for electronic products fingerprint module the most according to claim 1, it is characterised in that: described glue layer (8) is solid-state glue-line, layers of two-sided or liquid glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620115401.6U CN205540790U (en) | 2016-02-05 | 2016-02-05 | Fingerprint module for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620115401.6U CN205540790U (en) | 2016-02-05 | 2016-02-05 | Fingerprint module for electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205540790U true CN205540790U (en) | 2016-08-31 |
Family
ID=56776236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620115401.6U Expired - Fee Related CN205540790U (en) | 2016-02-05 | 2016-02-05 | Fingerprint module for electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205540790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106446843A (en) * | 2016-09-29 | 2017-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module assembly, processing method thereof and terminal with fingerprint module assembly |
-
2016
- 2016-02-05 CN CN201620115401.6U patent/CN205540790U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106446843A (en) * | 2016-09-29 | 2017-02-22 | 广东欧珀移动通信有限公司 | Fingerprint module assembly, processing method thereof and terminal with fingerprint module assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 Termination date: 20190205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |