CN205508806U - 集成在散热基板上的双面焊接单面散热功率模块 - Google Patents
集成在散热基板上的双面焊接单面散热功率模块 Download PDFInfo
- Publication number
- CN205508806U CN205508806U CN201620182515.2U CN201620182515U CN205508806U CN 205508806 U CN205508806 U CN 205508806U CN 201620182515 U CN201620182515 U CN 201620182515U CN 205508806 U CN205508806 U CN 205508806U
- Authority
- CN
- China
- Prior art keywords
- welding
- insulated
- bipolar transistor
- gate bipolar
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000003466 welding Methods 0.000 title claims abstract description 66
- 230000017525 heat dissipation Effects 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 85
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 14
- 229910000838 Al alloy Inorganic materials 0.000 claims description 12
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 229910007637 SnAg Inorganic materials 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 3
- 239000000017 hydrogel Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000010354 integration Effects 0.000 description 2
- -1 power terminal Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/40137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620182515.2U CN205508806U (zh) | 2016-03-10 | 2016-03-10 | 集成在散热基板上的双面焊接单面散热功率模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620182515.2U CN205508806U (zh) | 2016-03-10 | 2016-03-10 | 集成在散热基板上的双面焊接单面散热功率模块 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205508806U true CN205508806U (zh) | 2016-08-24 |
Family
ID=56728034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620182515.2U Active CN205508806U (zh) | 2016-03-10 | 2016-03-10 | 集成在散热基板上的双面焊接单面散热功率模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205508806U (zh) |
-
2016
- 2016-03-10 CN CN201620182515.2U patent/CN205508806U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Double-side welding and single-side heat radiation power module integrated on heat radiation substrate Effective date of registration: 20180726 Granted publication date: 20160824 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR LTD. Registration number: 2018330000205 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221020 Granted publication date: 20160824 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiaxing science and Technology Branch Pledgor: STARPOWER SEMICONDUCTOR Ltd. Registration number: 2018330000205 |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: No. 988 Kexing Road, Hunan District, Jiaxing City, Zhejiang Province, 314006 Patentee after: Star Semiconductor Co.,Ltd. Address before: No. 988 Kexing Road, Hunan District, Jiaxing City, Zhejiang Province, 314006 Patentee before: STARPOWER SEMICONDUCTOR Ltd. |