CN205508784U - Mask cavity device - Google Patents
Mask cavity device Download PDFInfo
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- CN205508784U CN205508784U CN201520925671.9U CN201520925671U CN205508784U CN 205508784 U CN205508784 U CN 205508784U CN 201520925671 U CN201520925671 U CN 201520925671U CN 205508784 U CN205508784 U CN 205508784U
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- 238000009434 installation Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 9
- 238000013519 translation Methods 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 19
- 239000000758 substrate Substances 0.000 abstract description 15
- 238000001816 cooling Methods 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000005137 deposition process Methods 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 18
- 238000012546 transfer Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000009432 framing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
This paper the embodiment relate to the mask cavity device of the processing that is used for display substrates. The mask cavity configures the part that is used for making the great processing system of OLED device into. The mask cavity can configure the mask heating and cooling to utilizing into during the all deposit technology in processing system. The mask cavity can be including the cavity body, the volume is injectd to the cavity body, the one or more box that holds a plurality of masks is received for being suitable for to the design of volume size. The heater that is coupled to the cavity body in the volume can configure into: when utilize the mask in the deposition process cavity before, heat the mask controllablely, and after using in the deposition process cavity, the cooling the mask.
Description
Technical field
Embodiment of the disclosure the base plate processing system relating generally to large-area substrates.More specifically, embodiment described herein relates to mask chamber.
Background technology
Organic Light Emitting Diode (OLED) is used in the manufacture for showing the television screen of information, computer monitor, mobile phone etc..Typical OLED can include all organic material layer between two electrodes, these layers all by formed have individually can energy supply pixel matrix display panel in the way of be deposited on substrate.OLED is typically positioned between two face glass, and these face glass edges are sealed, in order to be encapsulated in wherein by OLED.
Along with the market acceptance to plate technique, equipment manufacturers have been promoted to be the new system that flat faced display manufacturer develops the larger sized glass substrate of adaptation the demand of bigger display, the volume of production of increase and lower manufacturing cost.It addition, by efficient and cost-effective in the way of various system units are integrated into the ability processed in operation of complexity decrease and have cost.But, owing to using this type of main equipment to process large-area substrates, the various parts of integrated system become time-consuming and difficult.
Therefore, there is a need in the art for is the device of the improvement for manufacturing OLED display device.
Utility model content
In one embodiment, it is provided that mask chamber device.Described device includes: chamber body, described chamber body defined volume, and described volume size is designed as being suitable to receive one or more mask wherein；And lid component, described lid component can be slidably coupled to described chamber body outside described volume.Heater and temperature measuring equipment may be coupled to described chamber body.Described heater can be arranged in described volume, and described temperature measuring equipment may be coupled to described chamber body.Platform can be arranged in described volume, and relative with described lid component, and described platform can be removably coupled to described chamber body.
In another embodiment, it is provided that mask chamber device.Described device includes: chamber body, described chamber body defined volume；And lid component, described lid component is coupled to described chamber body outside described volume.Reflective heater can be coupled to described chamber body in described volume, and thermocouple may be coupled to described chamber body.Platform may be coupled to described chamber body, and can be movably disposed in described volume.
In another embodiment, it is provided that mask chamber device.Described device includes: chamber body, described chamber body defined volume；And lid component, described lid component is slidably coupled to described chamber body.Slit valve can be coupled to described chamber body below described cap assemblies, and thermocouple can be coupled to described chamber body below described slit valve.Multiple reflective heaters can be coupled to described chamber body in described volume.Platform can also be movably disposed in described volume, and alignment device may be coupled to described platform, and extends from described platform.Described alignment device can include bearing components.
Accompanying drawing explanation
Therefore, in order to be able to be understood in detail the mode of the features described above of the disclosure, the more specifically description to the disclosure summarized briefly above can be obtained by referring to embodiment, some in embodiment shown in appended accompanying drawing.It should be noted, however, that appended accompanying drawing only illustrates the exemplary embodiment of the disclosure, and therefore it is not construed as limiting the scope of the present disclosure, because the disclosure can allow other Equivalent embodiments.
Fig. 1 illustrates the axonometric chart of mask chamber.
Fig. 2 illustrates the plane graph of the mask chamber of Fig. 1, and wherein cap assemblies removes.
Fig. 3 illustrates the elevation cross-sectional view of the mask chamber of Fig. 1.
Fig. 4 illustrates the partial sectional side view of platform box alignment device.
Fig. 5 illustrates the schematic perspective view of processing system.
In order to make it easy to understand, in the conceived case, use identical reference to specify the common identical element of each accompanying drawing.The element and the feature that contemplate an embodiment can be beneficially incorporated other embodiments, and without being further discussed below.
Detailed description of the invention
Embodiment as herein described relates to the mask chamber of the process of display base plate.Described mask chamber can be arranged to the part of the bigger processing system (seeing Fig. 5) for manufacturing OLED.Described mask chamber can be configured to the mask heating utilized during all depositing operations in described processing system and cooling.Described mask chamber can include chamber body, described chamber body defined volume, and the reception that is sized to of described volume accommodates one or more boxes of multiple masks.The heater being coupled to chamber body in described volume can be configured such that before described mask is used for deposition processes chamber, controllably heats mask；And when after deposition processes chamber, cool down described mask.
Fig. 1 illustrates the axonometric chart of mask chamber 100.Mask chamber 100 includes chamber body 102, described chamber body 102 defined volume 104.The size of volume 104 may be designed as being suitable to receive one or more box 120, and the one or more box 120 is provided with one or more mask 122 the most removedly.Box 120 can be delivered to chamber 100 by crane (crane) or similar device, and is positioned in volume 104.Framing component 130 may be coupled to chamber body 102, and one or more alignment actuator 124 may be coupled to framing component 130.Alignment actuator 124 can be configured such that in the part being sent to engage between volume 104 mid-term described box 120, and assist and position box 120.In one embodiment, alignment actuator 124 is cylinder.
Lid component 106 can also couple chamber body 102.Lid component 106 can be configured to the enclosed volume 104 when this lid component 106 is positioned at the position of closedown.Lid supporting member 110 can also be coupled to chamber body 102, and can be configured to support when lid component 106 is positioned at open position (as shown in Figure 1) and position this lid component 106.Lid component 106 may be coupled to lid supporting member 110.Track component 126 may be coupled to lid supporting member 110, and this track component 126 can translate relative to chamber body 102.In one embodiment, track component 126 can make lid component 106 translate in a first direction, and box 120 can be made to translate into and out of volume 104 in a second direction.This first direction can be substantially perpendicular to each other with second direction.
Lid actuator 128 can be coupled to chamber body 102 by adjacent tracks component 126.Lid actuator 128 can be removably coupled to track component 126 so that lid component 106 to be positioned at the position opened or closed.In one embodiment, lid actuator 128 is cylinder.The translation capability of lid component 106, lid supporting member 110 and track component 126 makes it possible to box 120 and mask 122 are placed in chamber 100 efficiently.
Such as, accommodate the box of used mask by opening lid component 106 removing, can remove needing cleaning or the used mask that adjusts from chamber 100.By new box, new mask can be provided to chamber 100, and lid component 106 can be closed subsequently.As described in more detail with reference to Fig. 5, the replacing of mask and box can perform while substrate is the most processed so that when the process chamber in system needs new mask, suitable mask exists in mask chamber 100, and is available.In one embodiment, the first box being arranged in chamber 100 can accommodate untapped mask, and the second box being arranged in chamber 100 can accommodate used mask.New mask can be retrieved from the first box, and these new masks are used in the process chamber of system, and may return to the second box from the used mask processing chamber.When needed, the second box accommodating used mask can remove from chamber 100, and the 3rd box with new mask can be positioned in chamber 100.
Slit valve 118 can also be coupled to chamber body 102.This slit valve is typically coupled to the transfer chamber of processing system (seeing Fig. 5), and slit valve 118 is configured to allow for the transmission of travelling to and fro between volume 104 to mask 122.Mask sensor 114 may be coupled to chamber body 102, and extends in volume 104.Mask sensor 114 can be optical pickocff or touch sensor etc., and can be configured to detect the existence of mask 122 in volume 104.Box sensor 116 can also be coupled to chamber body 102, and extends in volume 104.Box sensor 116 can be optical pickocff or touch sensor etc., and can be configured to detect the existence of box 120 in volume 104.It addition, temperature sensor 108 may be coupled to chamber body 102, and extend in volume 104.In one embodiment, temperature sensor 108 can be arranged to the thermocouple of contact mask 122.
Chamber 100 can be configured to create in volume 104 and is suitable to regulate mask 122 and be more specifically suitable to heating and the environment of cooling mask 122.Pumping installations 112 may be coupled to chamber body 102, and can be configured to generate within the volume vacuum.In one embodiment, pumping installations 112 is cryopump.Pumping installations 112 can generate vacuum environment within the volume, and described vacuum environment can be similar with the environment of the transfer chamber that chamber 100 is coupled to.Thus, when opening slit valve 118 to receive or to discharge in mask 122, can not destroy vacuum, this can improve the efficiency that mask transmits.
Fig. 2 illustrates the plane graph of the mask chamber 100 of Fig. 1, and wherein cap assemblies 106 removes.As it can be seen, the box 120 accommodating mask 122 is arranged in chamber 100.Heater 204 can be in volume 104 and adjacent cassettes 120 and mask 122 are coupled to chamber body 102.Heater 204 can be configured for heating mask 122 and additionally aiding cooling mask 122.In one embodiment, heater 204 can be reflective heater or resistance type heater.
Heater 204 can be configured to heat mask 122, and mask 122 is cooled to the temperature between about 20 degrees Celsius and about 100 degrees Celsius, such as, between about 40 degrees Celsius and about 80 degrees Celsius.In general, new mask can be heated, and used mask can be cooled down.Heater 204 is gradually heated up mask 122, and heater 204 can carry out a liter high-temperature with the speed of greater than about 1 DEG C/min.In one example, mask can be heated to temperature required in less than about 6 hours by heater 204, such as, and about 80 degrees Celsius.Can perform gradually to heat technique to prevent the thermal stress tolerance beyond mask material.It addition, mask 122 can be maintained required target temperature, such as, about 80 degrees Celsius by heater 204, and deviation is less than about 3 degrees Celsius.Can little by little be cooled down used mask by heater 204 and reach the persistent period of less than about 10 hours.Such as, the used mask of the temperature that can little by little be would have about 80 degrees Celsius by heater 204 is cooled to the temperature of about 40 degrees Celsius.
One or more linear-type actuator 202 can also be coupled to chamber body 102.Although only illustrate two linear-type actuator 202, it is contemplated that greater or lesser number of linear-type actuator 202 may be coupled to chamber body 102.Linear-type actuator 202 may be coupled to platform, and is configured to make platform translation pass volume 104, as described in more detail with reference to Fig. 3-4.In one embodiment, linear-type actuator 202 is ball screw.
Fig. 3 illustrates the perspective, cut-away view of the chamber 100 of Fig. 1.It is coupled to linear-type actuator 202 and the platform 302 that is arranged in volume 104 can be configured to contact box 120, and make box 120 translate across volume 104.In general, the translation to box 120 carried out via platform 302 can be in the second direction of the first translation direction being perpendicular to lid component 106.In one embodiment, platform 302 is configured to stroke (stroke) distance translating in a second direction between about 1500mm and about 2500mm, such as, between about 2200mm and about 2300mm.
Platform 302 can engage box 120, and is positioned in volume 104 by this box 120.Such as, when box 120 is introduced in volume 104, platform 302 can be raised to receive box 120 and these boxes 120 are dropped to the desired location in volume 104 so that lid component 106 can be moved to the position closed.Box 120 can be positioned in volume 104 by platform 302 further relative to slit valve 118 so that can remove mask 122 from box 120 and maybe can be placed in box 120 by mask 122.As it is shown on figure 3, two boxes 120 each accommodating five masks 122 are arranged in chamber 100.It is, however, contemplated that greater or lesser number of box 120 and mask 122 can utilize in chamber 100, in order to the process yield needed for realizing in following processing system.
Fig. 4 illustrates the partial sectional side view of alignment device 402.Alignment device 402 may be coupled to the top surface 408 of platform 302, and extends from the top surface 408 of platform 302.Alignment device 402 can be coupled to the pin-shaped, shaft-like of bearing components 404 or tubular structure.Bearing components 404 can fixedly or movably be coupled to alignment device 402, and can be configured to engage the basal surface 410 of box 120.Alignment area 406 may be formed in the basal surface 410 of box 120, and can be with the bearing components 404 of contact float device 402.Alignment area 406 can be with forms such as the grooves that is formed on the basal surface of box 120.
Although only illustrating an alignment device 402, it is contemplated that two or more alignment devices (such as, about 4 alignment devices) may be coupled to platform 302.In operation, when box is introduced in chamber 100, platform 302, and the engageable alignment area of bearing components 404 406 of alignment device 402 can be raised in volume 104.It is believed that alignment device 402 with the contact float between platform improving 302 and box 120, and also can reduce the particle generation in chamber 100.It addition, during platform 302 and box 120 translate across volume 104, alignment device 402 combines alignment area 406 and is possible to prevent box 120 to depart from from platform 302 together.
Fig. 5 illustrates the schematic perspective view of processing system 500.In one embodiment, during mask chamber 100 can be beneficially incorporated processing system 500.Processing system 500 includes the first cluster tool 502 and the second cluster tool 504 by coupling chamber 506 connection.Couple chamber 506 to include the first passageway chamber 514, rotate chamber 516, alternate path chamber 520 and optional buffer chamber 518.
First cluster tool 502 can include that one or more first processes chamber 512A-512E, the first transfer chamber 511 and mask chamber 100.First process chamber 512A-512E and mask chamber 100 may be coupled to the first transfer chamber 511, and radially arrange around described first transfer chamber 511.Second cluster tool 504 can include that one or more second processes chamber 522A-522E, the second transfer chamber 521 and mask chamber 100.Similar with the first cluster tool 502, the second process chamber 522A-522E and mask chamber 100 may be coupled to the second transfer chamber 521, and radially arrange around described second transfer chamber 521.
In operation, the first mask can be retrieved from mask chamber 100 by the mechanical arm being arranged in the first transfer chamber 511, and these first masks are positioned in the first process chamber 512A-512E.The first mask can be utilized, process first and chamber 512A-512E processes substrate to be deposited on these substrates by ground floor.After the deposition of ground floor, these substrates can be transmitted and arrive the second cluster tool 504 by the first passageway chamber 514, rotation chamber 516 and alternate path chamber 520.Before processing substrate in the second cluster tool 504, it is arranged on the mechanical arm in the second transfer chamber 521 and can retrieve the second mask from the mask chamber 100 being coupled to the second transfer chamber 512, and these second mask alignment are processed in chamber 522A-522E second.It is arranged on the mechanical arm in the second transfer chamber 521 and can receive substrate from alternate path chamber 520, and these substrates are positioned in the second process chamber 522A-522E, described second processes chamber 522A-522E utilizes the second mask to be deposited on these substrates by the second layer.It is to be understood that, although transfer chamber 511,521 has been shown as accommodating the transfer chamber on eight limits of up to eight chambers, described eight chambers are coupled to the transfer chamber on described eight limits, but it is also contemplated that to other sizes through the transfer chamber of design, such as, the transfer chamber on six limits.In addition, it will be appreciated that process chamber 512A-512E, 522A-522E can include the appropriate housings for processing substrate, such as, PECVD, CVD, ALD, PVD, anneal, etch and other chambers.
As it has been described above, mask chamber 100 can improve processing system 500 by the mask utilization ratio in improvement system 500.New mask and used mask can exchange efficiently to processing chamber to improve the yield of system.The heating and the cooling that perform mask in mask chamber 100 enable processing system to process substrate more quickly, because without these mask is heated or cooled in the processing chamber.
Although foregoing is for embodiment of the disclosure, but the further embodiment elemental range without departing from the disclosure of the disclosure can be designed, and the scope of the present disclosure resides in the claims hereinafter appended.
Claims (20)
1. a mask chamber device, described mask chamber device includes:
Chamber body, described chamber body defined volume, described volume size is designed as being suitable to receive one or more mask in described volume；
Lid component, described lid component is slidably coupled to described chamber body outside described volume；
Heater, described heater is coupled to described chamber body in described volume；
Temperature survey component, described temperature survey component is coupled to chamber body；And
Platform, described platform is arranged in described volume, and relative with described lid component, wherein, is coupled to described chamber body described platform moveable.
Mask chamber device the most according to claim 1, it is characterised in that described platform is coupled to the first linear-type actuator, described first linear-type actuator is configured to make described platform translation through described volume.
Mask chamber device the most according to claim 2, it is characterised in that described linear-type actuator is ball screw device.
Mask chamber device the most according to claim 2, it is characterised in that described linear-type actuator is configured to make described platform translate in a first direction.
Mask chamber device the most according to claim 4, it is characterised in that track component is configured to make described lid component sliding translation in the second direction vertical with described first direction.
Mask chamber device the most according to claim 5, it is characterised in that track component is configured to make described lid component relative to described chamber body sliding translation.
Mask chamber device the most according to claim 5, it is characterised in that described track component is coupled to described chamber body.
Mask chamber device the most according to claim 1, it is characterised in that one or more second actuators are configured to make described lid component couple from described chamber body solution.
Mask chamber device the most according to claim 1, it is characterised in that described heater is reflective heater.
Mask chamber device the most according to claim 1, it is characterised in that described temperature measuring equipment is thermocouple.
11. mask chamber device according to claim 1, it is characterised in that farther include:
Pumping installations, described pumping installations is configured in described volume generate vacuum.
12. mask chamber device according to claim 11, it is characterised in that described pumping installations is cryopump.
13. 1 kinds of mask chamber device, described mask chamber device includes:
Chamber body, described chamber body defined volume；
Lid component, described lid component is coupled to described chamber body outside described volume；
Reflective heater, described reflective heater is coupled to described chamber body in described volume；
Thermocouple, described thermocouple is coupled to described chamber body；And
Platform, described platform is coupled to described chamber body, and is movably disposed in described volume.
14. mask chamber device according to claim 13, it is characterised in that farther include:
First actuator, described first actuator is coupled to described chamber body, and described first actuator is configured to make described platform translate across described volume in a first direction.
15. mask chamber device according to claim 14, it is characterised in that farther include:
Second actuator, described second actuator is coupled to described chamber body, and described second actuator is configured to make described lid component translate up in the second party vertical with described first direction.
16. mask chamber device according to claim 13, it is characterised in that farther include:
Pumping installations, described pumping installations is configured in described volume generate vacuum.
17. mask chamber device according to claim 16, it is characterised in that described pumping installations is cryopump.
18. 1 kinds of mask chamber device, described mask chamber device includes:
Chamber body, described chamber body defined volume；
Cap assemblies, described cap assemblies is slidably coupled to described chamber body；
Slit valve, described slit valve is coupled to described chamber body below described cap assemblies；
Thermocouple, described thermocouple is coupled to described chamber body below described slit valve；
Multiple reflective heaters, the plurality of reflective heater is coupled to described chamber body in described volume；
Platform, is arranged in described volume described platform moveable；And
Alignment device, described alignment device is coupled to described platform, and extends from described platform, and described alignment device includes bearing components.
19. mask chamber device according to claim 18, it is characterised in that farther include:
Cryopump, described cryopump by with described volumetric fluid connect in the way of be coupled to described chamber body, wherein said cryopump be configured in described volume generate vacuum.
20. mask chamber device according to claim 18, it is characterized in that, described volume size is designed as being suitable to receive the one or more boxes accommodating multiple masks, and described platform configuration becomes to contact the one or more box, and makes the one or more box translate in described volume.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462082478P | 2014-11-20 | 2014-11-20 | |
| US62/082,478 | 2014-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205508784U true CN205508784U (en) | 2016-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520925671.9U Active CN205508784U (en) | 2014-11-20 | 2015-11-19 | Mask cavity device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205508784U (en) |
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2015
- 2015-11-19 CN CN201520925671.9U patent/CN205508784U/en active Active
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