CN205488106U - Keep away photoelectronic label 's chip package structure - Google Patents
Keep away photoelectronic label 's chip package structure Download PDFInfo
- Publication number
- CN205488106U CN205488106U CN201620044451.XU CN201620044451U CN205488106U CN 205488106 U CN205488106 U CN 205488106U CN 201620044451 U CN201620044451 U CN 201620044451U CN 205488106 U CN205488106 U CN 205488106U
- Authority
- CN
- China
- Prior art keywords
- chip
- packaging structure
- ink
- base material
- metal pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The utility model provides a keep away photoelectronic label's chip package structure, it includes: printing ink below substrate, chip, the chip, the metal pad of being connected with the chip. The substrate is acceptd the chip, the chip with printing ink overall arrangement below the chip is on the two sides of substrate, just in the projection of chip on this printing ink drops on printing ink completely, printing ink arrives the direction of chip is the light struck direction.
Description
Technical field:
This utility model relates to radio frequency identification (RFID) field, it is provided that the chip-packaging structure of a kind of lucifuge electronic tag.
Background technology:
RFID (radio frequency identification) technology is an important component part of Internet of things system, and achieved with many application in actual life, the industry related to has the numerous areas such as logistics, false proof, traffic.In rfid system, electronic tag can be used on everyone or each object at one's side, is used for the information that carries out mutual.
Electronic tag is when running into sunlight or light-illuminating, as the thinnest in the base material thickness at fruit chip or base material printing opacity, then light note affects the duty of chip, under serious conditions, label even can not normally be read and write, or the data of chip-stored are tampered, the safety of electronic tag will be destroyed, to the application of RFID with many hidden danger.
Utility model content:
Main purpose of the present utility model is to provide the chip-packaging structure of a kind of lucifuge electronic tag, it is intended to solve the problem that electronic tag the most normally works, and the data of chip-stored can be protected again not affected by illumination simultaneously.
This utility model provides the chip-packaging structure of a kind of lucifuge electronic tag, comprising: the metal pad that the ink below base material, chip, chip is connected with chip, described base material houses described chip, ink layout below described chip and described chip is on the two sides of base material, and the projection that described chip is on this ink entirely falls within ink, the direction of described ink to described chip is light direction of illumination.
According to a preferred embodiment, described metal pad is two, and is directly connected with described chip.
According to a preferred embodiment, described chip is connected by described metal wire with described metal pad.
According to a preferred embodiment, described metal pad is arranged on described chip both sides.
According to a preferred embodiment, described metal pad is arranged on the same side of described base material.
According to a preferred embodiment, the both sides of described base material are provided with described metal pad, are turned on by the metallization via on described base material between the described metal pad of described chip the same side.
According to a preferred embodiment, described base material can be pottery, FR4, ply of paper, poly-flexible to phenyl formic acid glycol ester PET or polyimides PI etc. or the sheet material of hard, and the metal material on base material can be silver, copper, aluminum, silver slurry, carbon slurry etc..
According to a preferred embodiment, the connected mode of described chip and two metal pads can be down encapsulation, COB bonding, paster or welding.
According to a preferred embodiment, the shape of the ink of described beneath chips can be rectangle, trapezoidal, rhombus, triangle, circle, ellipse, polygon, circular arc etc..The area of described ink is not less than the area of described chip.The material of described ink can be electrically conductive ink, it is also possible to be dielectric ink.The color of described ink can be black, green, brown, yellow, redness, orange, blue, purple etc., and the thickness of ink is not less than 1 micron.
Accompanying drawing illustrates:
Fig. 1 is an embodiment of the chip-packaging structure of this utility model lucifuge electronic tag；
Fig. 2 is another embodiment of the chip-packaging structure of this utility model lucifuge electronic tag；
Fig. 3 is the further embodiment of the chip-packaging structure of this utility model lucifuge electronic tag.
Detailed description of the invention:
Described herein it is embodied as example only in order to explain this utility model, is not used to limit this utility model.
With reference to shown in Fig. 1, chip-packaging structure according to the lucifuge electronic tag in the present embodiment, it includes two metal pads 310 and 320, the ink 400 of beneath chips that base material 100, chip 200 be connected with chip 200, and its chips 200, metal pad 310 and 320, ink 400 are all attached on base material 100.
The metal pad 310 and 320 being connected with base material all can by printing, etch, the technique such as plating is attached on base material 100.
Ink 400 can first be printed on base material 100, then by the baking of 50～100 degree, in order to be stabilized on base material.
Fig. 2 is another embodiment of the chip-packaging structure of this utility model lucifuge electronic tag, chip 200 utilizes conducting resinl and encapsulation (flip-chip) technique of falling to be connected on two metal pads 310 and 320, embodiment according to Fig. 2, a compact tag can be formed, if the pad size in substrate sizes and base material is carried out particular design, label antenna can be made to realize preferably mating with the impedance of chip, given play to the optimum performance of label.
Fig. 3 is the further embodiment of the chip-packaging structure of this utility model lucifuge electronic tag; unlike Fig. 2; chip 200 can be fixed on base material 100 by red glue, elargol or insulating cement; chip 200 encapsulates with the technique being connected by COB of metal pad 310 and 320; the connection of chip and metal pad, then sealing protection chip 200 and nation's line 501 and 502 is realized by the bonding machines of gold thread, aluminum steel or copper cash.Additionally two pads 310 and 320 on base material 100 are turned on by the metallization via 601 on base material and the another side pad 311 and 321 on 602, with base material.Embodiment according to Fig. 3, a compact tag can be formed, if this label to be passed through pad 311 and 321 paster two feed ends at antenna, it is also possible to antenna is carried out particular design, and then make antenna realize preferably mating with the impedance of chip, give play to the optimum performance of label.
In two embodiments of Fig. 2 and Fig. 3; all achieve the absorption to light by ink 400 or block; avoid the illumination impact on chip, solve the problem that electronic tag the most normally works, the data of chip-stored can be protected again not affected by illumination simultaneously.
The foregoing is only two embodiments of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalent structure transformation utilizing this utility model description and accompanying drawing content to be done; or directly, indirectly it is used in other relevant technical field, is the most in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. the chip-packaging structure of a lucifuge electronic tag, comprising: the metal pad that the ink below base material, chip, chip is connected with chip, described base material houses described chip, ink layout below described chip and described chip is on the two sides of base material, and the projection that described chip is on this ink entirely falls within ink, the direction of described ink to described chip is light direction of illumination.
The chip-packaging structure of electronic tag the most according to claim 1, it is characterised in that described metal pad is two, and be directly connected with described chip.
Chip-packaging structure the most according to claim 2, it is characterised in that the connected mode of described chip and two metal pads is down encapsulation, COB bonding, paster or welding.
Chip-packaging structure the most according to claim 1, it is characterised in that described chip is connected by described metal wire with described metal pad.
Chip-packaging structure the most according to claim 4, it is characterised in that described metal pad is arranged on described chip both sides.
Chip-packaging structure the most according to claim 4, it is characterised in that described metal pad is arranged on the same side of described base material.
Chip-packaging structure the most according to claim 4, it is characterised in that the both sides of described base material are provided with described metal pad, is turned on by the metallization via on described base material between the described metal pad of described chip the same side.
Chip-packaging structure the most according to claim 1, it is characterised in that the area of described ink is not less than the area of described chip.
Chip-packaging structure the most according to claim 1, it is characterised in that the shape of the ink of described beneath chips is circular, oval, polygon, and the thickness of described ink is not less than 1 micron.
Chip-packaging structure the most according to claim 9, it is characterised in that described polygon is rectangle, trapezoidal, rhombus, triangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620044451.XU CN205488106U (en) | 2016-01-06 | 2016-01-06 | Keep away photoelectronic label 's chip package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620044451.XU CN205488106U (en) | 2016-01-06 | 2016-01-06 | Keep away photoelectronic label 's chip package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488106U true CN205488106U (en) | 2016-08-17 |
Family
ID=56669892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620044451.XU Active CN205488106U (en) | 2016-01-06 | 2016-01-06 | Keep away photoelectronic label 's chip package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488106U (en) |
-
2016
- 2016-01-06 CN CN201620044451.XU patent/CN205488106U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7365686B2 (en) | Radio frequency IC tag and method for manufacturing same | |
| US20060220871A1 (en) | RFID tag | |
| JP2011018319A (en) | Combination card and combination card communication device using the same | |
| CN106503778A (en) | Band IC tag paster and its installation method | |
| CN1773530A (en) | RFID tag | |
| CN203366350U (en) | Fingerprint reading sensor ic card | |
| CN106845614A (en) | A kind of RFID of the physics tamper based on polymer bump chip | |
| CN101572336B (en) | Small-size electronic tag antenna and manufacture method thereof | |
| CN202615431U (en) | RFID liquor anti-counterfeiting electronic tag | |
| US20130186960A1 (en) | Semiconductor storage device | |
| CN205488106U (en) | Keep away photoelectronic label 's chip package structure | |
| CN205594665U (en) | Keep away photoelectronic label 's chip package structure | |
| CN205486207U (en) | Keep away photoelectronic label 's chip package structure | |
| CN205486220U (en) | Keep away photoelectronic label 's chip package structure | |
| WO2012128204A1 (en) | Electrode member, antenna circuit and ic inlet | |
| JP2008186353A (en) | Antenna for ic tag | |
| CN205486219U (en) | Keep away photoelectronic label 's chip package structure | |
| JP5457741B2 (en) | RFID tag | |
| CN210166815U (en) | Electronic tag convenient to position | |
| CN101334854B (en) | Electronic label chip encapsulation method | |
| CN202495075U (en) | RFID electronic label for drug identification | |
| CN208271225U (en) | Low voltage mutual inductor and its radio electronic label | |
| CN103855461B (en) | Antenna | |
| CN105740939B (en) | A kind of RFID label tag being integrated in PCBA | |
| CN101800208A (en) | Semiconductor packaging structure and heat radiating fin thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190910 Address after: 610015 Sichuan China (Sichuan) Free Trade Pilot Zone Patentee after: Sichuan Huada Hengxin Technology Co., Ltd. Address before: 201203, Shanghai, Pudong New Area, Liang Xiu Road, No. 112, block Y1, Room 305, room three Patentee before: HUADA SEMICONDUCTOR CO., LTD. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Floor 17, unit 2, building 6, 171 hele 2nd Street, Chengdu hi tech Zone, Chengdu pilot Free Trade Zone, Sichuan 610212 Patentee after: Huada Hengxin Technology Co.,Ltd. Address before: 610015 China (Sichuan) pilot Free Trade Zone, Sichuan Province Patentee before: Sichuan Huada Hengxin Technology Co.,Ltd. |