CN101800208A - Semiconductor packaging structure and heat radiating fin thereof - Google Patents
Semiconductor packaging structure and heat radiating fin thereof Download PDFInfo
- Publication number
- CN101800208A CN101800208A CN 200910004093 CN200910004093A CN101800208A CN 101800208 A CN101800208 A CN 101800208A CN 200910004093 CN200910004093 CN 200910004093 CN 200910004093 A CN200910004093 A CN 200910004093A CN 101800208 A CN101800208 A CN 101800208A
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- China
- Prior art keywords
- convex part
- packaging structure
- strip convex
- semiconductor packaging
- chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention relates to a semiconductor packaging structure which comprises a chip, a lead frame, a heat radiating fin and sealing glue. The lead frame comprises a chip support which is used for supporting the chip. The heat radiating fin is attached on the chip support and comprises a body and a circular strip convex part. The body is provided with a surface, wherein the surface is in contact with the chip support. The circular strip convex part is arranged on the surface of the body and surrounds the chip support. The sealing glue is used for wrapping the part of the lead frame, the chip and the heat radiating fin.
Description
Technical field
The present invention more is particularly to a kind of semiconductor packaging structure relevant for a kind of semiconductor packaging structure, and the circular strip convex part of its fin is around the chip bearing.
Background technology
The pattern of integrated circuit encapsulation is a lot, for instance, the pattern that connects with pin includes thin little outer pin encapsulation (thin small outline package, TSOP), quad flat package (Quad Flat Package, encapsulation such as QFP), be to support encapsulating structure, be connected with circuit board by the pin on two sides or four limits by conductive metal frames.Ball lattice array (ball grid array, BGA) encapsulation is to be connected with circuit board via the tin ball, and therefore at different encapsulation patterns, its radiating mode also is not quite similar, at present industry installs heat abstractor such as fin in encapsulating structure, to improve radiating efficiency in response to mode.
With reference to figure 1, known semiconductor packaging structure 10 mainly comprises a lead frame 11, a chip 12, a fin 13 and an adhesive body 14.This chip 12 is fixed on the chip bearing 20 of this lead frame 11 via viscose 15, and is electrically connected to the pin 16 of this lead frame 11 via bonding wire (figure does not show).This fin 13 directly is attached at the lower surface 22 of this chip bearing 20, and is extremely extraneous in order to the heat conduction that this chip 12 is produced.Yet, often have space 24 between this chip bearing 20 and this fin 13 because of the contact surface out-of-flatness.Because space 24 narrow and small these adhesive bodies 14 that make can't be filled in space 24, therefore when this semiconductor packaging structure 10 carries out the test of reliability associated temperature, this space 24 can be caused interface delamination (Delamination) is taken place between this chip bearing 22 and this fin 13, as shown in Figure 2.
For instance, the packaging structure 10 of known quad flat package (QFP) is through moisture-sensitive degree grade 3 (260 ℃ Celsius) (moisture sensitivity level 3, MSL 3) test the time, bigger gap will appear between this fin 13 and this chip bearing 22.In the case, this gap 24 makes this lead frame 11 and fin 13 fail good bond, and then hinders the heat that this chip 12 produces and conduct to this fin 13, destroys the heat sinking function of the packaging structure 10 of quad flat package (QFP).What is more, excessive gap not only can make encapsulating structure can't reach the expection radiating effect, also may cause whole encapsulating structure to be damaged.
Therefore, just having to provide a kind of semiconductor packaging structure and fin thereof, can solve aforesaid shortcoming.
Summary of the invention
A purpose of the present invention is to provide a kind of semiconductor packaging structure, and the circular strip convex part of its fin can the space stretches out between this chip bearing and this fin via stoping around the chip bearing.
For reaching above-mentioned purpose, the invention provides a kind of semiconductor packaging structure, comprise a chip, a lead frame, a fin and an adhesive body.This lead frame comprises a chip bearing, and it carries this chip.This fin is attached on this chip bearing, and comprises a body and a circular strip convex part.This body has a surface, wherein should contact this chip bearing in the surface.This circular strip convex part is disposed on the surface of this body, and around this chip bearing.Part, chip and the fin of this adhesive body in order to coat this lead frame.
Though may have the space because of the contact surface out-of-flatness between this chip bearing and this fin, but the circular strip convex part of fin of the present invention can be via stoping this space to stretch out around this chip bearing, and then stop interface delamination (Delamination) takes place between this chip bearing and this fin.
In order to allow above and other objects of the present invention, feature and the advantage can be more obvious,, be described in detail below hereinafter with conjunction with figs..
Description of drawings
Fig. 1 is the generalized section of the semiconductor packaging structure of prior art, has space 24 between its display chip bearing 20 and this fin 13.
Fig. 2 is the generalized section of this semiconductor packaging structure of prior art, and it shows that this space 24 is caused between this chip bearing 22 and this fin 13 delamination sheet in interface takes place.
Fig. 3 a and 3b are the plane and the generalized section of the semiconductor packaging structure of one embodiment of the invention.
Fig. 4 a and 4b are the plane and the generalized section of the fin of one embodiment of the invention.
Fig. 5 is the generalized section of the fin of another embodiment of the present invention.
The primary clustering symbol description:
10 semiconductor packaging structures, 11 lead frames
12 chips, 13 fin
14 adhesive bodies, 15 viscoses
16 pins, 20 chip bearings
22 lower surfaces, 24 spaces
100 semiconductor packaging structures, 110 chips
112 viscoses
120 lead frames, 122 supporting ribs
124 chip bearings, 126 upper surfaces
128 pins, 130 lower surfaces
150 fin, 152 bodies
154 circular strip convex part, 154 ' circular strip convex part
156 upper surfaces
158 lower surfaces, 160 adhesive bodies
Embodiment
With reference to figure 3a and 3b, it shows the semiconductor packaging structure 100 of one embodiment of the invention.This semiconductor packaging structure 100 comprises a chip 110, a lead frame 120, a fin 150 and an adhesive body 160.This lead frame 120 comprises four supporting ribs 122 and a chip bearing 124, and this supporting rib 122 is connected in the corner of chip bearing 124, and this chip bearing 124 is in order to carry this chip 110.This chip 110 is fixed in the upper surface 126 of the chip bearing 124 of this lead frame 120 via viscose 112, and is electrically connected to the pin 128 of this lead frame 120 via bonding wire (figure does not show).This fin 150 is attached at the lower surface 130 of this chip bearing 124, and is extremely extraneous in order to the heat conduction that this chip 110 is produced.This fin 150 comprises a body 152 and a circular strip convex part 154.This body 152 has a upper surface 156 and a lower surface 158, and wherein the upper surface 156 of this body 152 contacts the lower surface 130 of these chip bearings 124, and the lower surface 158 of this body 152 is with respect to the upper surface 156 of this body 152.This circular strip convex part 154 is disposed at the upper surface 156 of this body 152, and around this chip bearing 124.Preferably, this circular strip convex part 154 is adjacent to this chip bearing 124.This adhesive body 160 is in order to coating this lead frame 120, chip 110 and fin 150, and exposes the part pin 128 of this lead frame 120 and the lower surface 158 of this fin 150.
Though may have the space because of the contact surface out-of-flatness between this chip bearing 124 and this fin 150, but the circular strip convex part 154 of fin 150 of the present invention can be via stoping this space to stretch out around this chip bearing 124, and then stop interface delamination (Delamination) takes place between this chip bearing 124 and this fin 150.
With reference to figure 4a and 4b, this circular strip convex part 154 is disposed at the upper surface 156 of this body 152.In the present embodiment, this circular strip convex part 154 can be a rectangular strip protuberance, such as the square or rectangular strip convex part.In another embodiment, this circular strip convex part 154 also can be circular strip convex part or oval strip convex part.The section of this circular strip convex part 154 can be rectangle.
With reference to figure 4b, in the present embodiment, this circular strip convex part 154 can be unlike material with this body 152 again, and this circular strip convex part 154 is fixed on this body 152 via viscose (figure does not show).It is made that this circular strip convex part 154 can be metal oxide, and this body 152 to can be metal made.Because the zygosity between metal oxide and the adhesive body 160 greater than the zygosity between this chip bearing 124 (metal is made) and the adhesive body 160, therefore can more effectively stop this space to stretch out.For example, this circular strip convex part 154 is that cupric oxide is made, and this body 152 is that the copper metal is made.Perhaps, this circular strip convex part 154 is that aluminium oxide is made, and this body 152 is that aluminum metal is made.With reference to figure 5, in another embodiment, this circular strip convex part 154 ' can be identical material with this body 152, and integrally formed manufactured.For example, this circular strip convex part 154 ' be all the copper metal with this body 152 or aluminum metal made.This circular strip convex part 154 ' can be via punching press or Forging Technology and is manufactured.
Though the present invention discloses with previous embodiment, so it is not in order to qualification the present invention, any persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (10)
1. semiconductor packaging structure comprises:
One chip;
One lead frame comprises a chip bearing, and it carries this chip;
One fin is attached on this chip bearing, and comprises:
One body has a surface, wherein should contact this chip bearing in the surface; And
One circular strip convex part is disposed on the surface of this body, and around this chip bearing; And
One adhesive body is in order to part, chip and the fin that coats this lead frame.
2. according to the described semiconductor packaging structure of claim 1, wherein this circular strip convex part is a rectangular strip protuberance.
3. according to the described semiconductor packaging structure of claim 2, wherein this rectangular strip protuberance is the square or rectangular strip convex part.
4. according to the described semiconductor packaging structure of claim 1, wherein this circular strip convex part is circular strip convex part or oval strip convex part.
5. according to the described semiconductor packaging structure of claim 1, wherein the section of this circular strip convex part is a rectangle.
6. according to the described semiconductor packaging structure of claim 1, wherein this circular strip convex part and this body are identical material, and integrally formed manufactured.
7. according to the described semiconductor packaging structure of claim 6, wherein this circular strip convex part and this body be all the copper metal or aluminum metal made.
8. according to the described semiconductor packaging structure of claim 1, wherein this circular strip convex part and this body are unlike material, and this circular strip convex part is fixed on this body.
9. according to the described semiconductor packaging structure of claim 8, wherein this circular strip convex part is that metal oxide is made, and this body is that metal is made.
10. according to the described semiconductor packaging structure of claim 1, wherein this circular strip convex part is adjacent to this chip bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910004093 CN101800208B (en) | 2009-02-11 | 2009-02-11 | Semiconductor packaging structure and heat radiating fin thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910004093 CN101800208B (en) | 2009-02-11 | 2009-02-11 | Semiconductor packaging structure and heat radiating fin thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101800208A true CN101800208A (en) | 2010-08-11 |
| CN101800208B CN101800208B (en) | 2012-02-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200910004093 Active CN101800208B (en) | 2009-02-11 | 2009-02-11 | Semiconductor packaging structure and heat radiating fin thereof |
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| CN (1) | CN101800208B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779804A (en) * | 2011-05-13 | 2012-11-14 | 晶致半导体股份有限公司 | Semiconductor packaging piece |
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
| US11232992B2 (en) | 2018-06-25 | 2022-01-25 | Actron Technology Corporation | Power device package structure |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1119832C (en) * | 1994-07-19 | 2003-08-27 | 模拟设备股份有限公司 | Enhanced heat dissipation lead frame |
| CN2596547Y (en) * | 2002-12-25 | 2003-12-31 | 立卫科技股份有限公司 | Semiconductor packaging structure with radiating fin |
| CN100433308C (en) * | 2005-04-28 | 2008-11-12 | 日月光半导体制造股份有限公司 | Radiating fin and its packing structure |
| JP4986435B2 (en) * | 2005-10-12 | 2012-07-25 | 株式会社ソニー・コンピュータエンタテインメント | Semiconductor device and method for producing semiconductor device |
| CN101226905A (en) * | 2008-02-15 | 2008-07-23 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation constitution with radiation fin and carrier thereof |
-
2009
- 2009-02-11 CN CN 200910004093 patent/CN101800208B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102779804A (en) * | 2011-05-13 | 2012-11-14 | 晶致半导体股份有限公司 | Semiconductor packaging piece |
| US11232992B2 (en) | 2018-06-25 | 2022-01-25 | Actron Technology Corporation | Power device package structure |
| CN109300865A (en) * | 2018-11-07 | 2019-02-01 | 华天科技（西安）有限公司 | A kind of encapsulating structure and manufacturing method of frame clsss product enhancing heat dissipation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101800208B (en) | 2012-02-29 |
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