CN205486174U - Fingerprint sensor module - Google Patents
Fingerprint sensor module Download PDFInfo
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- CN205486174U CN205486174U CN201620116023.3U CN201620116023U CN205486174U CN 205486174 U CN205486174 U CN 205486174U CN 201620116023 U CN201620116023 U CN 201620116023U CN 205486174 U CN205486174 U CN 205486174U
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- Prior art keywords
- fingerprint sensor
- sensor module
- fingerprint
- test section
- utility
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3833—Hand-held transceivers
Abstract
The utility model relates to a fingerprint sensor module who has good sensing sensitivity. According to the utility model discloses a fingerprint sensor module of embodiment includes fingerprint sensor and the support that is used for settling fingerprint sensor. Here, fingerprint sensor includes: the test section is on the base plate to a signal of telecommunication poor for receiving lie in the gu hefeng of the fingerprint of the finger of base plate upside, sensor circuit portion for detect the fingerprint image like handling. The support has: the overburden forms the upper surface into covering the test section, touch surface is formed at the upper surface of overburden. And, the last composite coating layer that is equipped with of touch surface, its upper surface with being acceptd the test section in the support is faced, and the thickness sum on overburden and composite coating layer is 40~60 mu m.
Description
The application is filing date on April 15th, 2014, Application No. 201490000817.2, entitled
The divisional application of the patent application of " fingerprint sensor module, possess this portable electric appts ".
Technical field
This utility model relates to a kind of fingerprint sensor module, the portable electric appts possessing this and system thereof
Make method, in particular to a kind of, there is the fingerprint sensor module of excellent sensing sensitivity, tool
Portable electric appts and manufacture method thereof for this.
Background technology
Recently as people's attention rate collection to the portable electric appts such as smart mobile phone or panel computer
In, the research and development for relevant technical field are carried out the most actively.
Portable electric appts is a kind of input equipment for receiving the specific order inputted by user,
It is built-in with in the majority with the situation of the touch screen of the indicator integral as display device (touch screen).
And, in addition to touch screen, portable electric appts is also equipped with various function key (function key)
Or soft key (soft key) etc. and as other input equipment.
These function keys or soft key can work as major key, for example, it is possible to perform to jump out to be currently running
In application program and forward the function of initial picture to, or last layer can be returned to as making user interface
Return (BACK) key or recall conventional menu Menu key use.Additionally, these function keys or
Soft key can realize by physical button.It addition, these function keys or soft key can be by detection conductors
The mode of electric capacity, or detect the mode of the electromagnetic wave of time writer or be provided simultaneously with answering of both modes
Conjunction mode realizes.
It addition, need the service of safeguard protection along with the purposes of smart mobile phone in recent years is rapidly spread to provide,
The trend installing fingerprint sensor in smart mobile phone also increases.Fingerprint sensor can integrally exist
Physical button realizes.
Fingerprint sensor is the sensor of the finger print for detecting people, and can pass through fingerprint sensing
Device carries out user's login or the step of certification and protects the data of storage in handheld electronic apparatus, it is possible to
Take precautions against security incident in advance.
It addition, in order to fingerprint sensor is installed on various electronic equipment, fingerprint sensor can be made
For comprising the form of the module of peripheral parts or structure, and in order to make the electricity of installation fingerprint sensor module
The color of subset and the solid colour of fingerprint sensor, or because other reason, need comprising
Color is embodied on the fingerprint sensor mother metal of fingerprint sensor.
In order to embody color on fingerprint sensor mother metal, prior art uses and utilizes colored paint
Coating process, ultraviolet (UV) firming agent deposition process etc..But, make utilizing existing method
In the case of fingerprint sensor mother metal embodies color, can exist and need the interlayer suitably ensureing film to constitute
And the limiting factor of thickness.Without forming sufficiently thick film, the most not only the embodiment of color can be difficult,
And the surface contamination being susceptible on fingerprint sensor, cut, impression equivalent damage.These damages can be right
The image of the fingerprint sensed by fingerprint sensor is negatively affected.
Further, to fingerprint sensor, particularly for capacitive way fingerprint sensor, along with fingerprint passes
Different coating thickness on sensor mother metal, its operability also can change.Especially, fingerprint sensing
The thickness of the film on device mother metal is the thickest, and the response characteristic of its fingerprint sensor can be the poorest, and institute is for body
Restriction can be there is in the film of existing color on its thickness.
Recently, in order to be installed on portable set and low cost and miniaturization manufacture fingerprint sensing
Device module, develops and utilizes COF (Chip-On-Film), BGA (Ball Grid Array) mode to set
The fingerprint sensor module of meter.In this fingerprint sensor module, fingerprint detection integrated circuit (IC) with
Sensing region is released state.
Above-mentioned fingerprint sensor module include fingerprint sensor and for fix fingerprint sensor support or
Substrate.It is therefore desirable to the efficiency of technique and productive fingerprint sensor and support can be improved
Combined process, simultaneously need to can be used in improving the PROCESS FOR TREATMENT for support of sensing sensitivity.
That is, it needs to a kind of fingerprint sensor module and comprise its portable electric appts and manufacture method thereof,
It does not affect electronics from the sensing region of fingerprint sensor to the thickness of the final lid contacted with the finger of user
The function (such as, fingerprint sensing sensitivity) of equipment, and the profile or reliability to electronic equipment will not
Formation problem.
Utility model content
Technical problem
In order to solve the problems referred to above, outside the purpose of this utility model is to provide one to prevent
Shape is bad or damaged, has again the fingerprint sensor module of outstanding sensing sensitivity, possesses this just
Take formula electronic equipment and manufacture method thereof.
Technical scheme
For the attainment of one's purpose, this utility model one embodiment provides a kind of fingerprint sensor module, comprising:
Fingerprint sensor, including: test section and sensor circuit portion；House parts, there is cover layer, described
Cover layer is formed as covering the upper surface of described test section；Composite film coating layer, is formed at described cover layer
Upper surface,
Described cover layer is formed by epoxy molding material.
In an embodiment of the present utility model, described epoxy resin film plastics can be liquid material.
In an embodiment of the present utility model, described cover layer can include strong dielectric.
In an embodiment of the present utility model, the thickness of described composite film coating layer can be 25～30 μm.
In an embodiment of the present utility model, described composite film coating layer can include prime coat, color paint
Layer and protecting film layer.
In an embodiment of the present utility model, described protecting film layer can be UV protecting film.
In an embodiment of the present utility model, described protecting film layer can be ceramic coating layer
In an embodiment of the present utility model, described fingerprint sensor can be COF type, COB type,
Any one in BGA type, WLP type.
In an embodiment of the present utility model, described test section and sensor circuit portion are detachably formed.
In an embodiment of the present utility model, described fingerprint sensor is test section and sensor circuit portion
It is integrated the domain type of type.
It addition, achieve the goal in position, this utility model one embodiment provides a kind of to be possessed above-mentioned fingerprint and passes
The portable electric appts of sensor module.
Technique effect
According to this utility model, it is provided that one can make fingerprint sensor firmly modularity, and
The improved fingerprint sensor module of its sensing sensitivity, include the portable of this fingerprint sensor module
Electronic equipment and manufacture method thereof.Especially, it is provided that one can stably support by COF or
The fingerprint sensor module of the fingerprint sensor that BGA mode designs, include this fingerprint sensor module
Portable electric appts and manufacture method thereof.
It addition, according to an embodiment of the present utility model, it is provided that one can manufacture fingerprint efficiently
The upper surface of sensor assembly, and profile, function and the reliability of electronic equipment will not be formed ask
Fingerprint sensor module, the portable electric appts including this fingerprint sensor module and the manufacturer thereof of topic
Method.
Additionally, according to an embodiment of the present utility model, can be by cover layer and composite film coating layer
Thickness sum control in 40～60 μm, such that it is able to the most effectively sense when fingerprint detection.
Effect of the present utility model is not limited to described effect, it is thus understood that it includes can be by this reality
The institute released by the composition of the utility model described in novel detailed description of the invention or claims
Effective.
Accompanying drawing explanation
Fig. 1 is the axonometric chart representing the fingerprint sensor module according to an embodiment of the present utility model.
Fig. 2 is the line A-A sectional illustrations figure along Fig. 1.
Fig. 3 is the manufacturing process representing the fingerprint sensor module according to an embodiment of the present utility model
Exemplary plot.
Fig. 4 is the manufacturing process representing the fingerprint sensor module according to an embodiment of the present utility model
Cross section exemplary plot.
Fig. 5 is roughly to represent in the fingerprint sensor module according to an embodiment of the present utility model to use
Sol-gel process prepares the schematic diagram of the process of ceramic coating.
Fig. 6 is the cross section example representing the fingerprint sensor module according to an embodiment of the present utility model
Figure.
Fig. 7 is the exemplary plot representing the fingerprint sensor according to an embodiment of the present utility model.
Fig. 8 is the figure roughly representing the fingerprint sensor structure according to an embodiment of the present utility model.
Fig. 9 is roughly to represent the fingerprint sensor module being provided to according to an embodiment of the present utility model
The exemplary plot of operation of fingerprint sensor.
Figure 10 is roughly to represent the fingerprint sensor being provided to according to another embodiment of the present utility model
The exemplary plot of the fingerprint sensor of module.
Figure 11 is roughly to represent the fingerprint sensor being provided to according to another embodiment of the present utility model
The exemplary plot of the fingerprint sensor of module.
Figure 12 is the axonometric chart representing the fingerprint sensor module according to another embodiment of the present utility model.
Figure 13 is that the cross section representing the fingerprint sensor module according to another embodiment of the present utility model shows
Illustration.
Figure 14 is the manufacture work illustrating the fingerprint sensor module according to another embodiment of the present utility model
The cross section exemplary plot of skill.
To the symbol description of major part in accompanying drawing
10,3010: fingerprint sensor module
200,100,2200: fingerprint sensor
220,1220,2220: sensor circuit portion
310,3310: support
312: groove
314,3314: touch surface
315,3315: cover layer
340: fixture
350: injected plastics material
360: metallic plate
400: strong dielectric body
500: composite film coating layer
502: prime coat
503: color paint layer
504: protecting film layer
3320: additional body
Preferred forms
Below with reference to accompanying drawing, this utility model is illustrated.But this utility model can be by multiple
Different shape realizes, and is therefore not limited to embodiment described herein.It addition, in order to enable in accompanying drawing
Enough clearly state this utility model and eliminate and illustrate incoherent part, and run through whole explanation
Book and similar part be addition of similar reference numeral.
In the specification, mentioning certain part when " being connected " with other parts, it not only includes " straight
Connect in succession " situation, also include middle " being indirectly connected with " situation getting involved other parts.Further, carry
To certain part " include " other elements when, in the case of there is no the most contrary record,
It does not discharge other elements, but means that it can also include other element.
Hereinafter, with reference to accompanying drawing, embodiment of the present utility model will be described in detail.
Fig. 1 is the axonometric chart representing the fingerprint sensor module according to an embodiment of the present utility model, and
And Fig. 2 is the generalized section of the line A-A along Fig. 1.
As shown in Figure 1 and Figure 2, fingerprint sensor module 10 includes: fingerprint sensor 200 support and
Composite film coating layer 500.
Fingerprint sensor module 10 can be provided to electronic equipment, it is particularly possible to is provided to portable electronic and sets
In Bei.Here, portable electric appts includes: mobile phone, smart mobile phone, PDA, panel computer, pen
Remember this computer, portable audio player (MP3 player) and there are all of similar form can
The electronic equipment carried.
Fingerprint sensor 200 can possess test section 210, utilize conductive body and on substrate 201 shape
Become；Sensor circuit portion 220, is electrically connected to test section 210.
Support 310 is the parts for housing and dispose fingerprint sensor 200, and it protects fingerprint sensor
200, and determine the global shape of fingerprint sensor module 10.Support 310 can be to utilize mould
(mold) the model product formed.Support 310 possesses cover layer 315, is used for covering fingerprint sensor 200
Top, specifically, cover test section 210, and the upper surface of this cover layer 315 is formed tactile
Touch face 314.That is, cover layer 315 can be provided to test section 210 upper surface between touch surface 314.
Touch surface 314 is the part of the touch realizing user, and it receives by user (precisely user
Finger) and the information transmitted.
Composite film coating layer 500 can be positioned to ground with test section 210 upper surface of fingerprint sensor 200
In the touch surface 314 of support 310.Here, the thickness D1 of cover layer 315 and composite film coating layer 500
Thickness D2's and can be 40～60 μm, and could be formed with the effective of effect accordingly when fingerprint detection
Detection.
Fig. 3 is the manufacturing process representing the fingerprint sensor module according to an embodiment of the present utility model
Exemplary plot, Fig. 4 is the manufacture work representing the fingerprint sensor module according to an embodiment of the present utility model
The cross section exemplary plot of skill.
As shown in Figure 3 and 4, support 310 can within it possess groove 312, and is formed recessed
The back side in the face of groove 312 forms corresponding with the shape of groove 312 and prominent touch surface 314.
Support 310 has the cover layer 315 between reeded bottom surface 313 and touch surface 314, and covers
The thickness D1 of layer 315 can be formed in 15～30 μ m.Here, the thickness D1 of cover layer 315
Mean the thickness measuring groove 312 vertically to touch surface 314.That is, cover layer 315 can be from
The upper surface of test section 210 is to the thickness between touch surface 314.If the thickness of cover layer 315 is excessively
Thin, then cannot stably house fingerprint sensor 200；On the contrary, if the thickness of cover layer 315 excessively
Thickness, then the sensing function of fingerprint sensor 200 may weaken.
Cover layer 315 could be included for improving the strong dielectric body 400 of dielectric constant.Specifically, as
Really dielectric constant is high, then can reduce the loss when fingerprint sensor of state of activation receives the signal of image,
And can the most freely build cover layer 315 and the thickness of composite film coating layer 500.
Being described in more detail strong dielectric body 400, strong dielectric body 400 is the dielectric substance of electric insulation
One, even if being not apply voltage itself to form the electric split pole phenomenon of positive pole and negative pole from outside
The general designation of material.Its representational material has Al2O3、BaTio3(BTO)、SrTio3(STO)、
(Ba,Sr)Tio3(BST) etc..
These strong dielectric bodies 400 can be included in whole in support 310 with the Hybrid such as powder or liquid
In individual support 310.Accordingly, can be by including that the EMC mould of strong dielectric 400 is to realize support 310.
EMC mould including strong dielectric 400 is possible not only to as the present embodiment be applicable to by flexible base board structure
The fingerprint sensor of COF (the Chip On Film) type become, in addition can be applicable to COB (Chip
On Board) fingerprint sensor of type and the fingerprint sensor of BGA (Ball Grid Array) type and
The fingerprint sensor of WLP (Wafer Level Package) type.
As it has been described above, strong dielectric 400 is preferably incorporated in cover layer 315, but can be for technique
Convenience and be included in whole support 310.
It addition, support 310 can be by epoxy molding material (EMC:Epoxy Molding
Compound), fluororesin and comprise 20～the nylon of 40% or polyamide (polyamide) material
In one constitute.Now, glass can improve the intensity of support, such that it is able to avoid external impact
Damage fingerprint sensor.But in the case of the ratio of glass is unduly high, occur bad during machining
Probability can increase, it is therefore preferable that glass add ratio should be 20～40%.It addition, fluororesin is permissible
It it is the Kynoar (PVDF) that dielectric constant is high.If dielectric constant is high, then it is possible not only to amplify sense
Survey signal and optimize fingerprint recognition, it is also possible to make the thickness in last handling process select to become freely.
Groove 312 contains test section 210 and the sensor circuit portion 220 of fingerprint sensor.This
Time, groove can be previously implanted into the epoxy resin 330 of scheduled volume as binding agent.
It addition, as shown in (b) of Fig. 3 and (b) of Fig. 4, can be at the margin location of groove 312
Put carrying flexible base board 201 on the end difference 316 of formation, such that it is able to make the biography of fingerprint sensor 200
Sensor circuit part 220 is arranged to upward.In the process, fingerprint sensor 200 can by means of with
Fixture (JIG) 340 that the profile of fingerprint sensor 200 is identical and dispose oppressedly.Because of fingerprint sensing
Device 200 is oppressed and is fixed on the support 310 being equipped with in advance, such that it is able to guarantee fingerprint sensor 200
The flatness of flexible material substrate 201.
After completing the arrangement of fingerprint sensor 200, can as shown in (c) of Fig. 4 fixture 340 from
Groove 312 is removed.
Then as shown in (c) to (d) of Fig. 3 and (d) of Fig. 4, after removing fixture 340, can
To be carried out groove 312 part of filling bracket 310 by injected plastics material 350.As shown in (b) of Fig. 3, recessed
Groove 312 contains test section 210 and sensor circuit portion 220, and except the part that houses with
There is also outward vacant space.If leaving described vacant space, then fingerprint sensor 200 may not have
Method is fixed and is moved in the space of described sky, therefore fills injection material in the space of described sky
Material 350.Injected plastics material 350 can be liquid polymer, and as an example, it is possible to use epoxy resin
Moulding compound (EMC:Epoxy Molding Compound), epoxy (epoxy) resin and putty (putty)
In any one.Epoxy molding material (EMC:Epoxy Molding Compound) ratio passes through
General injection and the PC series hard (hard) that formed, therefore can prevent tolerance in advance, thus
Flatness can be made to become more preferable.Moreover, it can also bring by also may be used after the technique of high temperature
To reduce the effect of the trace (chip mark) occurred in general injection moulding process.Injected plastics material 350 makes inspection
The bottom surface of groove 312 is close in survey portion 210, such that it is able to improve the reliability of fingerprint sensor 200.
It addition, injected plastics material can be the works with reservation shape.Described works can also be as
Aqueous polymer and being used for fixes fingerprint sensor 200 to improve detection reliability.Described works is permissible
It is designed as the size corresponding with the size of groove 312 and is pressed into, it is also possible to utilize special fixed cell
Fix.The example that injected plastics material is used as having the works of reservation shape will be described hereinafter.
The figure that (d) of Fig. 3 represents the support 310 of Fig. 3 (c) upside down.As above institute
Stating, the reverse side of groove 312 is protrudedly formed the touch surface 314 of the shape corresponding to groove 312.
And, as shown in (e) of Fig. 3 and (e) of Fig. 4, in the touch surface 314 of support 310
Can possess composite film coating layer 500.
Composite film coating layer 500 can play and embodies color on fingerprint sensor module 10 or strengthen fingerprint
The several functions such as the intensity of the upper surface side of sensor assembly 10.
Composite film coating layer 500 can include prime coat 502, color paint layer 503 and protecting film layer 504
And constitute, composite film coating layer 500 can be according to prime coat 502, color paint layer 503, protecting film layer
The order of 504 is formed.
Prime coat 502 is formed at and connects color paint layer 503 in touch surface 314, and color paint
Layer 503 can perform color and embody function.
The thickness of prime coat 502 can be formed as 2～3 μm, and the thickness of color paint layer 503 can be formed
It is 3～5 μm.
It addition, protecting film layer 504 can be UV protecting film or the ceramic coating layer comprising pottery.Separately
Outward, protecting film layer 504 can also include above-mentioned strong dielectric 400.Strong dielectric 400 can be with structure
Become and be simultaneously contained in cover layer 315 and protecting film layer 504；Or it is configured to be included in covering
Layer 315 or protecting film layer 504.The thickness of protecting film layer 504 can be formed as 20～22 μm.
The thickness D2 of composite film coating layer 500 can be formed as 25～30 μm.
Additionally, the thickness D2 of the thickness D1 of cover layer 315 and composite film coating layer 500 and can be
40～60 μm.
Fig. 5 is roughly to represent in the fingerprint sensor module according to an embodiment of the present utility model to use
Sol-gel process prepares the schematic diagram of the process of ceramic coating, and is included by Fig. 5 and says below
Bright.
For protecting film layer 504 is formed as ceramic coating layer, and prepare ceramic coating.Ceramic coating is such as
Can utilize and stir two or more solution and manufacture sol-gel (sol-gel) method of pottery and prepare.
That is, as described in (a) of Fig. 5, A liquid and B liquid are prepared.Then, by A liquid up and down
Shake the scheduled time (such as, 30 minutes) ((b) of Fig. 5).Afterwards, stir after A liquid being mixed with B liquid
Mix the scheduled time (such as, 5 hours) ((c) of Fig. 5).2 liquid type potteries are formed by above process
After porcelain coating, ((d) of Fig. 5) can be used after shaking up fully before coating (sputtering).Protection
Film layer 504 can be formed by the ceramic coating that prepared before sputtering on color paint layer 503.
Ceramic coating can manufacture as described above by sol-gel process, and utilizes this ceramic coating
And on color paint layer, form ceramic coating layer.
Pottery has higher dielectric constant, therefore can reduce fingerprint sensor and activate (active) shape
The loss of the signal of image is received under state.That is, ceramic coating layer plays the function of dielectric layer, so driving
Signal can more crypto set to the electric field line of fingerprint sensor 200 through the finger (not shown) of user
Ground is formed.That is, in the fingerprint sensor module 10 according to an embodiment of the present utility model, can subtract
Detect the loss amount of signal less.Further, ceramic anti-fingerprint (anti-fingerprint) and water proofing property etc.
Anti-fouling performance excellent.Therefore, it can obtain by reducing the fuzzy of the image that causes of surface contamination
Relatively sharp fingerprint image.And it is possible to by allocate in ceramic coating have brilliance thermostability,
Disguised, the inorganic pigment of rotproofness and embody multicolour.
The dielectric constant of pottery coating layer can be determined in advance according to the driving frequency of fingerprint sensor 200
Fixed, such as, dielectric constant can be more than 5.Specifically, the finger user touches fingerprint biography
Sensor module 10, or the finger of user is substantial access to fingerprint identification module 10 and can identify fingerprint
In the case of, the driving signal sent to the finger of user will be received test section 210 through user.
There is with the driving frequency of this test section 210 the ceramic coating layer of matched dielectric constant (i.e., utilizing
Protecting film layer 504) in the case of, signal can focus more on pottery coating layer, thus is received in image
Detection region.Accordingly, the loss of signal can reduce, such that it is able to improve the operability of fingerprint sensor 200
Energy.
In embodiment of the present utility model, by making the protecting film layer 504 of composite film coating layer 500 be formed
For ceramic coating layer, and be possible not only to bring coating thickness to reduce, wearability and thermostability is protected,
The effects such as the operability raising of fingerprint sensor, it is also possible to bring the loss of signal of fingerprint sensor to reduce,
Thus the effect that operability is improved.
Additionally, before in the touch surface 314 of support 310, composite film coating layer 500 is set, it is also possible to shape
Become thickness adjusted rate and the polishing (polishing) of flatness being used for improving the cover layer 315 of support 310
Process.Now, polishing process can carry out can carrying out the thickness sensed to fingerprint sensor 200,
To this end, can carry out to cover layer 315 thickness making support 310 forming 15～30 μm.Such as, if
The thickness of cover layer 315 is 100 μm, then cover layer 315 will carry out polishing and process to cover layer 315
Thickness become 15～30 μm till.
It addition, Fig. 6 is the cross section representing the fingerprint sensor module according to an embodiment of the present utility model
Exemplary plot, as shown in Figure 6, injected plastics material 350 can also be equipped with metallic plate 360 extraly.Metal
Plate 360 is provided on injected plastics material 350, and it seals and supports the part that injected plastics material 350 exposes, and
Support fingerprint sensor module 10, such that it is able to strengthen the intensity of fingerprint sensor module 10.Metallic plate
360 can be manufactured by stainless steel material.
It addition, Fig. 7 is the exemplary plot representing the fingerprint sensor according to an embodiment of the present utility model；
Fig. 8 is the composition of the structure roughly representing the fingerprint sensor according to an embodiment of the present utility model
Figure；Fig. 9 is roughly to represent the fingerprint sensor module being provided to according to an embodiment of the present utility model
The exemplary plot of operation of fingerprint sensor.
First, as it is shown in fig. 7, fingerprint sensor 200 can include the substrate 201 of flexible material, inspection
Survey portion 210, sensor circuit portion 220, external interface connecting portion 221.
Test section 210 includes the drive electrode formed by electric conductor and receives electrode, it is possible to be arranged at base
The inside of plate 201.Test section 210 can receive the paddy (valley) of the fingerprint of the finger being positioned on substrate 201
Difference with the signal of telecommunication of peak (ridge).
Substrate 201 is formed by the flexible printed circuit board (FPCB) of flexible material, and it protects described driving
Electrode and reception electrode, and also perform the effect of the substrate in sensor circuit portion 220.
Sensor circuit portion 220 is to be integrated with for detecting fingerprint image and processing the circuit of fingerprint image
Integrated circuit (IC), its be electrically connected to test section 210 drive electrode and receive electrode.Substrate
201 are made up of flexible printed circuit board (FPCB), and therefore sensor circuit portion 220 can be mounted on base
The lower surface of plate 201.
External interface connecting portion 221 is extended by the flexible printed circuit substrate (FPCB) of aforesaid substrate 201
And formed.External interface connecting portion 221 be internally formed wiring, and one of them end forms energy
Enough adapters 223 being connected with external interface.External interface connecting portion 221 such as can be with smart mobile phone
Connect Deng portable set.Fingerprint sensor according to an embodiment of the present utility model can be such as Fig. 7
" I " font that shown test section 210 and external interface connecting portion 221 are combined in same direction
Structure.
It addition, can be test section according to the fingerprint sensor of an embodiment of the present utility model and outside connects
Mouth connecting portion orthogonal " T " character form structure.I.e., as shown in Figure 8, fingerprint sensor 200 is permissible
Including being provided to the test section 210 of upper surface of substrate 201 and being provided to the biography of lower surface of substrate 201
Sensor circuit part 220.(b) of (a) of Fig. 8 and Fig. 8 represents upper surface and the base of substrate 201 respectively
The lower surface of plate 201, (c) of Fig. 8 is to represent test section 210 and sensor circuit portion for understandable
The pie graph of the electrical connection of 220.
Substrate can be flexible (flexible) substrate, such as, can be come by polyamide (polymide) film
Manufacture, but be not limited to this material.
Test section 210 can include that the multiple drive electrodes 211 being formed on substrate 201 and image connect
Receive electrode 212.Drive motor 211 and image-receptive motor 212 can be made up of electric conductor line.
Drive electrode 211 from sensor circuit portion 220 receive drive signal and to image-receptive electrode 212
Signal is sent in side.Image-receptive electrode 212 receives and from drive electrode 211 through user (for is Zhun Que
The finger of user) and the signal that transmits.
It is positioned at an end sections of image-receptive electrode 212 of the upper surface of substrate 201 along the longest
Distance extends and is formed.Multiple drive electrodes 211 are mutually isolated and extend parallel to and formed to be perpendicular to
The bearing of trend (with reference to (a) of Fig. 8) of this image-receptive electrode 212.Image-receptive electrode 212 is at base
The lower surface of plate 201 is electrically connected to sensor circuit portion 220.
The one end part of multiple drive electrodes 211 is in have left predetermined distance from image-receptive electrode 212
Position.Further, the other end of multiple drive electrodes 211 is electrically connected to pass at the lower surface of substrate 201
Sensor circuit part 220.
As it is shown in figure 9, drive electrode 211 and image-receptive electrode 212 are separated from each other, and from driving
The driving signal that electrode 211 sends is received by image-receptive electrode 212 through user U.Now, may be used
Will examine as signal according to being positioned at electric field change with presence or absence of the fingerprint valley of user's U finger or fingerprint peaks
Survey such that it is able to realize the identification of fingerprint.
Referring again to (b) and (c) of Fig. 8, sensor circuit portion 220 can have and outside formation electricity
The external interface connecting portion 221 connected.
Fingerprint sensor 200 can pass through COF (Chip-On-Film) or BGA (Ball Grid Array)
Mode realizes.Especially, the upper surface at substrate 201 only forms test section 210, i.e. drive electrode 211
With image-receptive electrode 212, and form, at the lower surface of substrate 201, the biography that is connected with test section 210
Sensor circuit part 220, is consequently formed divergence type structure, and sensor circuit portion 220 can be made accordingly integrated
The size of circuit (IC) is formed smaller.Accordingly, space limit when test section 210 is set can be released
System, and the outward appearance of its entirety can be formed compactly.
Additionally, by not in the upper surface formation sensor circuit portion of substrate 201 such that it is able to it is easier to
Ground arranges glass in the module of fingerprint sensor, and it plays in the portable electric appts such as smart mobile phone
Useful especially effect.
Detailed description of the invention
It addition, Figure 10 is roughly to represent the fingerprint sensor mould according to another embodiment of the present utility model
The exemplary plot of the fingerprint sensor that block possesses, as shown in Figure 10, the sensor electricity of fingerprint sensor 1200
Road portion 1220 can be arranged at the position having relatively large distance away from test section 1210.That is, above-mentioned sensing
Device circuit part 220 (with reference to Fig. 7 and Fig. 8) is positioned at the inner side of support 310 (with reference to Fig. 1), with this phase
Instead, the sensor circuit portion 1220 that Figure 10 represents can be arranged at the outside of described support.Accordingly, may be used
To prevent support and the combined process of fingerprint sensor 1200 and the technique of fixing fingerprint sensor 1200
In issuable impact and heat be applied directly to circuit part 1220.Additionally, sensor circuit portion
1220 any parts that can be arranged at substrate 1201, it is possible to the portable electronic according to assembling sets
Standby architectural characteristic and flexibly arrange and apply.
This fingerprint sensor is possible not only to be formed as described above into sensor circuit portion and test section discretely
The divergence type arranged, it is also possible to be formed as sensor circuit portion and test section shape all-in-one-piece is one-piece type.
Figure 11 is roughly to represent the fingerprint sensor being provided to according to another embodiment of the present utility model
The exemplary plot of the fingerprint sensor of module.As shown in figure 11, fingerprint sensor 2200 can form ball bar
Array (BGA:Ball Grid Array) type.
That is, substrate 2201 forms port 2250 with the arrangement of two-dimensional array shape, and at sensor
The soldered ball 2221 that the lower surface of circuit part 2220 is formed is configured to be connected with terminal 2250.Terminal
2250 and soldered ball 2221 can by welding and connect.
In order to be formed with sensor circuit portion 2220, substrate 2201 can be electrically connected so that the signal of telecommunication is passed
Passing, it can be such as tellite (PCB:Printed Circuit Board).Although it is not shown,
Lead frame can pass through resin moulded or surface mounting technology (SMT:Surface Mounting
Technology) bottom of substrate 2201 it is attached at.
Based on divergence type, fingerprint sensor is illustrated above, however in sensor circuit portion and
In the case of test section is integrated type, image-receptive portion be the situation of multiple region (AREA) types also
It is included in category of the present utility model.
Figure 12 is the axonometric chart representing the fingerprint sensor module according to another embodiment of the present utility model,
Figure 13 is the cross section exemplary plot representing the fingerprint sensor module according to another embodiment of the present utility model,
Figure 14 is the manufacturing process illustrating the fingerprint sensor module according to another embodiment of the present utility model
Cross section exemplary plot.In the present embodiment, fingerprint sensor can be fixed by additional body, and other are constituted
Identical with an embodiment, therefore will omit the description.
Such as Figure 12 to Figure 14, the sensor circuit portion 220 of 3310 fingerprint sensors 200 of support houses
To being formed at the first groove 3311 of inner side, and at the ladder at the edge being formed at the first groove 3311
Carry flexible base board 201 on 3319, thus dispose fingerprint sensor 200 and make its test section 210 upward.
Now, fingerprint sensor 200 and support 3310 mutually can be glued by epoxy resin or bonding bringing
Connect, and external interface connecting portion 221 can expose to the outside of support 3310 and arrange with extending.
Additionally, support 3310 may be constructed for supporting support 3310 and including making interface even
Connect the flange 3312 of the through breakthrough part in portion 221 3318.Flange 3312 can be formed with support 3310
One-piece type or divergence type.Now, flange 3312 can also be formed can make external decorating member (not
Diagram) engagement groove (not shown) that combines.Now, breakthrough part 3318 can be formed at and support 3310
Flange 3312 part that abuts against of bottom surface frame.
It addition, the profile of flange 3312 more broadly can be constituted than the frame of support 3310, accordingly, method
Blue 3312 play position fixation, such that it is able to make follow-up technique become the easiest.
Afterwards, support 3310 may be constructed additional body 3320, it is at breakthrough part 3318
Constitute and under the state having external interface connecting portion 221, cover support 3310.
Additional body 3320 can be designed as fixing external interface connecting portion 221, and easily fingerprint
Sensor assembly is attached at mobile device.It addition, additional body 3320 can also in technique with support
3310 are integrally constituted type.
The covering of test section 210 for covering fingerprint sensor 200 can be formed in additional body 3320
Layer 3315.
And, after constituting additional body 3320, the touch surface 3314 for additional body 3320 also may be used
To include individually polishing processing procedure.Now, polishing process can be carried out to fingerprint sensor 200 energy
Till the enough thickness (15～30 μm) performing detection.
Then, after completing to polish processing procedure, touch surface 3314 can form composite film coating layer 500.
Its composite film coating layer 500 can be formed as the thickness of 25～30 μm.
Support 3310, flange 3312 and additional body 3320 can by epoxy molding material (EMC:
Epoxy Molding Compound), fluororesin and comprise 20～the nylon of 40% or polyamide
(polyamide) one in material is constituted.
Additionally, the cover layer 3315 of additional body 3320 can comprise strong dielectric 400, Er Qieqiang
Electrolyte 400 is further included in whole additional body 3320.
It addition, additional body 3320 can be combined with support 3310 by physical method, it is also possible to by
Embed the injection moulding process such as injection (insert molding) to combine.
The fingerprint sensor mould that support 3310 and fingerprint sensor 200 and additional body 3320 combine
Block can process multiple on substrate, can be separated into individual other by sawing (sawing) process
Module.
The above-mentioned explanation carrying out this utility model is the most exemplary, and described in the utility model
The people in technical field with general knowledge all can not change technological thought of the present utility model or necessity
Other concrete forms it are readily converted in the case of feature.It is understood, therefore, that enforcement described above
Example is upper for exemplary in all respects, and is not restrictive.Such as, unitary type in explanation
Each element can be disperseed and implement, and equally, the scattered element in explanation can be by combining
Form implement.
Scope of the present utility model defines according to the scope of claims, and be appreciated that from right want
All changes of concept derivation or the form of deformation of asking the meaning in book and scope and its equivalent all should belong to
In this utility model.
Claims (10)
1. a fingerprint sensor module, it is characterised in that including:
Fingerprint sensor, including: test section and sensor circuit portion；
Housing parts, have cover layer, described cover layer is formed as covering the upper surface of described test section；
Composite film coating layer, is formed at the upper surface of described cover layer,
Described cover layer is formed by epoxy molding material.
2. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described epoxy resin film plastics are liquid materials.
3. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described cover layer includes strong dielectric.
4. fingerprint sensor module as claimed in claim 1, it is characterised in that
The thickness of described composite film coating layer is 25～30 μm.
5. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described composite film coating layer includes prime coat, color paint layer and protecting film layer.
6. fingerprint sensor module as claimed in claim 5, it is characterised in that
Described protecting film layer is UV protecting film.
7. fingerprint sensor module as claimed in claim 5, it is characterised in that
Described protecting film layer is ceramic coating layer.
8. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described fingerprint sensor is any one in COF type, COB type, BGA type, WLP type.
9. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described test section and the liftoff formation of sensor circuit part.
10. fingerprint sensor module as claimed in claim 1, it is characterised in that
Described fingerprint sensor is the domain type that test section and sensor circuit portion are integrated type.
Applications Claiming Priority (21)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130041312 | 2013-04-15 | ||
| KR10-2013-0041312 | 2013-04-15 | ||
| KR10-2013-0046374 | 2013-04-25 | ||
| KR20130046374 | 2013-04-25 | ||
| KR10-2013-0049684 | 2013-05-03 | ||
| KR20130049684 | 2013-05-03 | ||
| KR20130055781 | 2013-05-16 | ||
| KR10-2013-0055781 | 2013-05-16 | ||
| KR10-2013-0071913 | 2013-06-21 | ||
| KR20130071913 | 2013-06-21 | ||
| KR10-2013-0096079 | 2013-08-13 | ||
| KR20130096079 | 2013-08-13 | ||
| KR10-2013-0101823 | 2013-08-27 | ||
| KR20130101823 | 2013-08-27 | ||
| KR10-2013-0102512 | 2013-08-28 | ||
| KR20130102512 | 2013-08-28 | ||
| KR10-2013-0124557 | 2013-10-18 | ||
| KR20130124557 | 2013-10-18 | ||
| KR20130127770 | 2013-10-25 | ||
| KR10-2013-0127770 | 2013-10-25 | ||
| CN201490000817.2U CN205427870U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module, possesses this portable electronic equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201490000817.2U Division CN205427870U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module, possesses this portable electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205486174U true CN205486174U (en) | 2016-08-17 |
Family
ID=51731579
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620117504.6U Expired - Fee Related CN205375506U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116050.0U Expired - Fee Related CN205540792U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116088.8U Expired - Fee Related CN205540793U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116120.2U Expired - Fee Related CN205540794U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116119.XU Expired - Fee Related CN205375505U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201490000819.1U Expired - Fee Related CN205375499U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module and possess this portable electronic equipment |
| CN201490000817.2U Expired - Lifetime CN205427870U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module, possesses this portable electronic equipment |
| CN201620115713.7U Expired - Fee Related CN205486173U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620115900.5U Expired - Fee Related CN205540791U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116023.3U Expired - Fee Related CN205486174U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
Family Applications Before (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620117504.6U Expired - Fee Related CN205375506U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116050.0U Expired - Fee Related CN205540792U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116088.8U Expired - Fee Related CN205540793U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116120.2U Expired - Fee Related CN205540794U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620116119.XU Expired - Fee Related CN205375505U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201490000819.1U Expired - Fee Related CN205375499U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module and possess this portable electronic equipment |
| CN201490000817.2U Expired - Lifetime CN205427870U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module, possesses this portable electronic equipment |
| CN201620115713.7U Expired - Fee Related CN205486173U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
| CN201620115900.5U Expired - Fee Related CN205540791U (en) | 2013-04-15 | 2014-04-15 | Fingerprint sensor module |
Country Status (3)
| Country | Link |
|---|---|
| KR (2) | KR20140123919A (en) |
| CN (10) | CN205375506U (en) |
| WO (2) | WO2014171703A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9576177B2 (en) * | 2014-12-11 | 2017-02-21 | Fingerprint Cards Ab | Fingerprint sensing device |
| CN105740754B (en) * | 2014-12-12 | 2019-03-29 | 联想(北京)有限公司 | A kind of fingerprint collecting mould group, production method and electronic equipment |
| KR101675465B1 (en) * | 2015-01-02 | 2016-11-15 | 주식회사 바이오메트릭스 | Biometrics sensor module including film cover and packaging method of biometrics sensor |
| KR101707818B1 (en) | 2015-04-23 | 2017-02-20 | 주식회사 씨아이씨티 | Exterior forming method of mold product and exterrior forming structure of mold product |
| KR101678465B1 (en) * | 2015-10-20 | 2016-11-23 | (주)티이에스 | method for manufacturing touch sensor module and the touch sensor module thereby |
| CN105740852B (en) * | 2016-03-28 | 2022-04-05 | 江西欧迈斯微电子有限公司 | Fingerprint identification module and electronic device |
| KR20170122972A (en) * | 2016-04-28 | 2017-11-07 | 엘지이노텍 주식회사 | Fingerprint sensing apparatus and electric device including the apparatus |
| WO2018038569A1 (en) * | 2016-08-26 | 2018-03-01 | 주식회사 아모센스 | Cover for fingerprint sensor, and portable electronic device comprising same |
| CN106503685A (en) * | 2016-10-31 | 2017-03-15 | 北京小米移动软件有限公司 | Protection film layer, display base plate and electronic equipment |
| KR101833993B1 (en) * | 2016-11-23 | 2018-03-06 | (주) 개마텍 | Method of manufacturing transparent hardness layer and method of manufacturing fingerprint assembly using the same |
| WO2019071603A1 (en) | 2017-10-13 | 2019-04-18 | 华为技术有限公司 | Structure of electronic device and electronic device |
| WO2019103172A1 (en) * | 2017-11-21 | 2019-05-31 | (주)개마텍 | Fingerprint sensor assembly, fingerprint sensor module using same, and method for manufacturing same |
| CN108559938B (en) * | 2017-12-29 | 2020-04-10 | Oppo广东移动通信有限公司 | Sheet material, preparation method thereof, shell and mobile terminal |
| CN110799988B (en) * | 2019-04-30 | 2023-09-12 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN111144339B (en) * | 2019-12-30 | 2023-03-24 | 业泓科技(成都)有限公司 | Fingerprint identification module and electronic device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7542945B2 (en) * | 2003-01-15 | 2009-06-02 | Sanmina-Sci Corporation | Authentication device, system and methods |
| DE102004009287A1 (en) * | 2004-02-26 | 2005-09-15 | Institut Für Neue Materialien Gem. Gmbh | Amphiphilic nanoparticles |
| US9274553B2 (en) * | 2009-10-30 | 2016-03-01 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
| US8791792B2 (en) * | 2010-01-15 | 2014-07-29 | Idex Asa | Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making |
| US8378508B2 (en) * | 2010-03-05 | 2013-02-19 | Authentec, Inc. | Integrally molded die and bezel structure for fingerprint sensors and the like |
-
2014
- 2014-04-15 CN CN201620117504.6U patent/CN205375506U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201620116050.0U patent/CN205540792U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201620116088.8U patent/CN205540793U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201620116120.2U patent/CN205540794U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201620116119.XU patent/CN205375505U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201490000819.1U patent/CN205375499U/en not_active Expired - Fee Related
- 2014-04-15 CN CN201490000817.2U patent/CN205427870U/en not_active Expired - Lifetime
- 2014-04-15 WO PCT/KR2014/003244 patent/WO2014171703A1/en active Application Filing
- 2014-04-15 CN CN201620115713.7U patent/CN205486173U/en not_active Expired - Fee Related
- 2014-04-15 WO PCT/KR2014/003243 patent/WO2014171702A1/en active Application Filing
- 2014-04-15 KR KR20140045047A patent/KR20140123919A/en not_active Application Discontinuation
- 2014-04-15 CN CN201620115900.5U patent/CN205540791U/en not_active Expired - Fee Related
- 2014-04-15 KR KR1020140045050A patent/KR20140123920A/en not_active Application Discontinuation
- 2014-04-15 CN CN201620116023.3U patent/CN205486174U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN205375499U (en) | 2016-07-06 |
| CN205375506U (en) | 2016-07-06 |
| CN205540794U (en) | 2016-08-31 |
| CN205427870U (en) | 2016-08-03 |
| WO2014171703A1 (en) | 2014-10-23 |
| CN205486173U (en) | 2016-08-17 |
| CN205540793U (en) | 2016-08-31 |
| CN205540791U (en) | 2016-08-31 |
| CN205540792U (en) | 2016-08-31 |
| KR20140123920A (en) | 2014-10-23 |
| WO2014171702A1 (en) | 2014-10-23 |
| CN205375505U (en) | 2016-07-06 |
| KR20140123919A (en) | 2014-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171229 Address after: Gyeonggi Do city of South Korea Patentee after: CRUCIALTEC CO.,LTD. Address before: Seoul, South Korea Patentee before: IP CITY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 |