KR20140131265A - Fingerprint sensor module, portable electronic device having the same, and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a fingerprint sensor module having excellent sensitivity, a portable electronic device having the same, and a manufacturing method thereof. The fingerprint sensor module according to an embodiment of the present invention comprises a fingerprint sensor, a first bracket, and a second bracket. Here, the fingerprint sensor includes a sensing unit formed on a substrate by using a conductor and a sensor circuit unit electrically connected to the sensing unit. The first bracket accommodates the sensing unit and allows the fingerprint sensor to be installed therein. The second bracket forms a support layer on an upper surface of the sensing unit and fixedly covers the fingerprint sensor and the first bracket. A gate through which a mold material is introduced is formed in the first bracket, and the second bracket is formed by curing the mold material introduced to the gate.

Description

TECHNICAL FIELD [0001] The present invention relates to a fingerprint sensor module, a portable electronic device having the fingerprint sensor module, and a method of manufacturing the fingerprint sensor module.

The present invention relates to a fingerprint sensor module, a portable electronic device having the fingerprint sensor module, and a method of manufacturing the same. More particularly, the present invention relates to a fingerprint sensor module having excellent sensing sensitivity, a portable electronic device having the fingerprint sensor module and a method of manufacturing the same.

BACKGROUND ART [0002] Recently, with the public's attention focused on portable electronic devices including smartphones and tablet PCs, research and development on related technical fields are being actively conducted.

In many cases, a portable electronic device incorporates a touch screen integrated with a display as a display device as one of input devices for receiving a specific command from a user. The portable electronic device may also include various function keys or soft keys as an input device other than a touch screen.

These function keys or soft keys may act as home keys, for example, to exit a running app and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu. In addition, these function keys or soft keys can be implemented as physical buttons. Such a function key or a soft key may be realized by a method of sensing the capacitance of a conductor, a method of sensing an electromagnetic wave of an electromagnetic pen, or a hybrid method in which both of these methods are implemented.

Meanwhile, as the use of smartphones has rapidly expanded to services requiring security, there is an increasing tendency to install fingerprint sensors on smart phones. The fingerprint sensor may be integrated into a physical function key.

The fingerprint sensor is a sensor for detecting the fingerprint of a human being. By performing a user registration or authentication procedure through a fingerprint sensor, data stored in the portable electronic device can be protected and a security accident can be prevented in advance.

Meanwhile, in order to mount a fingerprint sensor on various electronic devices, a fingerprint sensor is manufactured in the form of a module including peripheral parts and structures. In order to match the color of the fingerprint sensor with the color of the electronic device on which the fingerprint sensor module is mounted , Or for other reasons, it is necessary to implement colors on the base material of the fingerprint sensor including the fingerprint sensor.

In order to implement color on the base material of the fingerprint sensor, conventionally, methods such as coating using a color paint and ultraviolet (UV) curing agent deposition have been used. However, when hue is implemented on the base material of the fingerprint sensor by the conventional method, there arises a restriction that the interlayer structure and the thickness of the coating film must be properly ensured. If the coating film is not formed to a sufficient thickness, it is not only difficult to implement colors, but also increases the possibility of surface contamination, scratches, scratches, and the like on the fingerprint sensor. These damages adversely affect the image of the fingerprint sensed by the fingerprint sensor.

In addition, in the case of a fingerprint sensor, in particular, an electrostatic-type fingerprint sensor, a change occurs in the operation of the fingerprint sensor depending on the thickness of the film on the base material of the fingerprint sensor. In particular, as the thickness of the coating on the base material of the fingerprint sensor increases, the sensing response characteristic of the fingerprint sensor deteriorates, so that the thickness of the coating film that implements the color is limited.

Recently, a fingerprint sensor module designed by a COF (Chip-On-Film) and a BGA (Ball Grid Array) method has been developed in order to manufacture a fingerprint sensor module in a portable device at low cost. In this fingerprint sensor module, the fingerprint detection IC is separated from the sensing area.

The fingerprint sensor module includes a fingerprint sensor and a bracket or a substrate on which the fingerprint sensor is fixed. Therefore, a process of combining a fingerprint sensor and a bracket that can increase process efficiency and productivity is required, and a processing process for the bracket is also required to increase the sensing sensitivity.

That is, while the thickness from the sensing area of the fingerprint sensor to the final cover contacting the user's finger is such that the thickness does not affect the function (e.g., fingerprint sensing sensitivity) of the electronic device, There is a need for a fingerprint sensor module having no fingerprint sensor module, a portable electronic device including the fingerprint sensor module, and a manufacturing method thereof.

In order to solve the above problems, the present invention provides a fingerprint sensor module having excellent sensing sensitivity while preventing external defects or breakage, a portable electronic device having the same, and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a fingerprint sensor comprising: a fingerprint sensor having a sensing unit formed using a conductor on a substrate and a sensor circuit unit electrically connected to the sensing unit; A first bracket receiving the sensing unit and seating the fingerprint sensor; And a second bracket fixing and covering the fingerprint sensor and the first bracket, wherein a gate through which the molding material flows is formed in the first bracket, And the second bracket is formed by hardening the molding material introduced into the gate.

In one embodiment of the present invention, the gate may be formed on one side of the bottom surface of the groove formed in the first bracket and receiving the sensing unit.

In one embodiment of the present invention, an air vent through which air is discharged may be formed on the other side of the bottom surface of the groove.

In one embodiment of the present invention, when the fingerprint sensor is seated in the groove, a flat projection that maintains flatness may be formed.

In one embodiment of the present invention, the molding material may include an epoxy molding compound, a fluorine resin, a nylon or polyamide material containing 20 to 40% of glass, an epoxy resin, and a putty putty. < / RTI >

In one embodiment of the present invention, the molding material may further include wax.

According to another aspect of the present invention, there is provided a portable electronic device including the fingerprint sensor module.

According to another aspect of the present invention, there is provided a fingerprint sensor comprising: a fingerprint sensor supported by a first bracket to receive a sensing unit; b) disposing a molding frame on the outer periphery of the first bracket; c) inserting a molding material into the gate formed in the first bracket to fill the inside of the molding frame; d) curing the inserted molding material to form a second bracket fixing and covering the fingerprint sensor and the first bracket; And e) removing the molding frame. BRIEF DESCRIPTION OF THE DRAWINGS

In one embodiment of the present invention, in the step (a) of supporting the fingerprint sensor with the first bracket, the fingerprint sensor may be positioned on the flat projection of the groove formed in the first bracket.

In one embodiment of the present invention, the molding material may include an epoxy molding compound, a fluorine resin, a nylon or polyamide material containing 20 to 40% of glass, an epoxy resin, and a putty putty. < / RTI >

In one embodiment of the present invention, the molding material may further include wax.

According to an embodiment of the present invention, there can be provided a fingerprint sensor module, a portable electronic device including the fingerprint sensor module and a method of manufacturing the same, wherein the fingerprint sensor is firmly modularized and the sensing sensitivity is improved.

In particular, it is possible to provide a fingerprint sensor module capable of stably supporting a fingerprint sensor designed in a COF or BGA system, a portable electronic device including the fingerprint sensor module, and a method of manufacturing the same.

According to an embodiment of the present invention, there is provided a fingerprint sensor module, a portable electronic device including the fingerprint sensor module, and a method of manufacturing the same, wherein the top surface of the fingerprint sensor module is efficiently manufactured while the external appearance, function, and reliability of the electronic device are not problematic can do.

According to an embodiment of the present invention, a gate is formed in the groove of the first bracket, and a molding material is injected into the gate and cured to form the second bracket. At this time, since the air vent is formed in the groove, the air can be discharged at the time of injecting the molding material, so that the defective rate that may occur due to air being contained in the second bracket can be reduced.

According to an embodiment of the present invention, since the flat protrusion is formed in the groove and the fingerprint sensor is positioned on the flat projections, the molding material flowing into the gate can be well introduced into the lower side of the fingerprint sensor. Accordingly, the second bracket formed by hardening the molding material may be formed to entirely surround the fingerprint sensor.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a perspective view illustrating a fingerprint sensor module according to an embodiment of the present invention.
2 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention.
3 is a block diagram schematically showing the structure of a fingerprint sensor according to an embodiment of the present invention.
4 is a schematic view illustrating an operation of a fingerprint sensor provided in the fingerprint sensor module according to an embodiment of the present invention.
5 is a schematic view illustrating a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.
6 is a schematic view illustrating a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.
7 is a view illustrating an example of a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.
8 is a cross-sectional view illustrating a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.
9 and 10 are cross-sectional views illustrating a fingerprint sensor module according to an embodiment of the present invention.
11 is a schematic view showing a process of preparing a ceramic paint by a sol-gel method in a fingerprint sensor module according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a fingerprint sensor module according to an embodiment of the present invention.

As shown in FIG. 1, the fingerprint sensor module 10 may include a fingerprint sensor 200, a first bracket 310, and a second bracket 320. Here, the sensing unit of the fingerprint sensor 200, which will be described later, is installed inside the fingerprint sensor module 10 and is not shown outside.

The fingerprint sensor module 10 may be provided in an electronic device, particularly a portable electronic device. Here, the portable electronic device includes a portable phone, a smart phone, a PDA, a tablet PC, a notebook computer, a portable sound recorder (MP3 player), and the like.

The first bracket 310 is a member for receiving and seating the fingerprint sensor 200, and may be a mold member formed by a mold.

The second bracket 320 is provided on the upper portion of the first bracket 310 to cover the first fingerprint sensor 200 and the first bracket 310 so that the molding material 30 (see FIG. 9) . The contact surface 321 of the second bracket 320 is a portion where the user touches, and receives a signal transmitted through the user (more precisely, the user's finger).

The first bracket 310 may be formed of any one of nylon and polyamide materials including an epoxy molding compound (EMC), a fluororesin, and 20 to 40% of glass. At this time, the glass can protect the fingerprint sensor from external impact by increasing the strength of the bracket. However, when the ratio of glass is too high, the probability of occurrence of defects in machining becomes high, so it is preferable to add glass in a proportion of 20 to 40%. Further, the fluororesin may be polyfluorinated vinylidene (PVDF) having a high dielectric constant.

FIG. 2 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention, FIG. 3 is a schematic view illustrating the structure of a fingerprint sensor according to an embodiment of the present invention, FIG. FIG. 1 is a schematic view illustrating an operation of a fingerprint sensor provided in a fingerprint sensor module according to an embodiment of the present invention;

2, the fingerprint sensor 200 may include a flexible substrate 201, a sensing unit 210, a sensor circuit unit 220, and an external interface connection unit 221.

The sensing unit 210 may include a driving electrode and a receiving electrode formed of a conductive material and may be installed inside the substrate 201. The sensing unit 210 may receive a difference between electric signals of a valley and a ridge of a fingerprint of a finger placed on the substrate 201. [

The substrate 201 is made of a flexible printed circuit board (FPCB) of a flexible material, and functions as a substrate of the sensor circuit unit 220 while protecting the driving and receiving electrodes.

The sensor circuit unit 220 is an integrated circuit (IC) integrated with an electronic circuit for sensing a fingerprint image and processing a fingerprint image, and is electrically connected to a driving electrode and a receiving electrode of the sensing unit 210. Since the substrate 201 is formed of a flexible printed circuit board (FPCB), the sensor circuit portion 220 can be mounted on the lower surface of the substrate 201. [

The external interface connecting portion 221 is formed by extending the flexible printed circuit board (FPCB) of the substrate 201 described above. A wiring is formed inside the external interface connecting portion 221, and a connector 223 is formed at one end thereof so as to be connectable to an external interface.

3, the fingerprint sensor 200 may include a sensing unit 210 provided on a top surface of a substrate 201 and a sensor circuit unit 220 provided on a bottom surface of the substrate 201. [ 3 (a) shows the upper surface of the substrate 201, and FIG. 3 (b) shows the lower surface of the substrate 201. FIG. 3 (c) 220 of the first embodiment of the present invention.

The substrate 201 may be a flexible substrate, and may be formed of, for example, a polymide film, but is not limited thereto.

The sensing unit 210 includes a plurality of driving electrodes 211 and an image receiving electrode 212 formed on a substrate 201. The driving electrode 211 and the image receiving electrode 212 may be formed of conductor lines.

The driving electrode 211 receives the driving signal from the sensor circuit unit 220 and transmits a signal to the image receiving electrode 212 side. The image receiving electrode 212 receives a signal transmitted from the driving electrode 211 via the user (more precisely, the user's finger).

One end of the image receiving electrode 212 located on the upper surface of the substrate 201 is formed to extend in the horizontal direction. A plurality of driving electrodes 211 are formed so as to extend in parallel to each other so as to be perpendicular to the extending direction of the image receiving electrode 212 (see Fig. 3 (a)). The image receiving electrode 212 is electrically connected to the sensor circuit unit 220 on the lower surface of the substrate 201.

One end of the plurality of driving electrodes 211 is spaced apart from the image receiving electrode 212 by a predetermined distance. The other end of the plurality of driving electrodes 211 is electrically connected to the sensor circuit unit 220 on the lower surface of the substrate 201.

4, the driving electrode 211 and the image receiving electrode 212 are spaced apart from each other, and the driving signal transmitted from the driving electrode 211 is received by the image receiving electrode 212 through the user U, do. At this time, it is possible to recognize the fingerprint by measuring the change in the electric field according to the presence or absence of the fingerprint bone or fingerprints located on the finger of the user U as a signal.

3 (b) and 3 (c), the sensor circuit unit 220 may have an external interface connection unit 221 electrically connected to the outside. The external interface connection unit 221 may be connected to a portable device such as a smart phone.

As described above, the fingerprint sensor 200 can be implemented by a chip-on-film (COF) method or a BGA method. In particular, a sensing unit 210, that is, a driving electrode 211 and an image receiving electrode 212 are formed on a top surface of a substrate 201, and a sensor circuit unit 220 connected to the sensing unit 210 So that the IC size of the sensor circuit unit 220 can be reduced. As a result, it is possible to eliminate the space limitation in which the sensing unit 210 is installed, and it is possible to make the overall contour compact.

In addition, it is easier to provide the glass on the fingerprint sensor module by not providing the sensor circuit portion on the upper surface of the substrate 201, which is a particularly useful effect in a portable electronic device such as a smart phone.

5, the sensor circuit unit 1220 of the fingerprint sensor 1200 includes a sensor unit 1220 and a sensor unit 1220. The sensor unit 1220 includes a sensor unit 1220, And may be installed at a position substantially apart from the main body 1210. 5), while the sensor circuit portion 220 (see Figs. 2 and 3) described above is located inside the first bracket 310 (see Fig. 1) and the second bracket 320 The sensor circuit portion 1220 may be installed outside the first bracket and the second bracket. The impact and heat that may be generated in the process of combining the first bracket, the second bracket, and the fingerprint sensor 1200 and the process of fixing the fingerprint sensor 1200 are directly applied to the sensor circuit portion 1220 Can be prevented. In addition, since the sensor circuit portion 1220 can be installed on any portion of the substrate 1201, the sensor circuit portion 1220 can be flexibly installed and applied according to the structural characteristics of the portable electronic device to be assembled.

As described above, the fingerprint sensor may be formed as a separate type in which the sensor circuit portion and the sensing portion are separated from each other, and may be integrally formed with the sensor circuit portion and the sensing portion integrally formed.

6, the fingerprint sensor 2200 includes a ball grid array (BGA) 2200, a ball grid array (BGA) ) Type.

That is, the terminals 2250 may be arranged in a two-dimensional array on the substrate 2201, and the bumps 2221 formed on the lower surface of the sensor circuit portion 2220 may be connected to the terminals 2250. The terminal 2250 and the bump 2221 may be connected by soldering.

The substrate 2201 may be electrically connected to the sensor circuit unit 2220 to transmit electrical signal information. The substrate 2201 may be, for example, a printed circuit board (PCB). Although not shown, a lead frame may be attached to a lower portion of the substrate 2201 by resin injection or surface mounting technology (SMT).

Although the fingerprint sensor has been described as a separation type in the foregoing, the case where the sensor circuit unit and the sensing unit are integrated, and the case where the image receiving unit is a plurality of AREA types are all included in the scope of the present invention.

FIG. 7 is a view illustrating a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention, and FIG. 8 is a cross-sectional view illustrating a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.

First, as shown in FIGS. 7A and 7B and FIGS. 8A and 8B, the first bracket 310 has a groove 311 on the inner side. The groove 311 may be formed to accommodate the sensing unit 210 of the fingerprint sensor 200 and the sensor circuit unit 220. When the sensing unit 210 of the fingerprint sensor 200 and the sensor circuit unit 220 are accommodated in the groove 311, a predetermined amount of the epoxy resin 330 may be injected into the groove 311 as an adhesive in advance.

The first bracket 310 has a flange 312 that structurally supports the first bracket 310 and the flange 312 has a penetration portion 314 through which the external interface connection portion 221 can pass . The external interface connection part 221 of the fingerprint sensor 200 is exposed to the outside through the penetration part 314 in a process in which the sensor circuit part 220 of the fingerprint sensor 200 is seated in the groove 311 so as to face the bottom surface And can be disposed prolonged. The flange 312 may be formed integrally with or separate from the first bracket 310, and is integrally formed in this embodiment. The flange 312 may further include a coupling groove (not shown) to which an outer ornament (not shown) can be coupled. The flange 312 may be widely formed on the outer side of the first bracket 310 so that the flange 312 can be fixed in position to facilitate subsequent processes.

A gate 316 may be formed on one side of the bottom surface of the groove 311.

In addition, when the fingerprint sensor 200 is seated in the groove 311, a flat projection 317 for maintaining the flatness may be formed. At least one of the flat projections 317 may be formed.

An air vent 318 may be formed on the other side of the bottom surface of the groove 311. A plurality of air vents 318 may be formed.

As shown in FIGS. 7 (c) and 8 (c) to 8 (d), the molding frame 20 may be disposed outside the first bracket 310. The molding frame 20 may be formed such that the inner surface thereof is spaced apart from the outer surface of the first bracket 310 and the fingerprint sensor 200 through which the molding material 30 to be introduced through the gate 316 So that a space to be filled can be formed. The inner surface of the molding frame 20 may be formed to correspond to the outer shape of the second bracket 320 to be formed. Accordingly, the shape of the second bracket 320 formed by curing the molding material 30 in the molding frame 20 can be determined.

The molding material 30 introduced into the gate 316 fills the inside of the molding frame 20. At this time, the molding material 30 flowing into the gate 316 is filled in the inner space of the molding frame 20 and the groove 311, thereby covering the fingerprint sensor 200. Since the fingerprint sensor 200 is placed on the flat projections 317, the molding material 30 is evenly filled in the lower portion of the fingerprint sensor 200 formed by the flat projections 317, As shown in FIG.

On the other hand, as the molding material 30 is filled, the air inside the molding frame 20 can be discharged to the outside through the air vent 318. The air vent 318 and the gate 316 are formed at both ends of the bottom surface of the groove 311 so that when the molding material 30 is filled and filled through the gate 316, The air vent 318 can be effectively discharged through the air vent 318 without being left inside. Accordingly, the defective rate that may occur due to the air being contained in the second bracket 320 can be reduced.

The molding material 30 filled in the molding frame 20 can then be cured and the cured molding material can form the second bracket 320. The molding material 30 is made of any one of epoxy molding compound, fluorine resin, nylon or polyamide material containing 20 to 40% of glass, epoxy resin, and putty . Further, the molding material 30 may further include wax. The wax may be contained in an amount of 0.4 to 0.6% by weight based on the molding material. When the molding material 20 is removed after the molding material 30 is cured by the molding material 30 further including the wax, the molding frame 20 and the hardened molding material, that is, the second bracket 320 Separation can be done well.

The supporting layer 322 may include a ferroelectric substance 400 capable of increasing the dielectric constant. More specifically, a high dielectric constant reduces the loss of the signal received by the fingerprint sensor in the active state, thereby allowing a more flexible implementation of the thickness of the support layer 322 and the later-described post-processing layer 500 (see FIG. 10) have.

More specifically, the ferroelectric material 400 is a dielectric material that is an electrically insulating material, and refers to materials that cause positive and negative electric polarization phenomena by themselves without applying a voltage to the ferroelectric material 400. Typical materials include Al2O3, BaTio3 (BTO), SrTio3 (STO), and (Ba, Sr) TiO3 (BST).

The ferroelectric material 400 may be mixed with the molding material 30 in the form of powder or liquid, and may be introduced into the gate 316 and cured to be included in the entire second bracket 320. As described above, the ferroelectric body 400 is preferably included in the support layer 322, but may be included in the second bracket 320 as a whole for the convenience of the process.

9 and 10 are cross-sectional views illustrating a fingerprint sensor module according to an embodiment of the present invention.

9, the second bracket 320 has a support layer 322 covering the sensing unit 210 of the fingerprint sensor 200. The upper surface of the support layer 322 has a contact surface (Not shown). The thickness D1 of the support layer 322 may be 15 to 30 占 퐉. Here, the thickness D1 of the supporting layer 322 means the thickness between the upper surface of the sensing portion 210 and the contact surface 321. [ If the thickness of the support layer 322 is too thin, the fingerprint sensor 200 can not be stably received. Conversely, if the thickness of the support layer 322 is too large, the sensing ability of the fingerprint sensor 200 can be weakened.

As the second bracket 320, a liquid polymer may be used. As described above, a nylon or polyamide material including an epoxy molding compound, a fluorine resin, and 20 to 40% , Epoxy resin, and putty may be used. The epoxy molding compound (EMC) may be a liquid epoxy molding compound (EMC). The epoxy molding compound (EMC) is harder than the PC series formed by general injection and can prevent the tolerance in advance and can improve the flatness. In addition, it has the effect of reducing the chip mark in general injection even after the high temperature process. The molding material 30 can be adhered to the sensing unit 210 and hardened so that the reliability between the second bracket 320 formed by the molding material 30 and the fingerprint sensor 200 can be enhanced. The fluororesin may be PVDF (polyfluorinated vinylidene) having a high dielectric constant. If the dielectric constant is high, the detection signal is amplified and the fingerprint is recognized well, and the thickness can be freed from the thickness in the post-processing.

10, the post-processing layer 500 may be provided on the contact surface 321 of the second bracket 320. As shown in FIG.

The post-processing layer 500 performs various functions such as implementing colors on the fingerprint sensor module 10 or reinforcing the upper surface side strength of the fingerprint sensor module 10. [

The post-processing layer 500 may include a primer layer 502, a color paint layer 503 and a protective film layer 504. The post-processing layer 500 may include a primer layer 502, a color paint layer 503, And a passivation layer 504 in this order.

The primer layer 502 is provided on the contact surface 321 to connect the color paint layer 503, and the color paint layer 503 can perform a color embedding function.

The primer layer 502 may be formed to have a thickness of 2 to 3 mu m and the color paint layer 503 may have a thickness of 3 to 5 mu m.

The protective film layer 504 may be a ceramic coating layer including a UV protective film or a ceramic. The protective film layer 504 may be formed to have a thickness of 20 to 22 mu m.

The post-processing layer 500 may be formed to a thickness of 25 to 30 mu m.

In addition, the sum D2 of the thicknesses of the post-processing layer 500 and the supporting layer 322 may be 40 to 60 占 퐉.

11 is a schematic view illustrating a process of preparing a ceramic coating material by a sol-gel method in a fingerprint sensor module according to an embodiment of the present invention.

First, in order to make the protective film layer 504 a ceramic coating layer, a ceramic coating material is prepared. The ceramic paint can be prepared, for example, by using a sol-gel method in which two or more solutions are stirred to produce a ceramic.

That is, as shown in FIG. 11A, liquids A and B are prepared. Then, as shown in Fig. 11 (b), the liquid A is shaken up, down, left and right for a predetermined time (for example, 30 minutes). Next, as shown in Fig. 11 (c), liquid B is mixed with liquid B and then stirred for a predetermined time (for example, 5 hours). If a two-component ceramic paint is formed in this way, it may be used after shaking sufficiently before application (spraying) as shown in Fig. 11 (d). The protective film layer 504 can be formed by spraying the ceramic paint prepared above on the color paint layer 503.

The ceramic coating may be prepared by, for example, a sol-gel method as described above, and a ceramic coating layer may be formed on the color coating layer by using the ceramic coating.

The ceramics have a high permittivity, which reduces the loss of the signal that the image sensor accepts in the active state of the fingerprint sensor. That is, since the ceramic coating layer acts as a dielectric layer, the electric lines of force directed toward the fingerprint sensor 200 through the user's finger (not shown) can be formed more densely. That is, in the fingerprint sensor module 10 according to the embodiment of the present invention, loss of the sensing signal is reduced. In addition, ceramics have high stain resistance such as anti-fingerprint and water repellency. Therefore, it is possible to obtain more clear fingerprint images by reducing image blurring due to surface contamination. In addition, it is possible to realize various colors by blending an inorganic pigment excellent in heat resistance, hiding power and weather resistance in the ceramic paint.

The dielectric constant of the ceramic coating layer may be determined in advance according to the driving frequency of the fingerprint sensor 200. For example, the dielectric constant may be 5 or more. More specifically, when a user's finger touches the fingerprint sensor module 10 or when the user's finger sufficiently approaches the fingerprint sensor module 10 to such a degree that fingerprint recognition is possible, Is received by the sensing unit 210 (see Fig. 2) via the user. When using a ceramic coating layer (i.e., a protective film layer 504) having a dielectric constant suitable for the driving frequency of the sensing portion 210, the signal becomes more concentrated in the ceramic coating layer and is received in the image sensing region. Thus, the loss of the signal is reduced and the operation of the fingerprint sensor 200 is improved.

In the embodiment of the present invention, by forming the protective film layer 504 of the post-processing layer 500 as a ceramic coating layer, not only the effect of ensuring low film thickness, abrasion resistance and heat resistance, It is possible to obtain an effect that the operation is improved.

The polishing process may be further performed to adjust the thickness of the support layer 322 of the second bracket 320 and to increase the flatness before the finish layer 500 is provided on the contact surface 321 of the second bracket 320 have. The thickness of the supporting layer 322 of the second bracket 320 may be 15 to 30 占 퐉.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

10: Fingerprint sensor module
20: Molding frame
30: Molding material
200, 1200, 2200: Fingerprint sensor
220, 1220, 2220:
310: first bracket
311: Home
312: Flange
314:
316: Gate
317:
318: Air vent
320: second bracket
321: contact surface
322: Support layer
400: ferroelectric
500: Finish layer
502: primer layer
503: Color paint layer
504:

Claims (11)

A fingerprint sensor having a sensing part formed on a substrate using a conductor and a sensor circuit part electrically connected to the sensing part;
A first bracket receiving the sensing unit and seating the fingerprint sensor; And
And a second bracket that forms a support layer on the upper surface of the sensing unit and fixes and covers the fingerprint sensor and the first bracket,
Wherein the first bracket is formed with a gate through which the molding material flows, and the second bracket is formed by curing the molding material introduced into the gate. The method according to claim 1,
Wherein the gate is formed on one side of the bottom surface of the groove formed in the first bracket and receiving the sensing portion. 3. The method of claim 2,
And an air vent through which the air is discharged is formed on the other side of the bottom surface of the groove. 3. The method of claim 2,
Wherein a flat protrusion for maintaining a flatness is formed in the groove when the fingerprint sensor is seated. The method according to claim 1,
Wherein the molding material is made of any one of epoxy molding compound, fluorine resin, nylon or polyamide material containing 20 to 40% of glass, epoxy resin, and putty. Sensor module. 6. The method of claim 5,
Wherein the molding material further comprises wax. A portable electronic device having a fingerprint sensor module according to any one of claims 1 to 6. a) supporting the fingerprint sensor with the first bracket so as to receive the sensing unit;
b) disposing a molding frame on the outer periphery of the first bracket;
c) inserting a molding material into the gate formed in the first bracket to fill the inside of the molding frame;
d) curing the inserted molding material to form a second bracket fixing and covering the fingerprint sensor and the first bracket; And
and e) removing the molding frame. 9. The method of claim 8,
Wherein in the step (a) of supporting the fingerprint sensor with the first bracket, the fingerprint sensor is positioned on the flat projection of the groove formed in the first bracket. 9. The method of claim 8,
Wherein the molding material is made of any one of epoxy molding compound, fluorine resin, nylon or polyamide material containing 20 to 40% of glass, epoxy resin, and putty. A method of manufacturing a sensor module. 11. The method of claim 10,
Wherein the molding material further comprises wax.

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