CN107868398A - A kind of electric slurry, preparation method and application - Google Patents
A kind of electric slurry, preparation method and application Download PDFInfo
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- CN107868398A CN107868398A CN201610844414.1A CN201610844414A CN107868398A CN 107868398 A CN107868398 A CN 107868398A CN 201610844414 A CN201610844414 A CN 201610844414A CN 107868398 A CN107868398 A CN 107868398A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The present invention provides a kind of electric slurry, preparation method and application.The electric slurry, mass parts meter, including 5~50 parts of following thermosetting resin；0.25~12.5 part of curing agent；0.025~1 part of curing accelerator；50~95 parts of dielectric filler；0.5~5 part of dispersant；10~50 parts of solvent.The electric slurry of the present invention not only has high dielectric constant, low dielectric loss, and has good dielectric frequency stability, visible light transmittance rate is less than 1%, and cheap, and preparation method is simple, large-scale industrialized production is used in, is that instead of sapphire preferred material.
Description
Technical field
The present invention relates to Size Technology field, more particularly to a kind of electric slurry, preparation method and application.
Background technology
Fingerprint recognition is the biometrics identification technology for having prolonged application history.From criminal investigation, combat terrorism to
The network information security, fingerprint identification technology all played an important role.Fingerprint recognition is increasingly received by society, into
For a kind of well known authentication means.
Apple Inc. releases the smart mobile phone with fingerprint identification function within 2013, supports mobile phone to unlock by fingerprint recognition
And e-payment, business success is obtained, drives fingerprint identification technology developing rapidly in mobile electronic device.Fingerprint identification technology
Application on mobile electronic device further have stimulated the development of the fingerprint collecting chip of small ultra-thin.Existing condenser type refers to
The fingerprint tough part of line identification sensor encapsulation is less than 10 sapphire using dielectric constant, but sapphire glass is deposited
Make it difficult for sensor to encapsulate the shortcomings that smaller more slim, manufacturing process complexity is high, therefore limit its transducer sensitivity
With the lifting of encapsulation performance.
The content of the invention
In view of this, it is an object of the present invention to provide a kind of electric slurry.The electric slurry solves electric slurry and is situated between
The problem of electric constant is low, high dielectric loss, electric slurry of the invention have high-k, low-dielectric loss, are situated between well
Electric frequency stability, it is seen that light light transmittance is small；Alternative sapphire is used for fingerprint Identification sensor.
The present invention uses following technical scheme.
A kind of electric slurry, mass parts meter, including following components：
Thermosetting resin in the present invention can be 5 parts, 6 parts, 8 parts, 10 parts, 12 parts, 15 parts, 20 parts, 30 parts, 40 parts,
45 parts or 50 parts etc.；Curing agent can be 0.25 part, 0.5 part, 0.8 part, 1 part, 2 parts, 5 parts, 8 parts, 10 parts, 12 parts or 12.5 parts
Deng；Curing accelerator can be 0.025 part, 0.05 part, 0.08 part, 0.1 part, 0.2 part, 0.3 part, 0.5 part, 0.6 part, 0.8 part
Or 1 part etc.；Dielectric filler can be 50 parts, 60 parts, 70 parts, 80 parts, 90 parts or 95 parts etc.；Dispersant can be 0.5 part, 0.6
Part, 0.8 part, 1 part, 2 parts, 3 parts, 4 parts or 5 parts etc.；Solvent can be 10 parts, 12 parts, 15 parts, 20 parts, 22 parts, 25 parts, 30 parts,
35 parts, 40 parts, 45 parts or 50 parts etc..
Electric slurry optimizes to each component, content in the present invention, wherein, addition dielectric is filled out in thermosetting resin
Material, dielectric constant can be not only increased substantially using polymer composites, and cheap, be easy to mass produce,
It is that instead of sapphire preferred material.Fingerprint recognition slurry proposed by the invention not only has high dielectric constant, low Jie
Electrical loss, and there is good dielectric frequency stability, it is seen that light light transmittance is less than 1%, and preparation method is simple, is used in big
Scale industrialization produces.
Wherein, mass parts meter, including following components：
Wherein, the thermosetting resin is epoxy resin, and preferably bisphenol A epoxide resin is (as Hensel steps productionGY 2600,GY 6010,GY 6020,MY 790-1,LY 1556,GY 507, Epon828 etc.), bisphenol F epoxy resin (as Hensel step productionGY 281,GY 282,GY 285,PY 306,
PY 302-2,PY 313 etc.), novolac epoxy resin (such as NPPN-638S of South Asia production of resins, NPPN-631
Deng the NPCN-701 of o-cresol formaldehyde epoxy resin such as South Asia production of resins, NPCN-702, NPCN-703, NPCN-704, NPCN-
704L, NPCN-704K80 etc.), cycloaliphatic epoxy resin (as under the U.S. Emerald CVC Specialty Chemicals produce
EPALLOY 5200, Hensel step productionCY 179,CY 184,CY 192,CY 5622,CY 9729 etc.), biphenyl epoxy resin is (such as Mitsui chemical production
YX4000, YX4000K, YX4000H, YX4000HK, YL6121H, YL6121HN etc.) or brominated epoxy resin (such as Yueyang Ba Ling
The CYDB-500 of petrochemical iy produced, CYDB-700, CYDB-900, CYDB-400, CYDB-450A80 etc.) in one kind or at least two
The mixture of kind.
Wherein, the curing agent is aliphatic polyol amine type curing agent, cycloaliphatic polyols amine type curing agent, aromatic amine solidification
Agent, acid anhydride type curing agent, polyamide curing agent, latent curative or one kind in synthetic resin curing agent or at least two
Mixture；
Preferably, the aliphatic polyol amine type curing agent is selected from ethylenediamine, diethylenetriamine, triethylene tetramine, four ethene
Five amine, dipropylenetriamine, dimethylamine propylamine, diethyl amino propylamine, trimethylhexamethylenediamine, dihexyl triamine, front three
One kind or at least two mixture in base hexamethylene diamine or polyether diamine；
Preferably, the cycloaliphatic polyols amine type curing agent be selected from diaminomethyl hexamethylene, Meng's alkane diamino, aminoethyl croak piperazine,
Hexahydropyridine, diaminocyclohexane, diaminomethyl cyclohexyl-methane or one kind in diaminourea cyclohexyl-methane or at least two
Mixture；
Preferably, the aromatic amine curing agent is selected from m-phenylene diamine (MPD), m-xylene diamine, diaminodiphenyl-methane, two
Aminodiphenyl base sulfone or one kind or at least two mixture in 4- chlorine o-phenylenediamines；
Preferably, acid anhydride type curing agent methine tetrahydrophthalic acid in benzophenone tetracarboxylic dianhydride, methyl
Acid anhydride, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, glutaric anhydride, poly- azelaic acid acid anhydride, dichloro- maleic acid
Acid anhydride, methylhexahydrophthalic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, mellophanic acid dianhydride, two
Benzophenone carboxylic di-acid acid anhydride, maleic anhydride, dodecyl for maleic anhydride, succinic anhydride, hexahydrophthalic acid anhydride,
Pentamethylene tetracarboxylic dianhydride or one kind or at least two mixture in two the first and second benzene of maleic acid anhydride group；
Preferably, the latent curative is selected from dicyandiamide, Boron Trifluoride Ethylamine, boron trifluoride phenyl ethylamine, borontrifluoride
Boron o-toluidine, boron trifluoride Bian amine, boron trifluoride dimethylaniline, boron trifluoride MEA, boron trifluoride pyridine,
MS-1 microcapsules, MS-2 microcapsules or one kind or at least two mixture in the hydrazides of SA three；
Preferably, the synthetic resin curing agent is selected from aniline-formaldehyde resin, phenol formaldehyde resin, linear phenolic resin
One kind or at least two mixture in.
Wherein, the curing accelerator is consolidated selected from imidazoles curing accelerator, substituted urea class curing accelerator or tertiary amines
Change one kind or at least two mixture in accelerator；
The imidazoles curing accelerator be selected from 2-methylimidazole, 2- ethyl imidazol(e)s, 2,4- diethyl imidazoliums, 2- ethyls-
4-methylimidazole, 2- undecyl imidazoles or one kind or at least two mixture in 2- heptadecyl imidazoles.
Wherein, the dielectric filler is selected from the dielectric filler that dielectric constant is higher than 20, preferably barium titanate, strontium titanates, metatitanic acid
One kind or at least two mixing in strontium barium, lead zirconate titanate, titanium dioxide, zinc oxide, carborundum, boron nitride or aluminium nitride
Thing.
Wherein, the dispersant in nonionic emulsifier, anionic emulsifier or cationic emulsifier one
Kind or at least two mixture；
Preferably, the nonionic emulsifier is selected from APES, high-carbon fatty alcohol polyoxyethylene ether, fat
One kind or at least two mixture in fat acid polyoxyethylene ester or fatty acid methyl ester ethoxylate；
Preferably, the anionic emulsifier is selected from OA sodium, enuatrol, odium stearate, laurate
Sodium, C13~C18 sodium alkyl benzene sulfonates or one kind or at least two mixture in sulfuric acid；
Preferably, the cationic emulsifier is selected from alkylammonium salt, preferably lauryl ammonium chloride, quaternary ammonium salt such as hexadecane
Base trimethylammonium bromide or one kind or at least two mixture in the cetyl pyridinium bromide nymph of a locust.
Wherein, the solvent is selected from aromatics, halogenated hydrocarbons, fat hydrocarbon, alicyclic hydrocarbon type, alcohols, esters, ketone or acyl
One kind or at least two mixture in amine；
Preferably, the aromatics are selected from dimethylbenzene, ortho-xylene, meta-xylene, paraxylene, hexamethylbenzene or ethylbenzene
In one kind or at least two mixture；
Preferably, the mixing of the one kind or at least two of the halogenated hydrocarbons in chlorobenzene, dichloro-benzenes or dichloromethane
Thing；
Preferably, the mixture of the one kind or at least two of the fat hydrocarbon in pentane, hexane or octane；
Preferably, the one kind or at least two of the alicyclic hydrocarbon type in hexamethylene, cyclohexanone or toluene cyclohexanone
Mixture；
Preferably, the mixture of the one kind or at least two of the alcohols in methanol, ethanol or isopropanol；
Preferably, the mixing of the one kind or at least two of the esters in methyl acetate, ethyl acetate, propyl acetate
Thing；
Preferably, the one kind or at least two mixing of the ketone in acetone, 2- butanone, hexone
Thing；
Preferably, the amide-type is selected from dimethylformamide, hexamethyl phosphoramide, N-METHYLFORMAMIDE, dimethyl second
One kind or at least two mixture in acid amides.
The two of the object of the invention are to provide a kind of preparation method of above-mentioned electric slurry, and the preparation method solves preparation
Technique is cumbersome, be not suitable for large-scale production the problem of.
A kind of preparation method of above-mentioned electric slurry, comprises the following steps：
(1) according to proportioning, raw material is positioned in ball grinder and carries out ball milling, obtains initial slurry；
(2) initial slurry is subjected to ultrasonic disperse, obtains electric slurry.
Wherein, rotational speed of ball-mill is 300~3000rpm, preferably 450~1200rpm in the step (1), Ball-milling Time 1
~24h, preferably 2~6h；
Preferably, the ultrasonic disperse time is 0~5h, preferably 1~2h in the step (2).
The three of the object of the invention are that providing a kind of above-mentioned electric slurry is preparing answering for fingerprint Identification sensor dielectric layer
With.The application solves the limitation of the lifting to transducer sensitivity and encapsulation performance.
A kind of above-mentioned electric slurry is preparing the application of fingerprint Identification sensor dielectric layer.
Compared with prior art, the present invention has the advantage that and beneficial effect：Electric slurry provided by the invention is not
Only there is high dielectric constant, low dielectric loss, and there is good dielectric frequency stability, it is seen that light light transmittance is less than
1%, and it is cheap, and preparation method is simple, is used in large-scale industrialized production, is that instead of sapphire preferred material.
Brief description of the drawings
The dielectric constant and dielectric loss for the electric slurry that Fig. 1 is prepared for embodiment 3 are with frequency variation curve；
Fig. 2 is light transmittance variation diagram of the electric slurry in visible-range class testing of the preparation of embodiment 1~4.
Embodiment
In order to which technical characteristic, purpose and the beneficial effect of the present invention is more clearly understood, now to the skill of the present invention
Art scheme carry out it is described further below, but it is not intended that to the present invention can practical range restriction.
Embodiment 1
Electric slurry in the present embodiment, mass parts meter, including following components：
The preparation method of above-mentioned electric slurry is as follows：
By epoxy resin Epon828 20g, methyl hexahydrophthalic anhydride 1.6g, 2- methyl -4- ethyl imidazol(e)s 0.2g, 2- butanone
10g, stirring and dissolving, obtain epoxy resin lysate；
Barium titanate 60g, titanium dioxide 10g, NPE 1.8g and 2- butanone 30g are added to ball grinder
In, and epoxy resin lysate is added, with ultrasonic 2h after 400rpm rotating speed ball milling 24h, electric slurry is made.
Embodiment 2
Electric slurry in the present embodiment, mass parts meter, including following components：
The preparation method of above-mentioned electric slurry is as follows：
By epoxy resin Epon828 20g, dicyandiamide 1.5g, 2- methyl -4- ethyl imidazol(e)s 0.2g, 2- butanone 20g, stirring
Dissolving, obtains epoxy resin lysate；
Zinc oxide 20g, titanium dioxide 30g, NPE 1.8g and 2- butanone 30g are added to ball grinder
In, and epoxy resin lysate is added, with ultrasonic 2h after 400rpm rotating speed ball milling 24h, electric slurry is made.
Embodiment 3
Electric slurry in the present embodiment, mass parts meter, including following components：
The preparation method of above-mentioned electric slurry is as follows：
By epoxy resinThe 10g of GY 6010, epoxy resin NPCN-703 10g, phthalic anhydride 10g,
2-methylimidazole 0.2g, 2- butanone 20g, stirring and dissolving, obtains epoxy resin lysate；
Titanium dioxide 80g, NPE 2.4g and 2- butanone 30g are added in ball grinder, and add ring
Oxygen tree fat lysate, with ultrasonic 2h after 1200rpm rotating speed ball milling 24h, electric slurry is made.
Embodiment 4
Electric slurry in the present embodiment, mass parts meter, including following components：
The preparation method of above-mentioned electric slurry is as follows：
By epoxy resinThe 10g of GY 6010, epoxy resinThe 10g of CY 179, O-phthalic
Acid anhydrides 10g, 2-methylimidazole 0.2g, 2- butanone 20g, stirring and dissolving, obtains epoxy resin lysate；
Titanium dioxide 70g, silicon nitride 20g, NPE 2.5g and 2- butanone 30g are added to ball grinder
In, and epoxy resin lysate is added, with ultrasonic 2h after 2500rpm rotating speed ball milling 24h, electric slurry is made.
Test：The obtained electric slurry of embodiment 3 is subjected to dielectric constant and dielectric loss test, as a result as shown in Figure 1；
Electric slurry made from embodiment 1~4 is subjected to light transmittance test between visible region, as a result as shown in Figure 2.
It will be seen from figure 1 that the electric slurry dielectric constant of the embodiment of the present invention 3 is higher than 20, dielectric loss is less than 0.07,
Embodiment 1-2,4 test result are similar therewith；
Figure it is seen that light transmittance of the present invention is less than 0.16%.
Electric slurry provided by the invention not only has high dielectric constant, low dielectric loss, and has good
Dielectric frequency stability, it is seen that light light transmittance is less than 1%, and cheap, and preparation method is simple, is used in extensive industry
Metaplasia is produced, and is that instead of sapphire preferred material.
Applicant states that the present invention illustrates the detailed construction and technique of the present invention, but the present invention by above-described embodiment
Above-mentioned detailed construction and technique are not limited to, that is, it is real not mean that the present invention has to rely on above-mentioned detailed construction and technique ability
Apply.Person of ordinary skill in the field should be understood that any improvement in the present invention, to the equivalent of each raw material of product of the present invention
Replacement and the addition of auxiliary element, the selection of concrete mode etc., within the scope of all falling within protection scope of the present invention and disclosing.
Claims (11)
1. a kind of electric slurry, it is characterised in that mass parts meter, including following components：
2. electric slurry according to claim 1, it is characterised in that mass parts meter, including following components：
3. electric slurry according to claim 1, it is characterised in that the thermosetting resin is epoxy resin, preferably double
Phenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, cycloaliphatic epoxy resin, biphenyl epoxy resin or brominated epoxy
One kind or at least two mixture in resin.
4. electric slurry according to claim 1, it is characterised in that the curing agent be aliphatic polyol amine type curing agent,
Cycloaliphatic polyols amine type curing agent, aromatic amine curing agent, acid anhydride type curing agent, polyamide curing agent, latent curative or synthesis
One kind or at least two mixture in resinae curing agent；
Preferably, the aliphatic polyol amine type curing agent be selected from ethylenediamine, diethylenetriamine, triethylene tetramine, TEPA,
Dipropylenetriamine, dimethylamine propylamine, diethyl amino propylamine, trimethylhexamethylenediamine, dihexyl triamine, trimethyl oneself
One kind or at least two mixture in diamines or polyether diamine；
Preferably, the cycloaliphatic polyols amine type curing agent is selected from diaminomethyl hexamethylene, Meng's alkane diamino, aminoethyl croak piperazine, hexahydro
Pyridine, diaminocyclohexane, diaminomethyl cyclohexyl-methane or one kind in diaminourea cyclohexyl-methane or at least two it is mixed
Compound；
Preferably, the aromatic amine curing agent is selected from m-phenylene diamine (MPD), m-xylene diamine, diaminodiphenyl-methane, diaminourea
Diphenyl sulfone or one kind or at least two mixture in 4- chlorine o-phenylenediamines；
Preferably, the acid anhydride type curing agent is selected from benzophenone tetracarboxylic dianhydride, MNA, four
Hydrogen phthalic anhydride, methyl tetrahydrophthalic anhydride, glutaric anhydride, poly- azelaic acid acid anhydride, dichloro- maleic anhydride, first
Base hexahydrophthalic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, mellophanic acid dianhydride, benzophenone four
Carboxylic di-acid acid anhydride, maleic anhydride, dodecyl are for maleic anhydride, succinic anhydride, hexahydrophthalic acid anhydride, pentamethylene
Tetracarboxylic dianhydride or one kind or at least two mixture in two the first and second benzene of maleic acid anhydride group；
Preferably, it is adjacent to be selected from dicyandiamide, Boron Trifluoride Ethylamine, boron trifluoride phenyl ethylamine, boron trifluoride for the latent curative
Methylaniline, boron trifluoride Bian amine, boron trifluoride dimethylaniline, boron trifluoride MEA, boron trifluoride pyridine, MS-1 are micro-
Capsule, MS-2 microcapsules or one kind or at least two mixture in the hydrazides of SA three；
Preferably, the synthetic resin curing agent is in aniline-formaldehyde resin, phenol formaldehyde resin, linear phenolic resin etc.
One kind or at least two mixture.
5. electric slurry according to claim 1, it is characterised in that the curing accelerator is selected from imidazoles solidification and promoted
Agent, substituted urea class curing accelerator or one kind or at least two mixture in tertiary amines curing accelerator；
The imidazoles curing accelerator is selected from 2-methylimidazole, 2- ethyl imidazol(e)s, 2,4- diethyl imidazoliums, 2- ethyl -4- first
Base imidazoles, 2- undecyl imidazoles or one kind or at least two mixture in 2- heptadecyl imidazoles.
6. electric slurry according to claim 1, it is characterised in that the dielectric filler is selected from dielectric constant and is higher than 20
Dielectric filler, preferably barium titanate, strontium titanates, barium strontium titanate, lead zirconate titanate, titanium dioxide, zinc oxide, carborundum, boron nitride or
One kind or at least two mixture in aluminium nitride.
7. electric slurry according to claim 1, it is characterised in that the dispersant is selected from nonionic emulsifier, the moon
One kind or at least two mixture in ionic emulsifying agent or cationic emulsifier；
Preferably, the nonionic emulsifier is selected from APES, high-carbon fatty alcohol polyoxyethylene ether, aliphatic acid
One kind or at least two mixture in polyoxyethylene ester or fatty acid methyl ester ethoxylate；
Preferably, the anionic emulsifier be selected from OA sodium, enuatrol, odium stearate, sodium laurate,
One kind or at least two mixture in C13~C18 sodium alkyl benzene sulfonates or sulfuric acid；
Preferably, the cationic emulsifier is selected from alkylammonium salt, preferably lauryl ammonium chloride, quaternary ammonium salt such as cetyl three
Methyl bromide ammonium or one kind or at least two mixture in the cetyl pyridinium bromide nymph of a locust.
8. electric slurry according to claim 1, it is characterised in that the solvent is selected from aromatics, halogenated hydrocarbons, fat
One kind or at least two mixture in hydro carbons, alicyclic hydrocarbon type, alcohols, esters, ketone or amide-type；
Preferably, the aromatics are in dimethylbenzene, ortho-xylene, meta-xylene, paraxylene, hexamethylbenzene or ethylbenzene
It is a kind of or at least two mixture；
Preferably, the mixture of the one kind or at least two of the halogenated hydrocarbons in chlorobenzene, dichloro-benzenes or dichloromethane；
Preferably, the mixture of the one kind or at least two of the fat hydrocarbon in pentane, hexane or octane；
Preferably, the one kind or at least two mixing of the alicyclic hydrocarbon type in hexamethylene, cyclohexanone or toluene cyclohexanone
Thing；
Preferably, the mixture of the one kind or at least two of the alcohols in methanol, ethanol or isopropanol；
Preferably, the mixture of the one kind or at least two of the esters in methyl acetate, ethyl acetate, propyl acetate；
Preferably, the one kind or at least two mixture of the ketone in acetone, 2- butanone, hexone；
Preferably, the amide-type is selected from dimethylformamide, hexamethyl phosphoramide, N-METHYLFORMAMIDE, dimethyl acetamide
In one kind or at least two mixture.
9. the preparation method of electric slurry described in a kind of claim 1, it is characterised in that comprise the following steps：
(1) according to proportioning, raw material is positioned in ball grinder and carries out ball milling, obtains initial slurry；
(2) initial slurry is subjected to ultrasonic disperse, obtains electric slurry.
10. preparation method according to claim 9, it is characterised in that in the step (1) rotational speed of ball-mill be 300~
3000rpm, preferably 450~1200rpm, Ball-milling Time are 1~24h, preferably 2~6h；
Preferably, the ultrasonic disperse time is 0~5h, preferably 1~2h in the step (2).
11. electric slurry described in a kind of claim 1 is preparing the application of fingerprint Identification sensor dielectric layer.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110643151A (en) * | 2019-10-18 | 2020-01-03 | 江苏兆维塑料科技有限公司 | Barium strontium titanate modified epoxy resin light heat insulation material and preparation method and application thereof |
| CN114479734A (en) * | 2022-01-07 | 2022-05-13 | 深圳先进电子材料国际创新研究院 | Insulating adhesive film, preparation method and application thereof |
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| KR20140131265A (en) * | 2013-05-03 | 2014-11-12 | 주식회사 아이피시티 | Fingerprint sensor module, portable electronic device having the same, and manufacturing method thereof |
| WO2015146816A1 (en) * | 2014-03-25 | 2015-10-01 | 住友ベークライト株式会社 | Epoxy resin composition and electrostatic-capacitance-type fingerprint sensor |
| CN104194271A (en) * | 2014-08-29 | 2014-12-10 | 天津德高化成新材料股份有限公司 | Dielectric composite material for fingerprint sensor induction layer and preparation method thereof |
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