WO2018038569A1

WO2018038569A1 - Cover for fingerprint sensor, and portable electronic device comprising same

Info

Publication number: WO2018038569A1
Application number: PCT/KR2017/009306
Authority: WO
Inventors: 조성호; 오창우; 안영준
Original assignee: 주식회사 아모센스
Priority date: 2016-08-26
Filing date: 2017-08-25
Publication date: 2018-03-01

Abstract

A cover for a fingerprint sensor is provided. The cover for a fingerprint sensor, according to an exemplary embodiment of the present invention, which is disposed in front of a fingerprint sensor and comes into contact with a finger of a user, comprises: a ceramic body; and a shield layer formed on one surface of the ceramic body, for preventing the fingerprint sensor from being shown outside and also for providing adhesion so as to be capable of being attached to one surface of the fingerprint sensor.

Description

Cover for fingerprint sensor and portable electronic device including the same

The present invention relates to a fingerprint sensor cover and a portable electronic device including the same.

The fingerprint sensor is a sensor for detecting a human finger fingerprint. Recently, the fingerprint sensor is widely used as a means for enhancing security in portable electronic devices such as mobile phones and tablet PCs. That is, by performing a user registration or authentication process through the fingerprint sensor, it is possible to protect the data stored in the portable electronic device, and to prevent security accidents in advance.

For example, when the fingerprint sensor is applied to the home button side of the mobile phone, the fingerprint sensor is inserted into the receiving side formed on the bezel of the mobile phone, and the exposure to the outside through the cover covering the receiving portion is prevented.

Such a cover is used in a ceramic material having excellent hardness, such as sapphire crystal or zirconia, to prevent damage due to scratches and to increase the recognition rate of the fingerprint sensor.

However, the ceramic material is excellent in hardness and effective in preventing scratches, but it is weak in impact due to strong brittleness due to the sintering process through heat treatment.

Accordingly, the cover made of a ceramic material is very difficult to process into various shapes through the punching. In particular, when the cover is a shape having a curved surface, such as oval or circular, the punching process is impossible, it is generally processed through laser processing. As a result, there is a problem that the production yield is lowered and the production cost is increased.

On the other hand, when the cover is made of a ceramic material such as sapphire crystal or zirconia, the material itself is a transparent color to prevent the fingerprint sensor from shining through the cover by applying a colored paint through a silk screen process.

However, in the case of the coating layer through the silk screen method, there is a problem of discoloration or peeling from the cover after a long time. In addition, such a coating layer is formed through a separate process, such as a silk screen method, there is a limit in productivity of work.

The present invention has been made in view of the above, and provides a cover for a fingerprint sensor and a portable electronic device including the same, which can realize a color similar to the peripheral parts without performing a separate process such as silk screen. There is a purpose.

According to one embodiment of the invention, the front of the fingerprint sensor is disposed in contact with the user's finger, the ceramic element; And a shield layer formed on one surface of the ceramic element and preventing the fingerprint sensor from shining outside and providing an adhesive force to be attached to one surface of the fingerprint sensor. to provide.

For example, the shield layer may be formed as a single layer including a colored component and an adhesive component.

As another example, the shield layer includes a colored layer formed on one surface of the ceramic element so that the colored component is included to prevent the fingerprint sensor from shining outside, and the adhesive component includes one surface of the colored layer. It may be formed in a multi-layer including an adhesive force imparting layer laminated on the.

In addition, the adhesive component may be a thermosetting adhesive component that exhibits adhesiveness at a high temperature of 50 ° C. or higher.

In addition, the thermosetting adhesive component includes a curable component and a binder component, the curable component is an acrylic component, a polyester component, an isocyanate component, a urethane component, a phenol component and an epoxy having at least one functional group or a site group that can be cured by heat. It may include one or more selected from the components.

In addition, the ceramic body may include at least one of zirconia, alumina, TiC, TIN and TiCN.

In addition, the shield layer may have some or all of the colors of white, gold, black, gray, silver, blue, pink, brown, green, yellow and red.

In addition, an anti-fingerprint layer may be formed on one surface of the ceramic body.

According to another embodiment of the present invention, a cover disposed in front of the fingerprint sensor in contact with the user's finger, Ceramic cover; And a colored shield layer formed on one surface of the ceramic element and formed through a deposition process to prevent the fingerprint recognition sensor from being reflected to the outside.

According to another embodiment of the present invention, disposed in front of the fingerprint sensor is in contact with the user's finger, comprising a ceramic element, wherein the ceramic element is a plurality of sheets having different colors are laminated in a multi-layer After sintered body provides a fingerprint sensor cover.

In this case, the plurality of sheets may be sheets containing colored pigments.

According to another embodiment of the present invention, disposed in front of the fingerprint recognition sensor to be in contact with the user's finger, comprising a ceramic element, the ceramic body has a first surface and the first surface having a different surface roughness on the side Provided is a cover for a fingerprint recognition sensor formed to have two areas.

In this case, the first region may be a punching surface formed by the punching, and the second region may be a cutting surface formed through a cutting process except for the punching.

The present invention is a mobile device main body; A fingerprint recognition sensor embedded in the mobile device main body; And a cover for the fingerprint recognition sensor described above disposed at the front side of the fingerprint recognition sensor.

According to the present invention, at least a part of the cover for the fingerprint sensor has the same color as or similar to the bezel of the main body of the mobile device, thereby preventing the fingerprint sensor from shining outside and giving a sense of unity to the overall color, thereby improving aesthetics. .

In addition, the present invention can be attached directly to the fingerprint sensor through the shield layer in the case of including a shield layer that exhibits adhesiveness in a predetermined condition, so that a separate process for placing or attaching an adhesive member is omitted. Assembly productivity can be improved.

In addition, the present invention can improve the reliability by preventing peeling or discoloration when the colored shield layer is formed as a deposition layer on one surface of the ceramic element.

Furthermore, the present invention may have different surface roughness when the side of the ceramic body is formed of the punching surface and the cut surface except the punching.

1 is a cross-sectional view showing a cover for a fingerprint recognition sensor according to an embodiment of the present invention,

2 is a cross-sectional view showing a cover for a fingerprint recognition sensor according to another embodiment of the present invention;

3 is a cross-sectional view showing a cover for a fingerprint recognition sensor according to another embodiment of the present invention;

4 is a cross-sectional view showing a cover for a fingerprint recognition sensor according to another embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a first region and a second region formed on the side surface of the ceramic element in FIG. 4;

6 is a view showing a case in which the ceramic body is composed of a multilayer sheet in FIG.

7 is a cross-sectional view showing a cover for a fingerprint recognition sensor according to another embodiment of the present invention;

8 is a cross-sectional view showing another form of the ceramic element in FIG.

9 is an exemplary view showing a variety of shapes of the fingerprint sensor cover according to the invention, and,

10 is an application state diagram showing a portable electronic device to which the cover for a fingerprint recognition sensor according to the present invention is applied.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. The drawings and description are to be regarded as illustrative in nature and not restrictive. Like reference numerals designate like elements throughout the specification.

The

cover

100 and 100 ′ for the fingerprint sensor according to the exemplary embodiment of the present invention includes the ceramic body 110 and the

shield layers

120, 120 ′ and 220 as illustrated in FIGS. 1 to 3.

The ceramic body 110 may be a plate-like sheet having a predetermined area and thickness. For example, the ceramic body 110 may be a body formed by sintering a green sheet made of a ceramic slurry.

In the present invention, the ceramic slurry may be a slurry in which fine ceramic powder is mixed with an aqueous or non-aqueous solvent and a binder, a plasticizer, a dispersant, an antifoaming agent, a surfactant, and the like at an appropriate ratio. In addition, the ceramic body 110 may be formed through sintering after the ceramic slurry is coated with a predetermined thickness on a substrate (not shown) to form a green sheet.

In addition, the ceramic powder constituting the ceramic element 110 may include one or more selected from the group consisting of zirconia, alumina, TiC, TIN, TiCN, and combinations thereof, but is not limited thereto. Note that any powder can be used.

In addition, the ceramic element 110 may be a single layer sheet in which one green sheet is formed through sintering, or may be a multilayer sheet in which a plurality of green sheets are integrally formed through sintering. In addition, when the ceramic element 110 is composed of a multi-layer sheet, it is noted that the plurality of green sheets may be made of the same material or may be made of different materials.

That is, the

cover

100, 100 ', 200 for the fingerprint recognition sensor according to the present invention is made of a ceramic element 110 having a predetermined dielectric constant and is disposed in front of the fingerprint recognition sensor 20 to generate the fingerprint recognition sensor 20. The driving signal may crowd the electric force lines directed toward the fingerprint recognition sensor 20 through the user's finger. Through this, the recognition rate and accuracy of the fingerprint recognition sensor 20 can be improved.

In this case, the ceramic body 110 may be provided to have various shapes as shown in FIG.

For example, the ceramic body 110 may have a polygonal shape such as a triangular shape or a square shape, as well as a circle or oval shape, and a shape in which at least a part of the edge of the entire border includes a curve, such as a polygonal shape whose edge is curved. Can have

To this end, the ceramic body 110 may be processed in a previous step of the sintering process to process the shape to have a shape substantially the same as the cover (100, 100 ', 200) of the final product. That is, the ceramic body 110 may be shaped in a state of the flexible green sheet before sintering, so that various forms of well-known shapes such as punching and laser processing may be applied.

However, the order of the process of processing the shape of the ceramic element 110 is not limited thereto, and it should be noted that the sintering process of the ceramic element 110 may be performed after the completion of the sintering process.

The shield layers 120, 120 ′ and 220 may be formed to have a predetermined thickness on one surface of the ceramic element 110. Such a shield layer (120, 120 ', 220) is the fingerprint

recognition sensor cover

100, 100', 200 according to the invention when the fingerprint recognition sensor 20 is disposed in front of the fingerprint recognition sensor 20 to the outside It can prevent it from shining.

That is, when the

cover

100, 100 ', 200 for the fingerprint sensor according to the present invention is applied to a portable electronic device together with the fingerprint sensor 20 by being translucent or opaque through the shield layers 120, 120', and 220. In addition, the fingerprint recognition sensor 20 built in the portable electronic device may be prevented from being exposed or reflected to the outside through the fingerprint recognition sensor covers 100, 100 ′ and 200 (see FIG. 10).

In this case, the shield layers 120 and 120 'may have an adhesive force under predetermined conditions.

In other words, the fingerprint recognition sensor cover (100, 100 ') has the adhesive layer in the predetermined conditions, the fingerprint layer is recognized through the shield layer (120, 120') even if a separate adhesive member is not used. It may be directly attached to one surface of the sensor 20. Accordingly, a work process for forming or arranging a separate adhesive layer between the fingerprint

recognition sensor cover

100 and 100 ′ and the fingerprint recognition sensor 20 may be omitted, thereby improving convenience and productivity of the work.

To this end, the shield layers 120 and 120 ′ may be attached to one surface of the fingerprint recognition sensor 20 and a colored component to prevent the fingerprint recognition sensor 20 from being exposed or reflected to the outside through the ceramic element 110. It may include an adhesive component for expressing the adhesive so that.

That is, when the shield layers 120 and 120 'include both colored components and adhesive components, the colored components can be lowered to below a desired level for light transmittance of the shield layers 120 and 120', and the shield layers 120 and 120 ' By implementing the color of the color of the fingerprint sensor 20 can be prevented from shining outside.

Here, the colored components included in the shield layers 120 and 120 ′ may be the same or similar colors as those of the portable electronic device. In one example, the colored component may have the same or similar color as the bezel 10 of the main body of the portable electronic device.

As a specific example, the colored component may be any one of white, gold, black, gray, silver, blue, pink, brown, green, yellow, and red, and the shield layers 120 and 120 'may be formed of the colored component. Some or all of them may have the same color.

By doing so, when the cover 100, 100 'for the fingerprint recognition sensor according to the present invention is applied to a portable electronic device and attached to one surface of the fingerprint recognition sensor 20, the shield layers 120 and 120 through the ceramic element 110 in a transparent state. Even if the color of ') is reflected to the outside, the same or similar color as that of the bezel 10 may be exposed to increase the unity of the overall color of the portable electronic device.

In this case, the adhesive component included in the shield layers 120 and 120 ′ may be expressed only under predetermined conditions. In one example, the adhesive component may be an adhesive component that is expressed when the adhesive force is not expressed at room temperature and is pressed at a predetermined temperature or more.

Specifically, the adhesive component may be a thermosetting adhesive component that exists in a solid state without adhesive force at room temperature and is expressed when the adhesive force is expressed at a temperature of 50 ° C. or higher.

To this end, the thermosetting adhesive component may include a curable component. Here, the curable component may be used without any known curable component, is easy to adhere to the EMC mold, excellent adhesion and does not peel off after adhesion, components that do not physically or chemically affect the fingerprint sensor are used. Can be.

In one example, the curable component may be a thermosetting adhesive component known in the art. Here, the thermosetting adhesive component may mean a component that curing may occur through an appropriate heat application or aging process.

The curable component includes, for example, one or more functional groups or moieties capable of curing by heat such as glycidyl group, isocyanate group, hydroxyl group, carboxyl group or amide group, etc. And one or more functional groups or moieties that can be cured by light irradiation, such as epoxide groups, cyclic ether groups, sulfide groups, acetal groups, or lactone groups. Ingredients to make can be used.

The curable component may include, but is not limited to, an acrylic component, a polyester component, an isocyanate component, a urethane component, a phenol component or an epoxy component having at least one or more of the above-described functional groups or sites.

For example, the epoxy component is a glycidyl ether type epoxy component, glycidyl amine type epoxy component, glycidyl ester type epoxy component, linear aliphatic epoxy component, cycloaliphatic epoxy component, It may include a heterocyclic containing epoxy component, a substituted epoxy component, naphthalene-based epoxy component and derivatives thereof, and may be a bi- or polyfunctional component, these may be used alone or in combination.

More specifically, the glycidyl ether type epoxy component may include glycidyl ether of phenols and glycidyl ether of alcohols. At this time, the glycidyl ethers of the phenols such as bisphenol A type, bisphenol B type, bisphenol AD type, bisphenol S type, bisphenol F type and resorcinol, such as bisphenol epoxy, phenol novolac epoxy, aralkyl Phenolic novolacs such as phenol novolac, terpene phenol novolac, cresol novolac epoxy components such as o-cresolnovolac epoxy, and the like, and these may be used alone or in combination of two or more.

Further, as the glycidyl amine type epoxy component, diglycidyl aniline, tetraglycidyl diaminodiphenylmethane, N, N, N ', N'-tetraglycidyl-m-xylylenediamine, 1 , 3-bis (diglycidylaminomethyl) cyclohexane, triglycidyl-m-aminophenol and triglycidyl-p-aminophenol having both structures of glycidyl ether and glycidylamine, These can be used individually or in combination of 2 or more types.

The glycidyl ester type epoxy component may be an epoxy component such as hydroxycarboxylic acid such as p-hydroxybenzoic acid or β-hydroxy naphthoic acid and polycarboxylic acid such as phthalic acid or terephthalic acid, and may be used alone or in combination of two or more thereof. can do. As the linear aliphatic epoxy component, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, cyclohexanedimethanol, glycerin, trimethylolethane, thirimethylolpropane, pentaerythritol, dodecahydro bisphenol A And glycidyl ethers based on dodecahydro bisphenol F, ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, and the like, and may be used alone or in combination of two or more thereof.

Examples of the alicyclic epoxy component include 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate.

Naphthalene-based epoxy components include 1,2-diglycidyl naphthalene, 1,5-diglycidylnaphthalene, 1,6-diglycidylnaphthalene, 1,7-diglycidylnaphthalene, 2,7-di It may be an epoxy component having a naphthalene skeleton such as glycidyl naphthalene, triglycidyl naphthalene, 1,2,5,6-tetraglycidyl naphthalene, and may be used alone or in combination of two or more thereof.

In addition to those enumerated above, triglycidyl isocyanurate and an epoxy component having an epoxycyclohexane ring in a molecule obtained by oxidizing a compound having a plurality of double bonds in the molecule may be used.

Such an epoxy component may vary in kind and blending ratio included according to the purpose, and is not particularly limited in the present invention.

Meanwhile, the thermosetting adhesive component may further include a curing agent, a curing accelerator, a binder component, and the like, in addition to the above-mentioned curable component, a solvent for dissolving or dispersing them.

First, the solvent may disperse the above-mentioned curable component, a solvent known in the art that the drying time of the solvent is not too long, may be used as a non-limiting example, methyl ethyl ketone (MEK), acetone , Toluene, dimethylformamide (DMF), methylcellosolve (MCS), tetrahydrofuran (THF) or N-methylpyrrolidone (NMP), and the like, or a mixture of two or more thereof. It doesn't happen.

Next, an appropriate kind may be selected and used according to the kind of the functional group contained in the above-mentioned curable component, and a conventionally known hardener may be used. If the curable adhesive component is an epoxy component, a curing agent that can be used therein includes, but is not limited to, aliphatic amines such as diethylenetriamine, triethylenetetramine, metaphenylenediamine, diaminodiphenylmethane, Polyhydric hydroxy compounds such as aromatic amines such as diaminodiphenyl sulfone and azomethylphenol, phenol novolak resins, orthocresol novolak resins, naphthol novolak resins and phenol aralkyl resins, and modified substances thereof, phthalic anhydride, Acidic anhydride curing agents such as maleic anhydride, hexahydrophthalic anhydride, pyromellitic anhydride, latent curing agents such as dicyandiamide, imidazole, BF3-amine complexes, and guanidine derivatives, and these alone or in combination of two or more thereof. Can be used.

In addition, the curing accelerator serves to adjust the curing rate or the properties of the cured product, and can be used without limitation as a conventional curing accelerator as the curing accelerator, non-limiting examples, imidazole-based curing accelerator, tertiary An amine hardening accelerator etc. can be used.

Although it does not specifically limit as said imidazole series hardening accelerator, For example, 1-cyanoethyl- 2-phenylimidazole which protected the 1 position of imidazole by the cyano ethyl group, or isocyanuric acid is basic. The protected brand name "2MA-0K" (made by Shikoku Kasei Kogyo Co., Ltd.), etc. are mentioned. These imidazole series hardening accelerators can be used individually or in combination of 2 or more types.

As shown in FIG. 1, the shield layer 120 may be formed as a single layer and stacked on one surface of the ceramic element 110. That is, the shield layer 120 may prevent the fingerprint recognition sensor 20 from being exposed or reflected to the outside through the ceramic element 110 and may be attached to one surface of the fingerprint recognition sensor 20 under a predetermined condition. It may be provided to have a complex function expressing the adhesion. For example, the shield layer 120 may be a form in which the above-described colored component and the thermosetting adhesive component are mixed, and may include a form containing a known dispersant.

As another example, the shield layer 120 ′ may have a form in which a colored layer 121 and an adhesive force applying layer 122 are sequentially stacked on one surface of the ceramic body 110 as shown in FIG. 2. . In this case, the colored layer 121 may be a colored paint layer containing the above-described colored component and serves to prevent the fingerprint recognition sensor 20 from shining outside by lowering light transmittance through the colored component. Can be done.

In addition, the adhesive force applying layer 122 includes the above-mentioned thermosetting adhesive component, thereby exhibiting adhesiveness upon heating and pressing, so that the fingerprint recognition sensor cover 100 ′ according to the present invention is placed on the fingerprint recognition sensor 20 side. In addition to the thermosetting adhesive component, the adhesive force applying layer 122 may further include a known dispersant.

On the other hand, the above-described shield layer (120, 120 ') may be an inorganic material type is implemented in a liquid or gel form to a predetermined thickness on one surface of the ceramic element 110, it is implemented in the form of a sheet through the adhesive layer It may also be in the form attached to one surface of the ceramic element 110. Such shield layers 120 and 120 'may be a printed layer formed through a known silk screen process, but are not limited thereto. If the shield layers 120 and 120' may be integrally laminated on one surface of the ceramic element 110 by a method such as coating or attaching, Note that all of the methods can be applied.

Alternatively, the shield layer 220 may be a deposition layer formed of a thin film on one surface of the ceramic element 110, and more preferably, may be a deposition layer formed by thermal evaporation or electron beam evaporation. Here, the shield layer 220 may have a colored color, and the colored color may be any one of white, gold, black, gray, silver, blue, pink, brown, green, yellow, and red. have.

That is, the cover 200 for the fingerprint sensor according to the present embodiment has a shield layer 220 for preventing the fingerprint sensor 20 from shining on one surface of the ceramic body 110 in the form of a thin film through a deposition process. By being deposited, the fingerprint sensor 20 may be prevented from being reflected to the outside while increasing the reliability of the product.

Specifically, when the shield layer 220 is formed as a coating layer on one surface of the ceramic body 110 through a silk screen process, the coating layer may be simply applied to one surface of the ceramic body 110. Accordingly, when a long time passes, the coating layer may be detached from the surface of the ceramic element 110 or discoloration may occur. However, when the shield layer 220 is formed as a deposition layer through a deposition process, detachment or discoloration may be prevented even if a long time passes.

In the deposition process, since the precursor of the thin film is adsorbed on the surface of the ceramic element 110 or is deposited by evaporation or sputtering in a vacuum state, the bonding force between the ceramic element 110 and the deposition material is relatively superior to that of the silk screen process. Because.

Here, the deposition method that can be applied to the present invention may be known chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD) and the like, the physical vapor deposition method is sputtering, electron beam deposition, thermal deposition, Laser molecule beam deposition, pulsed laser deposition, or the like.

At this time, the material for forming the shield layer 220 may be any known material used in the deposition method, it may be a known insulating material capable of deposition while having a colored color.

This is to prevent the driving signal generated from the fingerprint recognition sensor 20 from being distorted by the conductive material when the shield layer 220 is made of a conductive material, thereby reducing the recognition rate and accuracy of the fingerprint recognition sensor 20. . In addition, the deposition material forming the shield layer 220 may have a colored color to prevent the fingerprint recognition sensor 20 from being exposed to the outside.

For example, the deposition material for forming the shield layer 220 may be general ceramics such as boride ceramics, carbide ceramics, fluoride ceramics, nitrides ceramics, oxide ceramics, etc., as well as Selenides ceramics, Silicides ceramics, Sulfides ceramics, Tellurides ceramics. , AZO, Cr-SiO, CIGS, ITO, IGNO, GaAs, Ga-P, In-SB, InAs, InP, InSn, LSMO, NA ₃ AlF ₆ , YBCO, LCMO, YSZ and the like. However, the deposition material is not limited thereto, and it is understood that all known materials capable of being deposited while being insulative may be used.

On the other hand, the fingerprint sensor 100 (100 ', 200) for the above-described fingerprint anti-fingerprint layer 130 is formed on one surface of the ceramic body 110 can prevent slip and scratches.

Such an anti-fingerprint layer 130 may be a known anti-fingerprinting (AF) coating layer for preventing the occurrence of scratches and fingerprints. For example, the anti-fingerprint layer 130 may be a fluorine-based or silicon-based to have anti-fingerprint and antifouling properties.

On the other hand, the

fingerprint sensor cover

300, 400, 400 'according to another embodiment of the present invention may include a ceramic body 210 and the fingerprint prevention layer 130 as shown in Figs.

The ceramic body 210 may be a plate-like sheet having a predetermined area and thickness. For example, the ceramic body 210 may be a body formed by sintering a green sheet made of a ceramic slurry.

In the present invention, the ceramic slurry may be a slurry in which fine ceramic powder is mixed with an aqueous or non-aqueous solvent and a binder, a plasticizer, a dispersant, an antifoaming agent, a surfactant, and the like at an appropriate ratio. In addition, the ceramic element 210 may be formed through sintering after the ceramic slurry is coated to a predetermined thickness on a substrate (not shown) to form a green sheet.

In addition, the ceramic powder constituting the ceramic body 210 may include one or more selected from the group consisting of zirconia, alumina, TiC, TIN, TiCN, and combinations thereof, but is not limited thereto. Note that any powder can be used.

In addition, the ceramic element 210 may be a single layer sheet having a predetermined area and thickness, as shown in FIG. 4, and as illustrated in FIGS. 6 to 8, the plurality of

sheets

111, 112, and 113 are multilayered in two or more layers. It may be a multilayer sheet laminated with.

In addition, when the ceramic body 210 is formed of a multilayer sheet, the plurality of

sheets

111, 112, and 113 may be made of the same material or different materials.

That is, the

cover

300, 400, 400 'for the fingerprint recognition sensor according to the present embodiment is made of a ceramic element 210 having a predetermined dielectric constant and is disposed in front of the fingerprint recognition sensor 20 to generate the fingerprint recognition sensor 20. The driving signal may crowd the electric force lines directed toward the fingerprint recognition sensor 20 through the user's finger. Through this, the recognition rate and accuracy of the fingerprint recognition sensor 20 can be improved.

Meanwhile, the ceramic body 210 may be provided to have various shapes as shown in FIG. 9. For example, the ceramic element 210 may have a polygonal shape such as a triangular shape or a square shape, as well as a round shape or an oval shape, and a shape in which at least a part of the edge of the entire border includes a curved line, such as a polygonal shape whose edge is curved. Can have

At this time, the side of the ceramic element 210 may be formed of two parts having different surface roughness.

Specifically, the ceramic body 210 may have the same shape as the cover for the fingerprint sensor, which is a final product, and the side surfaces of the ceramic body 210, which are cut surfaces, have a predetermined area, and have a first area A1 and a second area. The surface roughness of the first region A1 and the surface roughness of the second region A2 may be formed to have different surface roughness (see FIG. 5).

Here, the sum of the area corresponding to the first area A1 and the area corresponding to the second area A2 may be the total area of one side of the ceramic element 210, and the first area A1. And the second region A2 may be separated from each other by a virtual straight line L formed along the side surface of the ceramic element 210 in the middle or thickness of the ceramic element 210. Accordingly, in the ceramic body 210, a part of the thickness t1 of the total thickness t corresponding to the first region A1 may form an upper side surface and may correspond to the second region A2. The remaining thickness t2 may form the lower side surface of the ceramic element 210.

In this case, the width or thickness t1 of the first region A1 may have the same size as or different from the width or thickness t2 of the second region A2. In addition, an imaginary straight line L separating the first area A1 and the second area A2 may be formed along the middle of the height or the middle of the thickness of the sheet constituting the ceramic element 210. When the ceramic body 210 is formed of a multilayer sheet, the ceramic body 210 may be formed to coincide with a boundary line between the

sheets

111, 112, and 113 stacked on each other.

For example, the ceramic body 210 may be partially cut to a thickness t1 corresponding to the first region A1 through primary cutting before sintering, thereby forming the upper side surface, and secondary cutting after sintering. The lower side surface may be formed by cutting the remaining portion corresponding to the thickness t2 corresponding to the second region A2.

Here, the primary cutting may be a punching process through a mold, and the secondary cutting may be various known cutting processes such as laser and sawing. Accordingly, the upper side surface may be the punching surface by the punching process, the lower side may be a cutting surface formed through various cutting methods, and the lower side surface may be the punching surface formed by the punching process like the upper side surface.

Accordingly, the ceramic element 210 may have different surface roughness by cutting the thickness t1 and the remaining thickness t2 of the entire thickness before and after sintering. That is, the ceramic body 210 may have a relatively small surface roughness compared to the lower side formed through the second cutting after sintering in the flexible state before the sintering.

On the other hand, the ceramic element 210 according to the present embodiment may include a colored pigment to have a desired color. Through this, the

final product cover

300, 400, 400 'for the fingerprint sensor may have at least one color.

Here, the colored pigment may have any one color of white, gold, black, gray, silver, blue, pink, brown, green, yellow, red, and the same as the color of the bezel 10 of the portable electronic device. Or similar colors may be used.

Through this, as illustrated in FIG. 10, when the

cover

300, 400, 400 ′ according to the present embodiment is applied to a portable electronic device and disposed in front of the fingerprint recognition sensor 20, the colored pigment may be added. Through the ceramic element 210 in a translucent or opaque state, the fingerprint sensor 20 may be prevented from being exposed or reflected to the outside through the

cover

300, 400, or 400 ′ (see FIG. 10). In addition, one surface exposed to the outside may have a color similar or identical to the bezel 10 through the ceramic element 210, thereby increasing the unity of the overall color of the portable electronic device.

In this case, the ceramic element 210 may be a single layer sheet having one color or a multilayer sheet in which a plurality of sheets having the same color are stacked, or may be a multilayer sheet in which a plurality of sheets having different colors are stacked.

For example, when the pigment contained in the ceramic element 210 is an opaque color other than a white color such as gold, black, gray, silver, blue, pink, brown, green, yellow, red, etc., the cover 300,400,400 ' Since there is no fear that the fingerprint recognition sensor 20 disposed at the rear of the) is exposed to the outside through the

covers

300, 400, and 400 ′, a single layer sheet may be used or a plurality of sheets having the same color may be stacked.

As another example, the ceramic body 210 may have a first sheet 111 and the first sheet 111 having any one color of gold, black, gray, silver, blue, pink, brown, green, yellow and red. The second sheet 112 having a color different from that of) may be laminated and then sintered (see FIGS. 6A and 7).

Accordingly, when the cover 300,400 for the fingerprint sensor according to the present embodiment is applied to a portable electronic device, one surface of the first sheet 111 may be exposed to the outside or one surface of the second sheet 112 may be exposed to the outside. By mounting exposed, one of the two colors can be chosen to be exposed to the outside.

That is, by selecting the exposed surface of the

cover

300, 400 for the fingerprint sensor can be coupled to the side of the portable electronic device, it is possible to select a color similar or identical to the bezel 10 of the portable electronic device. Through this, one

cover

300, 400 may be selectively applied to two portable electronic devices having different colors of the bezel 10.

As another example, when one sheet 111 of the two sheets constituting the ceramic element 210 has a white color, the first sheet 111 and the second sheet 112 may be disposed between the first sheet 111 and the second sheet 112. A third sheet 113 having a different color from the first sheet 111 and the second sheet 112 may be interposed (see FIGS. 6B and 8).

This is because, when the white first sheet 111 of the plurality of sheets constituting the ceramic element 210 is mounted to be exposed to the outside, the second sheet 112 is disposed behind the white first sheet 111. This is to prevent the color of the light from passing through the first sheet 111 to the outside. For example, the third sheet 113 may be gray and preferably have a color in which white is mixed.

On the other hand, the fingerprint recognition sensor cover (300, 400, 400 ') is formed by the anti-fingerprint layer 130 on at least one surface of the ceramic body 210 can prevent the occurrence of slip and scratches.

In this case, one surface on which the anti-fingerprint layer 130 is formed may be one surface exposed to the outside, and when the ceramic body 210 is implemented as a multilayer sheet having different colors, the upper surface and the lower surface may be formed on both surfaces. It may be.

Here, the anti-fingerprint layer 130 may be a known anti-fingerprinting (AF) coating layer for preventing the occurrence of scratches and fingerprints. For example, the anti-fingerprint layer 130 may be a fluorine-based or silicon-based to have anti-fingerprint and antifouling properties.

As described above, the

cover

100, 100 ′, 200, 300, 400, 400 ′ for the fingerprint recognition sensor according to the present invention may be applied to a portable electronic device as shown in FIG. 10, and the fingerprint recognition sensor 20 embedded in the main body of the portable electronic device. It may be disposed on the front side of the.

Through this, the

cover

100, 100 ′, 200, 300, 400, 400 ′ for the fingerprint sensor may serve as a button (for example, a home button) that is an input means of a portable electronic device.

At this time, the fingerprint recognition sensor cover (200,300,400,400 ') may be fixed to one surface of the fingerprint recognition sensor 20 via a separate adhesive member 30, the fingerprint recognition sensor cover (100,100') is a predetermined In the case where the

shield layer

120, 120 ′ has adhesiveness under the conditions, the adhesive member 30 may be omitted by being directly fixed to one surface of the fingerprint recognition sensor 20 through the shield layers 120 and 120 ′.

In addition, the entire thickness of the fingerprint sensor cover (100, 100 ', 200, 300, 400, 400') according to the present invention may have a thickness of 100 ~ 150㎛, but the overall thickness is not limited to this and varies depending on the design conditions and application location Note that it may change.

Although one embodiment of the present invention has been described above, the spirit of the present invention is not limited to the embodiments set forth herein, and those skilled in the art who understand the spirit of the present invention, within the scope of the same idea, the addition of components Other embodiments may be easily proposed by changing, deleting, adding, and the like, but this will also fall within the spirit of the present invention.

Claims

In the cover disposed in front of the fingerprint sensor in contact with the user's finger,

Ceramic body; And

And a shield layer formed on one surface of the ceramic element to prevent the fingerprint sensor from shining outside and to be attached to one surface of the fingerprint sensor.
The method of claim 1,

The shield layer is a cover for a fingerprint sensor comprising a colored component and an adhesive component.
The method of claim 2,

The shield layer is a fingerprint recognition sensor cover formed of a single layer.
The method of claim 2,

The shield layer includes a colored layer formed on one surface of the ceramic element to prevent the fingerprint sensor from being reflected to the outside by including the colored component, and the adhesive component is formed to be laminated on one surface of the colored layer. Cover for fingerprint recognition sensor comprising an adhesive layer.
The method of claim 2,

The adhesive component is a cover for fingerprint recognition sensor is a thermosetting adhesive component that exhibits adhesiveness at a high temperature of 50 ℃ or more.
The method of claim 5,

The thermosetting adhesive component includes a curable component and a binder component, wherein the curable component is one of an acrylic component, a polyester component, an isocyanate component, a urethane component, a phenol component and an epoxy component having at least one functional group or a site group that can be cured by heat. Cover for fingerprint sensor comprising at least one selected.
The method of claim 1,

The ceramic body is a cover for a fingerprint sensor comprising at least one of zirconia, alumina, TiC, TIN and TiCN.
The method of claim 1,

The shield layer is a part or the whole cover for the fingerprint sensor having a color of any one of white, gold, black, gray, silver, blue, pink, brown, green, yellow and red.
The method of claim 1,

The cover for the fingerprint sensor is formed on one surface of the ceramic element is a fingerprint layer.
In the cover disposed in front of the fingerprint sensor in contact with the user's finger,

Ceramic body; And

And a colored shield layer formed on one surface of the ceramic element and formed through a deposition process to prevent the fingerprint sensor from shining outside.
In the cover disposed in front of the fingerprint sensor in contact with the user's finger,

It includes; ceramic element;

The ceramic body is a cover for a fingerprint sensor is a sintered body after a plurality of sheets having different colors are laminated in a multi-layer.
The method of claim 11,

The plurality of sheets is a cover for a fingerprint sensor is a sheet containing a colored pigment.
In the cover disposed in front of the fingerprint sensor in contact with the user's finger,

It includes; ceramic element;

The ceramic body is a cover for a fingerprint sensor is formed to have a first region and a second region having different surface roughness on the side.
The method of claim 13,

The first region is a punching surface formed by the punching, and the second region is a cutting surface formed by a cutting process except the punching cover.
A mobile device body;

A fingerprint recognition sensor embedded in the mobile device main body; And

A portable electronic device comprising; a cover for a fingerprint recognition sensor according to any one of claims 1 to 14, which is disposed on the front side of the fingerprint recognition sensor.