CN205442900U - Heavy copper waste water decoppering processing system of chemistry - Google Patents
Heavy copper waste water decoppering processing system of chemistry Download PDFInfo
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- CN205442900U CN205442900U CN201521081143.6U CN201521081143U CN205442900U CN 205442900 U CN205442900 U CN 205442900U CN 201521081143 U CN201521081143 U CN 201521081143U CN 205442900 U CN205442900 U CN 205442900U
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Abstract
The utility model provides a heavy copper waste water decoppering processing system of chemistry, it includes the equalizing basin that connects gradually through the pipeline, little electrolytic reaction pond, pH adjusting pool, flocculation basin, buffer pool and MCR pond. The utility model discloses a replacing the method of tradition plus broken twine agent with little electrolytic reaction, need not plus broken twine agent, stability is splendid with broken twine effect. With the substituted sedimentation tank in MCR pond, it is extremely stable to go out the water effect, and does not receive the influence of factors such as quality of water is undulant, reaction effect is not good, still need not to throw with a large amount of flocculating agents. Return sludge to the flocculation basin in MCR pond has further reduced throwing of flocculating agent and has added, saves reagent cost. The utility model discloses stability is strong, and resistant load shock is good to greatly reduced intensity of labour, improved the treatment effeciency, the production demand corresponds to reality.
Description
Technical field
This utility model relates to technical field of sewage, particularly relates to a kind of electroless copper plating waste water copper removal processing system.
Background technology
Electroless copper is commonly called as heavy copper, is self catalysed oxidation reduction reaction a kind of.First by Treatment with activating agent, make the particle of insulating substrate surface adsorption last layer activity, usual is Metal Palladium particle, first copper ion is reduced on the Metal Palladium particle of these activity, and the metallic copper nucleus that these are reduced itself becomes the Catalytic Layer of copper ion, the reduction reaction of copper is made to continue to carry out on the copper nucleating surface that these are new.At present electroless copper plating is widely used in PCB manufacturing industry, along with and come is the generation of a large amount of electroless copper plating waste water.
Owing to forming complex state copper Cu-EDTA containing strong chelating agent EDTA, EDTA with copper in these waste water, the stability of this Cu-EDTA is high, uses traditional dosing precipitation copper removal technique that copper can not be made to form precipitate, does not the most just reach the purpose of copper removal.For the process of electroless copper plating waste water, primary process is exactly contact break, will abolish the Cu-EDTA of complex state, makes copper ion free out, then is precipitated by copper in sedimentation tank by dosing precipitation copper removal technique, or the precipitate of direct formation copper after contact break.
Conventional Cu-EDTA contact break technique has: (1) passes through ferrous sulfate contact break, and ferrous ion occurs displacement reaction with Cu-EDTA, forms Fe-EDTA, makes copper ion free out；(2) by adding sodium sulfide or agent contact break of recapturing, sodium sulfide or the agent of recapturing of input can be formed more higher precipitate than the Cu-EDTA coefficient of stability with copper, and copper is directly robbed from Cu-EDTA and dispossessed by this medicament；(3) by advanced oxidation contact break, under suitable condition, EDTA Oxidative demage is fallen by advanced oxidation agent so that it is loses the ability of complexation, is discharged by copper ion.
Three of the above technique is Cu-EDTA contact break technique more common in electroless copper plating waste water processes, and these three technological principle is different, but has a common ground to be both needed to additional contact break medicament.Owing to waste water quality exists certain fluctuation, the additional pharmaceutical quantities of different quality is the most different, and it is more difficult that additional contact break pharmaceutical quantities controls, and is generally individually that excess adds, medicament can be caused to waste even secondary pollution (such as sulfide).All there is the problems such as adaptability is poor, resistance to overload shock is poor, relatively costly in the most additional contact break medicament.
In addition; traditional electroless copper plating waste water is after carrying out contact break process; after being all the precipitate being formed copper by dosing; add after substantial amounts of flocculant is allowed to form bigger flco; then enter back into and sedimentation tank carries out precipitation removal; said method is not good enough by reaction effect, form the factors such as flco is more in small, broken bits, sedimentation function is bad, not timely spoil disposal, load are excessive is affected, and can frequently result in sedimentation tank outlet effect bad, and water outlet exceeds standard.
Utility model content
In consideration of it, the purpose of this utility model is to provide a kind of electroless copper plating waste water copper removal processing system, this system can be substantially reduced copper removal processing cost, and have extremely strong Technological adaptability.
For solving above-mentioned technical problem, this utility model adopts the following technical scheme that a kind of electroless copper plating waste water copper removal processing system, and it includes regulating reservoir, micro-electrolysis reaction pond, pH adjustment pond, flocculation basin, Buffer Pool and the MCR pond being sequentially connected with by pipeline.
Wherein, regulating reservoir is for receiving the electroless copper plating waste water from production line discharge, and the fully regulating water quality water yield.Further, elevator pump also it is equiped with at the discharge outlet of regulating reservoir.
For ensureing the Optimal pH that micro-electrolysis reaction pond is fully reacted, it is provided with for sulphuric acid and the well-mixed pipe-line mixer of waste water on pipeline between regulating reservoir and micro-electrolysis reaction pond, this pipe-line mixer is allowed to the pH value before microelectrolysis processing for the addition regulating sulphuric acid and reaches 3～4, and the dosage of sulphuric acid is automatically controlled by the pH On-line Control device being arranged on pipeline.
Micro-electrolysis reaction pond processes for the contact break realizing waste water, it includes water distribution distribution device, micro-electrolysis stuffing layer and the discharging device set gradually from the bottom to top, waste water the most successively through water distribution distribution device, micro-electrolysis stuffing layer and discharging device, eventually flows to pH and adjusts pond after regulating reservoir flows out.Preferably, the water distribution distribution device of bottom is additionally provided with carries out the trachea of aeration for accessing compressed air.
PH adjusts pond for regulating the optimal pH to flocculation reaction from the waste water after micro-electrolysis reaction pond processes.Described pH adjusts pond and is connected to the second online pH control device, and this control device reaches 8.5～9.0 for regulating the pH value of waste water in pH adjusts pond.Additionally, pH adjusts in pond is additionally provided with the first mechanical mixing apparatus, this mix and blend strength control average velocity gradient G-value 500～1000s-1。
Flocculation basin, for making the copper ion reaction in waste water form bigger flco, is additionally provided with the second mechanical mixing apparatus, this mix and blend strength control average velocity gradient G-value 30～60s in this flocculation basin-1。
Buffer Pool, for receiving the flco of flocculation basin outflow and making it form precipitation discharge under gravity, is provided with sludge bucket in this Buffer Pool, it is preferred that sludge bucket is also arranged above baffles.After waste water enters Buffer Pool, major part cupric precipitate precipitates at this, and the mud discharge line bottom sludge bucket is discharged.
MCR pond is for carrying out advanced treating to the waste water discharged from Buffer Pool, submerged ultrafiltration assembly it is provided with in pond, the sludge reflux pipeline being connected to flocculation basin it is provided with bottom MCR pond, this pipeline includes sludge reflux pump, it is arranged on sludge reflux pump and extends to the connecting tube bottom MCR pond, and be arranged on sludge reflux pump and be connected to the reflux line of flocculation basin.Waste water discharges via after being extracted out by suction pump after submerged ultrafiltration component filters, and mud is then trapped in pond inner bottom part.Preferably, the mud retained is back to flocculation basin by sludge reflux pump, can reduce adding of flocculant further, saves reagent cost.
A kind of electroless copper plating waste water copper removal processes technique, uses above-mentioned electroless copper plating waste water copper removal processing system, and it comprises the steps:
Step (1), adds sulphuric acid in waste water, and regulation wastewater pH is to 3～4.
Step (2), the waste water after step (1) being processed is delivered to micro-electrolysis reaction pond, discharges after aeration and micro-electrolysis stuffing process；Concrete, the micro-electrolysis reaction pool inner water power time of staying is 1～2h, and micro-electrolysis stuffing controlled 30～60min with the response time of waste water.Additionally, micro-electrolysis stuffing layer can be divided into 1～3 layer, the height 0.5～1.5m of every layer, compressed air aeration intensity 5～8L/s.m2。
Step (3), the waste water after processing through step (2) is delivered to pH and adjusts pond, adds sodium hydroxide so that it is pH controls 8.5～9.0, and it is 10～15min that pH adjusts the hydraulic detention time in pond.
Step (4), the waste water after step (3) being processed is delivered in flocculation basin, adds high polymer coagulant, and the dosage of high polymer coagulant is based on 2～5mg/L, and flocculation basin hydraulic detention time controls 20～40min.
Step (5), waste water after step (4) processes is delivered to Buffer Pool, the time of staying is 60～90min, this step makes the natural sedimentation under gravity of the flco in waste water, most cupric precipitate is discharged from sludge bucket after declining, and least a portion of cupric medium flows into MCR pond with waste water.
Step (6), the waste water with cupric medium enters MCR pond, and the time of staying is 30～60min, discharges after being extracted out by suction pump after submerged ultrafiltration component filters, and mud is then trapped in pond inner bottom part.
Preferably, before step (1), also include the water quality by regulating reservoir regulation electroless copper plating waste water and the step of the water yield.
Preferably, in step (1) and step (3), the dosage of sulphuric acid and sodium hydroxide can be automatically adjusted by online pH control device according to the real-time change of pH value in pond.
Preferably, any one during high polymer coagulant is sodium polyacrylate, polyacrylamide, poly styrene sulfonate, polyethylene glycol oxide.
The beneficial effects of the utility model: this utility model is by the method replacing traditional additional contact break agent with micro-electrolysis reaction, it is not necessary to additional contact break agent, stability and contact break effect are superior to conventional processes.Additionally, replace sedimentation tank with MCR pond, outlet effect is extremely stable, and is not affected, also without adding a large amount of flocculant by factors such as variation water quality, reaction effect are the best.The sludge reflux in MCR pond, to flocculation basin, further reduces adding of flocculant, saves reagent cost.
This utility model improves outlet effect greatly, it is to avoid conventional processes poor stability, and medicament input amount is big, and the problem that resistance to overload shock is poor, greatly reduces labor intensity, improves treatment effeciency, meets actual production demand.
Illustrate below in conjunction with accompanying drawing and embodiment, this utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, 1, regulating reservoir；2, micro-electrolysis reaction pond；3, pH adjusts pond；4, flocculation basin；5, Buffer Pool；6, MCR pond；7, elevator pump；8, pipe-line mixer；9, the first online pH controls device；10, trachea.11, the 3rd mechanical mixing apparatus；21, water distribution distribution device；22, micro-electrolysis stuffing layer；23, discharging device；31, the first mechanical mixing apparatus；32, the second online pH controls device；41, the second mechanical mixing apparatus；51, sludge bucket；52, baffles；61, hyperfiltration membrane assembly；62, suction pump；63, sludge reflux pump；64, return duct；65, connecting tube.
Detailed description of the invention
Below in conjunction with specific embodiment, this utility model is further expanded description; but it is to be noted; the present embodiment is implemented under premised on technical solutions of the utility model; give detailed embodiment and concrete operating process, but protection domain of the present utility model is not limited to following embodiment.
Embodiment:
As it is shown in figure 1, a kind of electroless copper plating waste water copper removal processing system, adjust pond 3, flocculation basin 4, Buffer Pool 5 and MCR pond 6 including regulating reservoir 1, micro-electrolysis reaction pond 2, pH.
Wherein, regulating reservoir 1 is for receiving the electroless copper plating waste water from production line discharge, and the fully regulating water quality water yield.For preventing the precipitation of waste water internal contamination thing, inside regulating reservoir 1, it is additionally provided with the 3rd mechanical mixing apparatus 11.Also being equiped with elevator pump 7 at the discharge outlet of regulating reservoir 1, this elevator pump 7 is connected to micro-electrolysis reaction pond 2 by pipeline.
Being provided with on pipeline between elevator pump 7 and micro-electrolysis reaction pond 2 and add to regulate the pipe-line mixer 8 of pH value of waste water for sulphuric acid, sulphuric acid dosage is automatically controlled by the pH On-line Control device 9 being arranged on this pipeline.
Water distribution distribution device 21, micro-electrolysis stuffing layer 22 and discharging device 23 it is sequentially provided with from the bottom to top in micro-electrolysis reaction pond 2.In micro-electrolysis reaction pond, waste water is intake by bottom, top water outlet, and bottom is concurrently accessed the trachea 10 that voltage supply stream of compressed air is logical.
Micro-electrolysis reaction pond 2 water outlet flows into pH and adjusts pond 3, sodium hydroxide is added in pH adjusts pond 3, the addition of sodium hydroxide controls device 32 automatic feeding by the second online pH, arranges the first mechanical mixing apparatus 31, its mix and blend strength control average velocity gradient G-value 500-1000s in this pond-1。
PH adjusts pond 3 water outlet and flows into flocculation basin 4, and in flocculation basin, 4 add high polymer coagulant, and the dosage of high polymer coagulant is based on 2～5mg/L.Flocculation basin hydraulic detention time controls, 20～40min, to arrange the second mechanical mixing apparatus 41 in this pond, its mix and blend strength control average velocity gradient G-value 30～60s-1。
Flocculation basin waste water automatically flows into Buffer Pool 5, sludge bucket 51 it is provided with in Buffer Pool, for accelerating the sedimentary natural sedimentation of cupric in waste water, it is additionally provided with a baffles 52 near water inlet position above sludge bucket 51, after waste water enters Buffer Pool, major part mud precipitates at this, mud is discharged via sludge bucket, the Buffer Pool time of staying 60～90min.
Waste water behind buffered pond flows into MCR pond 6, the MCR pond time of staying 30～60min, submerged ultrafiltration assembly 61 it is provided with in pond, waste water discharges after being extracted out by suction pump 62 after filtering via submerged ultrafiltration assembly 61, mud is then trapped in pond, the mud retained is back to flocculation basin 4 by sludge reflux pump 63 through return duct 64, and one end of connecting tube 65 is arranged on sludge reflux pump, and the other end extends to retaining at mud bottom MCR pond.
Claims (9)
1. an electroless copper plating waste water copper removal processing system, it is characterised in that: include the regulating reservoir being sequentially connected with by pipeline, it is achieved the micro-electrolysis reaction pond that waste water contact break processes, pH adjusts pond, flocculation basin, Buffer Pool and MCR pond；
Wherein, described regulating reservoir is for receiving the electroless copper plating waste water from production line discharge, and fully regulating water quality and the water yield；Micro-electrolysis reaction pond includes water distribution distribution device, micro-electrolysis stuffing layer and the discharging device arranged from lower to upper along the waste water flow direction；PH adjusts pond for regulating the optimal pH to flocculation reaction from the waste water after micro-electrolysis reaction pond processes；Flocculation basin is used for so that Cu in waste water ion fully reacts formation flco；Described Buffer Pool is used for making above-mentioned flco form precipitation under gravity and discharges, and is provided with sludge bucket in Buffer Pool, and the bottom of sludge bucket connects mud discharge line, and Buffer Pool is provided above being connected to the outlet in MCR pond；MCR pond, for the waste water discharged from Buffer Pool is carried out advanced treating, is provided with submerged ultrafiltration assembly in pond, the discharge outlet of this submerged ultrafiltration assembly connects the suction pump realizing discharge of wastewater.
2. electroless copper plating waste water copper removal processing system as claimed in claim 1, it is characterized in that: being provided with for sulphuric acid and the well-mixed pipe-line mixer of waste water on the pipeline between described regulating reservoir and micro-electrolysis reaction pond, this pipe-line mixer is allowed to the pH value before microelectrolysis processing for the addition regulating sulphuric acid and reaches 3～4；Pipeline is also associated with realizing a pH On-line Control device of sulphuric acid automatic feeding.
3. electroless copper plating waste water copper removal processing system as claimed in claim 1, it is characterised in that: it is additionally provided with, on described water distribution distribution device, the trachea carrying out aeration for accessing compressed air.
4. electroless copper plating waste water copper removal processing system as claimed in claim 1, it is characterised in that: described pH adjusts pond and is connected to the second online pH control device, and this control device reaches 8.5～9.0 for regulating the pH value of waste water in pH adjusts pond.
5. electroless copper plating waste water copper removal processing system as claimed in claim 1, it is characterised in that: described pH adjusts in pond and is additionally provided with the first mechanical mixing apparatus, the mix and blend strength control average velocity gradient G-value 500～1000s of this first mechanical mixing apparatus-1；Described flocculation basin is additionally provided with the second mechanical mixing apparatus, the mix and blend strength control average velocity gradient G-value 30～60s of this second mechanical mixing apparatus-1。
6. electroless copper plating waste water copper removal processing system as described in any one of claim 1 to 5, it is characterized in that: bottom described MCR pond, be provided with the sludge reflux pipeline being connected to flocculation basin, this pipeline includes sludge reflux pump, it is arranged on sludge reflux pump and extends to the connecting tube bottom MCR pond, and be arranged on sludge reflux pump and be connected to the return duct of flocculation basin.
7. electroless copper plating waste water copper removal processing system as claimed in claim 6, it is characterised in that: described sludge bucket is also arranged above baffles.
8. electroless copper plating waste water copper removal processing system as claimed in claim 6, it is characterised in that: it is additionally provided with elevator pump at the discharge outlet of described regulating reservoir.
9. electroless copper plating waste water copper removal processing system as claimed in claim 6, it is characterised in that: it is additionally provided with the 3rd mechanical mixing apparatus in described regulating reservoir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201521081143.6U CN205442900U (en) | 2015-12-21 | 2015-12-21 | Heavy copper waste water decoppering processing system of chemistry |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201521081143.6U CN205442900U (en) | 2015-12-21 | 2015-12-21 | Heavy copper waste water decoppering processing system of chemistry |
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| CN205442900U true CN205442900U (en) | 2016-08-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105439335A (en) * | 2015-12-21 | 2016-03-30 | 广东水清环保科技有限公司 | Chemical copper precipitation wastewater copper removing treatment process and chemical copper precipitation wastewater copper removing treatment system |
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- 2015-12-21 CN CN201521081143.6U patent/CN205442900U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105439335A (en) * | 2015-12-21 | 2016-03-30 | 广东水清环保科技有限公司 | Chemical copper precipitation wastewater copper removing treatment process and chemical copper precipitation wastewater copper removing treatment system |
| CN105439335B (en) * | 2015-12-21 | 2018-07-31 | 广东水清环保科技有限公司 | A kind of electroless copper plating waste water copper removal treatment process and its system |
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