CN205385017U - High -efficient radiating LTCC base plate miniflow way structure - Google Patents
High -efficient radiating LTCC base plate miniflow way structure Download PDFInfo
- Publication number
- CN205385017U CN205385017U CN201521074972.1U CN201521074972U CN205385017U CN 205385017 U CN205385017 U CN 205385017U CN 201521074972 U CN201521074972 U CN 201521074972U CN 205385017 U CN205385017 U CN 205385017U
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- China
- Prior art keywords
- base plate
- ltcc
- miniflow
- substrate
- heat radiation
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Abstract
The utility model discloses a high -efficient radiating LTCC base plate miniflow way structure, it belongs to electron chip manufacture field. This high -efficient radiating LTCC base plate miniflow way structure includes the base plate, the base plate has upper surface and lower surface, is equipped with the miniflow way on the upper surface of base plate, the miniflow says to the continuous spiral structure of individual layer, is equipped with filling opening and egress opening respectively at the both ends that the miniflow was said, be equipped with mobile cooling agent between filling opening to the egress opening, wherein the base plate adopts the preparation of LTCC material, and basic plate size is 40mm40mm, the about 1.5mm of thickness. Little flow passage cross section is 0.2mm0.2mm, and the miniflow way is located 1 inside central point of base plate puts 20mm20mm department. The utility model has the advantages of heat dispersion is good, the temperature rise is little, the distribution of temperature is even to to generate heat its increase of power slow along with the chip, is applicable to large scale integrated circuit's heat dissipation.
Description
Technical field
This utility model relates to the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation, belongs to electronic chip and manufactures field.
Background technology
In the encapsulation design of chip, the research of heat management is very important link.In real life is applied, too high temperature can cause the decline of systematic function, destructurized, and stress rises, even the generation of the bad result such as thawing, evaporation.And good design structure can guarantee that product is properly functioning in life cycle.
The heat radiation of LTCC (LTCC) substrate fluid channel is the transmission being carried out heat by the flowing of coolant, is the complicated multiple physical field problem of a thermal-arrest mechanics, solid-liquid coupling.The usual heat dispersion of existing chip substrate is bad, and temperature rise is relatively big, and temperature distributing disproportionation is even, along with chip generates heat the increase of its power comparatively fast.
Summary of the invention
For overcoming the deficiencies in the prior art, this utility model provides the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation.
This utility model adopts the technical scheme that: the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation, it includes substrate, described substrate has upper and lower surface, the upper surface of substrate is provided with fluid channel, described fluid channel is monolayer continuous helical type structure, being respectively arranged at two ends with inlet and flow export in fluid channel, described inlet is provided with the coolant of flowing between flow export.
Described substrate is of a size of 40mm*40mm, the about 1.5mm of thickness.
Described fluid channel cross section is 0.2mm*0.2mm, and fluid channel is positioned at described substrate inner hub location 20mm*20mm place.
Described coolant is the aqueous water of 25 DEG C.The viscosity of aqueous water is 0.895*10-3Pa s, density is 1g/cm3, specific heat capacity is 4.2*103J/Kg, heat conductivity is 0.58W/ (m k).
Described substrate adopts LTCC material to make.
The beneficial effects of the utility model are: screw type micro-channel structure has that perfect heat-dissipating, temperature rise be little, the advantage of uniformity of temperature profile, and along with chip its power that generates heat increases slowly, it is adaptable to the heat radiation of large scale integrated circuit.Additionally because adopting the special system of LTCC (LTCC) material, reduce process complexity, improve component reliability.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present utility model.
Fig. 2 is the structural representation of fluid channel.
In figure: 1-substrate, 2-fluid channel, 3-inlet, 4-flow export.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model is described in detail.
As depicted in figs. 1 and 2, a kind of ltcc substrate micro-channel structure of high efficiency and heat radiation, it includes substrate 1, described substrate 1 has upper and lower surface, the upper surface of substrate is provided with fluid channel 2, described fluid channel 2 is monolayer continuous helical type structure, is respectively arranged at two ends with inlet 3 and flow export 4 in fluid channel 2, is provided with the coolant of flowing between described inlet 3 to flow export 4.
Substrate of the present utility model adopts LTCC material to make, and substrate 1 is of a size of 40mm*40mm, the about 1.5mm of thickness.Fluid channel 2 cross section is 0.2mm*0.2mm, and fluid channel 2 is positioned at described substrate 1 inner hub location 20mm*20mm place.Coolant is the aqueous water of 25 DEG C, and the viscosity of water is 0.895*10-3Pa s, density is 1g/cm3, specific heat capacity is 4.2*103J/Kg, heat conductivity is 0.58W/ (m k).Aqueous water flows into from inlet (inlet), flows and substrate is lowered the temperature in fluid channel, then flows out from flow export (outlet).Thermal source is in the upper surface central area of substrate, it is provided that stable heat density.
The microchannel of this utility model and five kinds of conventional different structures compares, and is multiple rows of straight trough type respectively, Serpentis type, fractal curve type, I shape and parallel Fractal Tree shape structure, and comparison structure is following table such as:
It can be seen that screw type fluid channel substrate temperature rise is very little from chart, slope is minimum, slowly improves along with chip heating power increases temperature rise, it is adaptable to the heat radiation of large scale integrated circuit.
This utility model is not directed to part and all same as the prior art prior art maybe can be adopted to be realized.
Claims (6)
1. the ltcc substrate micro-channel structure of a high efficiency and heat radiation, it is characterized in that: include substrate, described substrate has upper and lower surface, the upper surface of substrate is provided with fluid channel, described fluid channel is monolayer continuous helical type structure, being respectively arranged at two ends with inlet and flow export in fluid channel, described inlet is provided with the coolant of flowing between flow export.
2. the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation according to claim 1, it is characterised in that: described substrate is of a size of 40mm*40mm, the about 1.5mm of thickness.
3. the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation according to claim 2, it is characterised in that: described fluid channel cross section is 0.2mm*0.2mm, and fluid channel is positioned at described substrate inner hub location 20mm*20mm place.
4. the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation according to claim 1, it is characterised in that: described coolant is the aqueous water of 25 DEG C.
5. the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation according to claim 4, it is characterised in that: the viscosity of described aqueous water is 0.895*10-3Pa s, density is 1g/cm3, specific heat capacity is 4.2*103J/Kg, heat conductivity is 0.58W/ (m k).
6. the ltcc substrate micro-channel structure of a kind of high efficiency and heat radiation according to any one of claim 1 to 5, it is characterised in that: described substrate adopts LTCC material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074972.1U CN205385017U (en) | 2015-12-21 | 2015-12-21 | High -efficient radiating LTCC base plate miniflow way structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521074972.1U CN205385017U (en) | 2015-12-21 | 2015-12-21 | High -efficient radiating LTCC base plate miniflow way structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205385017U true CN205385017U (en) | 2016-07-13 |
Family
ID=56338676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521074972.1U Expired - Fee Related CN205385017U (en) | 2015-12-21 | 2015-12-21 | High -efficient radiating LTCC base plate miniflow way structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205385017U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107860247A (en) * | 2017-10-10 | 2018-03-30 | 深圳航天东方红海特卫星有限公司 | A kind of expansion hot plate that conduit is spirally distributed that exchanges heat |
| CN108882619A (en) * | 2017-05-11 | 2018-11-23 | 梅森法国Sb公司 | Refrigerating module and power converter including this refrigerating module |
-
2015
- 2015-12-21 CN CN201521074972.1U patent/CN205385017U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108882619A (en) * | 2017-05-11 | 2018-11-23 | 梅森法国Sb公司 | Refrigerating module and power converter including this refrigerating module |
| CN108882619B (en) * | 2017-05-11 | 2021-08-17 | 梅森法国Sb公司 | Cooling module and power converter comprising such a cooling module |
| CN107860247A (en) * | 2017-10-10 | 2018-03-30 | 深圳航天东方红海特卫星有限公司 | A kind of expansion hot plate that conduit is spirally distributed that exchanges heat |
| CN107860247B (en) * | 2017-10-10 | 2019-12-27 | 深圳航天东方红海特卫星有限公司 | Spiral-distributed heat-expanding plate of heat exchange channel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160713 Termination date: 20201221 |