CN205362990U - Be used for BGA chip welded ultrasonic wave vibrations structure and welding tool - Google Patents
Be used for BGA chip welded ultrasonic wave vibrations structure and welding tool Download PDFInfo
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- CN205362990U CN205362990U CN201521087081.XU CN201521087081U CN205362990U CN 205362990 U CN205362990 U CN 205362990U CN 201521087081 U CN201521087081 U CN 201521087081U CN 205362990 U CN205362990 U CN 205362990U
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- ultrasonic wave
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- bga chip
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Abstract
The utility model relates to a be used for BGA chip welded ultrasonic wave vibrations structure and welding tool, including handheld subassembly, handheld subassembly including handheld ultrasonic wave electromagnetic shaker, contact head, battery, battery cover and switch, the battery cover set up in the battery outside, the battery pass through the switch with handheld ultrasonic wave electromagnetic shaker be connected, handheld ultrasonic wave electromagnetic shaker with the contact head be connected. Adopt the be used for BGA chip welded ultrasonic wave vibrations structure and welding tool of this kind of structure, can effectively improve the welded success rate, can pull down and install various BGA chips are complete, can make every solder joint of PCB mainboard fully weld, prevent that difficult scheduling problem obstructs the welding because soldering tin that tiny dust, the impurity in the solder flux, pad oxidation arouses flows, improve the welding success rate by a wide margin, be suitable for extensive popularization and application.
Description
Technical field
This utility model relates to chip dismounting and welder technical field, particularly relates to bga chip dismounting and welder technical field, specifically refers to a kind of vibration of ultrasonic wave structure for bga chip welding and soldering appliance.
Background technology
In the process directly bga chip dismantled with BGA Rework station and weld, need during dismounting to inject scaling powder to BGA pad, generally used the air (soot blowing ball) of pressurization in the past, Xi Qiuchu toward bga chip injects, owing to the gap ratio of stannum ball is relatively fine, stannum bulb diameter divides 0.76mm, 0.6mm, 0.5mm, 0.3mm etc., more tiny stannum ball, spacing is more little, and scaling powder is difficult to injection and puts in place.
Utility model content
The purpose of this utility model is the shortcoming overcoming above-mentioned prior art, it is provided that a kind of be capable of by ultrasonic activation hand-held device allow scaling powder fully flow to pad center for bga chip welding vibration of ultrasonic wave structure and soldering appliance.
To achieve these goals, the vibration of ultrasonic wave structure for bga chip welding of the present utility model and soldering appliance have following composition:
This is used for the vibration of ultrasonic wave structure of bga chip welding, it is mainly characterized by, described structure includes hand-held device, described hand-held device includes hand-held ultrasound electromagnetic shaker, contact head, battery, battery cover and switch, described battery cover is arranged at described outside batteries, described battery is connected with described hand-held ultrasound electromagnetic shaker by described switch, and described hand-held ultrasound electromagnetic shaker is connected with described contact head.
It is preferred that described structure also includes clamp assemblies, described clamp assemblies includes clip and fixture vibration of ultrasonic wave device, described clip and fixture vibration of ultrasonic wave device and may be contained within BGA Rework station.
It is preferred that described clamp assemblies also includes control line, described fixture vibration of ultrasonic wave device is connected by the controller of described control line with BGA Rework station.
It is preferred that described contact head is plastics heat resistant contact heads.
This utility model further relates to a kind of soldering appliance, and described instrument includes the described vibration of ultrasonic wave structure for bga chip welding.
It is preferred that described soldering appliance also includes BGA Rework station, soot blowing ball, vacuum WAND, suction stannum band and scaling powder.
Have employed the vibration of ultrasonic wave structure for bga chip welding in this utility model and soldering appliance, hand-held device and clamp assemblies can be divided into, comprise the vibration of ultrasonic wave device for bga chip welding, the success rate of welding can be effectively improved, various bga chips completely can be pulled down and install, the each solder joint of PCB main board can be made fully to weld, prevent the problems such as the scolding tin flow difficulties caused due to the impurity in tiny dust, solder flux, pad oxide from hindering welding, it is greatly improved and is welded into power, be suitable to large-scale promotion application.
Accompanying drawing explanation
Fig. 1 is the structural representation of the hand-held device of the vibration of ultrasonic wave structure for bga chip welding of the present utility model and soldering appliance.
Fig. 2 is the structural representation of the clamp assemblies of the vibration of ultrasonic wave structure for bga chip welding of the present utility model and soldering appliance.
Fig. 3 is the lead jointing temperature curve of the time point used relative to vibration of ultrasonic wave device adopting instrument of the present utility model.
Accompanying drawing labelling:
1 hand-held ultrasound electromagnetic shaker
2 switches
3 battery covers
4 heat resistant plastice contact heads
5 clips
6 control lines
7 fixture vibration of ultrasonic wave devices
A lower nozzle temperature
The time point that B ultrasonic acoustic wave vibrations device uses
C upper nozzle temperature
D top and the bottom nozzle temperature
E chip bonding pad observed temperature
F preheating zone
G active region
H refluxes welding zone
Detailed description of the invention
In order to more clearly describe technology contents of the present utility model, conduct further description below in conjunction with specific embodiment.
Vibration of ultrasonic wave structure for bga chip welding of the present utility model can be divided into hand-held device and clamp assemblies, and hand-held device can assist injection scaling powder, clamp assemblies and hand-held device when BGA Reflow Soldering, can to discharge impurity, make welding more abundant.
To achieve these goals, this vibration of ultrasonic wave structure being used for bga chip welding includes hand-held device, described hand-held device includes hand-held ultrasound electromagnetic shaker 1, contact head 4, battery, battery cover 3 and switch 2, described battery cover 3 is arranged at described outside batteries, described battery is connected with described hand-held ultrasound electromagnetic shaker 1 by described switch 2, and described hand-held ultrasound electromagnetic shaker 1 is connected with described contact head 4.
In one preferably embodiment, described structure also includes clamp assemblies, and described clamp assemblies includes clip 5 and fixture vibration of ultrasonic wave device 7, described clip 5 and fixture vibration of ultrasonic wave device 7 and may be contained within BGA Rework station.
In one preferably embodiment, described clamp assemblies also includes control line 6, and described fixture vibration of ultrasonic wave device 7 is connected with the controller of BGA Rework station by described control line 6.
In one preferably embodiment, described contact head 4 is plastics heat resistant contact heads.
Soldering appliance of the present utility model includes the described vibration of ultrasonic wave structure for bga chip welding.
In one preferably embodiment, described soldering appliance also includes BGA Rework station, soot blowing ball, vacuum WAND, suction stannum band and scaling powder.
The structure of hand-held device as shown in fig. 1, is divided into the heat-resisting vibrations contact head 4 of plastics, switchs 2, small hand-held vibration of ultrasonic wave device 1, battery, battery cover 3.
The structure of clamp assemblies as shown in Figure 2, including clip 5, small fixture vibration of ultrasonic wave device 7 and control line 6.This assembly can be additional on BGA Rework station, become one of them optional feature of BGA Rework station, this assembly is to cooperate with an auxiliary device of BGA Rework station, controlled by BGA Rework station, with side radiator fan, the optional equipment such as vacuum pump together on man machine interface guidance panel side by side, a jiao of mainboard clamped by clip, several seconds are shaken, so that it may reach the effect of welding when being heated to reflow soldering and drawing to an end.During the welding of conventional chip, when arriving the coda of Reflow Soldering, with instrument, bga chip is promoted, promote the too big welding adhesion easily caused by internal tin ball.
During welding when proceeding to the backflow welding zone one minute of scolding tin, it is necessary to start vibration of ultrasonic wave circuit board clamping assembly, pad is added vibration of ultrasonic wave, it is possible to by vibration of ultrasonic wave hand-held device, add vibrations in chip local and coordinate.Under the complete molten condition of scolding tin, can effectively discharge the impurity in tiny dust, solder flux and make scolding tin fully flow, making each solder joint fully be welded.The effect promoting wicking for there being the pad of slight oxidation to have, it is prevented that the generation of rosin joint.
Preferably, the described vibration of ultrasonic wave hand-held device for bga chip welding and clamp assemblies, also include BGA Rework station (not shown), soot blowing ball (not shown), vacuum WAND (not shown), inhale stannum band (not shown), scaling powder (not shown).
In order to inject scaling powder under the bga chip reprocessed and fully weld when chip re-flow welds, in specific embodiment of the utility model, the described ultrasonic vibrating unit for bga chip welding also includes BGA Rework station (not shown), soot blowing ball (not shown), vacuum WAND (not shown), inhales stannum band (not shown), scaling powder (not shown).
When this utility model uses, process is as follows:
(1) owing to BGA is to moisture sensitive, therefore before dismounting, to check whether device makes moist, the circuit board made moist is removed moisture process.The bga chip reprocessed will be needed to tilt 45 degree placements, and the stannum ball position injection scaling powder in portion under the die, with vibration of ultrasonic wave hand-held device vibrating chip, allow scaling powder flow through the every nook and cranny of bga chip；
(2) circuit board reprocessed is put on BGA bonding machine and dismantles chip, the general size chip at 40 × 40mm is dismantled with there being plumbous temperature curve setting, set with dismounting chip temperature and start dismounting, after observed temperature reaches reflow temperature 183 DEG C one minute, start to hold chip with vacuum WAND gently and mentioned；
(3) scolding tin remaining on cleaning pad, coordinates scaling powder to remove residual stannum with inhaling stannum band, and planting ball of laying equal stress on is in order to again welding；
(4) first vibration of ultrasonic wave circuit board clamping assembly is pressed from both sides on circuit boards.During welding, when proceeding to the backflow welding zone one minute of scolding tin, it is necessary to start vibration of ultrasonic wave circuit board clamping assembly, pad is added vibration of ultrasonic wave, it is possible to by vibration of ultrasonic wave hand-held device, add vibrations in chip local and coordinate.Under the complete molten condition of scolding tin, can effectively discharge the impurity in tiny dust, solder flux and make scolding tin fully flow, making each solder joint fully be welded.The effect promoting wicking for there being the pad of slight oxidation to have, it is prevented that the generation of rosin joint.
The full name of note 1:BGA is BallGridArray (PCB of ball grid array structure), and it is a kind of package method that integrated circuit adopts organic support plate.
Note 2:PCB (PrintedCircuitBoard), Chinese is printed circuit board.
Have employed the vibration of ultrasonic wave structure for bga chip welding in this utility model and soldering appliance, hand-held device and clamp assemblies can be divided into, comprise the vibration of ultrasonic wave device for bga chip welding, the success rate of welding can be effectively improved, various bga chips completely can be pulled down and install, the each solder joint of PCB main board can be made fully to weld, prevent the problems such as the scolding tin flow difficulties caused due to the impurity in tiny dust, solder flux, pad oxide from hindering welding, it is greatly improved and is welded into power, be suitable to large-scale promotion application.
In this description, this utility model is described with reference to its specific embodiment.But it is clear that still may be made that various amendment and conversion are without departing from spirit and scope of the present utility model.Therefore, specification and drawings is regarded in an illustrative, rather than a restrictive.
Claims (6)
1. the vibration of ultrasonic wave structure for bga chip welding, it is characterized in that, described structure includes hand-held device, described hand-held device includes hand-held ultrasound electromagnetic shaker, contact head, battery, battery cover and switch, described battery cover is arranged at described outside batteries, described battery is connected with described hand-held ultrasound electromagnetic shaker by described switch, and described hand-held ultrasound electromagnetic shaker is connected with described contact head.
2. the vibration of ultrasonic wave structure for bga chip welding according to claim 1, it is characterized in that, described structure also includes clamp assemblies, and described clamp assemblies includes clip and fixture vibration of ultrasonic wave device, described clip and fixture vibration of ultrasonic wave device and may be contained within BGA Rework station.
3. the vibration of ultrasonic wave structure for bga chip welding according to claim 2, it is characterised in that described clamp assemblies also includes control line, and described fixture vibration of ultrasonic wave device is connected by the controller of described control line with BGA Rework station.
4. the vibration of ultrasonic wave structure for bga chip welding according to claim 1, it is characterised in that described contact head is plastics heat resistant contact heads.
5. a soldering appliance, it is characterised in that described instrument includes the vibration of ultrasonic wave structure for bga chip welding according to any one of Claims 1-4.
6. soldering appliance according to claim 5, it is characterised in that described soldering appliance also includes BGA Rework station, soot blowing ball, vacuum WAND, suction stannum band and scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521087081.XU CN205362990U (en) | 2015-12-23 | 2015-12-23 | Be used for BGA chip welded ultrasonic wave vibrations structure and welding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521087081.XU CN205362990U (en) | 2015-12-23 | 2015-12-23 | Be used for BGA chip welded ultrasonic wave vibrations structure and welding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205362990U true CN205362990U (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201521087081.XU Active CN205362990U (en) | 2015-12-23 | 2015-12-23 | Be used for BGA chip welded ultrasonic wave vibrations structure and welding tool |
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| CN (1) | CN205362990U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
-
2015
- 2015-12-23 CN CN201521087081.XU patent/CN205362990U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |