CN205334520U - Compound RFID label - Google Patents

Compound RFID label Download PDF

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Publication number
CN205334520U
CN205334520U CN201520963761.7U CN201520963761U CN205334520U CN 205334520 U CN205334520 U CN 205334520U CN 201520963761 U CN201520963761 U CN 201520963761U CN 205334520 U CN205334520 U CN 205334520U
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CN
China
Prior art keywords
antenna
chamber
chip
labeling
hold
Prior art date
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Active
Application number
CN201520963761.7U
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Chinese (zh)
Inventor
李杏明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Inlay Link Inc
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Shanghai Inlay Link Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Shanghai Inlay Link Inc filed Critical Shanghai Inlay Link Inc
Priority to CN201520963761.7U priority Critical patent/CN205334520U/en
Application granted granted Critical
Publication of CN205334520U publication Critical patent/CN205334520U/en
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Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a compound RFID label, including last labeling, lower labeling, chip and antenna, the chip is connected with the antenna the lower surface of going up the labeling has been offered first antenna and has been held the chamber middle part that first antenna holds the chamber has been offered first chip and has been held the chamber down the upper surface of labeling is offered and is held the corresponding second antenna in chamber with first antenna and hold the chamber the middle part that the second antenna holds the chamber is offered the second chip that holds the chamber corresponding with first chip and is held the chamber, go up the labeling lid and establish and stick in the suffix, make first antenna hold chamber and second antenna and hold the chamber and match and form an antenna that holds the antenna and hold the chamber, make first chip hold chamber and second chip and hold the chamber and match and form a chip that holds the chip and hold the chamber the chip holds the intracavity and is equipped with resistant high temperature protection glue. The utility model relates to a rationally, simple structure, resistance to compression, high temperature resistant, can be greater than 100 DEG C and be less than and use low in production cost under 350 DEG C the environment.

Description

A kind of compound RFID tag
Technical field
This utility model relates to RFID tag technology field, is related specifically to a kind of compound RFID tag。
Background technology
RFID RF identification is a kind of contactless automatic identification technology, and it is automatically identified destination object by radiofrequency signal and obtained related data, identifies that work is without manual intervention, is operable with various adverse circumstances, is used for controlling, detecting and follow the tracks of object。
And the RFID tag of prior art usually in use causes damage in use procedure, because its structural core chip, being made up of silicon crystal, its mechanical strength is not enough to resist mechanical force punching press。Actually; Pallet for forklift (storage common tool) is often subject to car and clashes into pallet, pallet and pallet, pallet and freight hold and make chip rupture; in shipping, the RFID tag on various case and bag can be influenced by the pinch shock in loading process and causes RFID inefficacy, and compressive property is poor;Another, the RFID tag of prior art can only use mostly under the environment lower than 100 DEG C, when using under the environment lower than 350 DEG C higher than 100 DEG C, the destruction that chip very easily suffers, make RFID tag scrap, have a strong impact on the service life of RFID tag。
But for the deficiencies in the prior art, developer be necessary to develop a kind of reasonable in design, simple in construction, resistance to compression, high temperature resistant, can use under the environment lower than 350 DEG C more than 100 DEG C, production cost is low and the compound RFID tag of long service life。
Utility model content
For solving prior art Problems existing, this utility model purpose provide a kind of reasonable in design, simple in construction, resistance to compression, high temperature resistant, can use under the environment lower than 350 DEG C more than 100 DEG C, production cost is low and the compound RFID tag of long service life。
For solving above technical problem, this utility model realizes by the following technical solutions:
A kind of compound RFID tag, including upper labeling, lower labeling, chip and antenna, described chip is connected with antenna;
It is characterized in that, the lower surface of labeling offers first antenna and holds chamber on described, the middle part holding chamber in described first antenna offers the first chip accommodation chamber, upper surface at described lower labeling offers the second antenna holding chamber corresponding with first antenna and holds chamber, offer the second chip holding chamber corresponding with the first chip at the middle part that described second antenna holds chamber and hold chamber, described upper labeling lid is located at subscript and sticks, make first antenna accommodation chamber match with the second antenna accommodation chamber and form the antenna accommodation chamber of an accommodation antenna, make the first chip accommodation chamber match with the second chip accommodation chamber and form the chip accommodation chamber of an accommodation chip, hold intracavity at described chip and be provided with high temperature resistant protection glue。
In a preferred embodiment of the present utility model, described antenna selects etching method to be made, and described antenna is generally from outside to inside successively around a few structure。
In a preferred embodiment of the present utility model, described antenna is squaerial or circular antenna。
In a preferred embodiment of the present utility model, described upper labeling is bonded in subscript and sticks side。
Compared with prior art, this utility model is provided with first antenna to be held chamber and holds the second antenna accommodation chamber that chamber is corresponding with first antenna, it is additionally provided with the first chip hold chamber and hold the second chip accommodation chamber that chamber is corresponding with the first chip, match with the second antenna accommodation chamber and form the antenna accommodation chamber of an accommodation antenna in first antenna accommodation chamber, and match with the second chip accommodation chamber and form the chip accommodation chamber of an accommodation chip in the first chip accommodation chamber, antenna holds chamber and is effectively combined with chip accommodation chamber, can effectively avoid the situation that RFID tag is in use subject to crushing, further increase the compressive property of this RFID tag;Another, hold intracavity at chip and be provided with high temperature resistant protection glue, and the setting of high temperature resistant protection glue can make RFID tag use under the environment lower than 350 DEG C higher than 100 DEG C, improves resistance to elevated temperatures and the service life of this RFID tag。
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。
Fig. 1 is structural representation of the present utility model。
Fig. 2 is the A place enlarged drawing of Fig. 1。
Fig. 3 is the B-B sectional view of Fig. 2。
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and effect and be easy to understand, below in conjunction with being specifically illustrating, this utility model is expanded on further。
With reference to shown in Fig. 1-Fig. 3, a kind of compound RFID tag provided in figure, including upper labeling 100, lower labeling 200, chip 300 and antenna 400。
Upper labeling 100 is generally square, offers first antenna and hold chamber 110 on the lower surface of upper labeling 100, and the middle part holding chamber 100 in first antenna offers the first chip accommodation chamber 120。
Lower labeling 200 is generally square, lower labeling 200 is corresponding with upper labeling 100, offering the second antenna holding chamber 110 corresponding with first antenna on the upper surface of lower labeling 100 and hold chamber 210, the middle part holding chamber 210 at the second antenna offers the second chip accommodation chamber 220 corresponding with the first chip accommodation chamber 120。
Upper labeling 100 is bonded in the upside of lower labeling 200, make first antenna accommodation chamber 110 match with the second antenna accommodation chamber 210 and form the antenna accommodation chamber 600 of an accommodation antenna 400, and make the first chip accommodation chamber 120 match with the second chip accommodation chamber 220 and form the chip accommodation chamber 700 of an accommodation chip 300, antenna holds chamber 600 and is effectively combined with chip accommodation chamber 700, the situation that can effectively avoid RFID tag to be in use subject to crushing, further increases the service life of this RFID tag。
Holding in chamber 700 at chip and be provided with high temperature resistant protection glue 500, the setting of high temperature resistant protection glue 500 can make RFID tag use under the environment lower than 350 DEG C higher than 100 DEG C, improves resistance to elevated temperatures and the service life of this RFID tag。
Chip 300 is connected with antenna 400, and antenna 400 selects etching method to be made, and is fabricated to by antenna 400 generally from outside to inside successively around a few structure, antenna 400 is squaerial or circular antenna, making this RFID tag make simple, suitable batch produces, and reduces the cost of batch production。
When making this RFID tag, first antenna 400 is connected with chip 300, the second antenna that then antenna 400 is placed on lower labeling 200 holds in chamber 210, chip 300 is placed on the second chip and holds intracavity 220, and hold at the second chip and in chamber 220, inject high temperature resistant protection glue 500, then upper labeling 100 is bonded on the upside of lower labeling 200, make first antenna accommodation chamber 110 match with the second antenna accommodation chamber 210 and form an antenna accommodation chamber 600, antenna 400 is sealed in antenna and holds in chamber 600, and make the first chip accommodation chamber 120 match with the second chip accommodation chamber 220 and form a chip accommodation chamber 700, hold in chamber 700 thus chip 300 being sealed in chip。
This utility model is provided with first antenna accommodation chamber and holds the second antenna accommodation chamber that chamber is corresponding with first antenna in sum, it is additionally provided with the first chip hold chamber and hold the second chip accommodation chamber that chamber is corresponding with the first chip, match with the second antenna accommodation chamber and form the antenna accommodation chamber of an accommodation antenna in first antenna accommodation chamber, and match with the second chip accommodation chamber and form the chip accommodation chamber of an accommodation chip in the first chip accommodation chamber, antenna holds chamber and is effectively combined with chip accommodation chamber, can effectively avoid the situation that RFID tag is in use subject to crushing, further increase the compressive property of this RFID tag;Another, hold intracavity at chip and be provided with high temperature resistant protection glue, and the setting of high temperature resistant protection glue can make RFID tag use under the environment lower than 350 DEG C higher than 100 DEG C, improves resistance to elevated temperatures and the service life of this RFID tag。
Of the present utility model ultimate principle, principal character and of the present utility model advantage have more than been shown and described。Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope, this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model。This utility model claims scope and is defined by appending claims and equivalent thereof。

Claims (4)

1. a compound RFID tag, including upper labeling, lower labeling, chip and antenna, described chip is connected with antenna;
It is characterized in that, the lower surface of labeling offers first antenna and holds chamber on described, the middle part holding chamber in described first antenna offers the first chip accommodation chamber, upper surface at described lower labeling offers the second antenna holding chamber corresponding with first antenna and holds chamber, offer the second chip holding chamber corresponding with the first chip at the middle part that described second antenna holds chamber and hold chamber, described upper labeling lid is located at subscript and sticks, make first antenna accommodation chamber match with the second antenna accommodation chamber and form the antenna accommodation chamber of an accommodation antenna, make the first chip accommodation chamber match with the second chip accommodation chamber and form the chip accommodation chamber of an accommodation chip, hold intracavity at described chip and be provided with high temperature resistant protection glue。
2. a kind of compound RFID tag as claimed in claim 1, it is characterised in that: described antenna selects etching method to be made, and described antenna is generally from outside to inside successively around a few structure。
3. a kind of compound RFID tag as claimed in claim 1 or 2, it is characterised in that: described antenna is squaerial or circular antenna。
4. a kind of compound RFID tag as claimed in claim 1, it is characterised in that: described upper labeling is bonded in subscript and sticks side。
CN201520963761.7U 2015-11-27 2015-11-27 Compound RFID label Active CN205334520U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520963761.7U CN205334520U (en) 2015-11-27 2015-11-27 Compound RFID label

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520963761.7U CN205334520U (en) 2015-11-27 2015-11-27 Compound RFID label

Publications (1)

Publication Number Publication Date
CN205334520U true CN205334520U (en) 2016-06-22

Family

ID=56214713

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520963761.7U Active CN205334520U (en) 2015-11-27 2015-11-27 Compound RFID label

Country Status (1)

Country Link
CN (1) CN205334520U (en)

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