CN205375533U - Collect structure that sets up of drawing label - Google Patents

Collect structure that sets up of drawing label Download PDF

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Publication number
CN205375533U
CN205375533U CN201520967376.XU CN201520967376U CN205375533U CN 205375533 U CN205375533 U CN 205375533U CN 201520967376 U CN201520967376 U CN 201520967376U CN 205375533 U CN205375533 U CN 205375533U
Authority
CN
China
Prior art keywords
label
chip
packaging body
collect
model
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520967376.XU
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Chinese (zh)
Inventor
朱敏
王旭东
巩玉成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BEJING C & C JOINT PRINTING CO LTD
Original Assignee
BEJING C & C JOINT PRINTING CO LTD
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BEJING C & C JOINT PRINTING CO LTD filed Critical BEJING C & C JOINT PRINTING CO LTD
Priority to CN201520967376.XU priority Critical patent/CN205375533U/en
Application granted granted Critical
Publication of CN205375533U publication Critical patent/CN205375533U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a collect structure that sets up of drawing label should set up tag antenna and packaging body that the structure includes the label chip, is connected with the chip, and label chip and tag antenna are lived to this packaging body encapsulation parcel. The whole size of electronic tags that this scheme provided is little, and forms integratively through the packaging body encapsulation, improves temperature resistance behavior greatly, and the problem effectively solving prior art and exists can be used to to collect the drawing and limits the quantity of the identification of edition replica and manage.

Description

A kind of collect picture label structure is set
Technical field
This utility model relates to radio-frequency technique, is particularly used for the electronic label technology of identification management.
Background technology
RFID is the abbreviation of Radio-FrequencyIdentification, i.e. radio frequency identification.RFID RF identification is a kind of contactless automatic identification technology, and it is automatically identified destination object by radiofrequency signal and obtained related data, identifies that work is without manual intervention, is operable with various adverse circumstances.The recognizable high-speed moving object of RFID technique also can identify multiple label simultaneously, swift and convenient to operate.
Based on the feature of RFID technique, RFID technique can be applied to collection picture limited edition copy identification management.When RFID technique is applied to collection picture limited edition copy identification management, corresponding electronic tag requires over certain technique and embeds the inside of mounting calligraphy and painting, and this just requires that RFID is smaller.And the corresponding equal package dimension of electronic tag is excessive in prior art, it is impossible to meet system requirements, thus needs design volume less and the label of thinner thickness, be embedded into inside calligraphy and painting;
Furthermore, in calligraphy and painting mounting process, label to bear very high temperature, and the structure of existing electronic tag, it is impossible to bear higher temperature, it can be seen that also need to solve the high temperature resistant problem of electronic tag.
Utility model content
Oversize for existing electronic tag, and high-temperature cannot be born, the problem being not used to collection picture limited edition copy identification management, the purpose of this utility model is in that to provide a kind of size little and resistant to elevated temperatures electronic tag, is achieved in the identification management for collecting picture limited edition copy.
In order to achieve the above object, this utility model adopts the following technical scheme that:
A kind of structure that arranges collecting picture label, the described structure that arranges includes the label antenna that label chip is connected with chip, and the described structure that arranges also includes packaging body, and described packaging body wrapper wraps label chip and label antenna.
Preferably, what described encapsulation was formed arranges structure is flat cylinder, and diameter is that 18mm and thickness are less than 0.5mm.
Preferably, described label chip is NTAG213 chip.
Preferably, described label antenna is the distribution of planar rondure spiral winding.
Preferably, the lateral surface of described packaging body is coated with heat-resistant layer.
It is little that what this programme provided arranges structure overall dimensions, and forms one by packaging body encapsulation, is greatly improved heat resistance, effectively solves the problem existing for prior art, can be used for collecting the identification management of picture limited edition copy.
It addition, this electronic tag is owing to being packaged into one, it is stable and reliable for performance, long service life.
Accompanying drawing explanation
This utility model is further illustrated below in conjunction with the drawings and specific embodiments.
The structural representation that structure is set that Fig. 1 provides for this example;
The sectional view that structure is set that Fig. 2 provides for this example.
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and effect and be easy to understand, below in conjunction with being specifically illustrating, this utility model is expanded on further.
Referring to Fig. 1 and Fig. 2, it show the structural representation arranging structure 100 that this example provides.This arranges structure 100 and adopts the structure of molding subpackage integration, has size little, stable and reliable for performance and heat resistance high feature, can well be applicable to collection picture limited edition copy identification management.
It follows that this arranges structure 100 entirety includes label antenna 102 that label chip 101 is connected and molded packages body 103 3 part for encapsulating with chip.
Wherein, label chip 101 specifically adopts the NTAG213 chip of NXP company, and the selection for chip is not limited to this, may be used without the chip of other model as required.
In order to improve the performance of label chip 101 further, this NTAG213 chip adopts the following plan of establishment:
1. chip is provided with 7 unique serial numbers of byte;
2. chip is provided with password-protected memory block, needs the operation of these district's data through 32 cipher authentications;
3. in chip, it is provided with the module that certain data storage area can be set to read-only region;
4. the completely compatible NFC standard of chip.
Label antenna 102, it is connected with label chip 101, completes acceptance and the transmission of signal, it is achieved the communication of label chip 101 and read-write equipment.
This label antenna 102 specifically adopts planar rondure spiral winding mode to arrange, and thus when encapsulation, can further reduce the size of integrated electric label 100.
Molded packages body 103, for encapsulating the label chip 101 being connected to label antenna 102, the electronic tag 100 of being integrally formed.By this molded packages body 103 sealed envelope to label antenna 102 and label chip 101, thus label antenna 102 and label chip 101 are formed good protection;Completely cut off label antenna 102 and label chip 101 by molded packages body 103 to contact with extraneous, be effectively improved its thermostability.For reducing the size of integrated electric label 100, label antenna 102 and label chip 101 are packaged into a flat cylinder by this molded packages body 103, its diameter is 18mm, and the finished product label thickness after machining is less than 0.5mm, such as 0.2mm, 0.1mm, 0.4mm, 0.3mm.Additionally when implementing, molded packages body 103 can adopt exotic material to make, and so can further improve the heat resistance of electronic tag 100.
On this basis, in order to improve the heat resistance arranging structure 100 further, this example is also provided with a heat-resistant layer 104 on the outer surface of molded packages body 103 arranging structure 100.
This heat-resistant layer 104, arranging after structure 100 encapsulated, is coated with and is located on the outer surface of molded packages body 103, cover the whole outer surface of molded packages body 103, and thickness is uniform.The thickness of this heat-resistant layer 104 is generally 0.01-0.05mm.The heat-resisting ability that structure is set can be effectively further improved by this heat-resistant layer 104.
Integrated setting structure 100 size thus constituted is little, and heat resistance is high, is applicable to collection picture limited edition copy identification management.
Of the present utility model ultimate principle, principal character and of the present utility model advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description is that principle of the present utility model is described; under the premise without departing from this utility model spirit and scope; this utility model also has various changes and modifications, and these changes and improvements both fall within the scope of claimed this utility model.This utility model claims scope and is defined by appending claims and equivalent thereof.

Claims (5)

1. one kind collect picture label structure is set, the described structure that arranges includes the label antenna that label chip is connected with chip, it is characterized in that, the described structure that arranges also includes packaging body, and described packaging body wrapper wraps the label chip in electronic tag and label antenna.
2. according to claim 1 a kind of collect picture label structure is set, it is characterised in that structure that what described encapsulation was formed arranged is flat cylinder, and diameter is that 18mm and thickness are less than 0.5mm.
3. according to claim 1 a kind of collect picture label structure is set, it is characterised in that described label chip is NTAG213 chip.
4. according to claim 1 a kind of collect picture label structure is set, it is characterised in that described label antenna is the distribution of planar rondure spiral winding.
5. according to claim 1 a kind of collect picture label structure is set, it is characterised in that the lateral surface of described packaging body is coated with heat-resistant layer.
CN201520967376.XU 2015-11-27 2015-11-27 Collect structure that sets up of drawing label Expired - Fee Related CN205375533U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520967376.XU CN205375533U (en) 2015-11-27 2015-11-27 Collect structure that sets up of drawing label

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520967376.XU CN205375533U (en) 2015-11-27 2015-11-27 Collect structure that sets up of drawing label

Publications (1)

Publication Number Publication Date
CN205375533U true CN205375533U (en) 2016-07-06

Family

ID=56261871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520967376.XU Expired - Fee Related CN205375533U (en) 2015-11-27 2015-11-27 Collect structure that sets up of drawing label

Country Status (1)

Country Link
CN (1) CN205375533U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107483427A (en) * 2017-08-09 2017-12-15 北京冠霖环如科技有限公司 A kind of self-reinforcing type anti-counterfeiting technology based on Ntag21X family chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107483427A (en) * 2017-08-09 2017-12-15 北京冠霖环如科技有限公司 A kind of self-reinforcing type anti-counterfeiting technology based on Ntag21X family chips

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160706

Termination date: 20201127

CF01 Termination of patent right due to non-payment of annual fee