CN205319142U

CN205319142U - Cover copper ceramic substrate convenient to laser cutting

Info

Publication number: CN205319142U
Application number: CN201521065823.9U
Authority: CN
Inventors: 管鹏飞; 贺贤汉; 李德善
Original assignee: Shanghai Shenhe Thermo Magnetics Electronics Co Ltd
Current assignee: Jiangsu Fule De Semiconductor Technology Co., Ltd.
Priority date: 2015-12-18
Filing date: 2015-12-18
Publication date: 2016-06-15
Anticipated expiration: 2025-12-18

Abstract

The utility model relates to a cover copper ceramic substrate's cutting design field, disclose a cover copper ceramic substrate convenient to laser cutting, a serial communication port, include: cover copper ceramic substrate body, technology limit and copper bar, it is the rectangle structure to cover copper ceramic substrate body, the technology limit is located cover border a week of copper ceramic substrate body, amount to four straight flanges by upper and lower, left and right and constitute, it constitutes the linkage unit to be connected by the copper bar between two orthogonal technology limits, the width of copper bar is less than the width on technology limit. The utility model discloses a covering copper ceramic substrate structure, can improving the pressure of breathing in, DBC substrate surface height is even when realizing the cutting, and the cutting depth is controllable, improves the product yield, the design of thin copper line is adopted to the junction on technology limit, can effectively solve the problem of breaking the limit difficulty after the technology limit is connected off with the fingers and thumb.

Description

A kind of be easy to cut cover copper ceramic substrate

Technical field

This utility model belongs to the cutting design field covering copper ceramic substrate, particularly to a kind of be easy to cut cover copper ceramic substrate.

Background technology

Covering copper ceramic substrate (DBC substrate) is a kind of basic electronic material using DBC (DirectBondCopper) technology to be made at ceramic surface by Copper Foil direct sintering. cover copper ceramic substrate and there is fabulous thermal cycle, dimensionally stable, good rigidly, thermal conductivity is high, reliability is high, cover copper face and can etch the feature of various figure, and it is a kind of pollution-free, non-harmful green product, use temperature quite extensive, can from-55 DEG C～850 DEG C, thermal coefficient of expansion is close to silicon, its application is very extensive: can be used for semiconductor cooler, electronic heater, high-power electric semiconductor module, power control circuit, power hybrid circuit, intelligent power assembly, high frequency switch power, solid-state relay, automotive electronics, space flight and aviation and military electronic assembly, solar cell panel assembly, telecommunication private branch exchange system, reception system, the multinomial industrial electronic field such as laser.

Cover copper ceramic substrate in preparation process, it will usually the product CO of figure will have been etched₂Laser machine cuts, thus being divided into single piece of product. Generally thicker (more than 0.1mm), between figure, gap is bigger for the layers of copper of DBC substrate, it is easy to gas leakage, it is impossible to is inhaled by substrate flat, is difficult to ensure that the homogeneity of the DBC substrate cut degree of depth during cutting. For reducing inter-pattern space gas leakage, existing frequently-used method is to arrange in non-cutting face to add four technique edges around figure. Owing to needing to break technique edges into two with one's hands after cutting, it is off between technique edges, forms a semiclosed region having 4 gaps. These 4 gaps also can leak gas, and causes that pressure of inspiration(Pi) is still not enough, causes cutting bad, sees Fig. 1.

Utility model content

The purpose of this utility model is in that to overcome the deficiencies in the prior art, it is provided that a kind of be easy to cut cover copper ceramic substrate. Of the present utility model cover copper ceramic substrate structure, it is possible to improve pressure of inspiration(Pi), it is achieved during cutting, DBC substrate surface height is uniform, and depth of cut is controlled, improve product yield;The junction of technique edges adopts fine copper wire design, the problem that can effectively solve to break limit difficulty after technique edges connects.

In order to achieve the above object, this utility model provide a kind of be easy to cut cover copper ceramic substrate, including: cover copper ceramic substrate body, technique edges and copper bar; The described copper ceramic substrate body that covers is rectangle structure; Described technique edges covers the edge one week of copper ceramic substrate body described in being located at, upper and lower, left and right amount to four straight flanges and form; Being connected and composed connection unit by copper bar between mutually perpendicular two technique edges, the width of described copper bar is less than the width of described technique edges.

The width of described technique edges more than 3mm less than 15mm.

The width 0.3mm-1mm of described copper bar.

Copper bar in described connection unit is from wherein a technique edges place straight-line extension is to another technique edges, thus being connected by mutually perpendicular two technique edges.

In described connection unit, the quantity of copper bar is two, and wherein the both sides, edge of a technique edges are respectively along this technique edges place straight-line extension to another technique edges certainly for two copper bars, thus being connected by mutually perpendicular two technique edges.

The material of described technique edges is copper.

The beneficial effects of the utility model are:

(1) this utility model is on the basis of original technique edges, connects by adding copper bar at technique edges seam crossing, replaces the gap of original etching, and is integrally formed with technique edges, can effectively prevent technique edges etching gap place gas leakage;

(2) fine copper wire design, the problem that can effectively solve to break limit difficulty after being connected as a single entity are adopted.

Accompanying drawing explanation

Fig. 1 is the structural representation covering copper ceramic substrate of prior art;

Fig. 2 is the structural representation covering copper ceramic substrate of the present utility model;

Fig. 3 is the partial enlarged drawing connecting unit in Fig. 2 shown in A.

Wherein:

1-covers copper ceramic substrate body 2-technique edges 3-copper bar

4-shot copper

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, this utility model is described further.

Embodiment 1:

What as Figure 2-3 a kind of was easy to cut covers copper ceramic substrate, including: cover copper ceramic substrate body 1, technique edges 2 and copper bar 3.

Cover copper ceramic substrate body 1 for rectangle structure.

Technique edges 2 is located at the edge one week covering copper ceramic substrate body 1, upper and lower, left and right amount to four straight flanges and form; Being connected and composed connection unit by copper bar 3 between mutually perpendicular two technique edges 2, the width of copper bar 3 is less than the width of technique edges 2. The width of technique edges is 5mm.

Connecting the quantity of copper bar in unit is two (width of every copper bar is 0.5mm), article two, wherein the both sides, edge of a technique edges are respectively along this technique edges place straight-line extension to another technique edges certainly for copper bar, thus being connected by mutually perpendicular two technique edges.

The material of technique edges is Copper Foil.

Below for the manufacture method covering copper ceramic substrate being easy to cut of the present utility model:

Pottery sinters a piece of big Copper Foil, the design figure film with technique edges and copper bar, pad pasting development exposure, wet etching obtain of the present utility model be easy to cut cover copper ceramic substrate.

Below the preferred embodiment this utility model created has illustrated, but this utility model is created and is not limited to described embodiment, those of ordinary skill in the art can also make all equivalent modification or replacement under the premise without prejudice to this utility model creative spirit, and these equivalent modifications or replacement are all contained in the application claim limited range.

Claims

1. one kind be easy to cut cover copper ceramic substrate, it is characterised in that including: cover copper ceramic substrate body, technique edges and copper bar; The described copper ceramic substrate body that covers is rectangle structure; Described technique edges covers the edge one week of copper ceramic substrate body described in being located at, upper and lower, left and right amount to four straight flanges and form; Being connected and composed connection unit by copper bar between mutually perpendicular two technique edges, the width of described copper bar is less than the width of described technique edges.

2. according to claim 1 a kind of be easy to cut cover copper ceramic substrate, it is characterised in that: the width of described technique edges more than 3mm less than 15mm.

3. according to claim 1 a kind of be easy to cut cover copper ceramic substrate, it is characterised in that: the width 0.3mm-1mm of described copper bar.

4. according to claim 1 a kind of be easy to cut cover copper ceramic substrate, it is characterised in that: the copper bar in described connection unit is from wherein a technique edges place straight-line extension is to another technique edges, thus being connected by mutually perpendicular two technique edges.

5. according to claim 4 a kind of be easy to cut cover copper ceramic substrate, it is characterized in that: in described connection unit, the quantity of copper bar is two, article two, wherein the both sides, edge of a technique edges are respectively along this technique edges place straight-line extension to another technique edges certainly for copper bar, thus being connected by mutually perpendicular two technique edges.

6. according to claim 1 a kind of be easy to cut cover copper ceramic substrate, it is characterised in that: the material of described technique edges is copper.