CN205310029U - Sapphire grinding and polishing device - Google Patents
Sapphire grinding and polishing device Download PDFInfo
- Publication number
- CN205310029U CN205310029U CN201520967054.5U CN201520967054U CN205310029U CN 205310029 U CN205310029 U CN 205310029U CN 201520967054 U CN201520967054 U CN 201520967054U CN 205310029 U CN205310029 U CN 205310029U
- Authority
- CN
- China
- Prior art keywords
- abrasive disk
- axle
- abrasive disc
- material pallet
- material tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 22
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 22
- 239000010980 sapphire Substances 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 55
- 239000000203 mixture Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 206010016256 fatigue Diseases 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model discloses a sapphire grinding and polishing device, including material pallet, the abrasive disc goes up and down to add the air cylinder, the abrasive disc axle, and the material pallet axle, the abrasive disc is fixed with the abrasive disc hub connection, material pallet is fixed with the material pallet hub connection, abrasive disc axle and material pallet axle are connected respectively makes its rot. Power device, material pallet goes up and down to add station of air cylinder and material pallet axle component, the quantity of station is a plurality of, distributes around the abrasive disc, the abrasive disc is equipped with the multilayer, the number of piles that material pallet placed the material is the same with the abrasive disc number of piles. The utility model discloses a two driving disks, material pallet and abrasive disc rotate simultaneously promptly, adopt the multistation multilayered schema, and simultaneous processing's work piece increases, and machining efficiency is markedly increased, the material pallet diameter reduces, makes the reducible thickness of abrasive disc.
Description
Technical field
The open sapphire grinding and polishing device of this utility model, relates to the processing of sapphire grinding and polishing, belongs to processing equipment field.
Background technology
Sapphire has the advantage such as hardness height, fusing point high, light transmission is good, electrical insulating property is excellent, stable chemical performance, is widely used in the high-tech sectors such as machinery, optics, information. Sapphire hardness exceeds other hard brittle materials, and the sapphire for industrial use is monocrystalline а-Al2O3Transparent, there is identical optical characteristics and mechanical property with natural gemstone, infrared light transmission is high, having good wearability, hardness is only second to diamond and reaches Mohs 9 grades, at high temperature still has good stability, it is widely used in the manufacture material of Solid State Laser, infrared window, the substrate slice of semiconductor chip, the accurate part such as anti-friction bearing, smart mobile phone glass screen, is also made into never wornout table mirror and the luxurious ornaments of various fineness.
Current sapphire polisher lapper be a price fixing and Moving plate with the use of, working (machining) efficiency is low; Grinding wheel diameter is big, and for ensureing that areal deformation amount is little, it is thick especially that mill does, heavy.
Utility model content
For above-mentioned deficiency of the prior art.
The utility model discloses sapphire grinding and polishing device, it is characterized in that, described sapphire grinding and polishing device includes material tray, abrasive disk, lifts pressurized cylinder, abrasive disk axle, material tray axle, described abrasive disk is connected fixing with abrasive disk axle, and described material tray is connected fixing with material tray axle, and described abrasive disk axle and material tray axle connect respectively makes its pivotal power set;
Described material tray, lifting pressurized cylinder and material tray axle one station of composition, the quantity of described station is multiple, is distributed in the surrounding of abrasive disk;
Described abrasive disk is provided with multilamellar, and the number of plies that described material tray places material is identical with the abrasive disk number of plies.
The quantity of described station is 3～6.
Described abrasive disk is provided with 2～10 layers.
Described station is evenly distributed on the surrounding of abrasive disk.
In described abrasive disk, spacing between layers is equal.
The thickness of slab at described abrasive disk grinding and polishing place is 15mm.
Lifting pressurized cylinder on described each station is connected with controller respectively.
This utility model adopts two Moving plates, and namely material tray and abrasive disk rotate simultaneously, adopts multistation multilayered schema, and the workpiece simultaneously processed increases, and working (machining) efficiency substantially increases; Material tray diameter reduces, and makes abrasive disk can reduce thickness.
Accompanying drawing explanation
Fig. 1 is the elevation cross-sectional view of sapphire grinding and polishing device;
Fig. 2 is the top view of sapphire grinding and polishing device;
In figure: 1, material tray, 2, abrasive disk, 3, lifting pressurized cylinder, 4, abrasive disk axle, 5, material tray axle.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, this utility model is described further.
Embodiment 1:
Sapphire grinding and polishing device includes material tray 1, abrasive disk 2, lifting pressurized cylinder 3, abrasive disk axle 4, material tray axle 5, abrasive disk 2 is connected fixing with abrasive disk axle 4, and material tray 1 is connected fixing with material tray axle 5, and abrasive disk axle 4 and material tray axle 5 connect respectively makes its pivotal power set; Material tray 1, lifting pressurized cylinder 3 and material tray axle 5 form a station, and the quantity of station is 6, is distributed in the surrounding of abrasive disk 2; Abrasive disk 2 is provided with 10 layers, and the number of plies that material tray 1 places material is identical with abrasive disk 2 number of plies.
Station is evenly distributed on the surrounding of abrasive disk 2. In abrasive disk 2, spacing between layers is equal. The thickness of slab at abrasive disk 2 grinding and polishing place is 15mm. Lifting pressurized cylinder 3 on each station is connected with controller respectively.
Power set drive abrasive disk axle 4, make abrasive disk 2 rotate with a constant speed. Power set drive six material tray axles 5 respectively, six independent controls (in opposite direction with abrasive disk) of material tray 1, material tray 1 declines under lifting pressurized cylinder 3 drives, material tray 1 separates with abrasive disk 2, and material to be processed is placed on material tray 1, and material tray 1 rotates, material to be processed enters into abrasive disk 2 bottom, starting lifting pressurized cylinder 3, make material tray 1 increase and keep certain pressure, grinding starts. Each station independently controls, the blowing of each station/feeding action, does not affect the processing of other stations, so can improve material grinding and polishing efficiency. Because the diameter of material tray is little, the grinding part thickness of the abrasive disk 2 that 15mm is thick ensures that processing component areal deformation amount.
Claims (7)
1. sapphire grinding and polishing device, it is characterized in that, described sapphire grinding and polishing device includes material tray (1), abrasive disk (2), lifting pressurized cylinder (3), abrasive disk axle (4), material tray axle (5), described abrasive disk (2) is connected fixing with abrasive disk axle (4), described material tray (1) is connected fixing with material tray axle (5), and described abrasive disk axle (4) and material tray axle (5) connect respectively makes its pivotal power set;
Described material tray (1), lifting pressurized cylinder (3) and material tray axle (5) one station of composition, the quantity of described station is multiple, is distributed in the surrounding of abrasive disk (2);
Described abrasive disk (2) is provided with multilamellar, and the number of plies that described material tray (1) places material is identical with abrasive disk (2) number of plies.
2. sapphire grinding and polishing device according to claim 1, it is characterised in that the quantity of described station is 3～6.
3. sapphire grinding and polishing device according to claim 1, it is characterised in that described abrasive disk (2) is provided with 2～10 layers.
4. sapphire grinding and polishing device according to claim 1, it is characterised in that described station is evenly distributed on the surrounding of abrasive disk (2).
5. sapphire grinding and polishing device according to claim 1, it is characterised in that in described abrasive disk (2), spacing between layers is equal.
6. sapphire grinding and polishing device according to claim 1, it is characterised in that the thickness of slab at described abrasive disk (2) grinding and polishing place is 15mm.
7. sapphire grinding and polishing device according to claim 1, it is characterised in that the lifting pressurized cylinder (3) on described each station is connected with controller respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520967054.5U CN205310029U (en) | 2015-11-27 | 2015-11-27 | Sapphire grinding and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520967054.5U CN205310029U (en) | 2015-11-27 | 2015-11-27 | Sapphire grinding and polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205310029U true CN205310029U (en) | 2016-06-15 |
Family
ID=56189062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520967054.5U Expired - Fee Related CN205310029U (en) | 2015-11-27 | 2015-11-27 | Sapphire grinding and polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205310029U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113241A (en) * | 2019-12-27 | 2020-05-08 | 西安奕斯伟硅片技术有限公司 | Polishing machine |
| CN111230741A (en) * | 2020-03-17 | 2020-06-05 | 西安奕斯伟硅片技术有限公司 | Polishing disk cooling structure, polishing disk and polishing machine |
-
2015
- 2015-11-27 CN CN201520967054.5U patent/CN205310029U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113241A (en) * | 2019-12-27 | 2020-05-08 | 西安奕斯伟硅片技术有限公司 | Polishing machine |
| CN111113241B (en) * | 2019-12-27 | 2021-09-14 | 西安奕斯伟硅片技术有限公司 | Polishing machine |
| CN111230741A (en) * | 2020-03-17 | 2020-06-05 | 西安奕斯伟硅片技术有限公司 | Polishing disk cooling structure, polishing disk and polishing machine |
| CN111230741B (en) * | 2020-03-17 | 2021-09-14 | 西安奕斯伟硅片技术有限公司 | Polishing disk cooling structure, polishing disk and polishing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |