CN205303424U - Half from mobile core leafing mascerating machine - Google Patents
Half from mobile core leafing mascerating machine Download PDFInfo
- Publication number
- CN205303424U CN205303424U CN201521125135.7U CN201521125135U CN205303424U CN 205303424 U CN205303424 U CN 205303424U CN 201521125135 U CN201521125135 U CN 201521125135U CN 205303424 U CN205303424 U CN 205303424U
- Authority
- CN
- China
- Prior art keywords
- portal frame
- drive mechanism
- wafer
- supporting platform
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model provides a half from mobile core leafing mascerating machine, including equipment base, rotatory piece platform, activity portal frame, guide rail, motor, drive mechanism and the electrical control portion of holding, the rotation is held the piece platform and is included rotary cylinder, angle fine setting slip table and sucking disc, the setting of angle fine setting slip table is on rotary cylinder, the sucking disc is installed on the angle fine setting slip table, the activity portal frame includes that frame, single -acting cylinder, roll, spiral micrometering ware, bearing and rail block constitute, rail block assembles on the guide rail, drive mechanism includes belt and belt pulley, drive mechanism connects motor and frame, drive mechanism and motor make the activity portal frame hold the motion of piece platform at lobe of a leaf in -process relative rotation. Semi -automatization mechanism can improve the stress of chip, guarantee roll extrusion direction collimation, through spiral micrometering ware adjustment roll, stably push down height and overdraft, avoid sudden change and inconsistent.
Description
Technical field
This utility model belongs to technical field of manufacturing semiconductors, especially relates to a kind of semi-automatic chip breaking machine.
Background technology
In the preparation technology of semiconductor chip, tube core processing technique needs after completing to separate single core grain from silicon chip, then carries out the techniques such as follow-up welding encapsulation, and this operation is also referred to as " sliver ", and this operation is divided into two key steps:
1, scribing, use laser scriber, according to the track planned and parameter, on silicon chip, scribing goes out to have certain depth and the road plan do not drawn completely by silicon chip, tentatively separates each core grain, ready for next work step;
2, sliver, make by some way, preliminary separated core grain is kept completely separate, existing sliver operation is by completing manually, the hand-held pressure bar of operating personnel, imposes certain downforce and from both direction slide anteroposterior respectively, can be separated from silicon chip by single core grain the silicon chip after laser scribing.
In existing preparation technology, because using people to carry out sliver operation by hand, sliver process pressure bar is held in operating personnel's hands all the time, is affected by human factors, it is impossible to accurately controls the direction of motion, speed and strength, has the disadvantage in that
1, angular error is big: owing to without obvious benchmark reference, causing pressure bar direction and angular error in sliver operation process bigger;
2, downforce instability is uneven: owing to manual operations cannot accurately control, and causes pressure bar downforce dipping and heaving, unstable uneven;
3, pressure bar translational speed is unstable: owing to manual operations cannot accurately control, cause pressure bar translational speed to change back and forth.
Owing to there is problem above, it is easy to cause the core grain after sliver that wedge angle, unfilled corner occur, collapse limit, fragmentation, the quality defect such as Lian Xin, and then affect electric property, quality stability and yield rate, cause waste.
Summary of the invention
In view of this, this utility model is directed to a kind of semi-automatic chip breaking machine, to substitute pure manual work, improves production efficiency, reduces personnel's holding time, improves yield rate and stablize chip quality.
For reaching above-mentioned purpose, the technical solution of the utility model is achieved in that
A kind of semi-automatic chip breaking machine, including plant bottom case, rotates wafer-supporting platform, movable portal frame, guide rail, motor, drive mechanism and electrical control division;
Wherein, described rotation wafer-supporting platform, movable portal frame, guide rail, motor, drive mechanism and electrical control division are arranged on plant bottom case, and described movable portal frame is connected with motor by drive mechanism, guide rail;
Described rotation wafer-supporting platform includes rotary cylinder, angle adjustment slide unit and sucker, described angle adjustment slide unit is arranged on rotary cylinder, described sucker is arranged on described angle adjustment slide unit, this sucker described is for sorption chip and ensures that chip will not be subjected to displacement in roll rolling process in sliver process, rotary cylinder is rotated wafer-supporting platform half-twist and guarantees that the vertical angle one of twice rolling is made peace accurately, and the level angle that angle adjustment slide unit is placed for adjusting chip places, to compensate, the error caused by hand;
Described movable portal frame includes framework, single-acting cylinder, roll, spiral micrometering device, bearing and guide rail slide block composition, described guide rail slide block is assemblied on guide rail, single-acting cylinder coordinates air relief valve, for adjusting roll, chip is applied downward pressure, spiral micrometering device is arranged on single-acting cylinder both sides, is used for adjusting under roll and presses height and level angle;
Described drive mechanism includes belt and belt pulley, described drive mechanism connects motor and framework, described drive mechanism and motor make movable portal frame rotate against wafer-supporting platform motion in sliver process, and ensure that movable portal frame rotates against the speed of wafer-supporting platform motion and the accuracy of position in sliver process;
Described electrical control division includes portal frame control portion, roll control portion and wafer-supporting platform control portion, described portal frame control portion includes relay, machine governor and proximity switch, for controlling the direction of motion and the movement velocity of movable portal frame, described roll control portion includes air relief valve, for controlling the downforce of roll, described wafer-supporting platform control portion includes electromagnetic valve, air relief valve, for controlling to rotate the anglec of rotation of wafer-supporting platform.
Further, described drive mechanism includes belt and belt pulley are odontoid belt and toothed belt wheel.
Further, described sucker is vacuum cup.
Further, described bearing is linear bearing.
Further, described guide rail slide block is linear guides slide block.
Further, described rotation wafer-supporting platform is additionally provided with laser instrument, and described laser instrument coordinates the placed angle for accurately adjusting chip with angle adjustment slide unit.
Further, described electrical control division also includes precise pressure-reducing valve.
The splinter method of semi-automatic chip breaking machine, comprises the steps:
Step 1, standby host, open equipment main switch, adjust air relief valve, precise pressure-reducing valve to setting pressure;
Step 2, film releasing, the chip treating sliver is placed on pad, pad is placed on sucker, then cover thin film;
Step 3, vacuum, open vacuum valve, discharge the gas between chip and pad, it is ensured that chip is reliably attracted on pad;
Step 4, alignment, align chip angle by angle adjustment slide unit;
Step 5, a sliver, press startup button and start sliver operation by roll;
Step 6, rotates, and driven by motor roll arrives the other end of equipment after completing a sliver, trigger proximity switch rear motor to stop, connecting electromagnetic valve and air relief valve, rotary cylinder is rotated wafer-supporting platform and chip half-twist, is also turned on intervalometer trigger timing;
Step 7, secondary splitting, time delay timing starts motor after terminating and rotates backward, drive roll again to press through chip surface, return to work starting position, be automatically stopped after triggering proximity switch, simultaneously closing off electromagnetic valve, rotary cylinder is rotated wafer-supporting platform and chip resets simultaneously;
Step 8, takes sheet, closes vacuum valve, takes out pad and chip, delivers to subsequent processing.
Further, described step 4 also includes, and opens laser instrument, is incident upon the cross bright line on chip and the groove on chip according to laser instrument, utilizes angle adjustment slide unit to align chip angle.
Relative to prior art, semi-automatic chip breaking machine described in the utility model has the advantage that
(1) semi-automatic mechanism described in the utility model can improve the stress of chip, it is ensured that rolling direction collimation, by spiral micrometering device adjustment roll, the stable height of pressure down and downforce, it is to avoid sudden change is with inconsistent;
(2) semi-automatic mechanism described in the utility model can obviously reduce the irregular fragmentation of chip owing to the factors such as chip thickness surface, surface damage, internal flaw, impurity and residual thermal stress cause;
(3) semi-automatic mechanism described in the utility model can be effectively improved the angle direction error in the operation caused due to human factor, the various core grain defects such as broken core that pressure and velocity variations cause, wedge angle, unfilled corner, improve the stability of yield rate and finished product.
Accompanying drawing explanation
The accompanying drawing constituting a part of the present utility model is further appreciated by of the present utility model for providing, and schematic description and description of the present utility model is used for explaining this utility model, is not intended that improper restriction of the present utility model. In the accompanying drawings:
Fig. 1 is the structural representation of the semi-automatic chip breaking machine described in this utility model embodiment;
Fig. 2 is the structural representation of the semi-automatic chip breaking machine described in this utility model embodiment;
Fig. 3 is the structural representation rotating wafer-supporting platform described in this utility model embodiment;
Fig. 4 is the structural representation rotating wafer-supporting platform described in this utility model embodiment;
Fig. 5 is the structural representation of the movable portal frame described in this utility model embodiment;
Fig. 6 is the structural representation of the movable portal frame described in this utility model embodiment;
Fig. 7 is the schematic diagram of the semi-automatic chip breaking machine splinter method described in this utility model embodiment;
Description of reference numerals:
1-plant bottom case; 2-rotates wafer-supporting platform; 3-movable portal frame; 4-motor; 5-drive mechanism; 6-rotary cylinder; 7-angle adjustment slide unit; 8-sucker; 9-single-acting cylinder; 10-roll; 11-spiral micrometering device; 12-bearing; 13-guide rail slide block.
Detailed description of the invention
It should be noted that when not conflicting, the embodiment in this utility model and the feature in embodiment can be mutually combined.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of the instruction such as " outward " are based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than the device of instruction or hint indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model. additionally, term " first ", " second " etc. are only for descriptive purposes, and it is not intended that indicate or imply relative importance or the implicit quantity indicating indicated technical characteristic. thus, the feature defining " first ", " second " etc. can express or implicitly include one or more these features. in description of the present utility model, except as otherwise noted, " multiple " are meant that two or more.
In description of the present utility model, it is necessary to explanation, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, for instance, it is possible to it is fixing connection, it is also possible to be removably connect, or connect integratedly;Can be mechanically connected, it is also possible to be electrical connection; Can be joined directly together, it is also possible to be indirectly connected to by intermediary, it is possible to be the connection of two element internals. For the ordinary skill in the art, it is possible to understand above-mentioned term concrete meaning in this utility model by concrete condition.
1-7 in conjunction with the embodiments describe this utility model in detail below with reference to the accompanying drawings.
Semi-automatic chip breaking machine, including plant bottom case 1, rotates wafer-supporting platform 2, movable portal frame 3, guide rail, motor 4, drive mechanism 5 and electrical control division;
Wherein, described rotation wafer-supporting platform 2, movable portal frame 3, guide rail, motor 4, drive mechanism 5 and electrical control division are arranged on plant bottom case 1, and described movable portal frame 3 is connected with motor 4 by drive mechanism 5, guide rail;
Described rotation wafer-supporting platform 2 includes rotary cylinder 6, angle adjustment slide unit 7 and sucker 8, described angle adjustment slide unit 7 is arranged on rotary cylinder 6, described sucker 8 is arranged on described angle adjustment slide unit 7, this sucker 8 described for sorption chip and ensures that chip will not be subjected to displacement in roll 10 rolling process in sliver process, rotary cylinder 6 is rotated wafer-supporting platform 2 half-twist and guarantees that the vertical angle one of twice rolling is made peace accurately, and the level angle that angle adjustment slide unit 7 is placed for adjusting chip places, to compensate, the error caused by hand;
Described movable portal frame 3 includes framework, single-acting cylinder 9, roll 10, spiral micrometering device 11, bearing 12 and guide rail slide block 13 and forms, described guide rail slide block 13 is assemblied on guide rail, single-acting cylinder 9 coordinates air relief valve to be used for adjusting roll 10 chip is applied downward pressure, spiral micrometering device 11 is arranged on single-acting cylinder 9 both sides, is used for adjusting 10 times pressure height of roll and level angle;
Described drive mechanism 5 includes belt and belt pulley, described drive mechanism 5 connects motor 4 and framework, described drive mechanism 5 and motor make movable portal frame 3 rotate against wafer-supporting platform 2 in sliver process to move, and ensure that movable portal frame 3 rotates against the speed of wafer-supporting platform 2 motion and the accuracy of position in sliver process;
Described electrical control division includes portal frame control portion, roll control portion and wafer-supporting platform control portion, described portal frame control portion includes relay, machine governor and proximity switch, for controlling the direction of motion and the movement velocity of movable portal frame 3, described roll control portion includes air relief valve, for controlling the downforce of roll 10, described wafer-supporting platform control portion includes electromagnetic valve, air relief valve, for controlling to rotate the anglec of rotation of wafer-supporting platform 2.
Belt and belt pulley that described drive mechanism 5 includes are odontoid belt and toothed belt wheel.
Described sucker 8 is vacuum cup.
Described bearing 12 is linear bearing.
Described guide rail slide block 13 is linear guides slide block.
Described rotation wafer-supporting platform 2 is additionally provided with laser instrument, and described laser instrument coordinates the placed angle for accurately adjusting chip with angle adjustment slide unit 7.
Described electrical control division also includes precise pressure-reducing valve.
The splinter method of semi-automatic chip breaking machine, comprises the steps:
Step 1, standby host, open equipment main switch, adjust air relief valve, precise pressure-reducing valve to setting pressure;
Step 2, film releasing, the chip treating sliver is placed on pad, pad is placed on sucker 8, then covers thin film;
Step 3, vacuum, open vacuum valve, discharge the gas between chip and pad, it is ensured that chip is reliably attracted on pad;
Step 4, alignment, align chip angle by angle adjustment slide unit 7;
Step 5, a sliver, press startup button and start sliver operation by roll 10;
Step 6, rotates, and motor 4 drives roll 10 to arrive the other end of equipment after completing a sliver, trigger proximity switch rear motor to stop, connecting electromagnetic valve and air relief valve, rotary cylinder 6 is rotated wafer-supporting platform 2 and chip half-twist, is also turned on intervalometer trigger timing;
Step 7, secondary splitting, time delay timing starts motor 4 after terminating and rotates backward, drive roll 10 again to press through chip surface, return to work starting position, be automatically stopped after triggering proximity switch, simultaneously closing off electromagnetic valve, rotary cylinder 6 is rotated wafer-supporting platform 2 and chip resets simultaneously;
Step 8, takes sheet, closes vacuum valve, takes out pad and chip, delivers to subsequent processing.
Described step 4 also includes, and opens laser instrument, is incident upon the cross bright line on chip and the groove on chip according to laser instrument, utilizes angle adjustment slide unit 7 to align chip angle.
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all within spirit of the present utility model and principle, any amendment of making, equivalent replacement, improvement etc., should be included within protection domain of the present utility model.
Claims (7)
1. semi-automatic chip breaking machine, it is characterised in that: include plant bottom case (1), rotate wafer-supporting platform (2), movable portal frame (3), guide rail, motor (4), drive mechanism (5) and electrical control division;
Wherein, described rotation wafer-supporting platform (2), movable portal frame (3), guide rail, motor (4), drive mechanism (5) and electrical control division are arranged on plant bottom case (1), and described movable portal frame (3) is connected with motor (4) by drive mechanism (5), guide rail;
Described rotation wafer-supporting platform (2) includes rotary cylinder (6), angle adjustment slide unit (7) and sucker (8), described angle adjustment slide unit (7) is arranged on rotary cylinder (6), described sucker (8) is arranged on described angle adjustment slide unit (7), described this sucker (8) is for sorption chip and ensures that chip will not be subjected to displacement in roll (10) rolling process in sliver process, rotary cylinder (6) is rotated wafer-supporting platform (2) half-twist and guarantees that the vertical angle one of twice rolling is made peace accurately, the level angle that angle adjustment slide unit (7) is placed for adjusting chip places, to compensate, the error caused by hand,
Described movable portal frame (3) includes framework, single-acting cylinder (9), roll (10), spiral micrometering device (11), bearing (12) and guide rail slide block (13) composition, described guide rail slide block (13) is assemblied on guide rail, single-acting cylinder (9) cooperation air relief valve is used for adjusting roll (10) and chip is applied downward pressure, spiral micrometering device (11) is arranged on single-acting cylinder (9) both sides, is used for adjusting roll (10) and presses down height and level angle;
Described drive mechanism (5) includes belt and belt pulley, described drive mechanism (5) connects motor (4) and framework, described drive mechanism (5) and motor make movable portal frame (3) rotate against wafer-supporting platform (2) motion in sliver process, and ensure that movable portal frame (3) rotates against the accuracy of speed that wafer-supporting platform (2) moves and position in sliver process;
Described electrical control division includes portal frame control portion, roll control portion and wafer-supporting platform control portion, described portal frame control portion includes relay, machine governor and proximity switch, for controlling the direction of motion and the movement velocity of movable portal frame (3), described roll control portion includes air relief valve, for controlling the downforce of roll (10), described wafer-supporting platform control portion includes electromagnetic valve, air relief valve, is used for the anglec of rotation controlling to rotate wafer-supporting platform (2).
2. semi-automatic chip breaking machine according to claim 1, it is characterised in that: belt and belt pulley that described drive mechanism (5) includes are odontoid belt and toothed belt wheel.
3. semi-automatic chip breaking machine according to claim 1, it is characterised in that: described sucker (8) is vacuum cup.
4. semi-automatic chip breaking machine according to claim 1, it is characterised in that: described bearing (12) is linear bearing.
5. semi-automatic chip breaking machine according to claim 1, it is characterised in that: described guide rail slide block (13) is linear guides slide block.
6. semi-automatic chip breaking machine according to claim 1, it is characterised in that: described rotation wafer-supporting platform (2) is additionally provided with laser instrument, and described laser instrument coordinates the placed angle for accurately adjusting chip with angle adjustment slide unit (7).
7. semi-automatic chip breaking machine according to claim 1, it is characterised in that: described electrical control division also includes precise pressure-reducing valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521125135.7U CN205303424U (en) | 2015-12-30 | 2015-12-30 | Half from mobile core leafing mascerating machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521125135.7U CN205303424U (en) | 2015-12-30 | 2015-12-30 | Half from mobile core leafing mascerating machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205303424U true CN205303424U (en) | 2016-06-08 |
Family
ID=56469810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521125135.7U Withdrawn - After Issue CN205303424U (en) | 2015-12-30 | 2015-12-30 | Half from mobile core leafing mascerating machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205303424U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590884A (en) * | 2015-12-30 | 2016-05-18 | 天津天物金佰微电子有限公司 | Semi-automatic chip splitting machine and splitting method |
| CN107696311A (en) * | 2017-09-25 | 2018-02-16 | 青岛金汇源电子有限公司 | A kind of automatic sliver technology |
| CN108336213A (en) * | 2018-03-28 | 2018-07-27 | 深圳市海目星激光智能装备股份有限公司 | A kind of rolling breaking machine and splinter method |
-
2015
- 2015-12-30 CN CN201521125135.7U patent/CN205303424U/en not_active Withdrawn - After Issue
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590884A (en) * | 2015-12-30 | 2016-05-18 | 天津天物金佰微电子有限公司 | Semi-automatic chip splitting machine and splitting method |
| CN105590884B (en) * | 2015-12-30 | 2018-06-01 | 天津天物金佰微电子有限公司 | Semi-automatic chip breaking machine and splinter method |
| CN107696311A (en) * | 2017-09-25 | 2018-02-16 | 青岛金汇源电子有限公司 | A kind of automatic sliver technology |
| CN108336213A (en) * | 2018-03-28 | 2018-07-27 | 深圳市海目星激光智能装备股份有限公司 | A kind of rolling breaking machine and splinter method |
| CN108336213B (en) * | 2018-03-28 | 2024-01-09 | 海目星激光科技集团股份有限公司 | Rolling splitting machine and splitting method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205303424U (en) | Half from mobile core leafing mascerating machine | |
| CN105108366B (en) | Battery strings busbar automatic welding machine | |
| CN104441065B (en) | It is applicable to the cutting cutter of rule sheet material | |
| CN109650710A (en) | A kind of glass cutter device and its cutting method | |
| CN205972984U (en) | Glass rotor conveyor | |
| CN105590884B (en) | Semi-automatic chip breaking machine and splinter method | |
| CN106298608A (en) | Solar module high efficient full automatic frame loader | |
| CN106956117A (en) | A kind of convenient device for installing bright panel | |
| CN207372660U (en) | A kind of lockset assembly machine | |
| CN108262516A (en) | A kind of pen tip slot machine | |
| CN109500435B (en) | A kind of pantograph pan curved segment cutting and milling machine structure and its cut milling method | |
| CN204625470U (en) | A kind of break-up device for double-deck OLED mother matrix glass | |
| CN207372602U (en) | A kind of feeding structure of lockset assembly machine | |
| CN202114336U (en) | Pneumatic pin cutting machine | |
| CN103569398A (en) | Automatic film pasting packaging machine | |
| CN201038198Y (en) | Automatic sealing machine of battery | |
| CN216998177U (en) | Glass processing production line | |
| CN110125235A (en) | Fin piece cuts feeding and receives spacing mechanism | |
| CN205394165U (en) | Full -automatic sword equipment that grinds of tile sword | |
| CN214925916U (en) | Cutting device is used in processing of heat preservation type double coated glass | |
| CN205290281U (en) | Electrode hem system | |
| CN104552395A (en) | Door and window glazing bead cutting tool and technological method | |
| CN114230164A (en) | Glass processing production line | |
| CN207982409U (en) | A kind of pen tip slot machine | |
| CN209007148U (en) | A kind of aluminium sheet groover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160608 Effective date of abandoning: 20180601 |