CN205283816U - 一种mems麦克风芯片及mems麦克风 - Google Patents
一种mems麦克风芯片及mems麦克风 Download PDFInfo
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- CN205283816U CN205283816U CN201521097992.0U CN201521097992U CN205283816U CN 205283816 U CN205283816 U CN 205283816U CN 201521097992 U CN201521097992 U CN 201521097992U CN 205283816 U CN205283816 U CN 205283816U
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- 239000004020 conductor Substances 0.000 claims abstract description 60
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- 230000002889 sympathetic effect Effects 0.000 abstract 3
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108063991A (zh) * | 2016-11-08 | 2018-05-22 | 现代自动车株式会社 | 麦克风及其制造方法 |
CN112492486A (zh) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | 麦克风芯片、mems麦克风及电子装置 |
CN112520686A (zh) * | 2020-12-25 | 2021-03-19 | 华景科技无锡有限公司 | 一种mems麦克风晶圆级封装结构 |
CN112995860A (zh) * | 2019-12-18 | 2021-06-18 | 鑫创科技股份有限公司 | 微机电系统的麦克风结构 |
CN114466512A (zh) * | 2021-12-24 | 2022-05-10 | 江苏普诺威电子股份有限公司 | Mems埋容埋阻封装载板及其制作工艺 |
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2015
- 2015-12-25 CN CN201521097992.0U patent/CN205283816U/zh active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108063991A (zh) * | 2016-11-08 | 2018-05-22 | 现代自动车株式会社 | 麦克风及其制造方法 |
CN112995860A (zh) * | 2019-12-18 | 2021-06-18 | 鑫创科技股份有限公司 | 微机电系统的麦克风结构 |
CN112995860B (zh) * | 2019-12-18 | 2022-04-19 | 鑫创科技股份有限公司 | 微机电系统的麦克风结构 |
US11317220B2 (en) | 2019-12-18 | 2022-04-26 | Solid State System Co., Ltd. | Structure of micro-electro-mechanical-system microphone |
CN112492486A (zh) * | 2020-12-03 | 2021-03-12 | 青岛歌尔智能传感器有限公司 | 麦克风芯片、mems麦克风及电子装置 |
CN112492486B (zh) * | 2020-12-03 | 2022-03-25 | 青岛歌尔智能传感器有限公司 | 麦克风芯片、mems麦克风及电子装置 |
CN112520686A (zh) * | 2020-12-25 | 2021-03-19 | 华景科技无锡有限公司 | 一种mems麦克风晶圆级封装结构 |
CN114466512A (zh) * | 2021-12-24 | 2022-05-10 | 江苏普诺威电子股份有限公司 | Mems埋容埋阻封装载板及其制作工艺 |
CN114466512B (zh) * | 2021-12-24 | 2023-08-22 | 江苏普诺威电子股份有限公司 | Mems埋容埋阻封装载板及其制作工艺 |
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C14 | Grant of patent or utility model | ||
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CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20191120 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co., Ltd Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Gore Co., Ltd. |