CN205281385U - Heating element cooling arrangement - Google Patents

Heating element cooling arrangement Download PDF

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Publication number
CN205281385U
CN205281385U CN201490000655.2U CN201490000655U CN205281385U CN 205281385 U CN205281385 U CN 205281385U CN 201490000655 U CN201490000655 U CN 201490000655U CN 205281385 U CN205281385 U CN 205281385U
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China
Prior art keywords
cooling water
cooling
impeller
unit
water supply
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CN201490000655.2U
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Chinese (zh)
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朴东植
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Individual
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Priority claimed from PCT/KR2014/003633 external-priority patent/WO2014181984A2/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • G06F1/206Cooling means comprising thermal management
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

The utility model discloses a heating element cooling arrangement. According to the utility model discloses a heating element cooling arrangement of embodiment includes: a housing, the casing is with the heating element contact and the cooling water is mobile wherein, and impeller, the impeller sets up in the casing and in the casing rotatoryly, and the casing includes: the main part unit, main part unit and impeller connection, first lid unit, first lid unit be the heat conduction component, in the both sides of impeller and main part unit connection and contact with heating element, and cooling water supply unit, cooling water supply unit is connected with rotatory together with the impeller with the intermediate part of impeller to the cooling water is supplied along the direction of first lid unit to from impeller's intermediate part.

Description

Heater element cooling device
Technical field
The present invention relates to heater element cooling device, and relate more specifically to the heater element cooling device of the efficiency improvement of cooling heating element.
Background technology
Normally, central processing unit (CPU) is equipped with cooler or heat abstractor as the critical component of computer or various electronic-controlled installation, in order to reduces its temperature and guarantees stable operation.
Along with the development of CPU manufacturing technology, to a certain degree reduce the maximum heating temp of CPU. But, the disposal ability of CUP and the raising of speed have had built up the temperature of CPU. Such as, four core processors that latest developments are got up are likely to be due to its surface temperature and increase to 100 DEG C or higher and suppressed.
Therefore, even if being developed continuously for the cooling device cooling down CPU in today.
For being traditionally used for the equipment of cooling CPU, having been proposed for various equipment, they are realized by following apparatus: the radiator of the metal derby being attached on the surface of CPU only by binding agent or pressing means, the cooling fan being additionally installed on the surface of radiator, be attached on the surface of CPU and cool down the thermal modules of CPU, the water-cooling apparatus using water collar etc. based on paltie effect.
The radiator of metal derby has the advantage that owing to it has the aluminum manufacture of low melting point and low unit price typically via extruding or die casting, therefore manufacture and installation cost is low, but owing to using the material (such as aluminum) with lower thermal conductivity, there is the shortcoming owing to low heat capacity causes radiating effect difference, and due to the fine difference of the thermal conductivity between inside and outside at radiator, radiating efficiency is also low.
When cooling down the surface that fan is arranged on radiator, have the drawback that there is due to radiator itself low thermal conductivity and radiator fan generation noise, therefore cannot expect positive effect.
Additionally, the block with multiple radiating fin can by having relatively high thermal conductivity and the copper production of the radiating block as monomer. But, copper have the fusing point far above aluminum higher than the fusing point of 1000 DEG C, and therefore owing to very difficult extruding or casting copper (unlike aluminum) and manufacturing cost are high, thus economically infeasible.
Thermal modules has a very high cooling effectiveness, but costly. And, the too much electric power of thermal modules consumption, thus it is unsuitable for the portable computer of the requirement low power consumption (to save electric power) of such as notebook computer.
Additionally, the bigger temperature difference causes condensation, and the condensation on CPU and thermal modules may result in the electric fault of peripheral circuit. Thus, it is complicated for installing thermal modules.
Therefore, the water cooling equipment of cooling water is used to be developed recently, to cool down CPU.
But, traditional water cooling equipment receives the heat from CPU transmission by the inwall close with CPU, and thus, owing to heat does not pass to the cooling water flowed along the inwall away from CPU, but pass only to the cooling water along the inwall flowing close with CPU, therefore the raising of cooling performance is limited.
In other words, cooling water is not fully used as heat exchange medium, and the cooling water owing to flowing through adjacent only to CPU is used as heat exchange medium, and the utilization rate therefore cooling down water is very low.
Therefore, the raising being required for cooling effect when by cooling down water-cooled but CPU is studied.
Summary of the invention
Technical problem
The present invention provides a kind of heater element cooling device that can improve cooling effectiveness when using cooling water cooling heating element.
Technical scheme
According to an aspect of the present invention, it is provided that a kind of heater element cooling device, including: housing, described housing contacts with heater element and allows cooling water to flow wherein; And impeller, described impeller holds in the housing and rotates, and described housing includes: main unit, and described main unit is connected with impeller; First cap unit, described first cap unit is connected with main unit, and impeller is between the first cap unit and main unit, and described first cap unit is made up of the Heat Conduction Material of contact heating element; And chilled(cooling) water supply (CWS) unit, described chilled(cooling) water supply (CWS) unit is connected with the pars intermedia of impeller, and described chilled(cooling) water supply (CWS) unit rotates and from the pars intermedia of impeller towards the first cap unit cooling water supply together with impeller.
Described housing can also include cooled water supply channel, described cooled water supply channel is formed in main unit, and cooling water is guided to chilled(cooling) water supply (CWS) unit, and chilled(cooling) water supply (CWS) unit can include the cooling water tube of hollow, described cooling water tube has the one end connected with cooled water supply channel and the traverse main unit other end, being connected with the pars intermedia of impeller, cooling water tube rotates together with impeller, and cools down water and flow through this cooling water tube.
Described housing can also include support component, and described support component is connected with main unit, is set to surround the outer surface of cooling water tube, and contacts and support the outer surface of cooling water tube; And the cooling water tube contacting the inner surface of support component could be formed with screw thread on its outer surface.
Described first cap unit may include that plate, and described plate is connected with main unit; And groove, described groove formed at plate towards on the side of impeller and hold described impeller.
Described first cap unit can also include forming the multiple uneven pattern on the basal surface of groove.
Described housing can also include cooling water drainage and go out passage, described cooling water drainage goes out passage and is formed in main unit and guide the cooling water drainage being filled between main unit and the first cap unit to go out, and described groove can have the internal diameter that the direction of rotation along impeller is gradually increased.
Described groove can tilt from the opening that the inner bottom surface of the opening going out passage towards cooling water drainage goes out passage towards cooling water drainage so that can be directed into cooling water drainage along inner surface by the cooling water rotating driving rotation of impeller and go out the opening of passage.
Described main unit can include partition wall, partition wall is for separating and having the pars intermedia that cooled water supply pipe penetrates between the upper side and lower side, and described cooled water supply channel can be formed above partition wall and connect with cooling water tube, and described cooling water drainage goes out passage and can be formed in the lower section of partition wall and connect with described groove.
Described housing may include that cooling water inlet, and described cooling water inlet is connected with main unit, connects with cooled water supply channel, and cooling water supply; And coolant outlet, described coolant outlet is connected with main unit, channel connection is gone out with cooling water drainage, and discharge cooling water, and described heater element cooling device can also include cooler, described cooler is connected with cooling water inlet and coolant outlet, cools down the heated cooling water from coolant outlet discharge and by the chilled(cooling) water supply (CWS) after cooling to cooling water inlet.
Described heater element cooling device can also include indicator, and described indicator is arranged on the top of chilled(cooling) water supply (CWS) unit, and indicates whether cooling water is supplied to chilled(cooling) water supply (CWS) unit.
Described heater element cooling device can also include impeller drive, described impeller drive is placed on main unit inside and by making the chilled(cooling) water supply (CWS) finite element rotation being connected with impeller make impeller rotate, wherein said housing can also include the second cap unit, described second cap unit is connected with main unit, and impeller drive is between the second cap unit and main unit.
Beneficial effect
According to the present invention, cooling water is from the pars intermedia of impeller towards the first cap unit supply contacted with heater element, first cap unit can be cooled down by force, and impeller rotates in enclosure interior and cooling water can be stirred, and which thereby enhances the cooling effectiveness about heater element.
And, rotated by impeller-driven while the end pars intermedia inward flow of groove at it from the pars intermedia of impeller to the cooling water formed in the pars intermedia supply of the first cap unit, cooling water can be stirred more strongly, which thereby enhance the cooling effectiveness about heater element.
Additionally, driven the multiple uneven pattern that the cooling water rotated is formed on the basal surface of groove to stir more strongly by rotating of impeller in groove, thus further increase the cooling effectiveness about heater element.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of heater element cooling device according to an embodiment of the invention.
Fig. 2 and Fig. 3 is the exploded perspective view of heater element cooling device according to an embodiment of the invention.
Fig. 4 is the plane graph of the first cap unit according to an embodiment of the invention.
Fig. 5 is the axonometric chart of the first cap unit according to an embodiment of the invention.
Fig. 6 is the axonometric chart of main unit according to an embodiment of the invention.
Fig. 7 illustrates the mobile route cooling down water according to an embodiment of the invention.
Detailed description of the invention
With reference to for illustrating the accompanying drawing of embodiments of the invention to obtain fully understanding the present invention and its advantage.
Below with reference to accompanying drawings by illustrating that exemplary embodiment describes the present invention, accompanying drawing labelling similar in whole accompanying drawings represents similar element.
According to this embodiment, heater element includes the central processing unit (CPU) of computer and the heat generating member of other electronic unit. For convenience, CPU is described below.
Fig. 1 is the axonometric chart of heater element cooling device according to an embodiment of the invention, Fig. 2 and Fig. 3 is the exploded perspective view of heater element cooling device according to an embodiment of the invention, Fig. 4 is the plane graph of the first cap unit according to an embodiment of the invention, Fig. 5 is the axonometric chart of the first cap unit according to an embodiment of the invention, and Fig. 6 is the axonometric chart of main unit according to an embodiment of the invention.
With reference to Fig. 1-3, heater element cooling device includes contacting with heater element and wherein flowing has cooling water according to an embodiment of the invention housing 100, hold in a housing 100 and the impeller 300 rotated, be placed on that housing 100 is internal and the impeller drive 350 that drives impeller 300 to rotate and the cooler 400 being connected with housing 100, after the heating that cooling is discharged from housing 100, cooling down water and by the chilled(cooling) water supply (CWS) after cooling down and be circulated to housing 100.
Housing 100 directly or indirectly contacts with CPU, and logical supercooled water dissipates from the CPU heat transmitted, and thus cools down CPU.
Housing 100 includes: the main unit 110 being connected with impeller 300; First cap unit 120, described first cap unit, as heat conducting element, connects in the both sides of impeller with the bottom of main unit 110 and contacts with heater element; Chilled(cooling) water supply (CWS) unit 130, described chilled(cooling) water supply (CWS) unit with and impeller 300 together with the pars intermedia of impeller 300 that rotates connect, and from the pars intermedia of impeller 300 to the first cap unit 120 cooling water supply; Second cap unit 160, described second cap unit is connected in the upside of the both sides of impeller drive 350 with main unit 110; Cooled water supply channel 140, described cooled water supply channel is formed in main unit 110 and guides to chilled(cooling) water supply (CWS) unit 130 by cooling water; Cooling water inlet 170, described cooling water inlet is connected with main unit 110 and connects with cooled water supply channel 140 and to cooled water supply channel 140 cooling water supply; Cooling water drainage goes out passage 145, and described cooling water drainage goes out passage and formed in main unit 110 and guide the cooling water drainage being filled between main unit 110 and the first cap unit 120 to go out; Coolant outlet 175, described coolant outlet is connected with main unit 110 to go out passage 145 with cooling water drainage and connect and go out to cooler 400 by going out, along cooling water drainage, the cooling water drainage that passage 145 flows; And support component 150, described support component is connected with main unit 110, is set to surround the outer surface of chilled(cooling) water supply (CWS) unit 130 and contact and support the outer surface of chilled(cooling) water supply (CWS) unit 130.
In this embodiment, main unit 110, first cap unit 120 of the outward appearance forming housing 100 can be made up of copper, aluminum or similar Heat Conduction Material with the second cap unit 160. Especially, the first cap unit 120 only directly or indirectly contacted with heater element (i.e. CPU) is made from a material that be thermally conductive, and other element is made up of macromolecule heat-resisting material, thus reduces the gross weight of housing 100.
And, additionally including support 200 according to the heater element cooling device of the present embodiment, support is connected with housing 100 and allows housing 100 to be detachably connected on the mainboard (not shown) being provided with CPU.
Support 200 is connected with housing 100, and is especially connected with main unit 110, and allows main unit 110 to be detachably connected on the mainboard (not shown) being provided with CPU. The support 200 connected with main unit 110 can be detachably connected on mainboard by screw or similar independent retaining element.
In this embodiment, main unit 110 supports impeller 300 and provides supply and discharge the passage of cooling water.
Main unit 110 is formed with partition wall 111, and partition wall is for the separation of the upper side and lower side. That is, main unit 110 is separated into the upper side and lower side by partition wall 111 so that the first cap unit 120 can be connected with the downside of main unit 110, and the second cap unit 160 can be connected with the upside of main unit 110.
The upper side and lower side of main unit 110 the first cap unit 120 and the second cap unit 160 seal. Therefore, the first potted component 181 of such as O-ring seal is interposed between the downside of main unit 110 and the first cap unit 120, and the second potted component 183 of such as O-ring seal is interposed between the upside of main unit 110 and the second cap unit 160.
In this embodiment, impeller 300 is arranged between main unit 110 and the first cap unit 120. Specifically, impeller 300 is arranged between partition wall 111 and first cap unit 120 of main unit 110, and rotate so that the cooling water eddy flow that is filled between partition wall 111 and the first cap unit 120 so that cooling water can connect between partition wall 111 and the first cap unit 120.
In this embodiment, the first cap unit 120 is connected with the downside of main unit 110, and directly or indirectly contacts with CPU to pass through to conduct the heat receiving CPU generation. Thus, the first cap unit 120 can be made from a material that be thermally conductive, for instance copper or the outstanding similar material of thermal conductivity.
With reference to Figure 4 and 5, plate 121 that the first cap unit 120 includes being connected with the downside of main unit 110, formed at plate 121 towards in the side of impeller 300 and hold groove 123 and the formation multiple uneven pattern 125 on the basal surface of groove 123 of impeller 300.
The heat that CPU produces is transmitted along the first cap unit 120 and cooled water dissipates.
Therefore, along with the first cap unit 120 get thinner and the contact side of CPU of the first cap unit 120 and the first cap unit 120 contact cooling water side between the temperature difference more big, more many along the first cap unit 120 from the CPU heat transmitted.
In order to make the first cap unit 120 thinning, the side towards impeller 300 of plate 121 is formed with groove 123, and impeller 300 is contained in this groove 123.
In order to make the temperature difference between the both sides of the first cap unit 120 bigger, the basal surface that groove 123 contacts with cooling water is formed with the plurality of uneven pattern 125.
By forming multiple uneven pattern 125 on the basal surface of groove 123, increase the surface area of contact cooling water. And, the multiple uneven pattern 125 formed on the basal surface of groove 123 makes cooling water by eddy flow more strongly, and cooling water is circulated in groove 123 by impeller 300 simultaneously.
After the heat that cooling water between the partition wall 111 and the first cap unit 120 that are filled in main unit 110 is transmitted from CPU, between partition wall 111 and the first cap unit 120, water needs supply cooling.
In this embodiment, along from the pars intermedia of impeller 300 towards the direction cooling water supply of the first cap unit 120, it is subsequently filled between partition wall 111 and the first cap unit 120.
Specifically, by the chilled(cooling) water supply (CWS) unit 130 that is connected with the pars intermedia of impeller 300 along from the pars intermedia of impeller 300 towards the direction cooling water supply of the first cap unit 120.
Chilled(cooling) water supply (CWS) unit 130 through the partition wall 111 of main unit 110, with and the pars intermedia of impeller 300 that rotates together with impeller 300 connect, and include the cooling water tube 131 with hollow shape, cooling water flows wherein.
That is, cooling water tube 131 is not only the cooling water service between partition wall 111 and the first cap unit 120, but also as the rotating shaft for impeller 300.
In order to by cooling water tube 131 cooling water supply, the upside of main unit 110, namely the upside of partition wall 111 is formed for cooling water is guided the cooled water supply channel 140 to cooling water tube 131.
Such as, along the cooled water supply channel 140 formed on the upside of partition wall 111 by cooling water tube 131 cooling water supply between partition wall 111 and the first cap unit 120.
That is, along cooling water supply pipe 131 chilled(cooling) water supply (CWS) given the pars intermedia on the basal surface forming groove in the first cap unit 120, and cool down water and flow towards the inner radial of groove 123.
Due to when the pars intermedia of the first cap unit 120 contacts with the pars intermedia of CPU the pars intermedia of the first cap unit 120, groove 123 pars intermedia be heated to maximum temperature, therefore this cooling water that will first newly supply to the pars intermedia supply of groove 123, and the pars intermedia of groove 123 is cooled down by force.
In addition, while the inner radial flowing of the central part on the basal surface towards groove 123, the cooling water of the pars intermedia being supplied on the basal surface of groove 123 is driven rotation by impeller 130, and therefore cooling water, by eddy flow more strongly, which thereby enhances the efficiency of cooling heating element.
And, can additionally include indicator 500 as shown in Figures 2 and 3 according to the heater element cooling device of this embodiment, in order to indicate whether from chilled(cooling) water supply (CWS) unit 130 cooling water supply.
Indicator 500 is placed on cooling water tube 131, and includes the multiple wings 510 being radially arranged relative to pars intermedia.
Indicator 500 is a kind of sensor, for the supply of sensing cooling water when radial wings 510 is supplied by cooling water tube 131 along with cooling water and rotated.
Additionally, impeller 300 includes the multiple blades 310 being radially arranged relative to cooling water tube 131 so that the cooling water of the pars intermedia being supplied on the basal surface of groove 123 can evenly with smoothly towards the internal flow of groove 123.
When impeller 300 rotates, multiple blades 310 apply centrifugal force to the cooling water in groove 123 so that the cooling water being filled in groove 123 can flow to the inside of groove 123 by centrifugal force, and rotate along the inner surface of groove 123.
The cooling water that inner surface along groove 123 rotates is gone out passage 145 (as shown in Figure 6) discharge by passing through to be formed cooling water drainage in main unit 110. Cooling water drainage goes out passage 145 and is formed below partition wall 111 and connect with groove 123, in order to thus discharge the cooling water that the inner surface along groove 123 rotates.
As shown in Figure 4, the internal diameter of groove 123 is gradually increased along the direction of rotation of impeller 300.
In other words, along the direction of rotation of impeller 300, the distance D2 between inner surface and the outer surface of impeller 300 of the groove 123 in the left side of Fig. 4 is bigger than the distance D1 between the inner surface of the groove 123 on the right side at Fig. 4 and the outer surface of impeller 300. Like this, the distance between inner surface and the outer surface of impeller 300 of groove 123 is gradually increased along the direction of rotation of impeller 300.
Here, the internal diameter of the opening that groove 123 goes out passage 145 towards cooling water drainage is maximum. This slows down preventing owing to bumping against cooling water drainage and go out the opening of passage 145 when the cooling water rotated along the inner surface of groove 123 is incorporated into the cooling water rotated when cooling water drainage goes out the opening of passage 145 by impeller 300.
And, as shown in Figure 5, the going out the inner surface of opening of passage 145 towards cooling water drainage and go out the opening slight inclination of passage 145 from its bottom towards cooling water drainage of groove 123 so that by impeller 300 rotate that the inner surface along groove 123 rotates cool down water and can be directed to cooling water drainage and go out the opening of passage 145.
That is, groove 123 includes rake 123a, there the inner surface slight inclination bottom-up of the opening going out passage 145 towards cooling water drainage of groove 123. So, the cooling water rotated along the inner surface of groove 123 can smoothly be discharged to cooling water drainage along this rake 123a and go out passage 145.
And, the cooling water being discharged to the heating that cooling water drainage goes out passage 145 is introduced in cooler 400 by coolant outlet 175 and the second pipe 430 being connected with main unit 110, and cooled in cooler 400, then pass through the first pipe 410 and the cooling water inlet 170 being connected with main unit 110 returns to cooled water supply channel 140. So, cooling water is heated by the heat exchange with housing 100, and cooled in cooler 400, and loops back housing 100.
In this way, impeller 300 uses cooling water tube 131 to rotate as rotating shaft, and thus partition wall 111 is connected with support component 150, support component 150 is set to surround the outer surface of cooling water tube 131 and contact and support the outer surface of cooling water tube 131.
In this embodiment, the cooling water tube 131 being connected with impeller 300 rotates, the outer surface of contact support component 150, and the outer surface of therefore cooling water tube 131 is formed with screw thread 133 so that the friction reduced between cooling water tube 131 and support component 150.
And, in this embodiment, by forming cooling water supply pipe 140 above the partition wall 111 of main unit 110 to cooling water tube 131 cooling water supply, and therefore cooling water is supplied towards the first cap unit 120 also by the threaded rod of the screw thread 133 formed on the outer surface of cooling water tube 131, wherein cooling water can as the lubricant between support component 150 and cooling water tube 131.
And, in this embodiment, impeller drive 350 is arranged on the inside of housing 100, and is specifically arranged on the upside of the partition wall 111 of main unit 110, and drives impeller 300 to rotate.
The upside of partition wall 111 is formed with seat slot 113, and impeller drive 350 is seated securely within seat slot, and impeller drive 350 is fixed in seat slot 113, even and if impeller 300 rotate and also do not rotate together with impeller 300.
Impeller drive 350 can include brushless electric machine, and brushless electric machine includes the magnet being arranged in seat slot 113. This brushless electric machine commercially commonly uses, and therefore will omit detailed description thereof.
When impeller drive 350 is seated against in seat slot 113, the 3rd potted component 185 is connected with the upside of seat slot 113, in order to isolates with cooled water supply channel 140 and seals.
And, the second cap unit 160 is connected in the upside of the both sides of impeller drive 350 with main unit 110, and thus sealed body unit 110.
Using said structure, the operation of heater element cooling device is as follows according to an embodiment of the invention.
Fig. 7 illustrates the mobile route cooling down water according to an embodiment of the invention.
With reference to Fig. 2,3 and 7, be incorporated into the cooling water of the upside of main unit 110 by cooling water inlet 170 and be supplied to and form cooling water tube 140 on the upside of main unit 110.
The cooling water being supplied to cooling water tube 140 is supplied to the downside of main unit 110 and the pars intermedia of the first cap unit 120 by the cooling water tube 131 of the rotating shaft as impeller 300.
Owing to the pars intermedia of the first cap unit 120 is heated more by the heat transmitted from CPU, thus the strong cooling passing through the pars intermedia to the first cap unit 120 is improved cooling effectiveness by this.
And, it is supplied to the cooling water of cooled water supply channel 140 to be supplied to the downside of main unit 110 along the threaded rod of the screw thread 133 formed on the outer surface that the inner surface with support component 150 of cooling water tube 131 is connected, with the friction between reduction support component 150 and cooling water supply pipe 131 when impeller 300 rotates.
In order to improve the heat from CPU transmission, the first cap unit 120 is formed with groove 123, thus shortens the path from the CPU heat transmitted.
And, the cooling water supplied between the downside of main unit 110 and the first cap unit 120 is its groove 123 dissipating when rotating and drive and rotate from the CPU heat transmitted by impeller 300 along the first cap unit 120.
Impeller 300 stirs the cooling water being contained between the downside of main unit 110 and the first cap unit 120 so that cooling water can keep the temperature of somewhat constant. And, the rotation of impeller 300 makes cooling water be stirred more strongly. Thus, for the heat passing to the first cap unit 120, improve cooling effectiveness.
In order to increase the contact area between the basal surface of groove 123 and cooling water, the basal surface of groove 123 forms multiple uneven pattern 125. When cooling down water and being driven rotation by the rotation of impeller 300, multiple uneven patterns 125 make cooling water be stirred more strongly, thus for the heat passing to the first cap unit 120, further increase cooling effectiveness.
Along with the heat passing to the first cap unit 120 is cooled, it is filled in the cooling water between the downside of main unit 110 and the first cap unit 120 and is heated. The cooling water of heating is in its inner surface going out passage 145 by formation cooling water drainage on the downside of main unit 110 when rotating and drive and rotate and discharge by impeller 300 along groove 123.
And, cooling water goes out passage 145, coolant outlet 175 and the second pipe 430 by cooling water drainage and is introduced in cooler 400, and it is cooled, then passes through the first pipe 410 and cooling water inlet 170 is circulated back to the cooled water supply channel 140 of main unit 110.
Although being particularly shown with reference to the preferred embodiments of the present invention and describing the present invention, but skilled artisan would appreciate that, when not necessarily departing from by the spirit and scope of claims invention defined of extention, it is possible to be variously modified in form and details.
Industrial applicibility
The present invention improves the efficiency of cooling heating element.

Claims (11)

1. a heater element cooling device, including:
Housing, described housing contacts with heater element and allows cooling water to flow wherein; With
Impeller, described impeller holds in the housing and rotates,
Described housing includes:
Main unit, described main unit is connected with impeller;
First cap unit, described first cap unit is connected with main unit, and impeller is between the first cap unit and main unit, and described first cap unit is made up of the Heat Conduction Material of contact heating element; And
Chilled(cooling) water supply (CWS) unit, described chilled(cooling) water supply (CWS) unit is connected with the pars intermedia of impeller, and described chilled(cooling) water supply (CWS) unit rotates and from the pars intermedia of impeller towards the first cap unit cooling water supply together with impeller.
2. heater element cooling device according to claim 1, wherein:
Described housing also includes cooled water supply channel, and described cooled water supply channel is formed in main unit, and guides cooling water to chilled(cooling) water supply (CWS) unit, and
Chilled(cooling) water supply (CWS) unit includes the cooling water tube of hollow, described cooling water tube has the one end connected with cooled water supply channel and the traverse main unit other end, and being connected with the pars intermedia of impeller, cooling water tube rotates together with impeller and cools down water and flows through this cooling water tube.
3. heater element cooling device according to claim 2, wherein:
Described housing also includes support component, and described support component is connected with main unit, is set to surround the outer surface of cooling water tube, and contacts and support the outer surface of cooling water tube; And
The cooling water tube of the inner surface of contact support component is formed with screw thread on its outer surface.
4. heater element cooling device according to claim 2, wherein said first cap unit includes:
Plate, described plate is connected with main unit; With
Groove, described groove formed at described plate towards on the side of impeller and hold described impeller.
5. heater element cooling device according to claim 4, wherein said first cap unit also includes forming the multiple uneven pattern on the basal surface of groove.
6. heater element cooling device according to claim 4, wherein:
Described housing also includes cooling water drainage and goes out passage, and described cooling water drainage goes out passage and formed in main unit and guide the cooling water drainage being filled between main unit and the first cap unit to go out, and
Described groove has the internal diameter that the direction of rotation along impeller is gradually increased.
7. heater element cooling device according to claim 6, wherein:
The opening that described groove goes out passage from the inner bottom surface of the opening going out passage towards cooling water drainage towards cooling water drainage tilts so that can be directed into cooling water drainage along inner surface by the cooling water rotating driving rotation of impeller and go out the opening of passage.
8. heater element cooling device according to claim 6, wherein:
Described main unit includes partition wall, and partition wall is for the separation between the upper side and lower side and has the pars intermedia that cooled water supply pipe penetrates, and
Described cooled water supply channel is formed above partition wall and connects with cooling water tube, and described cooling water drainage goes out passage and formed in the lower section of partition wall and connect with described groove.
9. heater element cooling device according to claim 6, wherein said housing includes:
Cooling water inlet, described cooling water inlet is connected with main unit, connects with cooled water supply channel, and cooling water supply; With
Coolant outlet, described coolant outlet is connected with main unit, goes out channel connection with cooling water drainage, and discharges cooling water, and
Described heater element cooling device also includes cooler, and described cooler is connected with cooling water inlet and coolant outlet, cools down the heated cooling water from coolant outlet discharge and by the chilled(cooling) water supply (CWS) after cooling to cooling water inlet.
10. heater element cooling device according to claim 1, also includes indicator, and described indicator is arranged on the top of chilled(cooling) water supply (CWS) unit, and indicates whether cooling water is supplied to chilled(cooling) water supply (CWS) unit.
11. heater element cooling device according to claim 1, also including impeller drive, described impeller drive is placed on main unit inside and by making the chilled(cooling) water supply (CWS) finite element rotation being connected with impeller make impeller rotate, wherein:
Described housing also includes the second cap unit, and described second cap unit is connected with main unit, and impeller drive is between the second cap unit and main unit.
CN201490000655.2U 2013-05-10 2014-04-25 Heating element cooling arrangement Expired - Fee Related CN205281385U (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR20-2013-0003699 2013-05-10
KR20130003699 2013-05-10
KR20130004488 2013-06-04
KR20-2013-0004488 2013-06-04
KR10-2014-0013737 2014-02-06
KR1020140013737A KR101467375B1 (en) 2013-05-10 2014-02-06 Cooling apparatus for heating element
PCT/KR2014/003633 WO2014181984A2 (en) 2013-05-10 2014-04-25 Heating element cooling apparatus

Publications (1)

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CN205281385U true CN205281385U (en) 2016-06-01

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CN (1) CN205281385U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110440624A (en) * 2018-05-04 2019-11-12 双鸿科技股份有限公司 Water-cooling head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110440624A (en) * 2018-05-04 2019-11-12 双鸿科技股份有限公司 Water-cooling head
CN110444521A (en) * 2018-05-04 2019-11-12 双鸿科技股份有限公司 Water-cooling head
CN110444521B (en) * 2018-05-04 2021-08-06 双鸿科技股份有限公司 Water cooling head

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KR101467375B1 (en) 2014-12-03

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