CN205275730U - Metal substrate metallizing after annealing frock - Google Patents

Abstract

The utility model relates to a metal substrate metallizing after annealing frock, including the carrier base plate, characterized by: carrier base plate surface connections metal mesh, the bump combination of a plurality of groups has evenly been arranged at the upper surface of metal mesh to the mesh that gathers on the metal mesh, the bump combination of every group sets up around the peripheral of first kind of bump including a plurality of first kind of bumps and a plurality of second kind bump, second kind bump, the diameter of first kind of bump is less than the diameter of second kind bump, the height that highly is less than second kind bump of first kind of bump, arrange a plurality of through -holes on the carrier base plate, the upper and lower surface of carrier base plate is connected to the through -hole. The both sides of carrier base plate set up the flange respectively. First kind of bump distance each other is unanimous. Second kind bump distance each other is unanimous. The utility model discloses avoid the adhesion between substrate and the carrier, guarantee the effect of metallizing, make substrate surface metal coating film complete.

Description

Metal base metallizing after annealing frock

Technical field

The utility model relates to a kind of carrier for metal base metallizing after annealing, belongs to alloy production frock technical field.

Background technology

Plating utilizes electrolysis principle to plate the process of other metal or alloy of skim in some metallic substrate surface, electrolytic action is utilized to make the surface attachment layer of metal film of metal or other material product, thus play and prevent burning (such as corrosion), it is to increase wear resistance, electroconductibility, reflective, erosion resistance and promote the effect such as attractive in appearance.

In existing technique, metal base (such as molybdenum copper, tungsten copper sheet material) carries out craft of gilding after being placed on after nickel plating and heat-treating on carrier again, often there is the phenomenon of adhesion between base material and carrier, thus it is not thorough to be directed at substrate surface plating, affects electroplating effect.

Summary of the invention

The purpose of this utility model overcomes the deficiencies in the prior art, it is provided that a kind of metal base metallizing after annealing frock, avoids the adhesion between base material and carrier, ensures the effect of metallizing, make substrate surface metal coating complete.

The technical scheme provided according to the utility model, described metal base metallizing after annealing frock, comprises carrier substrate; It is characterized in that: at described carrier substrate upper surface connection metal net, wire netting gathers mesh, and the upper surface at wire netting has been evenly arranged some groups of group of bumps and has closed; Often organizing group of bumps conjunction and comprise the first convex point multiple and multiple 2nd kind of convex point, the 2nd kind of convex point is arranged around the peripheral of the first convex point; The diameter of the first convex point described is less than the diameter of the 2nd kind of convex point, and the height of the first convex point is less than the height of the 2nd kind of convex point; Described carrier substrate is arranged some through holes, the upper and lower surface of through hole connection carrier substrate.

Further, in the both sides of described carrier substrate, rib is set respectively.

Further, the first convex point described distance each other is consistent.

Further, described 2nd kind of convex some distance each other is consistent.

The utility model has the following advantages: (1) can avoid the adhesion between base material and carrier, ensures the effect of metallizing, makes substrate surface metal coating complete; (2) wire netting firmly is positioned on carrier substrate, it is not easy to come off; (3) metal base after electroplating can depart from carrier frock with just managing, and after overcoming plating, metal base is difficult to the defect taken off.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model.

Fig. 2 is the vertical view of Fig. 1.

Fig. 3 is the local figure on described wire netting surface.

Embodiment

Below in conjunction with concrete accompanying drawing, the utility model is described in further detail.

As shown in FIG. 1 to 3: described metal base metallizing after annealing frock comprises carrier substrate 1, wire netting 2, rib 3, group of bumps conjunction 4, the first convex some 4-1, the 2nd kind of convex some 4-2, through hole 5 etc.

As shown in Figure 1 and Figure 2, the utility model comprises carrier substrate 1, and carrier substrate 1 upper surface connection metal net 2, is positioned on wire netting 2 by metal base, due to the mesh gathered on wire netting 2, it is possible to effectively prevent metal base and carrier from sticking together.

In order to avoid in the process departed from carrier frock after metal base is electroplated, occur metal base and carrier work to be difficult to the phenomenon departed from, described carrier substrate 1 is arranged some through holes 5, the upper and lower surface of through hole 5 connection carrier substrate 1; In the process that metal base and carrier frock depart from, it is possible to by blowing by below carrier substrate 1, by through hole 5, the metal base being difficult to come off is taken off.

In order to prevent wire netting 2 from coming off from carrier substrate 1, rib 3 is set respectively in the both sides of carrier substrate 1, it is possible to firmly be positioned on carrier substrate 1 by wire netting 2, prevents from coming off.

In addition, in order to the preventing adhesiving effect improved further between metal base and carrier, the upper surface at described wire netting 2 has been evenly arranged some groups of group of bumps and has closed 4; As shown in Figure 3, often organize group of bumps conjunction 4 and comprise the first convex some 4-1 multiple and multiple 2nd kind of convex some 4-2, the first convex some 4-1 distance each other is consistent, and the 2nd kind of convex some 4-2 is around the peripheral setting of the first convex some 4-1, and the 2nd kind of convex some 4-2 distance each other is consistent; The diameter of the first convex some 4-1 described is less than the diameter of the 2nd kind of convex some 4-2, and the height of the first convex some 4-1 is less than the height of the 2nd kind of convex some 4-2. Adopt the first convex some 4-1 and the 2nd kind of mode that convex some 4-2 combines above-mentioned, it is possible to make carrier be applicable to the metal base of different size, when the size of metal base is less, it is possible to play support effect by the first convex some 4-1; When metal base size is bigger, it is possible to play support effect by the 2nd kind of convex some 4-2.

The utility model is in use, when being positioned over by metal base on wire netting 2, there is certain gap between metal base and wire netting 2, it is possible to improve preventing adhesiving effect further, and fill the effect sent out and ensure metallizing, make metallic substrate surface metal coating complete.

Claims (4)

1. a metal base metallizing after annealing frock, comprises carrier substrate (1); It is characterized in that: at described carrier substrate (1) upper surface connection metal net (2), the upper mesh that gathers of wire netting (2), the upper surface at wire netting (2) has been evenly arranged some groups of group of bumps and has closed (4); Often organizing group of bumps conjunction (4) and comprise the first convex point (4-1) multiple and multiple 2nd kind of convex point (4-2), the 2nd kind of convex point (4-2) is arranged around the peripheral of the first convex point (4-1); The diameter of the first convex point (4-1) described is less than the diameter of the 2nd kind of convex point (4-2), and the height of the first convex point (4-1) is less than the height of the 2nd kind of convex point (4-2); At described carrier substrate (1) the some through holes of upper layout (5), the upper and lower surface of through hole (5) connection carrier substrate (1).

2. metal base metallizing after annealing frock as claimed in claim 1, is characterized in that: arrange rib (3) respectively in the both sides of described carrier substrate (1).

3. metal base metallizing after annealing frock as claimed in claim 1, is characterized in that: the first convex point (4-1) described distance each other is consistent.

4. metal base metallizing after annealing frock as claimed in claim 1, is characterized in that: described 2nd kind of convex point (4-2) distance each other is consistent.