CN204849071U

CN204849071U - A carrier for metal substrate metallizing

Info

Publication number: CN204849071U
Application number: CN201520556660.8U
Authority: CN
Inventors: 田强
Original assignee: WUXI LEPU METAL TECHNOLOGY CO LTD
Current assignee: WUXI LEPU METAL TECHNOLOGY CO LTD
Priority date: 2015-07-28
Filing date: 2015-07-28
Publication date: 2015-12-09
Anticipated expiration: 2025-07-28

Abstract

The utility model relates to a carrier for metal substrate metallizing, including the carrier base plate, characterized by: carrier base plate surface connections metal mesh, the bump combination of a plurality of groups has evenly been arranged at the upper surface of metal mesh to the mesh that gathers on the metal mesh, the bump combination of every group sets up around the peripheral of first kind of bump including a plurality of first kind of bumps and a plurality of second kind bump, second kind bump, the diameter of first kind of bump is less than the diameter of second kind bump, the height that highly is less than second kind bump of first kind of bump. The both sides of carrier base plate set up the flange respectively. First kind of bump distance each other is unanimous. Second kind bump distance each other is unanimous. The utility model has the advantages of it is following: (1 )Can avoid the adhesion between substrate and the carrier, guarantee the effect of metallizing, make substrate surface metal coating film complete, (2 )The metal mesh is placed on the carrier base plate firmly, is difficult to drop.

Description

For the carrier of metal base metallizing

Technical field

The utility model relates to a kind of carrier for metal base metallizing, belongs to alloy production frock technical field.

Background technology

Plating utilizes electrolysis principle to plate the process of other metal or alloy of skim in some metallic substrate surface, electrolytic action is utilized to make the surface attachment layer of metal film of metal or other material, thus play and prevent burning (as corrosion), improve the effects such as wear resistance, electroconductibility, reflective, erosion resistance and having improved aesthetic appearance.

In existing technique, metal base (as molybdenum copper, tungsten copper sheet material) carries out craft of gilding after being placed on after nickel plating and carrier being heat-treated again, often there is the phenomenon of adhesion between base material and carrier, thus it is not thorough to be directed at substrate surface plating, affects electroplating effect.

Summary of the invention

The purpose of this utility model overcomes the deficiencies in the prior art, provides a kind of carrier for metal base metallizing, avoid the adhesion between base material and carrier, ensures the effect of metallizing, make substrate surface metal coating complete.

According to the technical scheme that the utility model provides, the described carrier for metal base metallizing, comprises carrier substrate; It is characterized in that: at described carrier substrate upper surface connection metal net, wire netting gathers mesh, has been evenly arranged some groups of salient point combinations at the upper surface of wire netting; Often organize salient point combination and comprise the first salient point multiple and multiple the second salient point, the second salient point is arranged around the periphery of the first salient point; The diameter of the first salient point described is less than the diameter of the second salient point, and the height of the first salient point is less than the height of the second salient point.

Further, in the both sides of described carrier substrate, rib is set respectively.

Further, the first salient point described distance is each other consistent.

Further, described the second salient point distance is each other consistent.

The utility model has the following advantages: (1) can avoid the adhesion between base material and carrier, ensures the effect of metallizing, makes substrate surface metal coating complete; (2) wire netting is firmly positioned on carrier substrate, is not easy to come off.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model.

Fig. 2 is the vertical view of Fig. 1.

Fig. 3 is the Local map on described wire netting surface.

Embodiment

Below in conjunction with concrete accompanying drawing, the utility model is described in further detail.

As shown in FIG. 1 to 3: described metal base metallizing carrier comprises carrier substrate 1, wire netting 2, rib 3, salient point combination 4, the first salient point 4-1, the second salient point 4-2 etc.

As shown in Figure 1 and Figure 2, the utility model comprises carrier substrate 1, and carrier substrate 1 upper surface connection metal net 2, is positioned on wire netting 2 by metal base, due to the mesh that wire netting 2 gathers, can effectively prevent metal base and carrier from sticking together.

In order to prevent wire netting 2 from coming off from carrier substrate 1, rib 3 being set respectively in the both sides of carrier substrate 1, wire netting 2 firmly can being positioned on carrier substrate 1, preventing from coming off.

In addition, in order to improve the preventing adhesiving effect between metal base and carrier further, some groups of salient point combinations 4 are evenly arranged at the upper surface of described wire netting 2; As shown in Figure 3, often organize salient point combination 4 and comprise multiple the first salient point 4-1 and multiple the second salient point 4-2, the first salient point 4-1 distance is each other consistent, and the second salient point 4-2 is arranged around the periphery of the first salient point 4-1, and the second salient point 4-2 distance is each other consistent; The diameter of described the first salient point 4-1 is less than the diameter of the second salient point 4-2, and the height of the first salient point 4-1 is less than the height of the second salient point 4-2.The mode adopting above-mentioned the first salient point 4-1 and the second salient point 4-2 to combine, can make carrier be applicable to the metal base of different size, when the size of metal base is less, can play support effect by the first salient point 4-1; When metal substrate size is larger, support effect can be played by the second salient point 4-2.

The utility model in use, when being positioned over by metal base on wire netting 2, between metal base and wire netting 2, there is certain gap, preventing adhesiving effect can be improved further, and fill the effect sent out and ensure metallizing, make metallic substrate surface metal coating complete.

Claims

1., for a carrier for metal base metallizing, comprise carrier substrate (1); It is characterized in that: at described carrier substrate (1) upper surface connection metal net (2), the upper mesh that gathers of wire netting (2), has been evenly arranged some groups of salient points combination (4) at the upper surface of wire netting (2); Often organize salient point combination (4) and comprise multiple the first salient point (4-1) and multiple the second salient point (4-2), the second salient point (4-2) is arranged around the periphery of the first salient point (4-1); The diameter of described the first salient point (4-1) is less than the diameter of the second salient point (4-2), and the height of the first salient point (4-1) is less than the height of the second salient point (4-2).

2., as claimed in claim 1 for the carrier of metal base metallizing, it is characterized in that: in the both sides of described carrier substrate (1), rib (3) is set respectively.

3., as claimed in claim 1 for the carrier of metal base metallizing, it is characterized in that: described the first salient point (4-1) distance is each other consistent.

4., as claimed in claim 1 for the carrier of metal base metallizing, it is characterized in that: described the second salient point (4-2) distance is each other consistent.