CN205265035U - Grand passageway liquid refrigerator and combination thereof - Google Patents
Grand passageway liquid refrigerator and combination thereof Download PDFInfo
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- CN205265035U CN205265035U CN201521050451.2U CN201521050451U CN205265035U CN 205265035 U CN205265035 U CN 205265035U CN 201521050451 U CN201521050451 U CN 201521050451U CN 205265035 U CN205265035 U CN 205265035U
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Abstract
The utility model provides a grand passageway liquid refrigerator and combination thereof. This grand passageway liquid refrigerator link up in the side of liquid refrigerator and sets up water inlet and the delivery port that is parallel to each other, the inside liquid cooling return circuit that is provided with grand passageway of liquid refrigerator, liquid refrigerator inside has multilayer divided circulation water route, the circulation water route respectively certainly the water inlet rises, and delivery port again flows back in the region of pile warp liquid refrigerator between refrigeration working face and water inlet. The utility model discloses a designability is good, and the rigidity is big, and non -deformable is fit for follow -up equipment, unique multilayer circulation waterway structure that connects in parallel is showing and is improving the radiating effect.
Description
Technical field
The utility model relates to a kind of grand channel liquid refrigerator.
Background technology
The heat dissipation design of high-power semiconductor laser is one of core content of encapsulation. Current high powerSemiconductor laser is encapsulated by following several modes conventionally:
A) as shown in Figure 1 and Figure 2, laser instrument bar bar is bonded directly on liquid chiller, liquid refrigeratingDevice adopts a kind of structure heat-sink based on microchannel. This encapsulating structure can be realized by heat sink stackThe output of relatively high power, but which encapsulation has a following shortcoming: and first, microchannel is easily because water is logicalRoad is narrow, easily results in blockage; The second, heat sink own charged, so must adopt deionized water to carry outCooling, and have very high requirement for ion concentration; The 3rd, the high-velocity flow in microchannel, can causeThe erosion of passage, causes product failure; The 4th, the bulk strength of micro-channel heat sink and rigidity lack, and holdEasily in assembling and manufacture process, there is bending, distortion, thus the quality of impact encapsulation.
This encapsulation, because bar bar does not mate with the CTE of heat sink material, can only be selected slicken solder encapsulation conventionallyBecause the bar bar that causes of thermal stress inner micro-damage is even torn, restrict laser device reliability to reducePromote. It is (logical that the laser instrument bar bar of this packing forms also can first be bonded in the conductive substrates of CTE couplingOften copper tungsten) upper, then be encapsulated into heat sink on. Such advantage is to use hard solder to encapsulate,But but increase heat dissipation path, reduced heat-sinking capability.
In addition, also there is the heat sink for clinging to the encapsulation of bar of a kind of grand passage, structure similar to Figure 1,By the water inlet connecting, the effect that delivery port plays heat radiation. Its advantage is that passage is larger, is difficult for producingPassage stops up, and the flow velocity of liquid also can be relatively low, can reduce the erosion of passage. But this also makesBecome the heat-sinking capability of grand passage packaging poor and have a problem of non-uniform temperature in passage, heatHeavy is also charged. So this encapsulation is only applicable to the application scenario lower at power.
B) Patents document is for example: US5105429, US5311530, US6480514, US6865200,US7016383, US7944955B2, US7660335B2 etc. Common a kind of packing forms is: laserThe substrate that device bar bar is bonded to CTE coupling forms a luminescence unit, and multiple luminescence units combine side by side,Be encapsulated on collets, then be encapsulated into and be generally on grand passage heat sink. Such packing forms, becauseHeat sink and laser instrument luminescence component integral insulation, for follow-up application provides convenience, can use simultaneouslyHard solder encapsulation, realizes non-deionized water (DIW) refrigeration. Because the existence of substrate and collets, shouldThe major defect of encapsulation is that the heat dissipation path of bar bar is long, is difficult to adapt to the occasion of high power high duty ratio.The grand channel liquid refrigerator being used in conjunction with can freeze or other modes are freezed by water. Based on thisEach product of heat sink structure, is difficult to assemble splicing to realize the expansion of bar number object. When needs moreWhen many bar bar, can only do that the bottom of different size is heat sink mates adaptation.
Utility model content
The structural design that the utility model proposes a kind of grand channel liquid refrigerator, radiating efficiency is high, structureProperty is good.
The technical solution of the utility model is as follows:
A kind of grand channel liquid refrigerator, connects and offers entering of being parallel to each other in the side of liquid chillerThe mouth of a river and delivery port, liquid chiller inside is provided with the liquid cooling loop of grand passage, described liquid chillerInside has the circulation waterway of Multi-layer separated; Circulation waterway respectively from described water inlet, pile warp liquid systemThe region of cooler between refrigeration work face and water inlet be back to again delivery port (be each layer of circulation waterway itBetween parallel with one another).
Realize the circulation waterway of above-mentioned Multi-layer separated, preferably following two kinds of concrete structures:
1, liquid chiller is connected along water inlet, delivery port by multiple independently water boards that direction is stacked to be formed,Be provided with the circulation waterway being communicated with described water inlet, delivery port in the inside of each water board;
2, liquid chiller is integrated part, offers the circulation waterway that multilayer is isolated mutually, recirculated water in insidePlace, road plane and water inlet, that delivery port connects direction is vertical.
For further improving the heat radiation uniformity of chipset installed surface, adjacent two layers circulation waterway water inlet,The water flowing interface of water outlet is symmetrical arranged, and makes the flow direction of adjacent two layers circulation waterway contrary.
The perforation direction of water inlet and delivery port is parallel with refrigeration work face. Especially for the refrigeration of stackObject, the perforation direction of described water inlet and delivery port and the heap of refrigeration object that is arranged on refrigeration work faceFolded direction is same direction or mutually vertical. Can make like this liquid chiller there is autgmentability. ?Make well water inlet be positioned at the near-end of refrigeration work face, delivery port is positioned at the far-end of refrigeration work face.
The utility model also proposes a kind of grand channel liquid refrigerator combination thus, adopts several above-mentioned grandChannel liquid refrigerator connects direction along water inlet, delivery port and aims at successively assembling, makes all grand passagesLiquid chiller forms unified water inlet, delivery port; The water inlet of adjacent grand channel liquid refrigerator,Delivery port position is provided with sealing ring. For example,, for the semiconductor laser chip forming with stack mannerGroup is installed chipset and is formed a laser module on each liquid chiller, can realize multiple sharpElectricity between light device module and the coupled in series in water route.
The utlity model has following advantage:
Liquid chiller structural good, rigidity is large, not yielding, is applicable to follow-up assembling; Unique is manyLayer parallel circulating waterway structure, has significantly improved radiating effect.
To the concrete structure optimization of circulation waterway, make heat radiation harmonious better, also strengthen to a certain extentThe stress equilibrium of chipset is installed.
The machinery assembling easily of multiple liquid chillers, maintenance, thus semiconductor laser supportedThe expansion of chipset.
Brief description of the drawings
Fig. 1, Fig. 2 are the mounting structure schematic diagram of traditional chipset-liquid chiller; Wherein, Fig. 1(a) be front view, Fig. 1 (b) is side view; Number in the figure: 1-radiator (sheet metal); 2-laserDevice chip; 3-negative pole brace; 4-insulating barrier; 5-water inlet; 6-delivery port.
Fig. 3, Fig. 4 are the mounting structure schematic diagram of application chipset-liquid chiller of the present utility model,Wherein Fig. 3 is front view; Fig. 4 is side view.
Fig. 5 is the schematic diagram of the multiple module assembled expansions of the utility model.
Fig. 6 is a kind of stepped construction (multilayer water board) schematic diagram of the utility model liquid chiller.
Fig. 7 is another kind of stepped construction (integral piece) schematic diagram of the utility model liquid chiller.
Fig. 8 is the circulation waterway schematic diagram of adjacent two layers water board.
Fig. 9 is the water inlet of perforation and the installation site schematic diagram of delivery port.
Detailed description of the invention
Below in conjunction with the mounting structure of concrete chipset-liquid chiller, to liquid system of the present utility modelCooler structure describes in detail.
As shown in Figure 3,4, chip of laser 12 is assembled in the conductive material of high heat conductance, CTE couplingSubstrate 11 on. The substrate of chip of laser is installed by the collets 13 of high heat conductance, is assembled into liquidOn system cooler 14, form a laser module. Liquid chiller side connects to offer and is parallel to each otherWater inlet and delivery port, liquid chiller inside is provided with the liquid cooling loop of grand passage. Make multiple sharpLight device module can be passed through sealing ring " seamless " and connect, and shares water inlet 15 and delivery port 16, realizes and expandingExhibition, as shown in Figure 5.
Liquid refrigerating implement body forms by multilayer water board is stacked, flows on the contrary, with reality between adjacent two layersThe heat radiation uniformity of existing laser instrument installed surface. The cooling road of the liquid chiller of liquid chiller to cooling waterPlan in footpath, has ensured loose heat availability, uniformity. Liquid chiller is intake from side, entersOral sex fork, mutually balanced. It should be noted that, except the circulation waterway structure shown in Fig. 8, all rightThe intake-outlet position of adjusting passage, the direction of current can be also other combination.
With traditional distinguishing based on the cooling product of micro channels liquid refrigerator: as Fig. 9, traditionalMicrochannel encapsulation is that chip of laser is installed to 31 above, and this programme is that chip of laser is installed toOn 30. This is one of outstanding feature being different from traditional microchannel encapsulating products.
The bar bar number of each laser module can be 1,2,3 etc. The maximum number of suggestion is littleIn 10, to improve configurability, the reliability of product.
The step that the utility model is assembled grand passage liquid cooling high-power semiconductor laser device is as follows:
1) together with being assembled into successively, one or more chip of laser and substrate and collets form coreSheet group, forms electrical coupling between each chip and substrate. Bar bar use hard solder and diamond copper substrate,Diamond collets carry out bonding, form DOPA bar group.
2) DOPA bar group and liquid chiller are assembled, and form an independently laser module.
3) repeat above two steps, make multiple laser modules.
4) performance parameter to each laser module: wavelength, power etc., test separately,Aging, screening.
5) the one or more modules that meet the demands can be according to certain order of performance or requirement, by closeSeal and mechanical clamp are assembled into required product application.
It should be noted that, above embodiment only freezes at semiconductor laser stacks as the utility modelA preferred embodiment of technical elements. The utility model goes for other refrigeration objects certainly.
Claims (8)
1. a grand channel liquid refrigerator, connects in the side of liquid chiller to offer and is parallel to each otherWater inlet and delivery port, liquid chiller inside is provided with the liquid cooling loop of grand passage, it is characterized in that:Described liquid chiller inside has the circulation waterway of Multi-layer separated; Circulation waterway is respectively from described water inletRise, the region of pile warp liquid chiller between refrigeration work face and water inlet is back to delivery port again.
2. grand channel liquid refrigerator according to claim 1, is characterized in that: described liquid systemCooler is connected along water inlet, delivery port by multiple independently water boards that direction is stacked to be formed, in each water flowingThe inside of plate is provided with the circulation waterway being communicated with described water inlet, delivery port.
3. grand channel liquid refrigerator according to claim 1, is characterized in that: described liquid systemCooler is integrated part, offers the circulation waterway that multilayer is isolated mutually in inside, circulation waterway place plane withIt is vertical that water inlet, delivery port connect direction.
4. according to the arbitrary described grand channel liquid refrigerator of claims 1 to 3, it is characterized in that: phaseAdjacent two-layer circulation waterway is symmetrical arranged at the water flowing interface of water inlet, water outlet, makes adjacent two layers circulationThe flow direction in water route is contrary.
5. grand channel liquid refrigerator according to claim 1, is characterized in that: water inlet and going outThe perforation direction at the mouth of a river is parallel with refrigeration work face.
6. grand channel liquid refrigerator according to claim 5, is characterized in that: for stackRefrigeration object, the perforation direction of described water inlet and delivery port is with to be arranged on the refrigeration of refrigeration work face rightThe stacking direction of elephant is same direction or mutually vertical.
7. grand channel liquid refrigerator according to claim 5, is characterized in that: described water inletBe positioned at the near-end of refrigeration work face, delivery port is positioned at the far-end of refrigeration work face.
8. a grand channel liquid refrigerator combination, is characterized in that: adopt several claims 5The grand channel liquid refrigerator of stating connects direction along water inlet, delivery port and aims at successively assembling, makes to ownGrand channel liquid refrigerator forms unified water inlet, delivery port; Entering of adjacent grand channel liquid refrigeratorThe mouth of a river, delivery port position are provided with sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521050451.2U CN205265035U (en) | 2015-12-15 | 2015-12-15 | Grand passageway liquid refrigerator and combination thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521050451.2U CN205265035U (en) | 2015-12-15 | 2015-12-15 | Grand passageway liquid refrigerator and combination thereof |
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| Publication Number | Publication Date |
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| CN205265035U true CN205265035U (en) | 2016-05-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201521050451.2U Active CN205265035U (en) | 2015-12-15 | 2015-12-15 | Grand passageway liquid refrigerator and combination thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470809A (en) * | 2015-12-15 | 2016-04-06 | 西安炬光科技股份有限公司 | Macro-channel liquid refrigerator and refrigerator combination |
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2015
- 2015-12-15 CN CN201521050451.2U patent/CN205265035U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470809A (en) * | 2015-12-15 | 2016-04-06 | 西安炬光科技股份有限公司 | Macro-channel liquid refrigerator and refrigerator combination |
| CN105470809B (en) * | 2015-12-15 | 2019-04-09 | 西安炬光科技股份有限公司 | A kind of macro channel liquid refrigerator and combinations thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |