CN205261484U - Heat conduction, heat dissipation integral type LED radiator - Google Patents
Heat conduction, heat dissipation integral type LED radiator Download PDFInfo
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- CN205261484U CN205261484U CN201520779622.9U CN201520779622U CN205261484U CN 205261484 U CN205261484 U CN 205261484U CN 201520779622 U CN201520779622 U CN 201520779622U CN 205261484 U CN205261484 U CN 205261484U
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- heat dissipation
- heat
- plate body
- led radiator
- heat conduction
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Abstract
The utility model provides a heat conduction, heat dissipation integral type LED radiator, the package rubbing board body, a plurality of body, the body setting on the plate body, the body have the cavity and with the cavity of plate body intercommunication, be provided with copper aluminium capillary tissue sintering structure in the cavity of plate body bottom. The utility model discloses a heat radiating area of any point can not wasted to the whole samming of heat conduction, heat dissipation integral type LED radiator, and contact heat resistance is close zero, and the radiating effect is good.
Description
Technical field
The utility model relates to LED heat sink technology field, and a kind of heat conduction, integrated heat dissipation formula LED radiator are provided especially.
Background technology
The same with conventional light source, semiconductor light emitting diode (LED) also can produce heat during operation, and how much it depends on overall luminous efficiency. Power up outside under energy, the radiation recombination generation electroluminescent in electronics and hole, near the light radiating PN junction also needs just can arrive at external world's (air) through the semiconductor medium of chip (chip) itself and encapsulation medium. Comprehensive electric current injection efficiency, radioluminescence quantum efficiency, chip exterior light take out efficiency etc., and finally probably only having the input electric energy conversion of 30-40% is luminous energy, and the energy of all the other 60-70% mainly transforms heat energy with the form of the lattice vibration of non-radiative compound generation. The method of LED heat radiation mainly contains: aluminium radiating fin, fan, heat pipe etc., these heat dissipation technologys are relatively ripe. In recent years, thermodynamics solves heat dissipation problem with the technology that air fluid mechanics combines, more effective radiator existing existence the at present although dispel the heat, but require very high radiator still to await breaking through to heat dispersion, technology how to utilize thermodynamics to combine with air fluid mechanics realizes heat conduction, heat-radiating integrated, and make the even more ideal and thermal contact resistance of radiator heat-dissipation effect approach zero technology is that people thirst for the technological difficulties that solve always.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is to provide a kind of heat conduction, integrated heat dissipation formula LED radiator of better heat-radiation effect.
For achieving the above object, this aspect adopts following technical scheme:
A kind of heat conduction, integrated heat dissipation formula LED radiator, comprise plate body, some bodys, and body is arranged on plate body, and described body has cavity and is communicated with the cavity of plate body, is provided with copper aluminium capillary structure sintering structure in described plate body bottom cavity.
Further, described plate body and the body structure that is formed in one.
Further, some bodys are array structure layout.
Preferably, described in, be array structure row and column and be odd number.
A kind of heat conduction of the present utility model, integrated heat dissipation formula LED radiator integral samming can not wasted the area of dissipation of any point, and thermal contact resistance approaches zero, good heat dissipation effect.
Brief description of the drawings
Fig. 1 is heat conduction of the present utility model, integrated heat dissipation formula LED radiator perspective view;
Fig. 2 is the A-A cutaway view shown in Fig. 1.
Detailed description of the invention
Below in conjunction with drawings and the embodiments, the utility model is described in further detail:
Incorporated by reference to consulting Fig. 1 and Fig. 2, a kind of heat conduction of the present utility model, integrated heat dissipation formula LED radiator, comprise plate body 1, some bodys 2, and body 2 is arranged on plate body 1, and described body 2 has cavity and is communicated with the cavity of plate body 1. In described plate body 1 bottom cavity, be provided with copper aluminium capillary structure sintering structure 3.
Described plate body 1 and body 2 can be integrated formed structure.
Preferably some bodys 2 are array structure to be arranged as of the present utility model, and repeatedly research shows that preferably this is array structure row and column and is odd number, better heat-radiation effect.
A kind of heat conduction of the present utility model, integrated heat dissipation formula LED radiator integral samming, can not waste the area of dissipation of any point, and thermal contact resistance approaches zero, good heat dissipation effect.
The foregoing is only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure transformation that utilizes the utility model description and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (4)
1. a heat conduction, integrated heat dissipation formula LED radiator, it is characterized in that: comprise plate body, some bodys, body is arranged on plate body, and described body has cavity and is communicated with the cavity of plate body, is provided with copper aluminium capillary structure sintering structure in described plate body bottom cavity.
2. according to heat conduction claimed in claim 1, integrated heat dissipation formula LED radiator, it is characterized in that: described plate body and the body structure that is formed in one.
3. according to the heat conduction described in claim 1 or 2, integrated heat dissipation formula LED radiator, it is characterized in that: some bodys are array structure and arrange.
4. according to heat conduction claimed in claim 3, integrated heat dissipation formula LED radiator, it is characterized in that: described array structure row and column is odd number.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520779622.9U CN205261484U (en) | 2015-10-09 | 2015-10-09 | Heat conduction, heat dissipation integral type LED radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520779622.9U CN205261484U (en) | 2015-10-09 | 2015-10-09 | Heat conduction, heat dissipation integral type LED radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205261484U true CN205261484U (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520779622.9U Active CN205261484U (en) | 2015-10-09 | 2015-10-09 | Heat conduction, heat dissipation integral type LED radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205261484U (en) |
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2015
- 2015-10-09 CN CN201520779622.9U patent/CN205261484U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Heat conduction, heat dissipation integral type LED radiator Effective date of registration: 20170811 Granted publication date: 20160525 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd Pledgor: CHONGQING FEICHENG METAL PRODUCT CO., LTD. Registration number: 2017440000064 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |