CN2052512U

CN2052512U - Microsemiconductor freezer

Info

Publication number: CN2052512U
Application number: CN 89214110
Authority: CN
Inventors: 肖善; 肖兵役
Original assignee: Individual
Current assignee: Individual
Priority date: 1989-07-13
Filing date: 1989-07-13
Publication date: 1990-02-07

Abstract

The utility model relates to a mini-size semiconductor freezer. A radiator is composed of a cooling water jacket, a water jacket bottom plate, a water inlet pipe and an outlet pipe, the lower end surface of the water jacket bottom plate is connected with the hot face of the semiconductor freezer; a heat absorber is composed of cold storage blocks and cold diffusion pieces; the upper end surface of the cold storage blocks is connected with a cold face of the semiconductor freezer, and the lower end surface is connected with the cold diffusion pieces. A refrigeration system and a rabbling mechanism are installed on a bottle stopper of a vacuum bottle bladder. The utility model has simple structure and high efficiency; when the environment temperature is 26 DEG, the empty bottle of six pounds is energized for an hour; the temperature of the bottle drops to minus-18 DEG. The mini-size semiconductor freezer can be used for freezing, chilling, and making ice cream of families or units.

Description

Microsemiconductor freezer

The utility model relates to a kind of micro semiconductor refrigerating plant.

Traditional mechanical compression type refrigerating plant complex structure, volume is big, and price is expensive, and noise is arranged, and should not make, and semiconductor refrigeration system is not have above shortcoming." semi-conductor electricity refrigerated bottle " that Chinese patent 86204374 provides is a kind of of this class device, should " semi-conductor electricity refrigerated bottle " adopt wind-cooling heat dissipating, the semiconductor refrigerating plant of this structure, and its refrigerating efficiency is lower, can not make the people satisfied; " a kind of semiconductor cold drink device " that also has Chinese patent 86205951 to provide, though adopt water-cooling, radiator is contained in the bottom, because cold air is heavier than hot-air, cooling earlier bottom can only making, refrigeration is bad, is unsuitable for refrigeration, freezing and system ice cream usefulness.

The purpose of this utility model provides and a kind ofly can further improve refrigerating efficiency, multi-functional and practical micro semiconductor refrigerating plant.

Refrigerating plant described in the utility model, structure comprises: radiator (cooling jacket, the water jacket base plate, oral siphon, outlet pipe), heat dump (stores up cold, cold diffusion sheet), vacuum refill, DC micromotor, reducing gear, agitator etc., be with the distinguishing characteristics of prior art: water-cooling pattern is adopted in heat radiation of the present utility model, its refrigeration system all is contained on the bottle stopper on vacuum refill top, radiator is by cooling jacket, the water jacket base plate, oral siphon and outlet pipe constitute, oral siphon and outlet pipe all are communicated with the radiator of sealing, the water jacket base plate is a part of radiator, be the base plate of radiator, the lower surface of water jacket base plate links to each other with the hot side of semiconductor cooler; Heat dump is made of cold of storage and cold diffusion sheet, and the upper surface of storing up cold links to each other with the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler, and the lower surface is connected with cold diffusion sheet.

Semiconductor refrigerating plant described in the utility model owing to have rational heat radiation and heat-absorbing structure, has improved refrigerating efficiency, have simple in structurely simultaneously, cost is low, and volume is little, advantages such as noiselessness are so be particularly suitable for family or unit is freezing on a small quantity, refrigeration and system ice cream are used.

Fig. 1 is the structural representation of micro semiconductor refrigerating plant.

Fig. 2 is the heat spreader structures schematic diagram.

Fig. 3 is the heat dump structural representation.

The utility model embodiment is described in detail as follows in conjunction with Fig. 1, Fig. 2, Fig. 3:

As shown in Figure 1, the structure of this device comprises outer casing upper cover (1), shell (2), vacuum refill (3), bottle stopper (4), storage cold (5), cold diffusion sheet (6), cooling jacket (7), water jacket base plate (8), oral siphon (9) outlet pipe (10), semiconductor cooler (11), DC micromotor (12), reducing gear (13), agitator (14) and heat-insulation layer (15).Last 1/2nd dress refrigeration systems of bottle stopper (4), other 1/2nd dress rabbling mechanisms.

Radiator is made by Fig. 2, and water jacket base plate (8) adopts aluminum alloy materials, and outside diameter is greater than 60 millimeters, be processed into truncated cone above, can be processed into radially to the bottom along the conical surface from the top wide 1 millimeter, dark 2 millimeters, many straight-line grooves, it is uniform to press the circumference five equilibrium, is processed into fineness below

The plane.Cooling jacket (7) and water jacket base plate (8) are by being threaded, and be coated with fluid sealant, oral siphon (9) gos deep in the cooling jacket (7), 5 millimeters in the truncation face of the truncated cone on the water jacket base plate (8), make cooling water directly be punched in the surface, centre of thermal source, the lower surface of outlet pipe (10) and cooling jacket top end face in one plane must not go deep in the cooling jacket (7).

Heat dump is made by Fig. 3, stores up cold (5) with high 30 millimeters, and length and width are 55 millimeters aluminum alloy materials and make, and its high upper and lower two faces are processed into the plane, and fineness exists More than.Cold diffusion sheet (6) employing thickness is 0.3～0.5 millimeter aluminium alloy plate multi-disc, and its surface area sum is more than 3/5ths of vacuum refill (3) internal surface area, and it is connected with screw with storage cold (5).The feature of refrigeration system is: the lower surface of the water jacket base plate (8) on the hot side of semiconductor cooler (11) and the radiator is connected, huyashi-chuuka (cold chinese-style noodles) is connected with the upper surface of storage cold (5), the cold and hot two sides of semiconductor cooler (11) all is coated with very thin one deck heat-conducting silicone grease, water jacket base plate (8) is connected the two screw with heat-insulating material with storage cold (5), and semiconductor cooler (11) is clipped in wherein.In addition, too fast for preventing bottle interior temperature recovery after refrigeration system quits work, be lined with the polyurethane thermal insulation layer in outer casing upper cover (1) and the bottle stopper (4).

During use, cooled thing is put into vacuum refill (3), cover tight bottle stopper (4), oral siphon (9) connects flexible pipe and connects with running water, and outlet pipe (10) connects flexible pipe, and water valve is opened, cooling water is discharged through outlet pipe, connect semiconductor cooler (11), DC micromotor (12) power supply (share 12 volts of dc sources) then, refrigeration system and rabbling mechanism are just worked, and begin to make ice cream.During as need refrigeration or freezing and refrigeration drink, only need to connect semiconductor cooler (11) power supply, taken off agitator (14) just.The model of the used semiconductor cooler of the utility model (11) is CTI-12705, and operating voltage is 12 volts of direct currents, the cold power 50W of maximum product.When 26 ℃ of environment temperatures, 6 pounds of empty bottles energisings one hour, a temperature is reduced to below-18 ℃ in the bottle, can be used as that family or unit are freezing, refrigeration, refrigeration drink and ice making river in Henan Province woods use.

Claims

1, a kind of micro semiconductor refrigerating plant, structure comprises outer casing upper cover (1), shell (2), vacuum refill (3), bottle stopper (4), semiconductor cooler (11), DC micromotor (12), reducing gear (13), agitator (14) and radiator, heat dump, semiconductor refrigeration system and rabbling mechanism are installed on the bottle stopper (4), bottle stopper (4) is provided with heat-insulation layer (15), it is characterized in that: radiator is by cooling jacket (7), water jacket base plate (8), oral siphon (9) and outlet pipe (10) constitute, the lower surface of water jacket base plate (8) links to each other with the hot side of semiconductor cooler (11); Heat dump is made of cold (5) of storage and cold diffusion sheet (6), and the upper surface of storing up cold (5) links to each other with the huyashi-chuuka (cold chinese-style noodles) of semiconductor cooler (11), and the lower surface links to each other with cold diffusion sheet (6).

2, by the described micro semiconductor refrigerating plant of claim 1, it is characterized in that: water jacket base plate (8) adopts aluminum alloy materials, be processed into truncated cone above, be processed with many straight-line grooves from the top along the conical surface radially to the bottom, it is uniform to press the circumference five equilibrium, bright and clean plane is processed in the lower surface, oral siphon (9) on the cooling jacket (7) gos deep in the cooling jacket (7) from the top, cooling water directly is punched on the truncation face of the truncated cone on the water jacket base plate (8), and outlet pipe (10) is contained on the end face at cooling jacket (7) top.

3, by the described micro semiconductor refrigerating plant of claim 1, it is characterized in that: the lower surface of storing up cold (5) links to each other with cold diffusion sheet (6), cold diffusion sheet (6) is made by the multi-disc aluminium alloy plate, and its surface area sum is more than 3/5ths of vacuum refill (3) internal surface area.