CN2347121Y - Top sealing semiconductor refrigerator - Google Patents
Top sealing semiconductor refrigerator Download PDFInfo
- Publication number
- CN2347121Y CN2347121Y CN98241631U CN98241631U CN2347121Y CN 2347121 Y CN2347121 Y CN 2347121Y CN 98241631 U CN98241631 U CN 98241631U CN 98241631 U CN98241631 U CN 98241631U CN 2347121 Y CN2347121 Y CN 2347121Y
- Authority
- CN
- China
- Prior art keywords
- water
- water courage
- semiconductor
- insulation shell
- temperature difference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor refrigerator in a cold and hot type drinking water appliance. The utility model is characterized in that the top of a water chamber and the top of an insulating casing are provided with a semiconductor temperature differential refrigerating system which is composed of a composite heat conducting dish, a semiconductor thermoelectric device, and a blowing radiation guard; the water chamber of a supporter is communicated with the insulating casing, and the natural convection can be farthest used; meanwhile, the utility model is also provided with an air exhaust and water retaining device, and the utility model is a top sealing semiconductor refrigerator which has the advantages of electricity saving and big quantity of water flowing out.
Description
The utility model is the refrigerator in a kind of cold and hot water drinking machine that adopts conductor refrigeration.
At present, the semiconductor cooler in the commercial cold and hot water drinking machine, refrigerating system are generally on sidewall, the complete machine freezing capacity is very low, even at the top of sealing, refrigerating system falls behind, the complete machine freezing capacity is low, in addition, does not have baffle device for water first, when going out cold water, follow out normal-temperature water, influence cold water temperature and water yield, second do not have exhaust apparatus, make and accompanied air layer between the refrigeration thing, influence cooling effect, similarly also make overall efficiency low.
The utility model improves above-mentioned deficiency, use up-to-date patented technology, with the conductor refrigeration system and device the sealing the water courage and the top of insulation shell, the complete machine freezing capacity improves 30%, maximally utilise cold simultaneously, the free convection circulation also is provided with exhaust, baffle device for water in addition to improve the complete machine freezing capacity, reaches power saving, goes out the big purpose of cool water quantity.
Feature of the present utility model is the top arrangement thermoelectric refrigeration of semiconductor system at the water courage of a sealing and insulation shell, this system is by the composite heat-conducting ware, the semiconductor temperature difference electrical part, bleed type heat radiation guard constitutes, the water courage of its supporter of UNICOM and insulation shell just constitute top seal formula semiconductor cooler, the composite heat-conducting ware is installed in the top of water courage lid and strides across heat-insulation layer by pressure ring and screw, its imitative square cold conducting surface is exposed to the insulation shell surface, the refrigeration face of semiconductor temperature difference electrical part is fitted on the cold conducting surface, with screw radiator is installed on the insulation shell, the radiator baseplane is fitted on the radiating surface of semiconductor temperature difference electrical part, at the semiconductor temperature difference electrical part all around is that gap between radiator baseplane and the insulation shell upper surface is sealed admittedly by the sponge that is full of epoxy resin, bleed type heat radiation guard is installed on radiator, the water courage lid inner top of sealing have exhaust duct with (or) exhaust chamber, in the water courage, have on being supported at the bottom of the water courage or be suspended under the water courage lid or be connected in water fender (film) around the water courage sidewall.
Fig. 1 is a profilograph of the present utility model.
Fig. 2 is a decomposing schematic representation of the present utility model.
Specify below in conjunction with accompanying drawing:
As shown in Figure 1, the water courage that composite heat-conducting ware (1) (seeing number of patent application 98207181.7 for details) is installed in the water courage (2) of a sealing covers on (3), surface stainless steel (4) is in the water courage, and compress sealing ring (8) in the ring-shaped step (7) that the water courage covers by pressure ring (5) and screw (6), reach hermetic structure, composite heat-conducting ware four sides (9) are embedded in the insulation material (10), in order to unidirectional heat transfer, its imitative square cold conducting surface (11) then strides across heat-insulation layer and is exposed to insulation shell (12) surface, the refrigeration face (14) of semiconductor temperature difference electrical part (13) is fitted on the cold conducting surface, with screw (15) radiator (16) is installed on the insulation shell, radiator baseplane (17) is fitted on the radiating surface (18) of semiconductor temperature difference electrical part, at the semiconductor temperature difference electrical part all around is that gap between radiator baseplane and the insulation shell upper surface (19) is by the solid envelope of the sponge that is full of epoxy resin (20), bleed type heat radiation guard (21) (seeing number of patent application 98208377.7 for details) is installed on radiator, the water courage lid inner top of sealing have exhaust duct (22) with (or) exhaust chamber (23), can drain air during water inlet, making in the water courage of sealing to have air blanketing to be beneficial to refrigeration, in the water courage, there is support (24) to go up or hang (26) under water courage lid or be connected in water courage sidewall (27) water fender (film) (28) on every side when going out cold water in (25) at the bottom of the water courage, block normal-temperature water, the water that cools down is preferentially come out, cool water quantity to increase, constitute thus and can maximally utilise free convection and be provided with exhaust simultaneously again, the power saving of baffle device for water, go out the big top seal formula semiconductor cooler of cool water quantity.
Claims (3)
1. semiconductor cooler in cold and hot water drinking machine, it is characterized in that top arrangement thermoelectric refrigeration of semiconductor system at the water courage (2) and the insulation shell (12) of a sealing, this system is made of composite heat-conducting ware (1), semiconductor temperature difference electrical part (13), bleed type heat radiation guard (21), and the water courage of its supporter of UNICOM and insulation shell just constitute top seal formula semiconductor cooler.
2. top seal formula semiconductor cooler according to claim 1, it is characterized in that the composite heat-conducting ware is installed in the top of water courage lid and strides across heat-insulation layer by pressure ring (5) and screw (6), its imitative square cold conducting surface (11) is exposed to the insulation shell surface, the refrigeration face of semiconductor temperature difference electrical part (14) is fitted on the cold conducting surface, with screw (15) radiator (16) is installed on the insulation shell, radiator baseplane (17) is fitted on the radiating surface (18) of semiconductor temperature difference electrical part, the semiconductor temperature difference electrical part all around be gap between radiator baseplane and the insulation shell upper surface (19) by the solid envelope of the sponge that is full of epoxy resin (20), bleed type heat radiation guard (21) is installed on radiator.
3. top seal formula semiconductor cooler according to claim 1, it is characterized in that water courage lid (3) inner top in sealing have exhaust duct (22) with (or) exhaust chamber (23), in the water courage, have support (24) to go up or hang (26) under the water courage lid or be connected in the water fender (film) (28) of (27) around the water courage sidewall in (25) at the bottom of the water courage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98241631U CN2347121Y (en) | 1998-10-20 | 1998-10-20 | Top sealing semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN98241631U CN2347121Y (en) | 1998-10-20 | 1998-10-20 | Top sealing semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2347121Y true CN2347121Y (en) | 1999-11-03 |
Family
ID=33988352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98241631U Expired - Fee Related CN2347121Y (en) | 1998-10-20 | 1998-10-20 | Top sealing semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2347121Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108800657A (en) * | 2017-04-28 | 2018-11-13 | 青岛海尔智能技术研发有限公司 | The assemble method of semiconductor refrigerating equipment |
-
1998
- 1998-10-20 CN CN98241631U patent/CN2347121Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108800657A (en) * | 2017-04-28 | 2018-11-13 | 青岛海尔智能技术研发有限公司 | The assemble method of semiconductor refrigerating equipment |
| CN108800657B (en) * | 2017-04-28 | 2020-07-24 | 青岛海尔智能技术研发有限公司 | Assembling method of semiconductor refrigeration equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |