CN205249483U - MEMS (Micro -electromechanical system) microphone - Google Patents
MEMS (Micro -electromechanical system) microphone Download PDFInfo
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- CN205249483U CN205249483U CN201521100007.7U CN201521100007U CN205249483U CN 205249483 U CN205249483 U CN 205249483U CN 201521100007 U CN201521100007 U CN 201521100007U CN 205249483 U CN205249483 U CN 205249483U
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Abstract
The utility model discloses a MEMS (Micro -electromechanical system) microphone, include: back electrode plate, the vibrating diaphragm, vibrating diaphragm and back electrode plate interval set up, the vibrating diaphragm is configured as response voice signal oscillation generation, and through -hole, the through -hole set up in the below of vibrating diaphragm, the cross -section of through -hole is single intercommunication and seals the figure, wherein, at least one teat has on the inner wall of through -hole, at least one teat will the through -hole falls into the sub - through -hole of a plurality of intercommunications. The utility model discloses a MEMS (Micro -electromechanical system) microphone's through -hole design equivalence be four respectively the diaphragm receive the gas shock, improved MEMS (Micro -electromechanical system) microphone's sensitivity, simultaneously the utility model discloses a release technology that MEMS (Micro -electromechanical system) microphone's through -hole passes through prior art can realize simple process.
Description
Technical field
The utility model relates to microphone, is specifically related to a kind of MEMS microphone.
Background technology
MEMS microphone is to adopt MEMS (MicroelectromechanicalSystems, MEMS), compared with traditional electret capacitor microphone (ECM), there is better soundLearn performance, higher signal to noise ratio, better conforming susceptibility and lower power consumption. MEMSMicrophone has been widely used in voice communication, auditory prosthesis, smart mobile phone, notebook computer etc.Field is to provide higher voice quality.
The MEMS microphone of prior art comprises substrate, and is formed at vibrating diaphragm and backplane on substratePlate. Vibrating diaphragm is configured to vibrate in response to voice signal, and back pole plate and vibrating diaphragm interval arrange, the back of the bodyVoice signal is converted to the signal of telecommunication by the electric capacity of pole plate and vibrating diaphragm composition. Below vibrating diaphragm, substrateOn be formed with through hole (being the operatic tunes), this through hole can be for providing the passage of voice signal. Existing skillThe cross section of the through hole of art is for example circle, rectangle, ellipse, track type, octagon etc.
The physical dimension of MEMS microphone is less, and the vibration shape and structure are more stable. But physical dimension tooLittle, the sensitivity of microphone also can be affected. Multiple by arranging on substrate in prior artThrough hole is to improve the sensitivity of microphone. Multiple through holes are due to mutual isolation, by the gas of each through holeIntensity of flow difference can cause transaudient deleterious.
Fig. 1 is the bottom view of a kind of MEMS microphone of the prior art, and Fig. 2 a and Fig. 2 b are theseThe sectional view of MEMS microphone, the AA line in Fig. 1 illustrates the intercepting position of sectional view shown in Fig. 2 aPut, the BB line in Fig. 1 illustrates the interception position of sectional view shown in Fig. 2 b. At MEMS microphoneIn 10, substrate 11 comprises relative first surface and second surface. Vibrating diaphragm 14 and back pole plate 16Be arranged on the first surface of substrate 11. Vibrating diaphragm 14 and substrate 11 separate by separation layer 13. The back of the bodyPole plate 16 and vibrating diaphragm 14 separate by separation layer 16.
Substrate 10 is formed with the operatic tunes, and this operatic tunes comprises: by lower from the first upper perforate 17 and multipleThe second perforate. Wherein, the first perforate 17 extends to substrate interior from the second surface of substrate 10,The second perforate (for example perforate 12a and perforate 12b) extends to the first table of substrate from the first perforateFace, the second perforate makes vibrating diaphragm 14 exposed. Multiple the second perforates are communicated with by the first perforate, makeAir-flow in each the second perforate is even.
But the complex structure of MEMS microphone 10, technology difficulty is larger. For example MEMS microphone10 the operatic tunes can form by first surface and second surface twice etching, but due on substrateThe existence of side vibrating diaphragm and back pole plate is too large in the etching technics difficulty of the first surface of substrate. AnotherKind method is on the basis of the first perforate, to form the second perforate, but the degree of depth of the first perforate is generalExceed 50 microns, be difficult to gluing and photoetching.
Utility model content
In view of this, the utility model proposes a kind of MEMS microphone, described MEMS microphoneThe operatic tunes is made up of the sub-through hole of multiple connections, can improve the sensitivity of microphone, has simultaneouslyLow technology difficulty.
The utility model proposes a kind of MEMS microphone, comprising: back pole plate; Vibrating diaphragm, described vibrating diaphragmArrange with back pole plate interval, described vibrating diaphragm is configured to corresponding sound signal and produces vibration; And logicalHole, described through hole is arranged at the below of described vibrating diaphragm, and the cross section of described through hole is simply connected Closed GraphShape, wherein, has at least one teat on the inwall of described through hole, described at least one teat willDescribed through hole is divided into the sub-through hole of multiple connections.
Preferably, the shape in the cross section of described multiple sub-through holes is identical with area.
Preferably, on the inwall of described through hole, there are at least two teats, described at least two teatsBe symmetrical arranged.
Preferably, described multiple sub-through hole is symmetrical arranged.
Preferably, described at least one projection is pointed to respectively the center of described through hole.
Preferably, the pickup point of described MEMS microphone and/or pad are arranged at the upper of described teatSide.
Preferably, described MEMS microphone also comprises and stops projection, described in stop that projection is arranged at instituteState between vibrating diaphragm and described teat.
Preferably, the cross section of described sub-through hole is polygon or circle.
Preferably, have four teats on the inwall of described through hole, described four teats are by described logicalHole is divided into four sub-through holes.
Preferably, have four teats on the inwall of described through hole, described four teats are by described logicalHole is divided into and is communicated with district and four sub-through holes.
The inwall of the through hole of the vibrating diaphragm below of MEMS microphone of the present utility model has at least oneTeat, is divided into through hole the through hole of multiple connections, the sensitivity that can improve microphone, simultaneouslyThere is lower technology difficulty.
Brief description of the drawings
By the description to the utility model embodiment referring to accompanying drawing, of the present utility model above-mentionedAnd other objects, features and advantages will be more clear, in the accompanying drawings:
Fig. 1 a, 1b, 1c be respectively the bottom view of a kind of MEMS microphone of prior art, along AAThe profile of line and along the profile of BB line;
Fig. 2 a is the cutaway view of the MEMS microphone of an embodiment of the present utility model;
Fig. 2 b is the cutaway view of the MEMS microphone of another embodiment of the present utility model;
Fig. 3 a to 3c shows respectively the cross sectional shape of the through hole of different embodiment; And
Fig. 4 a to 4c is respectively the MEMS microphone of a preferred embodiment of the present utility modelBottom view, along the profile of CC line with along the profile of DD line.
Detailed description of the invention
Hereinafter with reference to accompanying drawing, the utility model is described in more detail. In each accompanying drawing, identicalElement adopts similar Reference numeral to represent. For the sake of clarity, the various piece in accompanying drawing does not haveHave in proportion and draw. In addition, may not shown some known part.
Should be appreciated that in the time describing certain structure, when one deck, a region are called and are positioned at anotherLayer, when another region " above " or " top ", can refer to be located immediately at another layer, anotherAbove individual region, or also comprise other Ceng Huo district between itself and another floor, another regionTerritory. And, if by the upset of this structure, this one deck, region will be positioned at another layer, anotherIndividual region " below " or " below ". If be located immediately at another layer, another region in order to describeSituation above, will adopt " A is directly on B " or " A on B and with it in abutting connection with " hereinForm of presentation.
In description of the present utility model, it will be appreciated that term " first ", " second " etc.Only for describing object, and can not be interpreted as instruction or hint relative importance. In addition, in this realityWith in novel description, except as otherwise noted, the implication of " multiple " is two or more.
Fig. 2 a has schematically shown the analysing and observe of MEMS microphone of an embodiment of the present utility modelFigure. The MEMS microphone of the present embodiment is the microphone not encapsulating. With reference to Fig. 2 a, the present embodimentMEMS microphone 20 comprise substrate 21. Substrate 21 can be Si substrate, SOI substrate etc.MEMS microphone 20 further comprises the vibrating diaphragm 24 and the back pole plate 26 that are arranged on substrate 21 tops.Substrate 21 is for vibrating diaphragm 24 and back pole plate 26 provide support, and vibrating diaphragm 24 and substrate 21 pass through separation layer23 separate, and vibrating diaphragm 24 and back pole plate 26 separate by separation layer 25. Separation layer 23 and separation layer25 is insulating materials, for example SiO2 or Si3N4. Vibrating diaphragm 24 is configured to respond voice signal and producesRaw vibration. Sound is converted to the signal of telecommunication by the electric capacity that vibrating diaphragm 24 and back pole plate 26 form. Further,Vibrating diaphragm 24 can also comprise can vibrating area and anchorage zone, and anchorage zone is arranged on separation layer 23, canVibrating area for example separates by air and back pole plate 26.
Below vibrating diaphragm 24, substrate 21 is provided with through hole 27 (being called again the operatic tunes). Through hole 27For simply connected closed figure, wherein, on through hole 27 inwalls, there is at least one teat, at least describedA teat is divided into through hole 27 the sub-through hole of multiple connections. The cross section of sub-through hole can be any closingSuitable shape, for example circular, polygon (for example square, octagon).
Fig. 2 b meaning property shows the analysing and observe of MEMS microphone of another embodiment of the present utility modelFigure. With reference to Fig. 2 b, the MEMS microphone 20 of the present embodiment comprises substrate 21. Substrate 21 canSi substrate, SOI substrate etc. In the present embodiment, back pole plate 26 is parts of substrate 21,Vibrating diaphragm 24 is arranged at the top of back pole plate 26. Vibrating diaphragm 24 and substrate 21 separate by separation layer 23.Vibrating diaphragm 24 is configured to respond voice signal and produces vibration. The electricity that vibrating diaphragm 24 and back pole plate 26 formHold sound is converted to the signal of telecommunication. Further, vibrating diaphragm 24 can also comprise can vibrating area and anchorage zone,Anchorage zone is arranged on separation layer 23, can for example separate by air and back pole plate 26 by vibrating area.On back pole plate 26, be provided with multiple perforation.
Below back pole plate 26, substrate 21 is provided with through hole 27 (being called again the operatic tunes). Through hole27 is simply connected closed figure, wherein, on through hole 27 inwalls, has at least one teat, described inAt least one teat is divided into through hole 27 the sub-through hole of multiple connections. The cross section of sub-through hole can be to appointWhat suitable shape, for example circular, polygon (for example square, octagon).
At work, voice signal puts on vibrating diaphragm 24 by through hole 27, and vibrating diaphragm 24 is in response to soundTone signal vibration, the distance of vibrating diaphragm 24 and back pole plate 26 changes and causes vibrating diaphragm 24 and back pole plateThe capacitance of the electric capacity of 26 compositions changes.
Compared with prior art, through hole 27 of the present utility model is simply connected closed figure, wherein,On through hole 27 inwalls, have at least one teat, described at least one teat connects more than 27 of through holesLogical sub-through hole. Fig. 3 a to 3c shows respectively the cross sectional shape of the through hole of different embodiment.
With reference to Fig. 3 a, in one embodiment, the inwall of through hole 27 has two that are oppositely arrangedTeat 211, teat 211 points to the central authorities of through hole 27. Two teats 211 that this is oppositely arranged willThrough hole 27 is divided into sub-through hole 27a and the 27b of two connections. Wherein, sub-through hole 27a and 27b coupleClaim to arrange, the cross section of sub-through hole 27a and 27b is of similar shape and area. At the present embodimentIn, vibrating diaphragm 24 is equivalent to by two little operatic tunes and accepts voice signal, has improved sensitivity.
With reference to Fig. 3 b, in one embodiment, the inwall of the through hole 27 of rectangle has four teats212. Four teats 212 are symmetrical arranged, and are arranged at respectively the middle part on four limits of through hole 27. FourTeat 212 is divided into through hole 27 the sub-through hole 27c to 27f of four connections. Sub-through hole 27c to 27fBe symmetrical arranged, the cross section of sub-through hole 27c to 27f is of similar shape and area. In this enforcementIn example, vibrating diaphragm 24 is equivalent to by four little operatic tunes and accepts voice signal, has improved sensitivity.
With reference to Fig. 3 c, in one embodiment, the inwall of through hole 27 has four teats 212. FourIndividual teat 213 is symmetrical arranged, and teat 213 points to the central authorities of through hole 27. Four teats 213 will lead toHole 27 is divided into and is communicated with district and four sub-through hole 27g to 27j. Wherein, sub-through hole 27g to 27j dividesBe not communicated with connection district, sub-through hole 27g to 27j is symmetrical arranged, and sub-through hole 27g to 27j cutsFace is of similar shape and area. In the present embodiment, vibrating diaphragm 24 is equivalent to by four littleThe operatic tunes is accepted voice signal, has improved sensitivity.
In a preferred embodiment, vibrating diaphragm pad, back pole plate pad and/or chip pickup point are arranged onThe corresponding region of the top of teat.
Than the MEMS microphone 10 of prior art, MEMS microphone of the present utility model logicalHole is single layer structure, can realize by the release process of prior art, and technique is simple. This enforcementWhen the vibrating diaphragm of the MEMS microphone of example is subject to gas shock, is equivalent to four Small diaphragm-pieces and is subject to respectively gasStream impacts, and the sensitivity that has improved MEMS microphone exists the larger free degree in the time arranging. WithTime in when design, only need to analyze one of them Small diaphragm-piece, improved efficiency.
Fig. 4 a is the bottom view of the MEMS microphone of a preferred embodiment of the present utility model, figure4b and Fig. 4 c are the profiles of MEMS microphone shown in Fig. 4 a. CC line in Fig. 4 a illustratesThe interception position of sectional view shown in Fig. 4 b, the DD line in Fig. 4 a illustrates sectional view shown in Fig. 4 cInterception position.
With reference to Fig. 4 a to Fig. 4 c, the MEMS microphone 30 of the present embodiment comprises substrate 31. Substrate31 comprise relative first surface and second surface. Vibrating diaphragm 34 and back pole plate 36 are arranged on substrate 31First surface. Vibrating diaphragm 34 and substrate 31 separate by separation layer 33. Back pole plate 36 and vibrating diaphragm34 separate by separation layer 36.
Substrate 31 is formed with through hole 37, and this through hole 37 is positioned at vibrating diaphragm 34 belows. In through hole 37Wall has 311, four teats 311 of four teats and is symmetrical arranged, and four teats 311 point to respectivelyThrough hole 37 center. Four teats 311 are divided into through hole 37 to be communicated with district and four sub-through holes, fourIndividual sub-through hole is octagon, and four sub-through holes are connected with connection district respectively.
MEMS microphone 30 also comprises and stops projection 38, stops that projection 38 is arranged at vibrating diaphragm 34 HesBetween teat 311. Preferably, this stops that projection 38 is arranged on teat 311. At vibrating diaphragm 34When being subject to larger gas shock or being subject to larger mechanical shock, stopping that projection 38 can limit shakesVibration of membrane amplitude, avoids damaging, and improves reliability. Preferably, stop that projection 38 is arranged at prominentThe end of portion 311, the i.e. middle section of through hole 37.
Vibrating diaphragm pad 32 is arranged at the corresponding region of the vibrating diaphragm of teat top, and back pole plate pad 39 is establishedBe placed in the corresponding region of the back pole plate of teat top. In a preferred embodiment, chip pickup point alsoBe arranged on teat top.
When the vibrating diaphragm of the MEMS microphone of the present embodiment is subject to gas shock, be equivalent to four membranellesSheet is subject to respectively gas shock, has improved the sensitivity of MEMS microphone, exists larger in the time arrangingThe free degree. In the time of design, only need to analyze one of them Small diaphragm-piece simultaneously, improved efficiency. ThisThe through hole of the substrate of the MEMS microphone of embodiment can be realized by the release process of prior art,Technique is simple.
Above embodiment of the present utility model is described. But these embodiment are onlyFor illustrative purposes, be not intended to limit scope of the present utility model. Model of the present utility modelEnclose by claims and equivalent thereof and limit. Do not depart from scope of the present utility model, this areaTechnical staff can make multiple substituting and amendment, and these substitute and amendment all should drop on this practicality newlyWithin the scope of type.
Claims (10)
1. a MEMS microphone, is characterized in that, comprising:
Back pole plate;
Vibrating diaphragm, described vibrating diaphragm and back pole plate interval arrange, and described vibrating diaphragm is configured to respond sound letterNumber produce vibration; And
Through hole, described through hole is arranged at the below of described vibrating diaphragm, and the cross section of described through hole is simply connectedClosed figure, wherein, has at least one teat on the inwall of described through hole, described at least oneTeat is divided into described through hole the through hole of multiple connections.
2. MEMS microphone according to claim 1, is characterized in that, described multiple sonsThe shape in the cross section of through hole is identical with area.
3. MEMS microphone according to claim 1, is characterized in that, described through holeOn inwall, have at least two teats, described at least two teats are symmetrical arranged.
4. MEMS microphone according to claim 3, is characterized in that, described multiple sonsThrough hole is symmetrical arranged.
5. MEMS microphone according to claim 1, is characterized in that, described at least oneIndividual projection is pointed to respectively the center of described through hole.
6. MEMS microphone according to claim 1, is characterized in that, described MEMSThe pickup point of microphone and/or pad are arranged at the top of described teat.
7. MEMS microphone according to claim 1, is characterized in that, described MEMSMicrophone also comprises and stops projection, described in stop that projection is arranged between described vibrating diaphragm and described teat.
8. MEMS microphone according to claim 1, is characterized in that, described sub-through holeCross section be polygon or circle.
9. MEMS microphone according to claim 1, is characterized in that, described through holeOn inwall, have four teats, described through hole is divided into four sub-through holes by described four teats.
10. MEMS microphone according to claim 1, is characterized in that, described through holeOn inwall, have four teats, described through hole is divided into connection district to described four teats and four sons are logicalHole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521100007.7U CN205249483U (en) | 2015-12-24 | 2015-12-24 | MEMS (Micro -electromechanical system) microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521100007.7U CN205249483U (en) | 2015-12-24 | 2015-12-24 | MEMS (Micro -electromechanical system) microphone |
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| Publication Number | Publication Date |
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| CN205249483U true CN205249483U (en) | 2016-05-18 |
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| CN201521100007.7U Active CN205249483U (en) | 2015-12-24 | 2015-12-24 | MEMS (Micro -electromechanical system) microphone |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921923A (en) * | 2015-12-24 | 2017-07-04 | 北京卓锐微技术有限公司 | Mems microphone |
| WO2018137275A1 (en) * | 2017-01-25 | 2018-08-02 | 歌尔股份有限公司 | Mems microphone |
| CN108696811A (en) * | 2017-04-07 | 2018-10-23 | 英飞凌科技股份有限公司 | The method of MEMS acoustic transducer elements and manufacture MEMS acoustic transducer elements |
| CN112804628A (en) * | 2021-01-19 | 2021-05-14 | 潍坊歌尔微电子有限公司 | MEMS chip and electronic equipment |
| CN113556657A (en) * | 2021-06-29 | 2021-10-26 | 歌尔微电子股份有限公司 | MEMS microphone |
-
2015
- 2015-12-24 CN CN201521100007.7U patent/CN205249483U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921923A (en) * | 2015-12-24 | 2017-07-04 | 北京卓锐微技术有限公司 | Mems microphone |
| WO2018137275A1 (en) * | 2017-01-25 | 2018-08-02 | 歌尔股份有限公司 | Mems microphone |
| CN108696811A (en) * | 2017-04-07 | 2018-10-23 | 英飞凌科技股份有限公司 | The method of MEMS acoustic transducer elements and manufacture MEMS acoustic transducer elements |
| CN112804628A (en) * | 2021-01-19 | 2021-05-14 | 潍坊歌尔微电子有限公司 | MEMS chip and electronic equipment |
| CN113556657A (en) * | 2021-06-29 | 2021-10-26 | 歌尔微电子股份有限公司 | MEMS microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180726 Address after: 261000 Fengshan Road, Fangzi District, Weifang, Shandong Province, No. 68 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 100191 Beijing Haidian District Zhichun Road 23 quantum Ginza 1002 room Patentee before: Beijing Acuti Microsystems Co., Ltd. |
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| TR01 | Transfer of patent right |