CN205231043U - Field effect transistor's novel TO -220AB type packaging hardware - Google Patents
Field effect transistor's novel TO -220AB type packaging hardware Download PDFInfo
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- CN205231043U CN205231043U CN201521018414.3U CN201521018414U CN205231043U CN 205231043 U CN205231043 U CN 205231043U CN 201521018414 U CN201521018414 U CN 201521018414U CN 205231043 U CN205231043 U CN 205231043U
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- field effect
- effect transistor
- aluminium base
- novel
- base board
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Abstract
The utility model discloses a field effect transistor's novel TO -220AB type packaging hardware, it relates to field effect transistor encapsulation field, and it contains the field effect transistor body, aluminium base board, radiator, and the field effect transistor body welds on aluminium base board through the reflow soldering, and aluminium base board fixed mounting is on the radiator. It utilizes the thermal insulation performance that aluminium base board is good, has solved the bad problem of thermal insulation in the installation, saves the insulating grain and thermal insulation cloth of traditional mounting means, not only can improve field effect transistor's insulating properties, can also improve the heat conductivility.
Description
Technical field:
The utility model relates to a kind of novel TO-220AB type packaging system of field effect transistor, belongs to field effect transistor encapsulation technology field.
Background technology:
At present, the installation method that TO-220AB encapsulates field effect transistor mainly adopts cover insulation grain on nut, then installs heat conductive insulating cushion material below scene effect pipe, then be fixed on radiator, this kind of method is installed and is relatively bothered, and easily cause defective insulation, heat-conducting effect is also poor.
Utility model content:
For the problems referred to above, the technical problems to be solved in the utility model is to provide a kind of novel TO-220AB type packaging system of field effect transistor.
The novel TO-220AB type packaging system of a kind of field effect transistor of the present utility model, it comprises field effect body, aluminium base, radiator, and field effect body is welded on aluminium base by Reflow Soldering, and aluminium base fixed installation on a heat sink.
The beneficial effects of the utility model: the insulation heat-conducting property that it utilizes aluminium base good, solve the problem that insulating heat-conductive in installation process is bad, save insulation grain and the heat conductive insulating cloth of conventional mounting mode, not only can improve the insulation property of field effect transistor, can also heat conductivility be improved.
Accompanying drawing illustrates:
For ease of illustrating, the utility model is described in detail by following concrete enforcement and accompanying drawing.
Fig. 1 is structural representation of the present utility model.
1-field effect body; 2-aluminium base; 3-radiator.
Embodiment:
As shown in Figure 1, this embodiment by the following technical solutions: it comprises field effect body 1, aluminium base 2, radiator 3, and field effect body 1 is welded on aluminium base 2 by Reflow Soldering, and aluminium base 2 is fixedly mounted on radiator 3.
The insulation heat-conducting property that this embodiment utilizes aluminium base good, solve the problem that insulating heat-conductive in installation process is bad, save insulation grain and the heat conductive insulating cloth of conventional mounting mode, not only can improve the insulation property of field effect transistor, can also heat conductivility be improved.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (1)
1. the novel TO-220AB type packaging system of a field effect transistor, it is characterized in that: it comprises field effect body (1), aluminium base (2), radiator (3), field effect body (1) is welded on aluminium base (2) by Reflow Soldering, and aluminium base (2) is fixedly mounted on radiator (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521018414.3U CN205231043U (en) | 2015-12-09 | 2015-12-09 | Field effect transistor's novel TO -220AB type packaging hardware |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521018414.3U CN205231043U (en) | 2015-12-09 | 2015-12-09 | Field effect transistor's novel TO -220AB type packaging hardware |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205231043U true CN205231043U (en) | 2016-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521018414.3U Active CN205231043U (en) | 2015-12-09 | 2015-12-09 | Field effect transistor's novel TO -220AB type packaging hardware |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205231043U (en) |
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2015
- 2015-12-09 CN CN201521018414.3U patent/CN205231043U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |