CN205213235U - Aluminium formula radiating bottom plate is inlayed to copper for communications facilities - Google Patents
Aluminium formula radiating bottom plate is inlayed to copper for communications facilities Download PDFInfo
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- CN205213235U CN205213235U CN201520947861.0U CN201520947861U CN205213235U CN 205213235 U CN205213235 U CN 205213235U CN 201520947861 U CN201520947861 U CN 201520947861U CN 205213235 U CN205213235 U CN 205213235U
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- heat dissipation
- heat
- bulge loop
- copper coin
- copper
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Abstract
The utility model discloses an aluminium formula radiating bottom plate is inlayed to copper for communications facilities, including heat dissipation aluminum plate and at least one heat dissipation copper, this heat dissipation aluminum plate surperficial concave is equipped with the concave position of a plurality of first installations, and the shaping is inlayed on heat dissipation aluminum plate to the copper that should dispel the heat, the surperficial concave second installation position that is equipped with of heat dissipation copper, and the week side of heat dissipation copper is equipped with the bulge loop to the evagination, and this bulge loop buries in heat dissipation aluminum plate, and the lateral surface of bulge loop is the arc surface, and the equal protruding fin that is equipped with in the upper and lower surface of bulge loop. Week side through at the heat dissipation copper is equipped with the bulge loop to the evagination, utilize the bulge loop to bury in heat dissipation aluminum plate, and cooperation fin, the arc surface, the setting that first polish layer and second were polished layer, make the heat dissipation copper bigger with heat dissipation aluminum plate's combination area, it is seamless, the fastening and light tight, do not hide the dirt, can effectively improve the radiating efficiency, and the bonding strength between effective reinforcing heat dissipation copper and the heat dissipation aluminum plate, can bear the more push -and -pull of large intensity pulls out the test and does not drop, product performance is better.
Description
Technical field
The utility model relates to radiating bottom plate art, refers in particular to a kind of communication apparatus copper edge aluminium formula radiating bottom plate.
Background technology
The conductive coefficient of copper is far longer than the conductive coefficient of aluminium, therefore copper has better radiating effect compared with aluminium, but, cost ratio aluminium for copper is expensive, and the proportion of copper is larger than aluminium, the radiating bottom plate be therefore applied on communication apparatus is not suitable for overall employing copper coin, has occurred copper edge aluminium formula radiating bottom plate thus, it is produced by insert molding one small size copper coin on the local location of heat-dissipating aluminium plate, to carry out quick conductive for high heater element.
But, current copper edge aluminium formula radiating bottom plate when making just simply by copper coin produced by insert molding on aluminium sheet, copper coin is caused firmly to be fixed on aluminium sheet, when carrying out shock test to copper coin, copper coin easily comes off, and the bonded area of copper coin and aluminium sheet is limited, very large impact is caused on radiating effect.
Utility model content
In view of this, the utility model is for the disappearance of prior art existence, its main purpose is to provide a kind of communication apparatus copper edge aluminium formula radiating bottom plate, and it effectively can solve existing radiating bottom plate copper coin and can not to be firmly combined on aluminium sheet and the little problem causing radiating effect difference of bonded area.
For achieving the above object, the utility model adopts following technical scheme:
A kind of communication apparatus copper edge aluminium formula radiating bottom plate, includes heat-dissipating aluminium plate and at least one heat radiation copper coin; The surface of this heat-dissipating aluminium plate is arranged with multiple first and installs recess, this heat radiation copper coin produced by insert molding is on heat-dissipating aluminium plate, the surface of heat radiation copper coin and bottom surface expose surface and the bottom surface of heat-dissipating aluminium plate respectively, the surface of heat radiation copper coin is arranged with the second installation position, all sides convex of heat radiation copper coin is provided with bulge loop, this bulge loop is embedded in heat-dissipating aluminium plate, and the lateral surface of bulge loop is arc surface, and the upper and lower surface of bulge loop is all convexly equipped with fin; And the surface of heat-dissipating aluminium plate and the surface coverage of heat radiation copper coin are formed with the first polishing layer, the bottom surface of heat-dissipating aluminium plate and the bottom surface of heat radiation copper coin cover and are formed with the second polishing layer.
As a kind of preferred version, described heat radiation copper coin is spaced two.
As a kind of preferred version, described heat radiation copper coin is square, and its each corner is fillet.
As a kind of preferred version, the surface of described heat-dissipating aluminium plate is arranged with multiple embedding slot for being embedded heat pipe, and multiple embedding slot is distributed in around the first installation recess and heat radiation copper coin.
As a kind of preferred version, the cross section of described fin is arc.
The utility model compared with prior art has obvious advantage and beneficial effect, specifically, as shown from the above technical solution:
By being provided with bulge loop at all sides convex of heat radiation copper coin, bulge loop is utilized to be embedded in heat-dissipating aluminium plate, and coordinate the setting of fin, arc surface, the first polishing layer and the second polishing layer, the bonded area of make to dispel the heat copper coin and heat-dissipating aluminium plate is more greatly, seamless, fastening and light tight, do not hide dirt, effectively can improve radiating efficiency, and effectively strengthen the bond strength between heat radiation copper coin and heat-dissipating aluminium plate, can bear pushing away pull-out test and not coming off of greater strength, product serviceability is better.
For more clearly setting forth architectural feature of the present utility model and effect, below in conjunction with accompanying drawing and specific embodiment, the utility model is described in detail.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the preferred embodiment of the utility model;
Fig. 2 is the schematic perspective view of another angle of preferred embodiment of the utility model;
Fig. 3 is the sectional view of the preferred embodiment of the utility model;
Fig. 4 is the enlarged diagram of A position in Fig. 3.
Accompanying drawing identifier declaration:
10, heat-dissipating aluminium plate 11, first installs recess
12, location notch 13, embedding slot
20, recess installed by the copper coin 21, second that dispels the heat
22, bulge loop 23, fin
30, the first polishing layer 40, second polishing layer.
Embodiment
Please refer to shown in Fig. 1 to Fig. 4, that show the concrete structure of the preferred embodiment of the utility model, include heat-dissipating aluminium plate 10 and at least one heat radiation copper coin 20.
The surface of this heat-dissipating aluminium plate 10 is arranged with multiple first and installs recess 11, and heat-dissipating aluminium plate 10 is cuboid, and the side, two ends of heat-dissipating aluminium plate 10 is provided with location notch 12.
This heat radiation copper coin 20 produced by insert molding is on heat-dissipating aluminium plate 10, the surface of heat radiation copper coin 20 and bottom surface expose surface and the bottom surface of heat-dissipating aluminium plate 10 respectively, the surface of heat radiation copper coin 20 is arranged with the second installation recess 21, all sides convex of heat radiation copper coin 20 is provided with bulge loop 22, this bulge loop 22 is embedded in heat-dissipating aluminium plate 10, the lateral surface of bulge loop 22 is arc surface, and the upper and lower surface of bulge loop 22 is all convexly equipped with fin 23, so, make heat radiation copper coin 20 larger with the contact area of heat-dissipating aluminium plate 10, effectively can improve radiating efficiency, and the bond strength strengthened between heat radiation copper coin 20 and heat-dissipating aluminium plate 10, in the present embodiment, described heat radiation copper coin is spaced two, and each heat radiation copper coin 20 is square, and its each corner is fillet, and the cross section of described fin 23 is arc.
And, the surface of this heat-dissipating aluminium plate 10 and the surface coverage of heat radiation copper coin 20 are formed with the first polishing layer 30, the bottom surface of heat-dissipating aluminium plate 10 and the bottom surface of heat radiation copper coin 20 cover and are formed with the second polishing layer 40, make the outward appearance of product more attractive in appearance, and strengthen the bond strength between heat radiation copper coin 20 and heat-dissipating aluminium plate 10 further.
In addition, the surface of described heat-dissipating aluminium plate 10 is arranged with multiple embedding slot 13 for being embedded heat pipe, and multiple embedding slot 13 is distributed in the first installation recess 11 and dispels the heat copper coin 20 around.
Design focal point of the present utility model is: by being provided with bulge loop at all sides convex of heat radiation copper coin, bulge loop is utilized to be embedded in heat-dissipating aluminium plate, and coordinate fin, arc surface, first polishing layer and second polishing layer setting, make the bonded area of heat radiation copper coin and heat-dissipating aluminium plate larger, seamless, fastening and light tight, do not hide dirt, effectively can improve radiating efficiency, and the bond strength effectively strengthened between heat radiation copper coin and heat-dissipating aluminium plate, can bear pushing away pull-out test and not coming off of greater strength, product serviceability is better.
The above, it is only preferred embodiment of the present utility model, not technical scope of the present utility model is imposed any restrictions, therefore every above embodiment is done according to technical spirit of the present utility model any trickle amendment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (5)
1. a communication apparatus copper edge aluminium formula radiating bottom plate, is characterized in that: include heat-dissipating aluminium plate and at least one heat radiation copper coin; The surface of this heat-dissipating aluminium plate is arranged with multiple first and installs recess, this heat radiation copper coin produced by insert molding is on heat-dissipating aluminium plate, the surface of heat radiation copper coin and bottom surface expose surface and the bottom surface of heat-dissipating aluminium plate respectively, the surface of heat radiation copper coin is arranged with the second installation position, all sides convex of heat radiation copper coin is provided with bulge loop, this bulge loop is embedded in heat-dissipating aluminium plate, and the lateral surface of bulge loop is arc surface, and the upper and lower surface of bulge loop is all convexly equipped with fin; And the surface of heat-dissipating aluminium plate and the surface coverage of heat radiation copper coin are formed with the first polishing layer, the bottom surface of heat-dissipating aluminium plate and the bottom surface of heat radiation copper coin cover and are formed with the second polishing layer.
2. communication apparatus copper edge aluminium formula radiating bottom plate according to claim 1, is characterized in that: described heat radiation copper coin is spaced two.
3. communication apparatus copper edge aluminium formula radiating bottom plate according to claim 1, it is characterized in that: described heat radiation copper coin is square, its each corner is fillet.
4. communication apparatus copper edge aluminium formula radiating bottom plate according to claim 1, it is characterized in that: the surface of described heat-dissipating aluminium plate is arranged with multiple embedding slot for being embedded heat pipe, multiple embedding slot is distributed in around the first installation recess and heat radiation copper coin.
5. communication apparatus copper edge aluminium formula radiating bottom plate according to claim 1, is characterized in that: the cross section of described fin is arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520947861.0U CN205213235U (en) | 2015-11-25 | 2015-11-25 | Aluminium formula radiating bottom plate is inlayed to copper for communications facilities |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520947861.0U CN205213235U (en) | 2015-11-25 | 2015-11-25 | Aluminium formula radiating bottom plate is inlayed to copper for communications facilities |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205213235U true CN205213235U (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520947861.0U Active CN205213235U (en) | 2015-11-25 | 2015-11-25 | Aluminium formula radiating bottom plate is inlayed to copper for communications facilities |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205213235U (en) |
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2015
- 2015-11-25 CN CN201520947861.0U patent/CN205213235U/en active Active
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |