CN205213149U - Gong matrix utensil - Google Patents

Gong matrix utensil Download PDF

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Publication number
CN205213149U
CN205213149U CN201520863144.XU CN201520863144U CN205213149U CN 205213149 U CN205213149 U CN 205213149U CN 201520863144 U CN201520863144 U CN 201520863144U CN 205213149 U CN205213149 U CN 205213149U
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China
Prior art keywords
gong
pcb board
board
stupefied
convex
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CN201520863144.XU
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Chinese (zh)
Inventor
孟昭光
叶志
蔡志浩
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Dongguan Wuzhu Electronic Technology Co Ltd
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Dongguan Wuzhu Electronic Technology Co Ltd
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Priority to CN201520863144.XU priority Critical patent/CN205213149U/en
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Abstract

The utility model provides a gong matrix utensil. Gong matrix utensil is used for the gong board of PCB board, the neighbouring edge of PCB board has seted up the long groove that leads to, the long groove that leads to will cost somatic part, connecting portion and technology shaping limit are separated to the PCB board, connecting portion are connected this somatic part with technology shaping limit, gong matrix utensil include the bottom plate, formed at spill module on the bottom plate and all locating stupefied and the gong board gong dead zone of convex of spill module, the convex stupefied with the long groove that leads to of PCB board corresponds the setting, gong board gong dead zone is located the stupefied both ends of convex and with PCB joining of plates portion corresponds the setting. Compared with the prior art, the utility model provides a gong matrix utensil has orientation module, can with the accurate positioning of PCB plate in among the gong matrix utensil, when just carrying out PCB board gong board technology, the size control that can guarantee shaping PCB board improves off -the -shelf qualification rate in the tolerance range.

Description

Gong board mold
Technical field
The utility model relates to printed circuit board (PCB) (PrintingCircuitBoard, PCB) manufacturing technology field, particularly relates to a kind of gong board mold.
Background technology
Along with the development of electronic technology, pcb board instead of the connected mode of conditional electronic components and parts, is widely used in electronic product.The gong plate of pcb board is an important procedure in pcb board manufacturing process, is to be cut by the figure that pcb board needs by client by the processing formula of engineering design.
At present, in the processing industry of pcb board, for the ease of large-scale production, often need the monoblock pcb board first produced containing multiple PCB single board, then, sharp processing is carried out to monoblock pcb board, form multiple PCB single board.
In the process of gong plate, in order to ensure dimensional accuracy, fixed mould must be adopted to be fixed to polylith pcb board.Generally, adopt and offer location hole, the method be fixed with shop bolt at edges of boards place, four, the upper and lower, left and right of fixed mould.When needs large-scale production pcb board, in order to improve PCB typesetting utilance, reduce costs, often in the fixed mould of polylith PCB, do not stay edges of boards, thus location hole cannot be offered at edges of boards, in this case, certain difficulty is fixedly caused to pcb board in gong plate technique, and gong plate craft precision is difficult to control, and reduces conforming product rate.
Therefore, be necessary to provide a kind of to solve the problem to the gong board mold that monolithic pcb board carries out gong plate.
Utility model content
The utility model to be the fixed mould solving polylith pcb board be improve typesetting utilance cause without edges of boards and without location hole, can not the problem of accurate gong plate, provide one to carry out gong plate to monolithic pcb board, and the gong board mold that gong plate precision is high.
The utility model provides a kind of gong board mold, for the gong plate of pcb board, described pcb board neighboring edge place offers long groove, described pcb board is separated into body by described long groove, connecting portion and technological forming limit, described connecting portion connects described body and technological forming limit, described gong board mold comprises base plate, be formed at the spill module on described base plate, and the convex being all located at described spill module is stupefied and gong plate gong dead zone, described convex long groove that is stupefied and described pcb board is corresponding to be arranged, described gong plate gong dead zone is located at the stupefied two ends of described convex and correspondingly with the connecting portion of described pcb board is arranged.
Preferably, the size that described convex is stupefied is less than the size of the long groove of described pcb board.
Preferably, described gong board mold also comprises gong dead zone, end, and the stupefied middle part of described convex is run through and from the stupefied edge extending beyond described spill module of described convex in gong dead zone, described end.
Preferably, described gong board mold also comprises at least two shop bolts, and described shop bolt is diagonally distributed in described spill module, and described pcb board comprises at least two location holes, described location hole is located on described technological forming limit, and described alignment pin coordinates fixing with described location hole.
Preferably, described gong board mold also comprises fixing hole, and described fixing hole quantity is at least two, is diagonally distributed in the periphery of described base plate.
Compared with correlation technique, the gong board mold that the utility model provides comprises base plate, be formed at the spill module of described base plate, and the convex being all located at described spill module is stupefied and gong plate gong dead zone, described pcb board is embedded at described spill module, described gong plate gong dead zone is corresponding with the connecting portion of described pcb board to be arranged, described convex long groove that is stupefied and described pcb board is corresponding to be arranged, by described convex is stupefied, described pcb board is accurately positioned in described spill module, the gong plate gong dead zone of described spill module is corresponding with the connecting portion of described pcb board to be arranged, cutter gong under gong cutter can be facilitated to go to the technological forming limit of described pcb board, and gong cutter can not be damaged.The gong board mold that the utility model provides, can realize the accurate location of described pcb board, and when carrying out pcb board gong plate technique, can ensure that the size Control of shaping pcb board is in the margin of tolerance, improves the qualification rate of finished product.
Accompanying drawing explanation
The structural representation completing the pcb board after first time gong plate that Fig. 1 provides for the utility model;
The structural representation of the gong board mold that Fig. 2 provides for the utility model.
Embodiment
Below in conjunction with drawings and embodiments, the utility model is described in further detail.
Consulting Fig. 1, is the structural representation completing the pcb board after first time gong plate that the utility model provides.Described pcb board 1 comprises long groove 11, body 12, connecting portion 13, technological forming limit 14 and location hole 15.
Concrete, described pcb board 1 is rectangle plate body.Described long groove 11 is opened in the two ends of described pcb board, and described pcb board 1 is separated into body 12, connecting portion 13 and technological forming limit 14 by it.Wherein said body 12 is the mid portion of described pcb board 1, and described technological forming limit 14 is the both ends of described pcb board 1.
Described connecting portion 13 connects described body 12 and technological forming limit 14.The quantity of described location hole 15 is four, and described location hole 15 is positioned at two diagonal angles on described technological forming limit 14.
Except present embodiment, the quantity of described location hole 15 can also be two, is located at the diagonal angle on described technological forming limit 14 respectively.
Please combine again and consult Fig. 2, Fig. 2 is the structural representation of the utility model gong board mold.Described gong board mold 2 comprises that base plate 21, spill module 22, convex are stupefied 23, gong plate gong dead zone 24, gong dead zone, end 25, shop bolt 26 and fixing hole 27.
Described base plate 21 is platy structure.
Described spill module 22 is for being formed at the concave regions on described base plate 21, and the outer shape of its shape and described pcb board 1 matches.
Described convex stupefied 23 is for being formed at the strip bulge-structure of described spill module 22, and it is located at the both ends of described spill module 22.Described convex stupefied 23, for the location of described pcb board 1, correspondingly with the long groove 11 of described pcb board 1 to be arranged, and it is less than the size of described long groove 11.
Described gong plate gong dead zone 24 is located in described spill module 22, and it is positioned at the two ends of described convex stupefied 23 and correspondingly with the connecting portion 13 of described pcb board 1 arranges.
Gong dead zone, described end 25 is run through the middle part of described convex stupefied 23 and is extended beyond the edge of described spill module 22 from described convex stupefied 23.Gong dead zone, described end 25 conveniently can be taken, be installed described pcb board 1.
The quantity of described shop bolt 26 is identical with the quantity of the described location hole 15 of described pcb board 1, and described shop bolt 26 is corresponding with described location hole 15 arranges, described pcb board 1 be embedded with described spill module 22 in after, described shop bolt 26, through the described location hole 15 of described pcb board 1, realizes locating further.In the present embodiment, described shop bolt 26 is two, is diagonally distributed in described spill module 22.
The quantity of described fixing hole 27 is two, is diagonally distributed in the periphery of the described base plate 21 of described gong board mold 2.Described fixing hole 27 is for being fixed on gong board by described gong board mold 2.
Preferably, described gong board mold 2 is quartz plate.
The technological process of the utility model gong board mold 2 gong plate is:
Described pcb board 1 neighboring edge place gong is gone out long groove 11, and by described, described long groove 11 treats that gong pcb board 1 is separated into body 12, connecting portion 13 and technological forming limit 14, described connecting portion 13 connects described body 12 and described technological forming limit 14;
Described gong board mold 2 comprises base plate 21, is formed at the spill module 22 on described base plate 21 and is all located at convex stupefied 23 and the gong plate gong dead zone 24 of described spill module 22.Pcb board 1 after completing first time gong plate is embedded in described spill module 22, the corresponding described gong plate gong dead zone 24 of described connecting portion 13 is arranged, described convex stupefied 23 is arranged in the long groove 11 of described pcb board 1, described gong plate gong dead zone 24 is positioned at immediately below described connecting portion 13, described shop bolt 26 inserts in described location hole 15, makes described pcb board 1 be positioned in described gong board mold 2;
Be fixed on gong board by described fixing hole 27 by described gong board mold 2, described gong machine carries out second time gong plate in described gong plate gong dead zone 24 to described pcb board 1, and described gong cutter gong removes described connecting portion 13, removes described technological forming limit 14;
After machining, by the position of gong dead zone, described end 25, take out the described body 12 of described pcb board 1, obtain shaping pcb board.
Compared with correlation technique, the gong board mold 2 that the utility model provides comprises base plate 21, be formed at the spill module 22 of described base plate 21, and be all located at convex stupefied 23 and the gong plate gong dead zone 24 of described spill module, described pcb board 1 is embedded at described spill module 22, described gong plate gong dead zone 24 is corresponding with the connecting portion 13 of described pcb board 1 to be arranged, described convex stupefied 23 is corresponding with the long groove 11 of described pcb board 1 to be arranged, by described convex stupefied 23, described pcb board 1 is accurately positioned in described spill module 22, the gong plate gong dead zone 24 of described spill module 22 is corresponding with the described connecting portion 13 of described pcb board 1 to be arranged, cutter gong under gong cutter can be facilitated to go to the technological forming limit 14 of described pcb board 1, and gong cutter can not be damaged.The gong board mold 2 that the utility model provides, can realize the accurate location of described pcb board 1, and when carrying out pcb board 1 gong plate technique, can ensure that the size Control of shaping pcb board 1 is in the margin of tolerance, improves the qualification rate of finished product.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model specification and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.

Claims (5)

1. a gong board mold, for the gong plate of pcb board, described pcb board neighboring edge place offers long groove, described pcb board is separated into body by described long groove, connecting portion and technological forming limit, described connecting portion connects described body and technological forming limit, it is characterized in that, described gong board mold comprises base plate, be formed at the spill module on described base plate, and the convex being all located at described spill module is stupefied and gong plate gong dead zone, described convex long groove that is stupefied and described pcb board is corresponding to be arranged, described gong plate gong dead zone is located at the stupefied two ends of described convex and correspondingly with the connecting portion of described pcb board is arranged.
2. gong board mold according to claim 1, is characterized in that, the stupefied size of described convex is less than the size of the described long groove of described pcb board.
3. gong board mold according to claim 2, is characterized in that, described gong board mold also comprises gong dead zone, end, and the stupefied middle part of described convex is run through and from the stupefied edge extending beyond described spill module of described convex in gong dead zone, described end.
4. gong board mold according to claim 1, it is characterized in that, described gong board mold also comprises at least two shop bolts, described shop bolt is diagonally distributed in described spill module, described pcb board comprises at least two location holes, described location hole is located on described technological forming limit, and described alignment pin coordinates fixing with described location hole.
5. gong board mold according to claim 1, is characterized in that, described gong board mold also comprises fixing hole, and described fixing hole quantity is at least two, is diagonally distributed in the periphery of described base plate.
CN201520863144.XU 2015-10-29 2015-10-29 Gong matrix utensil Active CN205213149U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520863144.XU CN205213149U (en) 2015-10-29 2015-10-29 Gong matrix utensil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520863144.XU CN205213149U (en) 2015-10-29 2015-10-29 Gong matrix utensil

Publications (1)

Publication Number Publication Date
CN205213149U true CN205213149U (en) 2016-05-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105357876A (en) * 2015-10-29 2016-02-24 东莞市五株电子科技有限公司 Board milling mold and PCB milling method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105357876A (en) * 2015-10-29 2016-02-24 东莞市五株电子科技有限公司 Board milling mold and PCB milling method
CN105357876B (en) * 2015-10-29 2018-05-18 东莞市五株电子科技有限公司 The gong plate method of gong board mold and pcb board

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